WO2008114457A1 - 位置補正機能を有するハンドラーおよび未検デバイスの測定ソケットに対する装填方法 - Google Patents
位置補正機能を有するハンドラーおよび未検デバイスの測定ソケットに対する装填方法 Download PDFInfo
- Publication number
- WO2008114457A1 WO2008114457A1 PCT/JP2007/056120 JP2007056120W WO2008114457A1 WO 2008114457 A1 WO2008114457 A1 WO 2008114457A1 JP 2007056120 W JP2007056120 W JP 2007056120W WO 2008114457 A1 WO2008114457 A1 WO 2008114457A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- undetected
- clamper
- socket
- handler
- devices
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
Definitions
- the present invention relates to a horizontal type handler that is used when inspecting and measuring an electronic component (hereinafter referred to as a device) integrally with the electronic component inspection device.
- Such devices include, for example, smaller, thinner, lighter and narrower pins, such as CSP (GhipSizePacage), BGA (BallGridArray), and QFP (QuadFlatPacage). Pitching and multi-pinning
- the electronic device in order for the electronic device to operate as designed, it largely depends on the quality of the device, and in the component manufacturing process, when shipping the device, the quality of the device is judged when the device is shipped.
- Component inspection equipment hereinafter referred to as device tester
- an automatic handling machine which holds, transports and loads the device to be inspected from the storage area to the transfer area together with the device test. There is a drier.
- the so-called horizontal type auto handler arranges a tray containing an undetected device in the loader section in the handler, automatically handles and positions the undetected device, applies a temperature if necessary, and
- the test head of the tested device / tester performs electrical testing via the measurement socket, and the data of the test automatically classifies the device as good, defective, or retested product etc. It is a device configured to be housed in a weir.
- FIG. 15 shows and describes the handler proposed by the applicant.
- the device positioning stand S is shown to move laterally in a linear fashion. That is, in this handler, the horizontal transfer plate 3 to which the device D supplied by the supply hand 2. is set is moved, the disk 5 in the inspection and transfer device B is driven by the motor 4, and mounted on the disk 5.
- the device D is adsorbed and raised from the transverse transfer plate 3 by the suction pad on the first stage 6 side, and the device D is made to face the upper part of the measurement socket T by the rotation of the disk 5, and the measurement socket It is pressed into T and measured by the measuring device, and information based on the measured value is transmitted to the discharge hand 8 to indicate the discharge destination of the inspected device D.
- the characteristic of the device D is detected by the measuring device, the quality information of the device D is acquired, and the discharge hand 8 discharges to the target location (unloader 9) according to the quality of the device D by this quality information. I am trying to do it.
- the device D to be inspected is dropped into the measuring socket immediately before and immediately after the measuring socket. Therefore, with this, there is a risk that the attitude of the device may be broken even if the alignment is done properly.
- the device gripping portion In response to the advancement of test performance, the device gripping portion also has a mechanism configuration for improving the processing capability (for example, a configuration in which the suction unit function and the clamper function are switched and executed, and a plurality of A configuration capable of shortening the device replacement time to the gripping portion and the IC socket), (3) To be able to handle various types of devices
- the present invention has been proposed from such a point of view, and has a plurality of device gripping portions having independent device position correction functions that can cope with inspection of various types of devices, and also has a cleaning function. Intended to provide. Disclosure of the Invention.
- a predetermined number of untested devices are picked up from untested trays loaded with untested devices, loaded into a measurement socket on the device / tester, and inspected, and devices are inspected after inspection.
- a measurement socket on the device / tester In the handler that I made it back,
- a predetermined number of devices each having a plurality of device holding units for picking up undetected devices
- These device gripping parts recognize position positions of undetected devices to be held respectively, and include position correction means for correcting the positions of undetected devices from the position information of the undetected devices.
- suction means for loading into the measuring socket on the test tube suction means for suctioning from the untested tray by micro pressure when adsorbing the device and loading in the measuring socket,
- a handler characterized in that it is combined with a clamper for pressing an undetected device with a required pressing force after loading into a measuring socket. Ru.
- the position correction means is an image recognition device that recognizes the posture position of the untested device
- a position correction mechanism for device position correction is provided from posture position information of an undetected device by the image recognition device.
