WO2009008131A1 - 回路基板用の樹脂シートおよびその製造方法 - Google Patents

回路基板用の樹脂シートおよびその製造方法 Download PDF

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Publication number
WO2009008131A1
WO2009008131A1 PCT/JP2008/001718 JP2008001718W WO2009008131A1 WO 2009008131 A1 WO2009008131 A1 WO 2009008131A1 JP 2008001718 W JP2008001718 W JP 2008001718W WO 2009008131 A1 WO2009008131 A1 WO 2009008131A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin sheet
section
resin layer
resin
manufacturing
Prior art date
Application number
PCT/JP2008/001718
Other languages
English (en)
French (fr)
Inventor
Haruo Murakami
Original Assignee
Sumitomo Bakelite Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co., Ltd. filed Critical Sumitomo Bakelite Co., Ltd.
Priority to CN2008800234628A priority Critical patent/CN101731026B/zh
Priority to JP2009522513A priority patent/JP4770984B2/ja
Priority to US12/664,660 priority patent/US8535782B2/en
Publication of WO2009008131A1 publication Critical patent/WO2009008131A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0594—Insulating resist or coating with special shaped edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24777—Edge feature

Abstract

　樹脂シート（１００）は、樹脂層（１２０）と、樹脂層（１２０）の一方の面側に積層された保護層（１１０）とを備えている。樹脂シート（１００）は、平面視において矩形形状を有し、保護層（１１０）の外辺部は樹脂層（１２０）の外辺部より外側に延出するとともに、樹脂層（１２０）は、平坦部（１２１）と、平坦部（１２１）から外側に向かって樹脂層（１２０）の厚さが漸減するスロープ部（１２２）を有し、樹脂層（１２０）のスロープ部（１２２）と平坦部（１２１）との境界部（１２３）における樹脂厚さ（ｄ）と、平坦部（１２１）の平均厚さ（Ｄ）との差が、平均厚さ（Ｄ）の５％以下となっている。
PCT/JP2008/001718 2007-07-09 2008-07-01 回路基板用の樹脂シートおよびその製造方法 WO2009008131A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800234628A CN101731026B (zh) 2007-07-09 2008-07-01 用于电路板的树脂片及其生产方法
JP2009522513A JP4770984B2 (ja) 2007-07-09 2008-07-01 回路基板用の樹脂シートおよびその製造方法
US12/664,660 US8535782B2 (en) 2007-07-09 2008-07-01 Resin sheet for circuit board and production process therefor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-179639 2007-07-09
JP2007179639 2007-07-09

Publications (1)

Publication Number Publication Date
WO2009008131A1 true WO2009008131A1 (ja) 2009-01-15

Family

ID=40228325

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001718 WO2009008131A1 (ja) 2007-07-09 2008-07-01 回路基板用の樹脂シートおよびその製造方法

Country Status (7)

Country Link
US (1) US8535782B2 (ja)
JP (4) JP4770984B2 (ja)
KR (1) KR20100039329A (ja)
CN (2) CN102625567B (ja)
MY (1) MY152035A (ja)
TW (1) TWI439368B (ja)
WO (1) WO2009008131A1 (ja)

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JP2016096217A (ja) * 2014-11-13 2016-05-26 旭化成イーマテリアルズ株式会社 ドライレジスト層転写フィルムロール

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JP6656861B2 (ja) * 2015-09-25 2020-03-04 日鉄ケミカル＆マテリアル株式会社 フレキシブルデバイス用積層体及びフレキシブルデバイスの製造方法
JP6892751B2 (ja) * 2016-11-28 2021-06-23 日東電工株式会社 両面導電性フィルム
JP7132242B2 (ja) * 2018-06-14 2022-09-06 積水化学工業株式会社 積層フィルム及び積層構造体の製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016096217A (ja) * 2014-11-13 2016-05-26 旭化成イーマテリアルズ株式会社 ドライレジスト層転写フィルムロール

Also Published As

Publication number Publication date
TW200914263A (en) 2009-04-01
JP4905600B2 (ja) 2012-03-28
US20100183849A1 (en) 2010-07-22
JPWO2009008131A1 (ja) 2010-09-02
CN102625567B (zh) 2014-07-16
CN101731026B (zh) 2012-04-04
US8535782B2 (en) 2013-09-17
JP4770984B2 (ja) 2011-09-14
JP2011077545A (ja) 2011-04-14
KR20100039329A (ko) 2010-04-15
JP2011249845A (ja) 2011-12-08
JP4947211B2 (ja) 2012-06-06
CN101731026A (zh) 2010-06-09
JP2011176362A (ja) 2011-09-08
CN102625567A (zh) 2012-08-01
TWI439368B (zh) 2014-06-01
MY152035A (en) 2014-08-15

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