WO2008105100A1 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
WO2008105100A1
WO2008105100A1 PCT/JP2007/053836 JP2007053836W WO2008105100A1 WO 2008105100 A1 WO2008105100 A1 WO 2008105100A1 JP 2007053836 W JP2007053836 W JP 2007053836W WO 2008105100 A1 WO2008105100 A1 WO 2008105100A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
composition
chemical formula
oxide
composition parameter
Prior art date
Application number
PCT/JP2007/053836
Other languages
English (en)
French (fr)
Inventor
Wensheng Wang
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to PCT/JP2007/053836 priority Critical patent/WO2008105100A1/ja
Priority to PCT/JP2008/051090 priority patent/WO2008105204A1/ja
Priority to JP2009501154A priority patent/JP5104850B2/ja
Priority to CN2008800065920A priority patent/CN101641782B/zh
Priority to KR1020097016930A priority patent/KR101084408B1/ko
Publication of WO2008105100A1 publication Critical patent/WO2008105100A1/ja
Priority to US12/548,911 priority patent/US8405188B2/en
Priority to US13/780,177 priority patent/US8664011B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/55—Capacitors with a dielectric comprising a perovskite structure material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/60—Electrodes
    • H01L28/65—Electrodes comprising a noble metal or a noble metal oxide, e.g. platinum (Pt), ruthenium (Ru), ruthenium dioxide (RuO2), iridium (Ir), iridium dioxide (IrO2)
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
    • H10B53/30—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the memory core region

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)

Abstract

キャパシタ上部電極Ｑ２は、組成パラメータｘ１を使って化学式ＡＯｘ1（Ａ：金属元素）で表され実際の組成が組成パラメータｘ２を使って化学式ＡＯｘ2で表される第１酸化物よりなる第１の層５７と、第１の層５７上に形成され、組成パラメータｙ１を使って化学式ＢＯｙ1で表され実際の組成が組成パラメータｙ２を使って化学式ＢＯｙ２（Ｂ：金属元素）で表される第２酸化物であって、石垣状或いは柱状に接合される結晶からなり、第１の層５７より酸化の割合が高く構成され、組成パラメータｘ１、ｘ２、ｙ１およびｙ２の間には、関係ｙ２／ｙ１＞ｘ１／ｘ１が成立する第２の層５８と、第２の層５８上形成され、貴金属膜或いは貴金属を含む合金よりなる第３の層５９とを有する。
PCT/JP2007/053836 2007-02-28 2007-02-28 半導体装置及びその製造方法 WO2008105100A1 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
PCT/JP2007/053836 WO2008105100A1 (ja) 2007-02-28 2007-02-28 半導体装置及びその製造方法
PCT/JP2008/051090 WO2008105204A1 (ja) 2007-02-28 2008-01-25 半導体装置及びその製造方法
JP2009501154A JP5104850B2 (ja) 2007-02-28 2008-01-25 半導体装置の製造方法
CN2008800065920A CN101641782B (zh) 2007-02-28 2008-01-25 半导体器件及其制造方法
KR1020097016930A KR101084408B1 (ko) 2007-02-28 2008-01-25 반도체 장치 및 그 제조방법
US12/548,911 US8405188B2 (en) 2007-02-28 2009-08-27 Semiconductor device and method of manufacturing the semiconductor device
US13/780,177 US8664011B2 (en) 2007-02-28 2013-02-28 Semiconductor device and method of manufacturing the semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/053836 WO2008105100A1 (ja) 2007-02-28 2007-02-28 半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
WO2008105100A1 true WO2008105100A1 (ja) 2008-09-04

Family

ID=39720944

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2007/053836 WO2008105100A1 (ja) 2007-02-28 2007-02-28 半導体装置及びその製造方法
PCT/JP2008/051090 WO2008105204A1 (ja) 2007-02-28 2008-01-25 半導体装置及びその製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051090 WO2008105204A1 (ja) 2007-02-28 2008-01-25 半導体装置及びその製造方法

Country Status (4)

