WO2008149820A1 - 接着方法並びにそれを用いて作製したバイオケミカルチップ及び光学部品 - Google Patents

接着方法並びにそれを用いて作製したバイオケミカルチップ及び光学部品 Download PDF

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Publication number
WO2008149820A1
WO2008149820A1 PCT/JP2008/060074 JP2008060074W WO2008149820A1 WO 2008149820 A1 WO2008149820 A1 WO 2008149820A1 JP 2008060074 W JP2008060074 W JP 2008060074W WO 2008149820 A1 WO2008149820 A1 WO 2008149820A1
Authority
WO
WIPO (PCT)
Prior art keywords
bonding
optical component
bonding method
bonding surface
component produced
Prior art date
Application number
PCT/JP2008/060074
Other languages
English (en)
French (fr)
Inventor
Kazufumi Ogawa
Original Assignee
Kazufumi Ogawa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kazufumi Ogawa filed Critical Kazufumi Ogawa
Priority to US12/601,748 priority Critical patent/US8404078B2/en
Publication of WO2008149820A1 publication Critical patent/WO2008149820A1/ja
Priority to US13/767,094 priority patent/US8597460B2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/04—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31536—Including interfacial reaction product of adjacent layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

　接着剤を用いず、接合面の微細構造や光学特性を損なうことなく２つの部材を強固に接着することが可能な接着方法、並びにそれを用いて作製されたバイオケミカルチップ及び光学部品を提供する。 　接着方法は、第１の部材２１の第１の接合面１１上に、第１の官能基を有する第１の膜化合物の被膜１３を形成する工程Ａと、第２の部材２２の第２の接合面１２上に、第２の官能基を有する第２の膜化合物の被膜１４を形成する工程Ｂと、 第１及び第２の官能基とのカップリング反応により結合を形成する１又は２以上のカップリング反応基を有するカップリング剤を第１及び第２の官能基と接触させた状態で、第１の接合面１１と第２の接合面１２とを圧着させ、カップリング反応により結合を形成させる工程Ｃとを有する。
PCT/JP2008/060074 2007-05-30 2008-05-30 接着方法並びにそれを用いて作製したバイオケミカルチップ及び光学部品 WO2008149820A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/601,748 US8404078B2 (en) 2007-05-30 2008-05-30 Adhesion method, and biochemical chip and optical component made by the same
US13/767,094 US8597460B2 (en) 2007-05-30 2013-02-14 Adhesion method, and biochemical chip and optical component made by the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007144045A JP5315547B2 (ja) 2007-05-30 2007-05-30 接着方法並びにそれを用いて作製したバイオケミカルチップ及び光学部品
JP2007-144045 2007-05-30

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/601,748 A-371-Of-International US8404078B2 (en) 2007-05-30 2008-05-30 Adhesion method, and biochemical chip and optical component made by the same
US13/767,094 Division US8597460B2 (en) 2007-05-30 2013-02-14 Adhesion method, and biochemical chip and optical component made by the same

Publications (1)

Publication Number Publication Date
WO2008149820A1 true WO2008149820A1 (ja) 2008-12-11

Family

ID=40093638

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060074 WO2008149820A1 (ja) 2007-05-30 2008-05-30 接着方法並びにそれを用いて作製したバイオケミカルチップ及び光学部品

Country Status (3)

Country Link
US (2) US8404078B2 (ja)
JP (1) JP5315547B2 (ja)
WO (1) WO2008149820A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013105574A1 (ja) * 2012-01-13 2013-07-18 国立大学法人九州大学 マイクロ流路デバイス及びその製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2797998A1 (en) * 2011-12-29 2014-11-05 3M Innovative Properties Company Curable polysiloxane composition
JP2017088723A (ja) * 2015-11-09 2017-05-25 日東電工株式会社 接着方法、接着構造体、および、接着キット