- the device gripping portion is configured to be replaceable for each type of device to be suctioned, and suction means for suctioning the device;
- a clamper disposed around the suction means
- the suction means in the device holding portion sucks with a minute pressing force from the undetected tray at the time of suction of the device, while raising and lowering the suction means independently from the clamper. It is characterized in that it can be moved up and down by a suction means lifting mechanism which is loaded into the measurement socket through the buffer means.
- the clamper is held in the clamper holding bracket so as to be vertically movable independently of the suction means, and the clamper holding bracket is set for each device. It is characterized in that a pressure detection means is provided to detect that the pressure is applied.
- the clamper holds the clamper holding bracket so as to be movable up and down independently of the suction means, and the clamper holding bracket is provided with a cylinder. It is characterized in that the pressing force is controlled for each device by means of an empty regi one. According to one aspect of the present invention, a cleaning means of the contact of the measurement socket and a visualizing means are provided in order to make the state of the contact visible.
- a plurality of device holding portions for picking up a predetermined number of undetected devices from undetected trays mounted with undetected devices are provided, and these device gripping portions are undetected devices
- Position correction means for correcting the position of the undetected device based on the attitude position information of the undetected device In a handler having a combination of suction means for loading into a socket and a clamper for pressing an undetected device with a required pressing force after loading into a measurement socket,
- position correction is performed based on the previously acquired attitude position information of the device, and the untested device is adsorbed, not tested.
- FIG. 1 is a plan view showing a schematic configuration of a handler according to the present invention.
- Figure 2 shows the device grip used in the handler shown in Figure 1 It is a side view of the rod pot.
- FIG. 3 is another side view of the rod with the device grip used in the handler shown in FIG.
- FIG. 4 is a detailed enlarged fragmentary cross-sectional view of the device gripping portion shown in FIG.
- FIG. 5 is a detailed enlarged cross-sectional view of the device gripping portion shown in FIG.
- FIG. 6 is a process diagram for explaining a series of suction, position correction, suction means lowering, lifting, device transfer, and device accommodation steps of the handler according to the present invention.
- FIG. 7 is a process diagram for explaining a series of suction, position correction, suction means lowering, lifting, device transfer, and device accommodation steps of the handler according to the present invention. ⁇
- FIG. 8 is a process diagram for explaining a series of suction, position correction, suction means lowering, lifting, device transfer, and device accommodation steps of the handler according to the present invention.
- FIG. 9 is a process diagram for explaining a series of suction, position correction, suction means lowering, lifting, device transfer, and device accommodation steps of the hammer and the roller according to the present invention.
- FIG. 10 is a process diagram for explaining a series of suction, position correction, suction means lowering, lifting, device transfer, and device accommodation steps of the handler according to the present invention.
- FIG. 11 is a process diagram illustrating a series of suction, position correction, suction means lowering, lifting, device transfer, and device accommodation steps of the handler according to the present invention.
- FIG. 12 is a cross-sectional explanatory view of an essential part of a device gripping portion, which has been replaced by a ring-type adsorption means corresponding to a device to be adsorbed.
- FIG. 13 is a cross-sectional view of the main parts of the device gripping portion in which the suction means and the pressing member have been replaced according to the non-lead device to be suctioned.
- FIG. 14 is a simplified side view of a third robot provided with a cleaning and confirmation image recognition union provided in a handler according to the present invention.
- FIG. 15 is a plan view showing an example of a conventional handler. BEST MODE FOR CARRYING OUT THE INVENTION
- FIG. 1 shows an example of a handler 10 according to the present invention in plan view.
- This handler 10 is a horizontal type handler similar to the handler 1 shown in Fig. 15 and is laid out on the machine frame table A as follows. .
- the lowermost portion is the stacker area S a of each tray
- the middle portion is the single sheet positioning area S ma of each tray
- the upper portion is the image recognition area I ra
- the top stage part is taken as measurement area M a.
- an undetected tray stacker 1 1 In the lowermost stacker area S a, deploy an undetected tray stacker 1 1, an accommodating tray stacker 1 2, 1 2, an empty tray buffer 1 3 for undetected trays, and an empty tray buffer 1 4 for accommodating trays.
