WO2008136272A1 - ハイドロタルサイト化合物およびその製造方法、無機イオン捕捉剤、組成物、電子部品封止用樹脂組成物 - Google Patents

ハイドロタルサイト化合物およびその製造方法、無機イオン捕捉剤、組成物、電子部品封止用樹脂組成物 Download PDF

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WO2008136272A1
WO2008136272A1 PCT/JP2008/057450 JP2008057450W WO2008136272A1 WO 2008136272 A1 WO2008136272 A1 WO 2008136272A1 JP 2008057450 W JP2008057450 W JP 2008057450W WO 2008136272 A1 WO2008136272 A1 WO 2008136272A1
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hydrotalcite compound
composition
inorganic ion
ion scavenger
producing
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Ceased
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PCT/JP2008/057450
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French (fr)
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Yasuharu Ono
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Toagosei Co Ltd
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Toagosei Co Ltd
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Priority to KR1020097024534A priority Critical patent/KR101484343B1/ko
Priority to US12/597,383 priority patent/US20100123101A1/en
Priority to JP2009512920A priority patent/JP5126223B2/ja
Publication of WO2008136272A1 publication Critical patent/WO2008136272A1/ja
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F7/00—Compounds of aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F7/00—Compounds of aluminium
    • C01F7/78—Compounds containing aluminium, with or without oxygen or hydrogen, and containing two or more other elements
    • C01F7/784—Layered double hydroxide, e.g. comprising nitrate, sulfate or carbonate ions as intercalating anions
    • C01F7/785—Hydrotalcite
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/20—Two-dimensional structures
    • C01P2002/22—Two-dimensional structures layered hydroxide-type, e.g. of the hydrotalcite-type
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/72—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by d-values or two theta-values, e.g. as X-ray diagram
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Nanotechnology (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

　本発明は環境に優しく、少量の添加により優れた金属腐食防止効果を奏する新規なハイドロタルサイト化合物およびこれを用いた無機イオン捕捉剤であり、ハイドロタルサイト化合物は粉末Ｘ線回折パターンにおいてハイドロタルサイト化合物のピークを有し、２θ＝１１．４°～１１．７°におけるピーク強度が３，５００ｃｐｓ以上であり、かつ、ＢＥＴ比表面積が３０ｍ2／ｇを超えることを特徴とする、式（１）で表されるものである。 　ＭｇaＡｌb（ＯＨ）c（ＣＯ3）d・ｎＨ2Ｏ　（１） 　式（１）において、ａ、ｂ、ｃ、およびｄは正数であり、２ａ＋３ｂ－ｃ－２ｄ＝０を満たす。また、ｎは水和の数を示し、０または正数である。
PCT/JP2008/057450 2007-04-26 2008-04-16 ハイドロタルサイト化合物およびその製造方法、無機イオン捕捉剤、組成物、電子部品封止用樹脂組成物 Ceased WO2008136272A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020097024534A KR101484343B1 (ko) 2007-04-26 2008-04-16 하이드로탈사이트 화합물 및 그 제조 방법, 무기 이온 포착제, 조성물, 전자 부품 밀봉용 수지 조성물
US12/597,383 US20100123101A1 (en) 2007-04-26 2008-04-16 Hydrotalcite compound, process for producing same, inorganic ion scavenger, composition, and electronic component-sealing resin composition
JP2009512920A JP5126223B2 (ja) 2007-04-26 2008-04-16 ハイドロタルサイト化合物およびその製造方法、無機イオン捕捉剤、組成物、電子部品封止用樹脂組成物

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Application Number Priority Date Filing Date Title
JP2007-116787 2007-04-26
JP2007116787 2007-04-26

Publications (1)

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WO2008136272A1 true WO2008136272A1 (ja) 2008-11-13

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PCT/JP2008/057450 Ceased WO2008136272A1 (ja) 2007-04-26 2008-04-16 ハイドロタルサイト化合物およびその製造方法、無機イオン捕捉剤、組成物、電子部品封止用樹脂組成物

Country Status (6)

