WO2009001773A1 - 接着構造、封止構造及びそれを用いた電子部品、接着方法並びに封止方法 - Google Patents
接着構造、封止構造及びそれを用いた電子部品、接着方法並びに封止方法 Download PDFInfo
- Publication number
- WO2009001773A1 WO2009001773A1 PCT/JP2008/061327 JP2008061327W WO2009001773A1 WO 2009001773 A1 WO2009001773 A1 WO 2009001773A1 JP 2008061327 W JP2008061327 W JP 2008061327W WO 2009001773 A1 WO2009001773 A1 WO 2009001773A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- bonded
- electronic part
- sealed
- part utilizing
- molecules
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
- C04B35/63448—Polymers obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C04B35/63452—Polyepoxides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/04—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass
- C04B37/047—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass by means of an interlayer consisting of an organic adhesive, e.g. phenol resin or pitch
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/48—Organic compounds becoming part of a ceramic after heat treatment, e.g. carbonising phenol resins
- C04B2235/483—Si-containing organic compounds, e.g. silicone resins, (poly)silanes, (poly)siloxanes or (poly)silazanes
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/52—Pre-treatment of the joining surfaces, e.g. cleaning, machining
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
- C09K2323/055—Epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31518—Next to glass or quartz
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Abstract
両接合面の材質が異なっている場合や、接合面の接着剤に対する濡れ性が低い場合にも、接着剤を用いて気密に接着することが可能な接着構造、封止構造及びそれを用いた電子部品、接着方法並びに封止方法を提供する。電子部品等に用いられる封止構造21は、第1の被接着物11上の第1の接合面17と第2の被接着物16上の第2の接合面18とが接着剤の層24を介して接着され、第1及び第2の接合面17、18の一方又は双方の表面には膜化合物の被膜22、23が形成され、膜化合物は分子の一端で表面17、18に結合し、分子の他端に有する官能基で接着剤の分子と結合している。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/664,723 US8366867B2 (en) | 2007-06-25 | 2008-06-20 | Bonded structure, sealed structure, electronic component including the same, bonding method, and sealing method |
US13/732,956 US20130202816A1 (en) | 2007-06-25 | 2013-01-02 | Bonded structure, sealed structure, electronic component including the same, bonding method, and sealing method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007166598A JP2009001754A (ja) | 2007-06-25 | 2007-06-25 | 接着構造、封止構造及びそれを用いた電子部品、接着方法並びに封止方法 |
JP2007-166598 | 2007-06-25 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/732,956 Division US20130202816A1 (en) | 2007-06-25 | 2013-01-02 | Bonded structure, sealed structure, electronic component including the same, bonding method, and sealing method |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009001773A1 true WO2009001773A1 (ja) | 2008-12-31 |
Family
ID=40185590
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/061327 WO2009001773A1 (ja) | 2007-06-25 | 2008-06-20 | 接着構造、封止構造及びそれを用いた電子部品、接着方法並びに封止方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US8366867B2 (ja) |
JP (1) | JP2009001754A (ja) |
WO (1) | WO2009001773A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015151222A1 (ja) * | 2014-03-31 | 2015-10-08 | リンテック株式会社 | 両面粘着シート |
KR102448682B1 (ko) * | 2017-09-25 | 2022-09-29 | 삼성전자주식회사 | 지문인식 패키지 및 그 제조방법 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62289280A (ja) * | 1986-06-10 | 1987-12-16 | Three Bond Co Ltd | プライマ− |
JPS6460680A (en) * | 1987-08-31 | 1989-03-07 | Matsushita Electric Ind Co Ltd | Bonded assembly |
JPH02212577A (ja) * | 1988-12-12 | 1990-08-23 | Dow Corning Corp | プライマー組成物、コーティング方法及びコーティングされたシリコーン基材 |
JPH02310527A (ja) * | 1989-05-26 | 1990-12-26 | Nec Corp | 液晶素子の製造方法 |
JPH0682600A (ja) * | 1992-09-03 | 1994-03-22 | Fujitsu Ltd | 放射線画像変換パネル |
JPH11100238A (ja) * | 1997-09-26 | 1999-04-13 | Daito Chemitronics Kk | 複層異材合せガラス板及びその製造方法 |
JP2003309227A (ja) * | 2002-04-17 | 2003-10-31 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JP2005139458A (ja) * | 2003-11-10 | 2005-06-02 | General Electric Co <Ge> | 金表面へのエポキシ接着を強化する方法 |
JP2007117826A (ja) * | 2005-10-26 | 2007-05-17 | Kagawa Univ | 化学吸着溶液 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4109818A (en) * | 1975-06-03 | 1978-08-29 | Semi-Alloys, Inc. | Hermetic sealing cover for a container for semiconductor devices |
US4822426A (en) * | 1985-11-14 | 1989-04-18 | Toagosei Chemical Industry Co., Ltd. | Primer composition useful for application to non-polar on highly crystalline resin substrates |
JP2813801B2 (ja) * | 1989-02-01 | 1998-10-22 | 鐘淵化学工業株式会社 | 接着方法 |
JPH05174733A (ja) | 1991-12-18 | 1993-07-13 | Matsushita Electric Ind Co Ltd | 平板型表示装置用真空容器 |
JP3424835B2 (ja) * | 1991-12-27 | 2003-07-07 | 松下電器産業株式会社 | カラー固体撮像装置およびカラーフィルタ |
US5835256A (en) | 1995-06-19 | 1998-11-10 | Reflectivity, Inc. | Reflective spatial light modulator with encapsulated micro-mechanical elements |