- these trays are capable of holding a predetermined number of devices, and the stacker of each tray can accommodate trays up to 300 mm each.
- the middle one-sheet positioning area Sma the position where one tray is positioned at a predetermined position is shown. From each tray stacker, each tray, and one sheet positioning area Sma, the tray is fed and discharged by each belt conveyor. That is, one sheet positioning area S In ma, from untested tray stacker 11 in stacker area S a, for example, an untested tray on which one untested tray conveyed by belt conveyor BC is positioned and placed is one sheet positioning position 15 I have secured.
- one accommodation tray positioning position 16, 17 and, if necessary, one-piece tray 2 2 are secured.
- an X-direction moving device is provided below the undetected tray and one positioning area Sma of the storage tray, and it is moved to the 1st port pot and the 2nd robot (described later) to a large extent.
- the device storage and adsorption paths are shortened and processing capacity is increased.
- an image recognition device 20 is disposed in the image recognition area I ra of the upper stage part.
- This image recognition apparatus 20 is equipped with a unit U d that simultaneously recognizes a plurality of (for example, two or four) devices D.
- the inter-core distance is the same as the distance between the measurement section and the measurement socket. It is a size.
- the mounting position and posture of the device D are recognized by image and corrected.
- the details of the image recognition apparatus 20 are not disclosed in the present invention, but employ those having a known configuration, so detailed illustration and description thereof will be omitted here.
- the preheating means 21 can be arranged.
- measurement socket T and four measurement sockets are arranged in the figure, and the measurement sockets are in the lower electronic component test equipment 2 3 (hereinafter device, tester 2 3) , Are connected electrically.
- the first and second port pots 30 and 31 for loading and discharging the device D to be tested are arranged in the measuring socket T of the device tester 23.
- first and second robots 30 0 and 31 1 basically have a movable portion 3 0 a (3 1 a) movable in the directions of two axes (X, Y axes) and three axes (X, Y, It has a position correction unit 30 b (31 b) capable of position correction in the Z axis direction (see Fig. 2 and Fig. 3).
- the first and second port pots 30 0 and 31 measure the untested device D whose suction position has been recognized by the image recognition device 20 as the measurement socket of the device tester 23. At the same time, the load is correctly loaded and pressed with a predetermined pressing force.
- these first and second port pots 30 0 and 3 1 have a combination of means for picking up the device D and means for loading the device into the measuring socket with a pressing force.
- the device grip 3 2 is provided.
- Position correction is possible using position correction unit 30 0 b (31 1 b) as a position correction mechanism for device position correction from rotational position information of the inspection device, and rotational drive means (described later) that corrects rotation around an axis. It is composed of
- Each of the device gripping portions 32 is a position correction portion 30 0 b 3 1 b (X) that constitutes the first and second robots 3 0 3 1. (Y, ⁇ ) through bracket 33. That is, the plate 33 has a linear shaft 34 oriented in the vertical axis direction as a suction means lifting mechanism, and a linear shaft 34 suspended in a vertical direction parallel to the axial direction of the linear shaft 34. A relay shaft 35 is provided, and at the tip of the relay shaft 35, an adsorption means 36 for adsorbing the device D is exchangeably provided.
- a top 3 7 is provided at the upper end of the linear shaft 34, the vertical motion of the linear drive source 38 is transmitted to the core 3 7 through a connector 3 9.
- a relief is provided between the connector 39 and the core 37 so that the driving force of the linear drive source 38 is not directly transmitted to the suction means 36 for suctioning the device D.
- a concave joint 40 is provided at the lower end of the linear shaft 34, and a disc 41 fitted with the concave joint 40 is provided at the upper end of the relay shaft 3.5 to relay the vertical motion of the linear shaft 34. It is configured to transmit to shaft 35 side.
- the relay shaft 35 is supported by the bearings 4 3 and 4 4 via the upper and lower holders 4 2 a and 4 2 b constituting the holder 4 2 at the lower end side and the middle portion of the bracket 33. It is done. That is, in the relay shaft 35, the outer periphery is splined, and the pole spline nut 45 held by the holder 42 gives rotation and vertical movement to the suction means 36. .
