WO2008143191A1 - Ｍｅｍｓセンサおよびその製造方法 - Google Patents

Ｍｅｍｓセンサおよびその製造方法 Download PDF

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Publication number
WO2008143191A1
WO2008143191A1 PCT/JP2008/059078 JP2008059078W WO2008143191A1 WO 2008143191 A1 WO2008143191 A1 WO 2008143191A1 JP 2008059078 W JP2008059078 W JP 2008059078W WO 2008143191 A1 WO2008143191 A1 WO 2008143191A1
Authority
WO
WIPO (PCT)
Prior art keywords
manufacturing
same
mems sensor
base layer
deformation part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/059078
Other languages
English (en)
French (fr)
Inventor
Goro Nakatani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to US12/451,497 priority Critical patent/US20100116057A1/en
Priority to JP2009515218A priority patent/JPWO2008143191A1/ja
Publication of WO2008143191A1 publication Critical patent/WO2008143191A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/00468—Releasing structures
    • B81C1/00476—Releasing structures removing a sacrificial layer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0118—Cantilevers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
    • G01P2015/0842—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass the mass being of clover leaf shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Gyroscopes (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

　本発明のＭＥＭＳ（Micro Electro Mechanical Systems）センサは、基層と、前記基層上に前記基層と間隔を空けて設けられ、外力により変形する変形部とを備える。前記変形部は、有機材料からなる。
PCT/JP2008/059078 2007-05-17 2008-05-16 Ｍｅｍｓセンサおよびその製造方法 Ceased WO2008143191A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/451,497 US20100116057A1 (en) 2007-05-17 2008-05-16 Mems sensor and method of manufacturing the same
JP2009515218A JPWO2008143191A1 (ja) 2007-05-17 2008-05-16 Ｍｅｍｓセンサおよびその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007131831 2007-05-17
JP2007-131831 2007-05-17

Publications (1)

Publication Number Publication Date
WO2008143191A1 true WO2008143191A1 (ja) 2008-11-27

Family

ID=40031892

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059078 Ceased WO2008143191A1 (ja) 2007-05-17 2008-05-16 Ｍｅｍｓセンサおよびその製造方法

Country Status (3)

Country Link
US (1) US20100116057A1 (ja)
JP (1) JPWO2008143191A1 (ja)
WO (1) WO2008143191A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101825902B1 (ko) * 2010-03-18 2018-02-06 로베르트 보쉬 게엠베하 피에조 저항성 마이크로메커니컬 센서 소자 및 측정 방법

