WO2008152974A1 - 耐熱エージング特性に優れた金属被覆ポリイミド樹脂基板の製造方法 - Google Patents

耐熱エージング特性に優れた金属被覆ポリイミド樹脂基板の製造方法 Download PDF

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Publication number
WO2008152974A1
WO2008152974A1 PCT/JP2008/060420 JP2008060420W WO2008152974A1 WO 2008152974 A1 WO2008152974 A1 WO 2008152974A1 JP 2008060420 W JP2008060420 W JP 2008060420W WO 2008152974 A1 WO2008152974 A1 WO 2008152974A1
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WO
WIPO (PCT)
Prior art keywords
polyimide resin
electroless nickel
resin substrate
forming
plated layer
Prior art date
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PCT/JP2008/060420
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English (en)
French (fr)
Inventor
Taku Yoshida
Toshifumi Kawamura
Original Assignee
Nippon Mining & Metals Co., Ltd.
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Publication date
Application filed by Nippon Mining & Metals Co., Ltd. filed Critical Nippon Mining & Metals Co., Ltd.
Priority to CN2008800008881A priority Critical patent/CN101548029B/zh
Priority to JP2008558126A priority patent/JP4283882B2/ja
Publication of WO2008152974A1 publication Critical patent/WO2008152974A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

　ポリイミド樹脂フィルムの両面又は片面にＢを含有する無電解ニッケルめっき層を形成し、その表層に無電解銅めっき又は電気銅めっきにより導電性皮膜を形成する金属被覆ポリイミド樹脂基板の製造方法において、上記無電解ニッケルめっきに先立って、ポリイミド樹脂基板をアルカリ金属水酸化物からなる溶液に浸漬し親水化する処理、触媒付与処理及び触媒活性化処理を施した後、前記無電解ニッケル層の形成を２工程に分け、第１工程で第２工程よりも厚い無電解ニッケルめっき層を形成した後、加熱処理を行い、さらに第２工程で再度無電解ニッケルめっき層を形成することを特徴とする金属被覆ポリイミド樹脂基板の製造方法。無接着剤フレキシブルラミネートの密着力の指標である初期密着力を低下させることなく加熱エージング後（１５０°Ｃ、大気中に１６８時間放置された後）の密着力を高めることを課題とする。
PCT/JP2008/060420 2007-06-15 2008-06-06 耐熱エージング特性に優れた金属被覆ポリイミド樹脂基板の製造方法 WO2008152974A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800008881A CN101548029B (zh) 2007-06-15 2008-06-06 耐热老化特性优良的金属包覆聚酰亚胺树脂基板的制造方法
JP2008558126A JP4283882B2 (ja) 2007-06-15 2008-06-06 耐熱エージング特性に優れた金属被覆ポリイミド樹脂基板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-158512 2007-06-15
JP2007158512 2007-06-15

Publications (1)

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WO2008152974A1 true WO2008152974A1 (ja) 2008-12-18

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PCT/JP2008/060420 WO2008152974A1 (ja) 2007-06-15 2008-06-06 耐熱エージング特性に優れた金属被覆ポリイミド樹脂基板の製造方法

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JP (1) JP4283882B2 (ja)
KR (1) KR100997629B1 (ja)
CN (1) CN101548029B (ja)
TW (1) TW200905014A (ja)
WO (1) WO2008152974A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010098235A1 (ja) * 2009-02-25 2010-09-02 日鉱金属株式会社 耐熱エージング特性に優れた金属被覆ポリイミド樹脂基板
JP2013159784A (ja) * 2012-02-01 2013-08-19 Toyota Motor Corp めっき処理材の製造方法およびめっき処理材
JP2015201658A (ja) * 2010-08-25 2015-11-12 宇部興産株式会社 フレキシブルプリント基板の製法
JP2019173112A (ja) * 2018-03-29 2019-10-10 グリーンケム株式会社 金属メッキ方法