- relay shaft 35 is provided with an air suction passage Pa penetrating along the axial center.
- the pole spline nut ⁇ 45 is fixedly held by the upper and lower holders 4 2 a and 4 2 b at its outer peripheral portion with a key or the like.
- a pulley 46 is attached to the upper part of the upper holder 42 b.
- Pulley 46 is a relay shaft 3 5 that rotates the rotation drive source (described later) as a position correction mechanism.
- the device rotation angle correction is performed by a command from the image recognition device 20, and the position correction means (not shown).
- the rotational drive source also has a function to rotate, if necessary, for example, when the device pin 1 on the tray and the pin 1 on the measurement socket have different angles.
- the relay shaft 3 5 also has a connector 4 9 on the upper end side, and the connector 4 9 is provided with a suction negative pressure joint 4 7 and a tube 4 8 connected to a suction drive source (not shown). There is.
- a spring member S 1 as a shock-absorbing means for applying a minute pressing force to the attachment means 36.
- suction means 36 in the device gripping portion 32 is configured to be replaceable for each type of suction device.
- Suction means. 3 6 ' is the air along the axial center so as to communicate with the air suction passage Pa on the relay shaft 35 side when it is coupled to the lower end side of the relay shaft 35 in Porto B or the like.
- the suction passage Pa is formed.
- a vacuum pad 50 as a suction means is attached.
- the suction means 36 will be described later as a suction means, but according to the device type to be suctioned, a configuration in which the suction means 36 such as O ring type or suction hole only is replaced and attached. It is said that. .
- a clamper 51 is fixed to the clamper holding bracket 52 on the outer periphery of the suction means 36 (see FIG. 5), and a pressing member 53 is attached to the tip of the clamper 51.
- the pressing member 53 shown here corresponds to the lead type device (QFP). That is, the pressing member 53 is provided with a pressing protrusion 5 3 a at the tip end side edge thereof to be in contact with the lead protruding on the side of the lead type device (QFP).
- the clamper 51 has a device D to be adsorbed.
- the pressing member 5 3 is held exchangeably for mounting.
- a linear guide 54 or the like that can move up and down is attached to the side surface of the clamper holding bracket 52 that holds the clamper 51 independently of the Z-axis movable unit bracket 33, and spring 5 It is held movably up and down by 5 mag.
- the clamper holding bracket 5 2 is provided with a pressure detection means 56.
- a pressure detection means 56 a load cell can be used which detects that the pressing force is set for each device.
- the driving source of the pressing force is displacement of 30 b in the figure, in the vertical direction, and in the Z axis.
- the Z-axis displacement is fixed as a drive source of the pressing force, a cylinder is disposed instead of the load cell, and the pressing force is controlled by a well-known electro-pneumatic regulator or the like. May be
- rotational power for correcting the rotation is given via the transmission belt 5 7 to the pulley 4 6 on the upper end side of the relay shaft 3 5 connected to the suction means 3 6.
- a rotational drive source 58 is provided.
- the same device gripping part. 3 2 has a device adsorption with independent upper and lower functions, and an adsorption means 3 6 with a minute pressing force when the device is loaded into the measurement socket, and a variable at the time of measurement contact It will also be equipped with a clamper 5 1 with possible pressing force.
- the handler 10 according to the present invention is configured as described above, and then placed in the measurement area M a of the machine frame table A of the handler 10. Describe the procedure for loading / unloading the device D to be tested. That is, in the handler 10 according to the present invention, the device D is not only a non-read type device (CSP, BGA) but also for the read-out device (QFP). It can be loaded and can be tested.
- CSP non-read type device
- QFP read-out device
- the unread tray holding the device D to be inspected is transferred from the unchecked tray stacker 11 to the middle single sheet positioning area S ma by the belt conveyer BC from the handler 10 area of the static force area S a. Then place the tray 1 in the 1 sheet positioning position 1 5.
- the first port pot 30 is activated, and the movable part 30a is operated in the directions of two axes (X and Y axes) to bring the plurality of device gripping parts 32 close to the undetected tray, and the respective adsorptions are performed.
