WO2008129832A1 - 超音波測定方法及び装置 - Google Patents

超音波測定方法及び装置 Download PDF

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Publication number
WO2008129832A1
WO2008129832A1 PCT/JP2008/000729 JP2008000729W WO2008129832A1 WO 2008129832 A1 WO2008129832 A1 WO 2008129832A1 JP 2008000729 W JP2008000729 W JP 2008000729W WO 2008129832 A1 WO2008129832 A1 WO 2008129832A1
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WIPO (PCT)
Prior art keywords
acceptable
master data
article
observed
corrected
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PCT/JP2008/000729
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English (en)
French (fr)
Inventor
Shinsuke Komatsu
Yoichiro Ueda
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Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to KR1020087023179A priority Critical patent/KR101137141B1/ko
Priority to CN2008800001257A priority patent/CN101542279B/zh
Priority to US12/295,504 priority patent/US8091426B2/en
Priority to JP2008531477A priority patent/JP5154422B2/ja
Publication of WO2008129832A1 publication Critical patent/WO2008129832A1/ja

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4409—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison
    • G01N29/4436—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison with a reference signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
    • G01N29/348—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor with frequency characteristics, e.g. single frequency signals, chirp signals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4445—Classification of defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/46—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by spectral analysis, e.g. Fourier analysis or wavelet analysis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/023—Solids
    • G01N2291/0231—Composite or layered materials

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  • Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Acoustics & Sound (AREA)
  • Mathematical Physics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

　良品の観測対象物（２）の波形信号から作成のマスターデータと未測定の観測対象物から得た波形信号との比較で、観測対象物に発生する時間位相差を補正、さらにマスターデータとの差異を検出する。第１段階として、作成したマスターデータを用いた長区間マスターデータにより未測定の観測対象物に対し良否判定を行い（ステップＳ３１～Ｓ３３）、時間位相差を補正する（ステップＳ３４）。次に、第２段階として、時間軸で分割した短区間マスターデータと、同様に分割した観測対象物の波形信号によって良否判定を行う（ステップＳ３５、Ｓ３６）。これにより、観測対象物（良品と不良品）間に発生する時間位相差を補正し、良品の波形信号との比較によって高精度な良否判定ができる。
PCT/JP2008/000729 2007-03-29 2008-03-26 超音波測定方法及び装置 WO2008129832A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020087023179A KR101137141B1 (ko) 2007-03-29 2008-03-26 초음파 측정 방법 및 장치
CN2008800001257A CN101542279B (zh) 2007-03-29 2008-03-26 超声波测量方法和装置
US12/295,504 US8091426B2 (en) 2007-03-29 2008-03-26 Ultrasonic wave measuring method and apparatus
JP2008531477A JP5154422B2 (ja) 2007-03-29 2008-03-26 超音波測定方法及び装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007087280 2007-03-29
JP2007-087280 2007-03-29

Publications (1)

Publication Number Publication Date
WO2008129832A1 true WO2008129832A1 (ja) 2008-10-30

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ID=39875364

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000729 WO2008129832A1 (ja) 2007-03-29 2008-03-26 超音波測定方法及び装置

Country Status (5)

Country Link
US (1) US8091426B2 (ja)
JP (1) JP5154422B2 (ja)
KR (1) KR101137141B1 (ja)
CN (1) CN101542279B (ja)
WO (1) WO2008129832A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009175136A (ja) * 2007-12-26 2009-08-06 Panasonic Corp 超音波測定方法、電子部品製造方法、及び、半導体パッケージ
JP2011163918A (ja) * 2010-02-09 2011-08-25 Toyota Motor Corp 超音波を用いた接合面検査方法および接合面検査装置
CN102628835A (zh) * 2012-04-19 2012-08-08 迪皮埃复材构件（太仓）有限公司 一种风力发电叶片腹板粘接质量检测系统及方法
JP2014203342A (ja) * 2013-04-08 2014-10-27 中国電力株式会社 作業エリアに存在する危険箇所に関する情報を収集する方法、及び危険箇所情報収集システム
JP2019184449A (ja) * 2018-04-12 2019-10-24 株式会社日立パワーソリューションズ 超音波検査装置及び超音波検査方法
JP2021028632A (ja) * 2019-08-09 2021-02-25 Ntn株式会社 き裂進展試験方法、許容欠陥寸法の算出方法、検査方法および軸受の製造方法
JP2022060449A (ja) * 2017-03-27 2022-04-14 株式会社アミック コンクリート構造物の診断方法及びその診断装置
JP2022526837A (ja) * 2019-04-17 2022-05-26 ディーエムシー グローバル インコーポレイテッド 多層構造の物品における強固な結合と弱い結合の間の結合境界を特定する方法及びシステム

