JPS6460680A - Bonded assembly - Google Patents

Bonded assembly

Info

Publication number
JPS6460680A
JPS6460680A JP21685487A JP21685487A JPS6460680A JP S6460680 A JPS6460680 A JP S6460680A JP 21685487 A JP21685487 A JP 21685487A JP 21685487 A JP21685487 A JP 21685487A JP S6460680 A JPS6460680 A JP S6460680A
Authority
JP
Japan
Prior art keywords
adherend
inorg
org
chemically adsorbed
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21685487A
Other languages
Japanese (ja)
Inventor
Takao Ochi
Hiroaki Fujimoto
Kenzo Hatada
Hideji Tamura
Kazufumi Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP21685487A priority Critical patent/JPS6460680A/en
Publication of JPS6460680A publication Critical patent/JPS6460680A/en
Pending legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Joining Of Glass To Other Materials (AREA)

Abstract

PURPOSE:To provide a bonded assembly having remarkaly improved adhesion, heat resistance and moisture resistance, by preliminarily forming a chemically adsorbed monomolecular film on the surface, on the bonding side, of an inorg. adherend prior to bonding the inorg. adherend to other adherend with an org. adhesive therebetween. CONSTITUTION:An inorg. adherend prepd. by washing the surface of an inorg. material as an adherend with an acid, pure water, an org. solvent or the like and drying the material is dipped in a solution of a substance, to be formed into a chemically adsorbed film, to form on the surface of the adherend a chemically adsorbed monomolecular film of, for example, linear molecules having an inorg. reactive group at one terminal and an org. reactive group at the other terminal. An org. adhesive 3 comprising a urethene, acrylic, epoxy or the like resin is sandwiched between inorg. adherends 1 each having a chemically adsorbed film 2 formed on the surface thereof or between such an inorg. adherend 1 and other adherend to effect bonding thereof.
JP21685487A 1987-08-31 1987-08-31 Bonded assembly Pending JPS6460680A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21685487A JPS6460680A (en) 1987-08-31 1987-08-31 Bonded assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21685487A JPS6460680A (en) 1987-08-31 1987-08-31 Bonded assembly

Publications (1)

Publication Number Publication Date
JPS6460680A true JPS6460680A (en) 1989-03-07

Family

ID=16694945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21685487A Pending JPS6460680A (en) 1987-08-31 1987-08-31 Bonded assembly

Country Status (1)

Country Link
JP (1) JPS6460680A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007161912A (en) * 2005-12-15 2007-06-28 Kagawa Univ Adhesion method and biochemical chip produced by the method and optical part
WO2008149820A1 (en) * 2007-05-30 2008-12-11 Kazufumi Ogawa Bonding method, and biochemical chip and optical component produced by the method
WO2009001773A1 (en) * 2007-06-25 2008-12-31 Kazufumi Ogawa Bonded structure or sealed structure, and bonding method or sealing method and electronic part utilizing the structure
US7824159B2 (en) 2004-01-14 2010-11-02 Ishikawajima-Harima Heavy Industries Co., Ltd. Compressor, titanium-made rotor blade, jet engine and titanium-made rotor blade producing method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5130890A (en) * 1974-09-10 1976-03-16 Japan Synthetic Rubber Co Ltd Ketsushosei 1 22 horiputajen no seizoho
JPS6054845A (en) * 1983-09-06 1985-03-29 東洋製罐株式会社 Adherent structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5130890A (en) * 1974-09-10 1976-03-16 Japan Synthetic Rubber Co Ltd Ketsushosei 1 22 horiputajen no seizoho
JPS6054845A (en) * 1983-09-06 1985-03-29 東洋製罐株式会社 Adherent structure

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7824159B2 (en) 2004-01-14 2010-11-02 Ishikawajima-Harima Heavy Industries Co., Ltd. Compressor, titanium-made rotor blade, jet engine and titanium-made rotor blade producing method
JP2007161912A (en) * 2005-12-15 2007-06-28 Kagawa Univ Adhesion method and biochemical chip produced by the method and optical part
WO2008149820A1 (en) * 2007-05-30 2008-12-11 Kazufumi Ogawa Bonding method, and biochemical chip and optical component produced by the method
JP2008297410A (en) * 2007-05-30 2008-12-11 Kagawa Univ Bonding method, biochemical chip manufactured by using the same and optical component
US8404078B2 (en) 2007-05-30 2013-03-26 Empire Technology Development Llc Adhesion method, and biochemical chip and optical component made by the same
US8597460B2 (en) 2007-05-30 2013-12-03 Empire Technology Development Llc Adhesion method, and biochemical chip and optical component made by the same
WO2009001773A1 (en) * 2007-06-25 2008-12-31 Kazufumi Ogawa Bonded structure or sealed structure, and bonding method or sealing method and electronic part utilizing the structure
JP2009001754A (en) * 2007-06-25 2009-01-08 Kagawa Univ Adhesion structure, sealing structure, and electronic component, adhesive method and sealing method using the same
US8366867B2 (en) 2007-06-25 2013-02-05 Empire Technology Development Llc Bonded structure, sealed structure, electronic component including the same, bonding method, and sealing method

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