JPS6460680A - Bonded assembly - Google Patents
Bonded assemblyInfo
- Publication number
- JPS6460680A JPS6460680A JP21685487A JP21685487A JPS6460680A JP S6460680 A JPS6460680 A JP S6460680A JP 21685487 A JP21685487 A JP 21685487A JP 21685487 A JP21685487 A JP 21685487A JP S6460680 A JPS6460680 A JP S6460680A
- Authority
- JP
- Japan
- Prior art keywords
- adherend
- inorg
- org
- chemically adsorbed
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
PURPOSE:To provide a bonded assembly having remarkaly improved adhesion, heat resistance and moisture resistance, by preliminarily forming a chemically adsorbed monomolecular film on the surface, on the bonding side, of an inorg. adherend prior to bonding the inorg. adherend to other adherend with an org. adhesive therebetween. CONSTITUTION:An inorg. adherend prepd. by washing the surface of an inorg. material as an adherend with an acid, pure water, an org. solvent or the like and drying the material is dipped in a solution of a substance, to be formed into a chemically adsorbed film, to form on the surface of the adherend a chemically adsorbed monomolecular film of, for example, linear molecules having an inorg. reactive group at one terminal and an org. reactive group at the other terminal. An org. adhesive 3 comprising a urethene, acrylic, epoxy or the like resin is sandwiched between inorg. adherends 1 each having a chemically adsorbed film 2 formed on the surface thereof or between such an inorg. adherend 1 and other adherend to effect bonding thereof.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21685487A JPS6460680A (en) | 1987-08-31 | 1987-08-31 | Bonded assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21685487A JPS6460680A (en) | 1987-08-31 | 1987-08-31 | Bonded assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6460680A true JPS6460680A (en) | 1989-03-07 |
Family
ID=16694945
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21685487A Pending JPS6460680A (en) | 1987-08-31 | 1987-08-31 | Bonded assembly |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6460680A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007161912A (en) * | 2005-12-15 | 2007-06-28 | Kagawa Univ | Adhesion method and biochemical chip produced by the method and optical part |
WO2008149820A1 (en) * | 2007-05-30 | 2008-12-11 | Kazufumi Ogawa | Bonding method, and biochemical chip and optical component produced by the method |
WO2009001773A1 (en) * | 2007-06-25 | 2008-12-31 | Kazufumi Ogawa | Bonded structure or sealed structure, and bonding method or sealing method and electronic part utilizing the structure |
US7824159B2 (en) | 2004-01-14 | 2010-11-02 | Ishikawajima-Harima Heavy Industries Co., Ltd. | Compressor, titanium-made rotor blade, jet engine and titanium-made rotor blade producing method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5130890A (en) * | 1974-09-10 | 1976-03-16 | Japan Synthetic Rubber Co Ltd | Ketsushosei 1 22 horiputajen no seizoho |
JPS6054845A (en) * | 1983-09-06 | 1985-03-29 | 東洋製罐株式会社 | Adherent structure |
-
1987
- 1987-08-31 JP JP21685487A patent/JPS6460680A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5130890A (en) * | 1974-09-10 | 1976-03-16 | Japan Synthetic Rubber Co Ltd | Ketsushosei 1 22 horiputajen no seizoho |
JPS6054845A (en) * | 1983-09-06 | 1985-03-29 | 東洋製罐株式会社 | Adherent structure |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7824159B2 (en) | 2004-01-14 | 2010-11-02 | Ishikawajima-Harima Heavy Industries Co., Ltd. | Compressor, titanium-made rotor blade, jet engine and titanium-made rotor blade producing method |
JP2007161912A (en) * | 2005-12-15 | 2007-06-28 | Kagawa Univ | Adhesion method and biochemical chip produced by the method and optical part |
WO2008149820A1 (en) * | 2007-05-30 | 2008-12-11 | Kazufumi Ogawa | Bonding method, and biochemical chip and optical component produced by the method |
JP2008297410A (en) * | 2007-05-30 | 2008-12-11 | Kagawa Univ | Bonding method, biochemical chip manufactured by using the same and optical component |
US8404078B2 (en) | 2007-05-30 | 2013-03-26 | Empire Technology Development Llc | Adhesion method, and biochemical chip and optical component made by the same |
US8597460B2 (en) | 2007-05-30 | 2013-12-03 | Empire Technology Development Llc | Adhesion method, and biochemical chip and optical component made by the same |
WO2009001773A1 (en) * | 2007-06-25 | 2008-12-31 | Kazufumi Ogawa | Bonded structure or sealed structure, and bonding method or sealing method and electronic part utilizing the structure |
JP2009001754A (en) * | 2007-06-25 | 2009-01-08 | Kagawa Univ | Adhesion structure, sealing structure, and electronic component, adhesive method and sealing method using the same |
US8366867B2 (en) | 2007-06-25 | 2013-02-05 | Empire Technology Development Llc | Bonded structure, sealed structure, electronic component including the same, bonding method, and sealing method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5770520A (en) | Liquid crystal element | |
EP1553126A4 (en) | Stretched resin film and label comprising the same | |
DE59407899D1 (en) | Device for connecting hollow profiles, preferably made of metal | |
JPS6460680A (en) | Bonded assembly | |
JPS6422542A (en) | Composite material consisting of aluminum and glass fiber and manufacture thereof | |
JPS6459786A (en) | Connection member of circuit | |
GB2014170A (en) | Hot melt adhesive and method of bonding adherends | |
TR27596A (en) | Method and equipment for the production of electrodes. | |
JPS54111534A (en) | Bonding of two-part adhesive | |
DE3660340D1 (en) | Process for manufacturing impregnatable thin mica strips containing an accelerator | |
ATE60076T1 (en) | COATING OF MOVING SUBSTRATES. | |
JPS57138064A (en) | Optical disc medium | |
CN208700958U (en) | Adhesive tape structure with anti-static function | |
EP0186080A3 (en) | Method of making an adhesive item showing a thermoplastic activity, and method of using the same | |
Hahn et al. | Adhesive Bonds: Influence of the Structure of the Adhesive Layer | |
WHITE et al. | Method of bonding plasticized elastomer to metal and articles produced thereby[Patent] | |
JPS5472284A (en) | Laminating honeycomb construction core material | |
SU505670A1 (en) | Glue | |
JPS5438336A (en) | Bonding method | |
JPS57152157A (en) | Semiconductor device | |
JPS5740577A (en) | Fluorine type synthetic resin film having bonding adaptability | |
JPS6445780A (en) | Method for bonding material having different thermal expansion coefficients | |
JPS52146444A (en) | Method for bonding | |
JPS57177024A (en) | Bonding of polyethylene molded article with metal | |
AU599205C (en) | Heat-meltable polymer for use as adhesive agent, method for manufacturing the same and application thereof to the glueing of substrate materials |