Country Link
US (1) US20100123101A1 (ja)
JP (1) JP5126223B2 (ja)
KR (1) KR101484343B1 (ja)
CN (1) CN101668702A (ja)
TW (1) TWI439420B (ja)
WO (1) WO2008136272A1 (ja)

Cited By (12)

* Cited by examiner, † Cited by third party
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JP2009029919A (ja) * 2007-07-26 2009-02-12 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物および半導体装置
CN102369458A (zh) * 2009-04-03 2012-03-07 株式会社岛津制作所 放射线检测器以及具备该放射线检测器的放射线摄影装置
GB2483801A (en) * 2010-09-17 2012-03-21 Magnesium Elektron Ltd Synthetic hydrotalcite
US20140039094A1 (en) * 2010-05-21 2014-02-06 Taiwan Union Technology Corporation Epoxy resin composition, and prepreg and printed circuit board using the same
JP2016511300A (ja) * 2013-01-17 2016-04-14 ビーエーエスエフ コーティングス ゲゼルシャフト ミット ベシュレンクテル ハフツングＢＡＳＦ Ｃｏａｔｉｎｇｓ ＧｍｂＨ 防食被膜の製造方法
WO2017150300A1 (ja) * 2016-02-29 2017-09-08 日本ゼオン株式会社 ポリエーテルゴムの製造方法
WO2017209047A1 (ja) * 2016-05-30 2017-12-07 日立化成株式会社 封止組成物及び半導体装置
CN108516707A (zh) * 2018-01-30 2018-09-11 武汉理工大学 一种离子固化剂及赤泥粉煤灰胶凝材料
WO2018169019A1 (ja) * 2017-03-17 2018-09-20 協和化学工業株式会社 微粒子ハイドロタルサイト、その製造方法、その樹脂組成物、及びその懸濁液
WO2018168496A1 (ja) * 2017-03-17 2018-09-20 堺化学工業株式会社 ハイドロタルサイト類組成物、および、該組成物を含む樹脂添加剤
JP2018534222A (ja) * 2015-09-24 2018-11-22 ダンスク インダストリアル シー・オー エル・ティー・ディーＤａｎｓｕｋ Ｉｎｄｕｓｔｒｉａｌ Ｃｏ．， Ｌｔｄ． ハイドロタルサイト及びその製造方法
JP2019210165A (ja) * 2018-05-31 2019-12-12 協和化学工業株式会社 ハイドロタルサイト、その製造方法、農業用フィルム用保温剤および農業用フィルム

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CN102530881A (zh) * 2012-01-05 2012-07-04 河南工业大学 层间距可调的高纯度水滑石类化合物的简单制备方法
US8872358B2 (en) * 2012-02-07 2014-10-28 Shin-Etsu Chemical Co., Ltd. Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus
RU2600378C2 (ru) * 2012-03-26 2016-10-20 Киова Кемикал Индастри Ко., Лтд. Мелкие частицы гидроталькита
WO2015068787A1 (ja) * 2013-11-08 2015-05-14 味の素株式会社 ハイドロタルサイトを含有する封止用樹脂組成物及び封止用シート
JP6369475B2 (ja) 2013-11-08 2018-08-08 味の素株式会社 封止用樹脂組成物及び封止用シート
JP5648169B1 (ja) * 2014-01-20 2015-01-07 東洋インキＳｃホールディングス株式会社 太陽電池封止材用樹脂組成物および太陽電池封止材
WO2017052333A1 (ko) * 2015-09-24 2017-03-30 주식회사 단석산업 하이드로탈사이트 및 그의 제조방법
CN106373632B (zh) * 2016-08-30 2017-09-12 泉州市真匠体育用品有限公司 含有导电材料的阳极材料
JP2018044029A (ja) * 2016-09-12 2018-03-22 戸田工業株式会社 白色顔料溶剤系分散体、および、それを用いた塗膜体
JP7760845B2 (ja) * 2021-06-25 2025-10-28 堺化学工業株式会社 ハイドロタルサイト及びそれを含む硫化水素吸収剤、硫化物型全固体電池外装材、硫化物型全固体電池
CN118546431A (zh) * 2024-07-26 2024-08-27 世京(德州)新型材料科技有限公司 一种氨纶专用特殊粒径水滑石及其制备方法