- a device D is adsorbed by means 36 (see FIG. 6).
- the suction means 36 drives the linear drive source 3 8 of the device gripping portion 32 so as to project downward from the clamper 51 and the pressing member 53 in the Z-axis direction.
- the device D can be attracted to the vacuum pad 50 at the tip of the suction means 36 by suctioning through the air suction passage Pa of the suction means 36.
- a small pressing force the shock absorbing action of the spring member S 1 between the lower end side of the relay shaft 35 and the suction means 36
- Less than a few hundred grams without damaging device D.
- the first port pot 30 lifts the plurality of device gripping portions 32 in the Z-axis direction by the first robot 30 in a state where the device D is adsorbed by the adsorption means 36. Then move in the X, Y axis direction , Image recognition area Ira: Image recognition device 20 carries out image recognition of a plurality of devices D, and conveys it to the position of unit U d (see FIG. 7). At this time, the tip of the suction means 36 suctioning the device D is in a state of projecting downward from the clamper 51 and the pressing member 53 in the Z-axis direction.
- the mounting position and posture of the device D are recognized by the image by an instruction from the image recognition device 20 and position correction means, and position correction information in the X, Y and ⁇ directions is acquired. .
- the first port pot 30 operates the movable part 30 a in the directions of the two axes (X and Y axes) to hold the device gripping part 3 having attracted a plurality of devices D to be inspected.
- the measurement area Ma On the measurement area Ma, to the measurement socket T of the device test 23.
- the first port pot 3.0 is the inter-core distance of the plurality of device gripping portions 32 and the inter-core distance of the measuring portion measuring socket T.
- the position correction unit 30b is driven to correct the position in the X and Y directions, and the rotational drive source 5 is transmitted to the pulley 46 on the upper end side of the relay shaft 35 via the transmission belt 5 7 From 8, give rotational power to correct the rotation, and then correct the device rotation angle.
- the plurality of device holding portions 32 can be finely adjusted, and the device D to be inspected can be reliably loaded into the measuring socket T.
- the mounting position and attitude can be corrected.
- the device D to be tested when loading the measurement socket T, the device D to be tested is loaded in a state where the device D is adsorbed to the adsorption means 36. Therefore, the device D to be inspected is measured immediately from the measurement socket and the measurement socket as described above. Unlike the method of dropping the device D, the device D can be loaded correctly, the posture of the device D is not broken, and it can contribute to the reduction of the measurement failure rate.
- the suction drive source is stopped, and in a state where suction is turned off, the linear motion drive source 3 8 of the device holding portion 32 is driven to raise the suction means 3 6 (see FIG. 9).
- the device gripping part 32 including the clamper 51 and the pressing member 53 is the position correction means, and the clamper 51 and the pressing member 53 measure the lead of the device D. Correct to the possible position.
- the clamper 51 and the pressing member 53 are lowered in the Z-axis direction by the position correction portion 30b of the mouth pot 3.0, and the measuring socket T contact is made via the pressing projecting portion 53a of the pressing member 53.
- the child can be contacted with a predetermined pressure (a few kg to a few tens of kg) (see Figure 10).
- the position correction of the device gripping section 32 including the clamper 51 and the pressing member 53 after raising the suction means 36 is only for the lead type device (QFP), and the non lead type device (CSP , BGA) is not necessary. .
- the device D mounted on the measuring socket T of the device 'test tube 23 is finished, and after the measurement is finished, the device D is adsorbed by the respective adsorption means 36. Then, the suction means 3 6 is lifted in the Z-axis direction, and the device gripping portion 32 is placed by the movable portion 3 0 a in the middle one-sheet positioning area Sma storage tray 1 sheet positioning position 16, 1 7 Also, the device D after inspection can be transported and stored up to the storage tray (see Fig. 11). As described above, in the handler 10 of the present invention, when the device D to be tested is loaded on the measurement socket of the device / tester 23 and the tag T, the device gripping portion 3 2 adsorbed is aligned.
- the method differs from the method of dropping it from the nearest end of the measuring socket before loading the measuring socket T. Therefore, it is possible to avoid such a situation that the attitude of the device D collapses and the measurement failure rate increases.
