WO2008152974A1 - 耐熱エージング特性に優れた金属被覆ポリイミド樹脂基板の製造方法 - Google Patents
耐熱エージング特性に優れた金属被覆ポリイミド樹脂基板の製造方法 Download PDFInfo
- Publication number
- WO2008152974A1 WO2008152974A1 PCT/JP2008/060420 JP2008060420W WO2008152974A1 WO 2008152974 A1 WO2008152974 A1 WO 2008152974A1 JP 2008060420 W JP2008060420 W JP 2008060420W WO 2008152974 A1 WO2008152974 A1 WO 2008152974A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polyimide resin
- electroless nickel
- resin substrate
- forming
- plated layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008800008881A CN101548029B (zh) | 2007-06-15 | 2008-06-06 | 耐热老化特性优良的金属包覆聚酰亚胺树脂基板的制造方法 |
JP2008558126A JP4283882B2 (ja) | 2007-06-15 | 2008-06-06 | 耐熱エージング特性に優れた金属被覆ポリイミド樹脂基板の製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-158512 | 2007-06-15 | ||
JP2007158512 | 2007-06-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008152974A1 true WO2008152974A1 (ja) | 2008-12-18 |
Family
ID=40129579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/060420 WO2008152974A1 (ja) | 2007-06-15 | 2008-06-06 | 耐熱エージング特性に優れた金属被覆ポリイミド樹脂基板の製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4283882B2 (ja) |
KR (1) | KR100997629B1 (ja) |
CN (1) | CN101548029B (ja) |
TW (1) | TW200905014A (ja) |
WO (1) | WO2008152974A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010098235A1 (ja) * | 2009-02-25 | 2010-09-02 | 日鉱金属株式会社 | 耐熱エージング特性に優れた金属被覆ポリイミド樹脂基板 |
JP2013159784A (ja) * | 2012-02-01 | 2013-08-19 | Toyota Motor Corp | めっき処理材の製造方法およびめっき処理材 |
JP2015201658A (ja) * | 2010-08-25 | 2015-11-12 | 宇部興産株式会社 | フレキシブルプリント基板の製法 |
JP2019173112A (ja) * | 2018-03-29 | 2019-10-10 | グリーンケム株式会社 | 金属メッキ方法 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012045819A (ja) * | 2010-08-26 | 2012-03-08 | Sakaiya:Kk | 加飾膜層と金属膜層を備えた樹脂シートの製造方法 |
CN104960305B (zh) * | 2015-04-09 | 2017-09-29 | 柏弥兰金属化研究股份有限公司 | 制成可挠式金属积层材的方法 |
TWI615073B (zh) * | 2015-04-09 | 2018-02-11 | 柏彌蘭金屬化研究股份有限公司 | 製成可撓式金屬積層材之方法 |
TWI585245B (zh) * | 2015-04-09 | 2017-06-01 | 柏彌蘭金屬化研究股份有限公司 | 單面薄型金屬基板之製造方法 |
CN107637184B (zh) * | 2015-06-04 | 2020-07-17 | 住友电气工业株式会社 | 印刷线路板用基板和印刷线路板 |
CN106567058B (zh) * | 2015-10-09 | 2019-03-19 | 凯基有限公司 | 无铬环保镀金属膜结构系统 |
CN106929833A (zh) * | 2015-12-30 | 2017-07-07 | 凯基有限公司 | 聚乙酰胺或聚对苯二甲酸乙二酯基材的湿式金属化处理控制方法 |
US11317507B2 (en) * | 2018-03-09 | 2022-04-26 | Arisawa Mfg. Co., Ltd. | Laminate and method for manufacturing the same |
KR102081078B1 (ko) * | 2018-07-02 | 2020-02-25 | 도레이첨단소재 주식회사 | 연성동박적층필름 및 이의 제조방법 |
JP7456579B2 (ja) * | 2019-05-09 | 2024-03-27 | ナミックス株式会社 | 金属層を有する金属部材の製造方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01295847A (ja) * | 1988-02-16 | 1989-11-29 | Polyonics Corp | 表面模様付きのポリイミドフイルムから作製された熱的に安定な2層金属被覆積層体製品 |
JPH05129377A (ja) * | 1991-10-31 | 1993-05-25 | Sumitomo Metal Mining Co Ltd | 銅ポリイミド基板の製造方法 |
