WO2008096540A1 - 積層体、積層体を含む回路基板、半導体パッケージおよび積層体の製造方法 - Google Patents

積層体、積層体を含む回路基板、半導体パッケージおよび積層体の製造方法 Download PDF

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Publication number
WO2008096540A1
WO2008096540A1 PCT/JP2008/000168 JP2008000168W WO2008096540A1 WO 2008096540 A1 WO2008096540 A1 WO 2008096540A1 JP 2008000168 W JP2008000168 W JP 2008000168W WO 2008096540 A1 WO2008096540 A1 WO 2008096540A1
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WO
WIPO (PCT)
Prior art keywords
laminated body
base material
fiber base
resin
circuit board
Prior art date
Application number
PCT/JP2008/000168
Other languages
English (en)
French (fr)
Inventor
Kazuyuki Yoshizaki
Teppei Ito
Iji Onozuka
Kensuke Nakamura
Original Assignee
Sumitomo Bakelite Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co., Ltd. filed Critical Sumitomo Bakelite Co., Ltd.
Priority to US12/523,320 priority Critical patent/US8871660B2/en
Priority to CN2008800045541A priority patent/CN101605653B/zh
Priority to JP2008557025A priority patent/JP5120267B2/ja
Priority to KR1020097017331A priority patent/KR20090108636A/ko
Publication of WO2008096540A1 publication Critical patent/WO2008096540A1/ja

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    • Y10T442/3179—Woven fabric is characterized by a particular or differential weave other than fabric in which the strand denier or warp/weft pick count is specified
    • Y10T442/3301—Coated, impregnated, or autogenous bonded
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3382—Including a free metal or alloy constituent
    • Y10T442/3415—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3382—Including a free metal or alloy constituent
    • Y10T442/3415—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
    • Y10T442/3431—Plural fabric layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3382—Including a free metal or alloy constituent
    • Y10T442/3463—Plural fabric layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3472—Woven fabric including an additional woven fabric layer
    • Y10T442/348—Mechanically needled or hydroentangled
    • Y10T442/3496—Coated, impregnated, or autogenously bonded

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Laminated Bodies (AREA)

Abstract

　積層体が、第一の繊維基材と樹脂とからなる第一の樹脂層および第二の繊維基材と樹脂とからなる第二の樹脂層を含む積層体であって、前記第一および第二の樹脂層は、第一の樹脂層および第二の樹脂層の少なくとも一部が前記積層体の厚み方向における中心線を挟んでそれぞれ異なる領域に位置するように、配置され、第一の繊維基材および第二の繊維基材の少なくとも一方が目曲がり領域を有し、ここで目曲がり領域とは繊維基材の縦糸と横糸との小さい方の交差角度が９０°未満である領域をいい、前記目曲がり領域における、第一の繊維基材および第二の繊維基材の縦糸で形成される角度および第一の繊維基材および第二の繊維基材の横糸で形成される角度のいずれか大きい方の角度が２°以下である。
PCT/JP2008/000168 2007-02-08 2008-02-07 積層体、積層体を含む回路基板、半導体パッケージおよび積層体の製造方法 WO2008096540A1 (ja)

Priority Applications (4)

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US12/523,320 US8871660B2 (en) 2007-02-08 2008-02-07 Laminated body, circuit board including laminated body, semiconductor package and process for manufacturing laminated body
CN2008800045541A CN101605653B (zh) 2007-02-08 2008-02-07 层叠体、包含该层叠体的电路板、半导体封装件及制造层叠体的方法
JP2008557025A JP5120267B2 (ja) 2007-02-08 2008-02-07 積層体、積層体を含む回路基板、半導体パッケージおよび積層体の製造方法
KR1020097017331A KR20090108636A (ko) 2007-02-08 2008-02-07 적층체, 적층체를 포함하는 회로 기판, 반도체 패키지 및 적층체의 제조 방법

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US8871660B2 (en) 2014-10-28
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MY151594A (en) 2014-06-13
CN101605653A (zh) 2009-12-16
US20100078201A1 (en) 2010-04-01
KR20090108636A (ko) 2009-10-15
CN101605653B (zh) 2013-01-30
TW200842036A (en) 2008-11-01
JPWO2008096540A1 (ja) 2010-05-20

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