JP4007626B2 (ja) * | 1996-03-06 | 2007-11-14 | 日本パーカライジング株式会社 | 接着耐久性増進用水性金属表面前処理剤組成物 |
JP4614214B2 (ja) * | 1999-12-02 | 2011-01-19 | 信越化学工業株式会社 | 半導体装置素子用中空パッケージ |
US7307775B2 (en) | 2000-12-07 | 2007-12-11 | Texas Instruments Incorporated | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
US6656313B2 (en) * | 2001-06-11 | 2003-12-02 | International Business Machines Corporation | Structure and method for improved adhesion between two polymer films |
KR100896858B1 (ko) * | 2001-09-28 | 2009-05-12 | 스미토모 베이클리트 컴퍼니 리미티드 | 에폭시 수지 조성물 및 반도체 장치 |
US20030116273A1 (en) * | 2001-10-01 | 2003-06-26 | Koichiro Nakamura | Method of bonding an optical part |
US20030116860A1 (en) * | 2001-12-21 | 2003-06-26 | Biju Chandran | Semiconductor package with low resistance package-to-die interconnect scheme for reduced die stresses |
US20060283546A1 (en) * | 2003-11-12 | 2006-12-21 | Tremel James D | Method for encapsulating electronic devices and a sealing assembly for the electronic devices |
JP2006220190A (ja) * | 2005-02-09 | 2006-08-24 | Kurashiki Kako Co Ltd | 防振構造体の製造方法 |
JP4667982B2 (ja) | 2005-07-04 | 2011-04-13 | 株式会社フジクラ | 発光素子モジュール、殺菌ランプ装置、紫外線硬化型樹脂硬化用ランプ装置、照明装置、表示装置及び交通信号機 |
-
2007
- 2007-06-25 JP JP2007166598A patent/JP2009001754A/ja active Pending
-
2008
- 2008-06-20 US US12/664,723 patent/US8366867B2/en not_active Expired - Fee Related
- 2008-06-20 WO PCT/JP2008/061327 patent/WO2009001773A1/ja active Application Filing
-
2013
- 2013-01-02 US US13/732,956 patent/US20130202816A1/en not_active Abandoned
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62289280A (ja) * | 1986-06-10 | 1987-12-16 | Three Bond Co Ltd | プライマ− |
JPS6460680A (en) * | 1987-08-31 | 1989-03-07 | Matsushita Electric Ind Co Ltd | Bonded assembly |
JPH02212577A (ja) * | 1988-12-12 | 1990-08-23 | Dow Corning Corp | プライマー組成物、コーティング方法及びコーティングされたシリコーン基材 |
JPH02310527A (ja) * | 1989-05-26 | 1990-12-26 | Nec Corp | 液晶素子の製造方法 |
JPH0682600A (ja) * | 1992-09-03 | 1994-03-22 | Fujitsu Ltd | 放射線画像変換パネル |
JPH11100238A (ja) * | 1997-09-26 | 1999-04-13 | Daito Chemitronics Kk | 複層異材合せガラス板及びその製造方法 |
JP2003309227A (ja) * | 2002-04-17 | 2003-10-31 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JP2005139458A (ja) * | 2003-11-10 | 2005-06-02 | General Electric Co <Ge> | 金表面へのエポキシ接着を強化する方法 |
JP2007117826A (ja) * | 2005-10-26 | 2007-05-17 | Kagawa Univ | 化学吸着溶液 |
Also Published As
Publication number | Publication date |
---|---|
US20100181090A1 (en) | 2010-07-22 |
US20130202816A1 (en) | 2013-08-08 |
US8366867B2 (en) | 2013-02-05 |
JP2009001754A (ja) | 2009-01-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2009049651A8 (en) | An adhesive tape | |
WO2007149377A3 (en) | Epoxy adhesive composition and use thereof | |
WO2006028672A3 (en) | Edge coating fro honeycomb used in panels with composite face sheets | |
WO2007127681A3 (en) | Adhesive formulation for vacuum forming applications | |
JP2009074002A5 (ja) | ||
WO2009078787A3 (en) | Surgical tape | |
WO2008024739A3 (en) | Elastic composite | |
ATE428741T1 (de) | Primerzusammensetzung | |
WO2010011710A3 (en) | Two-part epoxy-based structural adhesives | |
TW200746506A (en) | Laminate packing material for battery and laminate battery | |
WO2009013968A1 (ja) | 接着フィルム、接続方法及び接合体 | |
WO2008094758A8 (en) | Method of bonding perfluoroelastomeric materials to a surface | |
WO2005123387A3 (en) | Electro-active adhesive systems | |
MX2008015176A (es) | Adhesivo de fusion en caliente con buena adhesion a poliolefinas. | |
UA88067C2 (ru) | Способ изготовления обеспеченного печатным изображением или декоративного формованного или фасонного изделия и изделие (варианты) | |
MY140916A (en) | Rubber-modified edge coating for honeycomb used in panels with composite face sheets | |
WO2008052209A3 (en) | Polymeric composite adhesive tape | |
RU2008134329A (ru) | Поверхностное уплотнение и способ создания уплотненных соединений с использованием этого поверхностного уплотнения | |
WO2012027377A3 (en) | Double-sided multi-layer adhesive | |
WO2007079366A3 (en) | Method for improving glass bond adhesion | |
WO2017137796A8 (ja) | 接着性樹脂組成物、被着体接着方法、及び接着性樹脂フィルム | |
TW200700233A (en) | Optical low-pass filter | |
EP2584014A3 (en) | Method for joining aluminum part and resin and composite made by same | |
WO2006104625A3 (en) | Activator means for pre-applied adhesives | |
EP2154710A3 (en) | Substrate joining method and 3-D semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08777471 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12664723 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 08777471 Country of ref document: EP Kind code of ref document: A1 |