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Publication number Priority date Publication date Assignee Title
JP2009029919A (ja) * 2007-07-26 2009-02-12 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物および半導体装置
CN102369458A (zh) * 2009-04-03 2012-03-07 株式会社岛津制作所 放射线检测器以及具备该放射线检测器的放射线摄影装置
US8466534B2 (en) 2009-04-03 2013-06-18 Shimadzu Corporation Radiation detector, and a radiographic apparatus having the same
US20140039094A1 (en) * 2010-05-21 2014-02-06 Taiwan Union Technology Corporation Epoxy resin composition, and prepreg and printed circuit board using the same
GB2483801A (en) * 2010-09-17 2012-03-21 Magnesium Elektron Ltd Synthetic hydrotalcite
GB2483801B (en) * 2010-09-17 2017-06-14 Magnesium Elektron Ltd Hydrotalcite-containing compositions for CO2 capture
JP2016511300A (ja) * 2013-01-17 2016-04-14 ビーエーエスエフ コーティングス ゲゼルシャフト ミット ベシュレンクテル ハフツングＢＡＳＦ Ｃｏａｔｉｎｇｓ ＧｍｂＨ 防食被膜の製造方法
JP2018534222A (ja) * 2015-09-24 2018-11-22 ダンスク インダストリアル シー・オー エル・ティー・ディーＤａｎｓｕｋ Ｉｎｄｕｓｔｒｉａｌ Ｃｏ．， Ｌｔｄ． ハイドロタルサイト及びその製造方法
JPWO2017150300A1 (ja) * 2016-02-29 2018-12-20 日本ゼオン株式会社 ポリエーテルゴムの製造方法
WO2017150300A1 (ja) * 2016-02-29 2017-09-08 日本ゼオン株式会社 ポリエーテルゴムの製造方法
CN108699235B (zh) * 2016-02-29 2020-12-15 日本瑞翁株式会社 聚醚橡胶的制造方法
CN108699235A (zh) * 2016-02-29 2018-10-23 日本瑞翁株式会社 聚醚橡胶的制造方法
WO2017209047A1 (ja) * 2016-05-30 2017-12-07 日立化成株式会社 封止組成物及び半導体装置
JPWO2017209047A1 (ja) * 2016-05-30 2018-12-20 日立化成株式会社 封止組成物及び半導体装置
JP2020164871A (ja) * 2016-05-30 2020-10-08 日立化成株式会社 封止組成物及び半導体装置
US11854919B2 (en) 2016-05-30 2023-12-26 Resonac Corporation Sealing composition and semiconductor device
WO2018168496A1 (ja) * 2017-03-17 2018-09-20 堺化学工業株式会社 ハイドロタルサイト類組成物、および、該組成物を含む樹脂添加剤
JPWO2018169019A1 (ja) * 2017-03-17 2019-11-21 協和化学工業株式会社 微粒子ハイドロタルサイト、その製造方法、その樹脂組成物、及びその懸濁液
WO2018169019A1 (ja) * 2017-03-17 2018-09-20 協和化学工業株式会社 微粒子ハイドロタルサイト、その製造方法、その樹脂組成物、及びその懸濁液
US11591234B2 (en) 2017-03-17 2023-02-28 Setolas Holdings, Inc. Microparticulate hydrotalcite, method for producing same, resin composition of same, and suspension of same
CN108516707A (zh) * 2018-01-30 2018-09-11 武汉理工大学 一种离子固化剂及赤泥粉煤灰胶凝材料
JP2019210165A (ja) * 2018-05-31 2019-12-12 協和化学工業株式会社 ハイドロタルサイト、その製造方法、農業用フィルム用保温剤および農業用フィルム
JP7099698B2 (ja) 2018-05-31 2022-07-12 協和化学工業株式会社 ハイドロタルサイト、その製造方法、農業用フィルム用保温剤および農業用フィルム

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