JPH06200396A (ja) * | 1993-01-05 | 1994-07-19 | Sumitomo Metal Mining Co Ltd | 金属被覆ポリイミド基板の製造方法 |
JPH07216553A (ja) * | 1994-01-28 | 1995-08-15 | Sumitomo Metal Mining Co Ltd | 銅被覆ポリイミド基板の製造方法 |
WO2005073431A1 (ja) * | 2004-01-29 | 2005-08-11 | Nippon Mining & Metals Co., Ltd. | 無電解めっき前処理剤、それを用いる無電解めっき方法、及び無電解めっき物 |
JP2005294700A (ja) * | 2004-04-02 | 2005-10-20 | Tokai Rubber Ind Ltd | フレキシブルプリント基板の製法 |
JP2007096007A (ja) * | 2005-09-29 | 2007-04-12 | Cmk Corp | プリント配線板及びその製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4027642B2 (ja) * | 2001-11-08 | 2007-12-26 | 日本パーカライジング株式会社 | 樹脂との耐熱接着性に優れたニッケル系表面処理皮膜 |
JP3825790B2 (ja) * | 2003-10-30 | 2006-09-27 | 東海ゴム工業株式会社 | フレキシブルプリント基板の製法 |
-
2008
- 2008-06-06 CN CN2008800008881A patent/CN101548029B/zh not_active Expired - Fee Related
- 2008-06-06 KR KR1020097007701A patent/KR100997629B1/ko not_active IP Right Cessation
- 2008-06-06 WO PCT/JP2008/060420 patent/WO2008152974A1/ja active Application Filing
- 2008-06-06 JP JP2008558126A patent/JP4283882B2/ja not_active Expired - Fee Related
- 2008-06-11 TW TW097121636A patent/TW200905014A/zh not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01295847A (ja) * | 1988-02-16 | 1989-11-29 | Polyonics Corp | 表面模様付きのポリイミドフイルムから作製された熱的に安定な2層金属被覆積層体製品 |
JPH05129377A (ja) * | 1991-10-31 | 1993-05-25 | Sumitomo Metal Mining Co Ltd | 銅ポリイミド基板の製造方法 |
JPH06200396A (ja) * | 1993-01-05 | 1994-07-19 | Sumitomo Metal Mining Co Ltd | 金属被覆ポリイミド基板の製造方法 |
JPH07216553A (ja) * | 1994-01-28 | 1995-08-15 | Sumitomo Metal Mining Co Ltd | 銅被覆ポリイミド基板の製造方法 |
WO2005073431A1 (ja) * | 2004-01-29 | 2005-08-11 | Nippon Mining & Metals Co., Ltd. | 無電解めっき前処理剤、それを用いる無電解めっき方法、及び無電解めっき物 |
JP2005294700A (ja) * | 2004-04-02 | 2005-10-20 | Tokai Rubber Ind Ltd | フレキシブルプリント基板の製法 |
JP2007096007A (ja) * | 2005-09-29 | 2007-04-12 | Cmk Corp | プリント配線板及びその製造方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010098235A1 (ja) * | 2009-02-25 | 2010-09-02 | 日鉱金属株式会社 | 耐熱エージング特性に優れた金属被覆ポリイミド樹脂基板 |
CN102333908A (zh) * | 2009-02-25 | 2012-01-25 | 吉坤日矿日石金属株式会社 | 耐热老化特性优良的金属包覆聚酰亚胺树脂基板 |
JPWO2010098235A1 (ja) * | 2009-02-25 | 2012-08-30 | Jx日鉱日石金属株式会社 | 耐熱エージング特性に優れた金属被覆ポリイミド樹脂基板 |
JP2015201658A (ja) * | 2010-08-25 | 2015-11-12 | 宇部興産株式会社 | フレキシブルプリント基板の製法 |
JP2013159784A (ja) * | 2012-02-01 | 2013-08-19 | Toyota Motor Corp | めっき処理材の製造方法およびめっき処理材 |
JP2019173112A (ja) * | 2018-03-29 | 2019-10-10 | グリーンケム株式会社 | 金属メッキ方法 |
Also Published As
Publication number | Publication date |
---|---|
KR100997629B1 (ko) | 2010-12-01 |
JPWO2008152974A1 (ja) | 2010-08-26 |
KR20090095543A (ko) | 2009-09-09 |
CN101548029B (zh) | 2011-01-05 |
TW200905014A (en) | 2009-02-01 |
CN101548029A (zh) | 2009-09-30 |
JP4283882B2 (ja) | 2009-06-24 |
TWI369415B (ja) | 2012-08-01 |
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