Country Link
US (2) US8405188B2 (ja)
KR (1) KR101084408B1 (ja)
CN (1) CN101641782B (ja)
WO (2) WO2008105100A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101830193B1 (ko) * 2010-07-02 2018-02-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
US8780628B2 (en) * 2011-09-23 2014-07-15 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit including a voltage divider and methods of operating the same
JP5845866B2 (ja) * 2011-12-07 2016-01-20 富士通セミコンダクター株式会社 半導体装置の製造方法
WO2014094882A1 (en) * 2012-12-21 2014-06-26 European Space Agency Additive manufacturing method using focused light heating source
JP2015133392A (ja) * 2014-01-10 2015-07-23 富士通セミコンダクター株式会社 半導体装置及びその製造方法
US9711454B2 (en) * 2015-08-29 2017-07-18 Taiwan Semiconductor Manufacturing Co., Ltd. Through via structure for step coverage improvement
US10319635B2 (en) * 2017-05-25 2019-06-11 Sandisk Technologies Llc Interconnect structure containing a metal slilicide hydrogen diffusion barrier and method of making thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002110934A (ja) * 2000-09-29 2002-04-12 Fujitsu Ltd 半導体装置およびその製造方法
JP2002203948A (ja) * 2001-01-05 2002-07-19 Matsushita Electric Ind Co Ltd 半導体装置
JP2002324894A (ja) * 2001-04-25 2002-11-08 Fujitsu Ltd 半導体装置およびその製造方法
JP2006073648A (ja) * 2004-08-31 2006-03-16 Fujitsu Ltd 半導体装置及びその製造方法

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
JP3299909B2 (ja) 1997-02-25 2002-07-08 シャープ株式会社 酸化物導電体を用いた多層構造電極
JP3109485B2 (ja) 1998-08-03 2000-11-13 日本電気株式会社 金属酸化物誘電体膜の気相成長方法
JP3159255B2 (ja) 1998-09-16 2001-04-23 日本電気株式会社 強誘電体容量で用いる電極のスパッタ成長方法
JP3545279B2 (ja) 1999-10-26 2004-07-21 富士通株式会社 強誘電体キャパシタ、その製造方法、および半導体装置
US6887716B2 (en) 2000-12-20 2005-05-03 Fujitsu Limited Process for producing high quality PZT films for ferroelectric memory integrated circuits
JP4050004B2 (ja) 2001-03-28 2008-02-20 富士通株式会社 半導体装置及びその製造方法
JP4428500B2 (ja) * 2001-07-13 2010-03-10 富士通マイクロエレクトロニクス株式会社 容量素子及びその製造方法
JP2003204043A (ja) 2001-10-24 2003-07-18 Fujitsu Ltd 半導体装置及びその製造方法
JP4657545B2 (ja) 2001-12-28 2011-03-23 富士通セミコンダクター株式会社 半導体装置の製造方法
JP4316188B2 (ja) 2002-05-29 2009-08-19 富士通マイクロエレクトロニクス株式会社 半導体装置及びその製造方法
JP4153333B2 (ja) 2003-03-10 2008-09-24 株式会社アルバック 酸化物薄膜の製造方法
JP2004296929A (ja) * 2003-03-27 2004-10-21 Seiko Epson Corp 強誘電体キャパシタの製造方法、強誘電体キャパシタ、記憶素子、電子素子、メモリ装置及び電子機器
JP2005183842A (ja) 2003-12-22 2005-07-07 Fujitsu Ltd 半導体装置の製造方法
US20050161717A1 (en) * 2004-01-28 2005-07-28 Fujitsu Limited Semiconductor device and method of fabricating the same
JP2006128274A (ja) 2004-10-27 2006-05-18 Seiko Epson Corp 強誘電体キャパシタおよび強誘電体メモリの製造方法
JP2006222227A (ja) * 2005-02-09 2006-08-24 Fujitsu Ltd 半導体装置及びその製造方法
KR100663356B1 (ko) * 2005-02-14 2007-01-02 삼성전자주식회사 부분적 화학기계적 연마공정을 갖는 강유전체 메모리 소자제조방법들
JP2006245457A (ja) 2005-03-07 2006-09-14 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
CN101203957B (zh) 2005-06-17 2011-03-30 富士通半导体股份有限公司 半导体装置的制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002110934A (ja) * 2000-09-29 2002-04-12 Fujitsu Ltd 半導体装置およびその製造方法
JP2002203948A (ja) * 2001-01-05 2002-07-19 Matsushita Electric Ind Co Ltd 半導体装置
JP2002324894A (ja) * 2001-04-25 2002-11-08 Fujitsu Ltd 半導体装置およびその製造方法
JP2006073648A (ja) * 2004-08-31 2006-03-16 Fujitsu Ltd 半導体装置及びその製造方法

Also Published As

Publication number Publication date
KR101084408B1 (ko) 2011-11-18
CN101641782A (zh) 2010-02-03
CN101641782B (zh) 2012-10-10
US8405188B2 (en) 2013-03-26
KR20090110908A (ko) 2009-10-23
US20130177997A1 (en) 2013-07-11
WO2008105204A1 (ja) 2008-09-04
US8664011B2 (en) 2014-03-04
US20090315144A1 (en) 2009-12-24

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