- the adsorption means 36 may be replaced, for example, as shown in FIG. You can use In this case, an o-ring Ro formed of a soft material, for example, is provided around the edge of the tip of the suction means 36. '
- the pressing member 53 for pressing the measuring socket T with a predetermined pressing force is used with an outer diameter adjusted to the dimensions of the suction means 36, and a pressure that protrudes along the outer circumference of the suction means 36.
- the protrusion 5 3 a is provided.
- the device gripping portion 32 of the present invention is a suction means 36 for adsorbing and pushing with a small pressure, a linear motion driving means 38, and a clamper for pushing in the reed portion of the device D 5 1
- the lead mechanism and the non-lead type device can be handled and measured by the same mechanism by providing the pressing member 5 3 with the pushing means that exerts the necessary pressing force and making it replaceable.
- the handler 10 is used to clean the contact of the device socket T 2 of the device holder 2 3.
- the visualizing means can be configured to make the state of the contact visible.
- the third mouth pot having a cleaning and confirmation image recognition union which is a means for cleaning and visualizing the contact tip of the measuring section measuring socket.
- the third port 60 is different from the first and second robots 30 and 31 for holding and transporting the device, and the third robot 6 0
- the measuring unit is disposed near the measuring socket T and equipped with the cleaning means 61 and the image recognition device 62. These cleaning means 61 and the image recognition device 62 are X, , Control in the Z-axis direction.
- the cleaning means 6 1 uses a so-called nano-tech brush or the like that removes foreign matter (solder dust etc.) at the tip of the contact of the measurement socket T.
- a nozzle 63 is provided coaxially with the cleaning means 61. The nozzle 63 is for collecting the removed foreign matter by a clean room vacuum (not shown) after being blown by a clean air blow (not shown).
- the operator determines whether or not the foreign matter at the tip of the contactor of the measuring unit measuring socket has been removed. That is, for example, copy the contact of the measuring section measurement socket T after cleaning on the operator's monitor (not shown), and the operator visually checks the presence or absence of foreign matter removal. If foreign matter remains, the drive source of cleaning means 6 1 and removal nozzle 6 3 is activated again by the cleaning bench retry instruction.
- the above-mentioned image recognition device 62 also has a function for confirming the position of the measuring section measuring socket at the time of setup replacement by changing the measuring section measuring socket T or changing the product type.
- the contact defect between the device D and the contact due to (IC solder dust) etc. prevents the non-defective product rate from decreasing by cleaning the contactor and the tip of the contact and its visualization, and the operation time of test set Can be secured as much as possible.
- the device gripping part moves from the device suction position on the undetected tray to the measurement port measurement socket position and the storage tray upper storage position via the image recognition position, to the transport port pot for transporting the devices.
- the processing capacity is improved by using the method of attaching and processing individual pieces.
- the device can be suctioned and measurement can be performed by regularly pressing the measuring socket contact with a predetermined pressure. ....
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
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Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/531,546 US8506231B2 (en) | 2007-03-16 | 2007-03-16 | Handler having position correcting function and method of loading uninspected device into measuring socket |