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102275860B (zh) * 2010-06-11 2014-12-31 张家港丽恒光微电子科技有限公司 惯性微机电传感器的制造方法
WO2011161917A1 (ja) * 2010-06-25 2011-12-29 パナソニック株式会社 加速度センサ
DE102011119349A1 (de) * 2011-11-25 2013-05-29 Bizerba Gmbh & Co. Kg Verfahren zur Herstellung eines Dünnschichtsensorelements
US9462389B2 (en) * 2013-08-06 2016-10-04 Goertek Inc. Anti-impact silicon based MEMS microphone, a system and a package with the same
US11186481B2 (en) * 2017-11-30 2021-11-30 Taiwan Semiconductor Manufacturing Company, Ltd. Sensor device and manufacturing method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0798328A (ja) * 1993-09-28 1995-04-11 Mazda Motor Corp 半導体センサ
JPH07167885A (ja) * 1993-12-13 1995-07-04 Omron Corp 半導体加速度センサ及びその製造方法、ならびに当該半導体加速度センサによる加速度検出方式
JPH0843434A (ja) * 1994-07-28 1996-02-16 Matsushita Electric Ind Co Ltd 力学量センサおよびその製造方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5241864A (en) * 1992-06-17 1993-09-07 Motorola, Inc. Double pinned sensor utilizing a tensile film
JP3536544B2 (ja) * 1996-09-05 2004-06-14 株式会社デンソー 半導体力学量センサの製造方法
JP3328575B2 (ja) * 1998-03-25 2002-09-24 日本碍子株式会社 加速度センサ素子、加速度センサ及びこれらの製造方法
DE19844686A1 (de) * 1998-09-29 2000-04-06 Fraunhofer Ges Forschung Mikromechanischer Drehratensensor und Verfahren zur Herstellung
US7154372B2 (en) * 2001-01-10 2006-12-26 Sensirion Ag Micromechanical flow sensor with tensile coating
JP2002357619A (ja) * 2001-06-01 2002-12-13 Mitsubishi Electric Corp 加速度センサ及びその製造方法
JP4216525B2 (ja) * 2002-05-13 2009-01-28 株式会社ワコー 加速度センサおよびその製造方法
US20040007063A1 (en) * 2002-05-29 2004-01-15 California Institute Of Technology Micro machined polymer beam structure method and resulting device for spring applications
JP2004045269A (ja) * 2002-07-12 2004-02-12 Mitsubishi Electric Corp 容量式加速度センサ
US7367232B2 (en) * 2004-01-24 2008-05-06 Vladimir Vaganov System and method for a three-axis MEMS accelerometer
JP4272115B2 (ja) * 2004-06-03 2009-06-03 Ｏｋｉセミコンダクタ株式会社 加速度センサ及びその製造方法
US7540198B2 (en) * 2004-06-15 2009-06-02 Canon Kabushiki Kaisha Semiconductor device
JP2006133192A (ja) * 2004-11-09 2006-05-25 Nippon Soken Inc 静電容量式湿度センサおよびその製造方法
JP4553720B2 (ja) * 2004-12-21 2010-09-29 Ｏｋｉセミコンダクタ株式会社 半導体装置及びその製造方法
JP2006250653A (ja) * 2005-03-09 2006-09-21 Ricoh Co Ltd 半導体センサの製造方法
JP2006295149A (ja) * 2005-03-18 2006-10-26 Citizen Watch Co Ltd 機械・電気変換器とその製造方法
US7461559B2 (en) * 2005-03-18 2008-12-09 Citizen Holdings Co., Ltd. Electromechanical transducer and method of fabricating the same
US7977757B2 (en) * 2005-05-19 2011-07-12 Rohm Co., Ltd. MEMS element, MEMS device and MEMS element manufacturing method
JP5008834B2 (ja) * 2005-05-19 2012-08-22 ローム株式会社 Ｍｅｍｓ素子およびその製造方法
US7481113B2 (en) * 2005-07-27 2009-01-27 Ricoh Company, Ltd. Semiconductor sensor with projection for preventing proof mass from sticking to cover plate
JP4688600B2 (ja) * 2005-07-29 2011-05-25 株式会社リコー 半導体センサの製造方法
US7562575B2 (en) * 2005-08-05 2009-07-21 Hitachi Metals, Ltd. Impact-resistant acceleration sensor
US7652575B2 (en) * 2005-10-27 2010-01-26 Hewlett-Packard Development Company, L.P. Monitoring of packages
JP5195102B2 (ja) * 2008-07-11 2013-05-08 大日本印刷株式会社 センサおよびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0798328A (ja) * 1993-09-28 1995-04-11 Mazda Motor Corp 半導体センサ
JPH07167885A (ja) * 1993-12-13 1995-07-04 Omron Corp 半導体加速度センサ及びその製造方法、ならびに当該半導体加速度センサによる加速度検出方式
JPH0843434A (ja) * 1994-07-28 1996-02-16 Matsushita Electric Ind Co Ltd 力学量センサおよびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101825902B1 (ko) * 2010-03-18 2018-02-06 로베르트 보쉬 게엠베하 피에조 저항성 마이크로메커니컬 센서 소자 및 측정 방법

Also Published As

Publication number Publication date
US20100116057A1 (en) 2010-05-13
JPWO2008143191A1 (ja) 2010-08-05

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