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* Cited by examiner, † Cited by third party
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JP2012045819A (ja) * 2010-08-26 2012-03-08 Sakaiya:Kk 加飾膜層と金属膜層を備えた樹脂シートの製造方法
CN104960305B (zh) * 2015-04-09 2017-09-29 柏弥兰金属化研究股份有限公司 制成可挠式金属积层材的方法
TWI615073B (zh) * 2015-04-09 2018-02-11 柏彌蘭金屬化研究股份有限公司 製成可撓式金屬積層材之方法
TWI585245B (zh) * 2015-04-09 2017-06-01 柏彌蘭金屬化研究股份有限公司 單面薄型金屬基板之製造方法
CN107637184B (zh) * 2015-06-04 2020-07-17 住友电气工业株式会社 印刷线路板用基板和印刷线路板
CN106567058B (zh) * 2015-10-09 2019-03-19 凯基有限公司 无铬环保镀金属膜结构系统
CN106929833A (zh) * 2015-12-30 2017-07-07 凯基有限公司 聚乙酰胺或聚对苯二甲酸乙二酯基材的湿式金属化处理控制方法
US11317507B2 (en) * 2018-03-09 2022-04-26 Arisawa Mfg. Co., Ltd. Laminate and method for manufacturing the same
KR102081078B1 (ko) * 2018-07-02 2020-02-25 도레이첨단소재 주식회사 연성동박적층필름 및 이의 제조방법
JP7456579B2 (ja) * 2019-05-09 2024-03-27 ナミックス株式会社 金属層を有する金属部材の製造方法

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JPH01295847A (ja) * 1988-02-16 1989-11-29 Polyonics Corp 表面模様付きのポリイミドフイルムから作製された熱的に安定な２層金属被覆積層体製品
JPH05129377A (ja) * 1991-10-31 1993-05-25 Sumitomo Metal Mining Co Ltd 銅ポリイミド基板の製造方法
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JPH07216553A (ja) * 1994-01-28 1995-08-15 Sumitomo Metal Mining Co Ltd 銅被覆ポリイミド基板の製造方法
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JP2005294700A (ja) * 2004-04-02 2005-10-20 Tokai Rubber Ind Ltd フレキシブルプリント基板の製法
JP2007096007A (ja) * 2005-09-29 2007-04-12 Cmk Corp プリント配線板及びその製造方法

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JP4027642B2 (ja) * 2001-11-08 2007-12-26 日本パーカライジング株式会社 樹脂との耐熱接着性に優れたニッケル系表面処理皮膜
JP3825790B2 (ja) * 2003-10-30 2006-09-27 東海ゴム工業株式会社 フレキシブルプリント基板の製法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01295847A (ja) * 1988-02-16 1989-11-29 Polyonics Corp 表面模様付きのポリイミドフイルムから作製された熱的に安定な２層金属被覆積層体製品
JPH05129377A (ja) * 1991-10-31 1993-05-25 Sumitomo Metal Mining Co Ltd 銅ポリイミド基板の製造方法
JPH06200396A (ja) * 1993-01-05 1994-07-19 Sumitomo Metal Mining Co Ltd 金属被覆ポリイミド基板の製造方法
JPH07216553A (ja) * 1994-01-28 1995-08-15 Sumitomo Metal Mining Co Ltd 銅被覆ポリイミド基板の製造方法
WO2005073431A1 (ja) * 2004-01-29 2005-08-11 Nippon Mining & Metals Co., Ltd. 無電解めっき前処理剤、それを用いる無電解めっき方法、及び無電解めっき物
JP2005294700A (ja) * 2004-04-02 2005-10-20 Tokai Rubber Ind Ltd フレキシブルプリント基板の製法
JP2007096007A (ja) * 2005-09-29 2007-04-12 Cmk Corp プリント配線板及びその製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010098235A1 (ja) * 2009-02-25 2010-09-02 日鉱金属株式会社 耐熱エージング特性に優れた金属被覆ポリイミド樹脂基板
CN102333908A (zh) * 2009-02-25 2012-01-25 吉坤日矿日石金属株式会社 耐热老化特性优良的金属包覆聚酰亚胺树脂基板
JPWO2010098235A1 (ja) * 2009-02-25 2012-08-30 Jx日鉱日石金属株式会社 耐熱エージング特性に優れた金属被覆ポリイミド樹脂基板
JP2015201658A (ja) * 2010-08-25 2015-11-12 宇部興産株式会社 フレキシブルプリント基板の製法
JP2013159784A (ja) * 2012-02-01 2013-08-19 Toyota Motor Corp めっき処理材の製造方法およびめっき処理材
JP2019173112A (ja) * 2018-03-29 2019-10-10 グリーンケム株式会社 金属メッキ方法

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TW200905014A (en) 2009-02-01
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