PCT/JP2007/056120 WO2008114457A1 (ja) | 2007-03-16 | 2007-03-16 | 位置補正機能を有するハンドラーおよび未検デバイスの測定ソケットに対する装填方法 |
KR1020097019287A KR101108591B1 (ko) | 2007-03-16 | 2007-03-16 | 위치 보정 기능을 갖는 핸들러 및 미검사 디바이스의 측정 소켓에 대한 로딩 방법 |
JP2009505055A JP5052598B2 (ja) | 2007-03-16 | 2007-03-16 | 位置補正機能を有するハンドラーおよび未検デバイスの測定ソケットに対する装填方法 |
TW097114519A TWI413772B (zh) | 2007-03-16 | 2008-04-21 | A processor for position correction function, and a method for loading the measurement slot of the apparatus to be inspected |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/056120 WO2008114457A1 (ja) | 2007-03-16 | 2007-03-16 | 位置補正機能を有するハンドラーおよび未検デバイスの測定ソケットに対する装填方法 |
Publications (1)
Publication Number | Publication Date |
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WO2008114457A1 true WO2008114457A1 (ja) | 2008-09-25 |
Family
ID=39765578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/056120 WO2008114457A1 (ja) | 2007-03-16 | 2007-03-16 | 位置補正機能を有するハンドラーおよび未検デバイスの測定ソケットに対する装填方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8506231B2 (ja) |
JP (1) | JP5052598B2 (ja) |
KR (1) | KR101108591B1 (ja) |
TW (1) | TWI413772B (ja) |
WO (1) | WO2008114457A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8506231B2 (en) | 2007-03-16 | 2013-08-13 | Tohoku Seiki Industries, Ltd. | Handler having position correcting function and method of loading uninspected device into measuring socket |
KR20160093043A (ko) | 2013-12-03 | 2016-08-05 | 해피재팬, 인크. | 전자 디바이스의 핸들러 |
TWI717059B (zh) * | 2018-12-21 | 2021-01-21 | 日商賽納克股份有限公司 | 處理器 |
JP2021173684A (ja) * | 2020-04-28 | 2021-11-01 | 株式会社ロムテック | カバーソケット、ハンドリング装置、半導体検査書き込み装置及び半導体検査書き込み方法 |
US11353500B2 (en) | 2019-01-15 | 2022-06-07 | Synax Co., Ltd. | Contactor and handler |
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EP2601504B1 (en) * | 2010-08-06 | 2020-12-30 | Siemens Healthcare Diagnostics Inc. | Methods and systems adapted to handle sticky sample containers |
EP2426794A1 (en) * | 2010-09-06 | 2012-03-07 | Rasco GmbH | Cleaning a contactor in a test-in-strip handler for ICs |
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TWI582874B (zh) * | 2012-05-03 | 2017-05-11 | Chroma Ate Inc | A test system for testing semiconductor packaged stacked wafers, and a semiconductor automated test machine |
CN105940311B (zh) * | 2013-12-03 | 2020-02-21 | 株式会社幸福日本 | Ic处理机 |
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US11961220B2 (en) * | 2018-01-23 | 2024-04-16 | Texas Instruments Incorporated | Handling integrated circuits in automated testing |
KR102501497B1 (ko) * | 2020-03-13 | 2023-02-21 | 레이저쎌 주식회사 | 턴테이블 방식의 프로브핀 레이저 본딩장치 |
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- 2007-03-16 WO PCT/JP2007/056120 patent/WO2008114457A1/ja active Application Filing
- 2007-03-16 US US12/531,546 patent/US8506231B2/en not_active Expired - Fee Related
- 2007-03-16 JP JP2009505055A patent/JP5052598B2/ja not_active Expired - Fee Related
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US8506231B2 (en) | 2007-03-16 | 2013-08-13 | Tohoku Seiki Industries, Ltd. | Handler having position correcting function and method of loading uninspected device into measuring socket |
KR20160093043A (ko) | 2013-12-03 | 2016-08-05 | 해피재팬, 인크. | 전자 디바이스의 핸들러 |
TWI717059B (zh) * | 2018-12-21 | 2021-01-21 | 日商賽納克股份有限公司 | 處理器 |
US11231456B2 (en) | 2018-12-21 | 2022-01-25 | Synax Co., Ltd. | Handler |
US11353500B2 (en) | 2019-01-15 | 2022-06-07 | Synax Co., Ltd. | Contactor and handler |
JP2021173684A (ja) * | 2020-04-28 | 2021-11-01 | 株式会社ロムテック | カバーソケット、ハンドリング装置、半導体検査書き込み装置及び半導体検査書き込み方法 |
JP7536263B2 (ja) | 2020-04-28 | 2024-08-20 | 株式会社ロムテック | カバーソケット、ハンドリング装置及び半導体検査書き込み装置 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2008114457A1 (ja) | 2010-07-01 |
TWI413772B (zh) | 2013-11-01 |
US20100104404A1 (en) | 2010-04-29 |
JP5052598B2 (ja) | 2012-10-17 |
KR101108591B1 (ko) | 2012-01-31 |
KR20100005027A (ko) | 2010-01-13 |
US8506231B2 (en) | 2013-08-13 |
TW200944797A (en) | 2009-11-01 |
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