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6460680A (en) * 1987-08-31 1989-03-07 Matsushita Electric Ind Co Ltd Bonded assembly
JP2007033167A (ja) * 2005-07-26 2007-02-08 Kagawa Univ バイオケミカルチップとその製造方法
JP2007077429A (ja) * 2005-09-13 2007-03-29 Alps Electric Co Ltd 金属膜を有する基板およびその製造方法、ならびに前記基板を用いた電子部品およびその製造方法
JP2007161912A (ja) * 2005-12-15 2007-06-28 Kagawa Univ 接着方法とそれを用いて製作したバイオケミカルチップと光学部品
JP2007220884A (ja) * 2006-02-16 2007-08-30 Kagawa Univ 電極とその製造方法およびそれを用いたリード配線とその接続方法およびそれらを用いた電子部品と電子機器

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4822426A (en) 1985-11-14 1989-04-18 Toagosei Chemical Industry Co., Ltd. Primer composition useful for application to non-polar on highly crystalline resin substrates
JPH0826289B2 (ja) 1986-06-10 1996-03-13 株式会社スリ−ボンド プライマ−
US5248334A (en) 1988-12-12 1993-09-28 Dow Corning Corporation Primer composition, coating method and coated silicone substrates
JP2813801B2 (ja) 1989-02-01 1998-10-22 鐘淵化学工業株式会社 接着方法
JPH02310527A (ja) 1989-05-26 1990-12-26 Nec Corp 液晶素子の製造方法
JPH05174733A (ja) 1991-12-18 1993-07-13 Matsushita Electric Ind Co Ltd 平板型表示装置用真空容器
JPH0682600A (ja) 1992-09-03 1994-03-22 Fujitsu Ltd 放射線画像変換パネル
US5835256A (en) 1995-06-19 1998-11-10 Reflectivity, Inc. Reflective spatial light modulator with encapsulated micro-mechanical elements
JP4102464B2 (ja) 1997-09-26 2008-06-18 株式会社サカワ 複層異材合せガラス板及びその製造方法
US7307775B2 (en) 2000-12-07 2007-12-11 Texas Instruments Incorporated Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
US20030116273A1 (en) * 2001-10-01 2003-06-26 Koichiro Nakamura Method of bonding an optical part
US20030116860A1 (en) 2001-12-21 2003-06-26 Biju Chandran Semiconductor package with low resistance package-to-die interconnect scheme for reduced die stresses
JP2003246971A (ja) 2002-02-25 2003-09-05 Kansai Tlo Kk 箔状ないし膜状物体の接着方法及びその方法によって得られた衝撃波速度計測用ターゲット
JP2003309227A (ja) 2002-04-17 2003-10-31 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
US7053521B2 (en) 2003-11-10 2006-05-30 General Electric Company Method for enhancing epoxy adhesion to gold surfaces
JP2005221478A (ja) 2004-02-09 2005-08-18 Taisei Plas Co Ltd バイオチップの検出体とその製造方法
JP4667982B2 (ja) 2005-07-04 2011-04-13 株式会社フジクラ 発光素子モジュール、殺菌ランプ装置、紫外線硬化型樹脂硬化用ランプ装置、照明装置、表示装置及び交通信号機
JP5167528B2 (ja) 2005-10-26 2013-03-21 国立大学法人 香川大学 化学吸着溶液

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6460680A (en) * 1987-08-31 1989-03-07 Matsushita Electric Ind Co Ltd Bonded assembly
JP2007033167A (ja) * 2005-07-26 2007-02-08 Kagawa Univ バイオケミカルチップとその製造方法
JP2007077429A (ja) * 2005-09-13 2007-03-29 Alps Electric Co Ltd 金属膜を有する基板およびその製造方法、ならびに前記基板を用いた電子部品およびその製造方法
JP2007161912A (ja) * 2005-12-15 2007-06-28 Kagawa Univ 接着方法とそれを用いて製作したバイオケミカルチップと光学部品
JP2007220884A (ja) * 2006-02-16 2007-08-30 Kagawa Univ 電極とその製造方法およびそれを用いたリード配線とその接続方法およびそれらを用いた電子部品と電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013105574A1 (ja) * 2012-01-13 2013-07-18 国立大学法人九州大学 マイクロ流路デバイス及びその製造方法

Also Published As

Publication number Publication date
JP2008297410A (ja) 2008-12-11
US20130157059A1 (en) 2013-06-20
US20100178514A1 (en) 2010-07-15
US8404078B2 (en) 2013-03-26
JP5315547B2 (ja) 2013-10-16
US8597460B2 (en) 2013-12-03

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