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CA2835899C (en) 2011-05-10 2019-04-16 Edison Welding Institute, Inc. Three-dimensional matrix phased array spot weld inspection system
KR101513142B1 (ko) * 2012-04-24 2015-04-17 히하카이켄사 가부시키가이샤 적층체의 박리검사방법 및 박리검사장치
CN103969335B (zh) * 2013-06-27 2016-12-28 中车青岛四方机车车辆股份有限公司 一种焊缝侧壁未熔合自动超声成像与可视化方法
US10338036B2 (en) * 2014-05-01 2019-07-02 TecScan Systems Inc. Method and apparatus for scanning a test object and correcting for gain
US9594058B2 (en) * 2014-09-29 2017-03-14 Bell Helicopter Textron Inc. Implementing steep delta wave technique to inspect joints
CN104359432B (zh) * 2014-12-02 2017-04-12 中电科信息产业有限公司 电磁超声波测厚方法及装置
JP6333871B2 (ja) * 2016-02-25 2018-05-30 ファナック株式会社 入力画像から検出した対象物を表示する画像処理装置
JP6055948B1 (ja) * 2016-04-20 2016-12-27 株式会社岩崎電機製作所 データベース構築装置、データベース構築方法、および、データベース構築プログラム
JP6182236B1 (ja) * 2016-04-25 2017-08-16 非破壊検査株式会社 積層体の剥離検査方法及び剥離検査装置
US10575258B2 (en) * 2016-10-27 2020-02-25 Qualcomm Incorporated Techniques and apparatuses for uplink power control
CN108318579B (zh) * 2017-12-26 2021-03-26 中国航空工业集团公司基础技术研究院 一种蜂窝共固化结构缺陷超声a扫描识别方法及装置
CN108362772A (zh) * 2018-01-17 2018-08-03 中国第汽车股份有限公司 一种检测dpf载体内部损伤的超声波无损探伤方法
FR3079302B1 (fr) * 2018-03-22 2020-03-20 Safran Procede et dispositif de cartographie de pieces pour detection de direction d'allongement
JP6498341B1 (ja) * 2018-06-19 2019-04-10 株式会社日立パワーソリューションズ 超音波検査装置、制御装置及び検査方法
JP6602449B1 (ja) * 2018-12-05 2019-11-06 株式会社日立パワーソリューションズ 超音波検査方法、超音波検査装置及び超音波検査プログラム
JP7257290B2 (ja) * 2019-08-27 2023-04-13 株式会社日立パワーソリューションズ 超音波検査装置および超音波検査方法
CA3138634C (en) 2021-03-04 2023-09-19 TecScan Systems Inc. System and method for scanning an object using an array of ultrasonic transducers
JP2023138149A (ja) * 2022-03-18 2023-09-29 株式会社東芝 超音波溶接診断方法、超音波溶接部材の製造方法、検査装置、及びプログラム
CN117007681B (zh) * 2023-09-27 2023-12-19 苏州有执激光智能科技有限公司 超声波探伤方法及系统

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009175136A (ja) * 2007-12-26 2009-08-06 Panasonic Corp 超音波測定方法、電子部品製造方法、及び、半導体パッケージ
JP2011163918A (ja) * 2010-02-09 2011-08-25 Toyota Motor Corp 超音波を用いた接合面検査方法および接合面検査装置
CN102628835A (zh) * 2012-04-19 2012-08-08 迪皮埃复材构件（太仓）有限公司 一种风力发电叶片腹板粘接质量检测系统及方法
JP2014203342A (ja) * 2013-04-08 2014-10-27 中国電力株式会社 作業エリアに存在する危険箇所に関する情報を収集する方法、及び危険箇所情報収集システム
JP2022060449A (ja) * 2017-03-27 2022-04-14 株式会社アミック コンクリート構造物の診断方法及びその診断装置
JP7235265B2 (ja) 2017-03-27 2023-03-08 株式会社アミック コンクリート構造物の診断方法及びその診断装置
JP2019184449A (ja) * 2018-04-12 2019-10-24 株式会社日立パワーソリューションズ 超音波検査装置及び超音波検査方法
JP7042149B2 (ja) 2018-04-12 2022-03-25 株式会社日立パワーソリューションズ 超音波検査装置及び超音波検査方法
JP2022526837A (ja) * 2019-04-17 2022-05-26 ディーエムシー グローバル インコーポレイテッド 多層構造の物品における強固な結合と弱い結合の間の結合境界を特定する方法及びシステム
JP2021028632A (ja) * 2019-08-09 2021-02-25 Ntn株式会社 き裂進展試験方法、許容欠陥寸法の算出方法、検査方法および軸受の製造方法
JP7485564B2 (ja) 2019-08-09 2024-05-16 Ntn株式会社 算出方法、検査方法および軸受の製造方法

Also Published As

Publication number Publication date
KR20090035466A (ko) 2009-04-09
US20100224000A1 (en) 2010-09-09
KR101137141B1 (ko) 2012-04-20
JPWO2008129832A1 (ja) 2010-07-22
CN101542279B (zh) 2013-03-13
US8091426B2 (en) 2012-01-10
JP5154422B2 (ja) 2013-02-27
CN101542279A (zh) 2009-09-23

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