WO2008084866A1 - 銀微粉およびその製法並びにインク - Google Patents

銀微粉およびその製法並びにインク Download PDF

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Publication number
WO2008084866A1
WO2008084866A1 PCT/JP2008/050308 JP2008050308W WO2008084866A1 WO 2008084866 A1 WO2008084866 A1 WO 2008084866A1 JP 2008050308 W JP2008050308 W JP 2008050308W WO 2008084866 A1 WO2008084866 A1 WO 2008084866A1
Authority
WO
WIPO (PCT)
Prior art keywords
silver
fine powder
ink
protective material
particles
Prior art date
Application number
PCT/JP2008/050308
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Kimitaka Sato
Taku Okano
Original Assignee
Dowa Electronics Materials Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Electronics Materials Co., Ltd. filed Critical Dowa Electronics Materials Co., Ltd.
Priority to CN2008800020027A priority Critical patent/CN101583449B/zh
Priority to US12/522,422 priority patent/US7981326B2/en
Priority to EP08703172.0A priority patent/EP2119518B1/en
Priority to KR1020097013034A priority patent/KR101451603B1/ko
Publication of WO2008084866A1 publication Critical patent/WO2008084866A1/ja

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • B22F9/16Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05Metallic powder characterised by the size or surface area of the particles
    • B22F1/054Nanosized particles
    • B22F1/0545Dispersions or suspensions of nanosized particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102Metallic powder coated with organic material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/30Inkjet printing inks
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/30Inkjet printing inks
    • C09D11/36Inkjet printing inks based on non-aqueous solvents
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/52Electrically conductive inks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0224Conductive particles having an insulating coating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982Particulate matter [e.g., sphere, flake, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991Coated
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991Coated
    • Y10T428/2998Coated including synthetic resin or polymer

Definitions

  • an object of the present invention is to provide a silver nanoink having a significantly improved silver concentration while maintaining good dispersibility of silver nanoparticles.
  • Silver fines that are / 0 are provided.
  • the organic protective material an amine compound having a molecular weight of 100 to 100 is preferably used, and a substance having one or more unsaturated bonds in one molecule is particularly suitable.
  • This fine silver powder has a crystallite diameter of, for example, 20 nm or less in the (1 1 1) crystal plane of silver.
  • the present invention also provides an ink in which the silver fine powder particles are dispersed in an organic solvent at a silver concentration of 10% by mass or more and have a viscosity of 50 mPa ⁇ s or less.
  • FIG. 1 is a diagram schematically showing a heat pattern by a TG—DTA apparatus employed for measuring the ratio of an organic protective material.
  • the inventors have developed a silver fine powder in which silver nanoparticles are covered with an organic protective material as a silver fine powder exhibiting extremely good dispersibility in an organic solvent.
  • an organic protective material as a silver fine powder exhibiting extremely good dispersibility in an organic solvent.
  • the reducing agent a solvent alcohol or polyol is used. This makes it possible to obtain silver nanoparticles with little impurity contamination. In the reaction, it is efficient to perform a reflux operation. For this reason, it is preferable that the boiling point of the alcohol or polyol is low. Specifically, the boiling point is preferably 300 ° C. or lower, preferably 20 ° C. or lower, and more preferably 150 ° C. or lower. In addition, it is preferable from the viewpoint of reducing ability that the alcohol has as long a carbon chain as possible.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Composite Materials (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
PCT/JP2008/050308 2007-01-09 2008-01-08 銀微粉およびその製法並びにインク WO2008084866A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008800020027A CN101583449B (zh) 2007-01-09 2008-01-08 银微粉及其制造方法以及油墨
US12/522,422 US7981326B2 (en) 2007-01-09 2008-01-08 Silver fine powder, process for producing the same, and ink
EP08703172.0A EP2119518B1 (en) 2007-01-09 2008-01-08 Silver fine powder, method for producing the same, and ink
KR1020097013034A KR101451603B1 (ko) 2007-01-09 2008-01-08 은 미분 및 그 제법 및 잉크

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-001298 2007-01-09
JP2007001298 2007-01-09
JP2007-173732 2007-07-02
JP2007173732A JP5252843B2 (ja) 2007-01-09 2007-07-02 銀インクおよびその製法

Publications (1)

Publication Number Publication Date
WO2008084866A1 true WO2008084866A1 (ja) 2008-07-17

Family

ID=39608753

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050308 WO2008084866A1 (ja) 2007-01-09 2008-01-08 銀微粉およびその製法並びにインク

Country Status (6)

Country Link
US (1) US7981326B2 (zh)
EP (1) EP2119518B1 (zh)
JP (1) JP5252843B2 (zh)
KR (1) KR101451603B1 (zh)
CN (1) CN101583449B (zh)
WO (1) WO2008084866A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10941304B2 (en) 2016-04-04 2021-03-09 Nichia Corporation Metal powder sintering paste and method of producing the same, and method of producing conductive material

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2101334B1 (en) * 2007-01-09 2015-05-13 DOWA Electronics Materials Co., Ltd. Silver particle dispersion and process for producing the same
JP2010108843A (ja) * 2008-10-31 2010-05-13 Hitachi Cable Ltd 絶縁被覆電線
KR101012986B1 (ko) * 2009-01-08 2011-02-10 엘에스전선 주식회사 전도성 잉크의 제조 방법
US9412487B2 (en) 2009-09-18 2016-08-09 Sumitomo Chemical Company, Limited Silver-(conjugated compound) composite
WO2011034177A1 (ja) 2009-09-18 2011-03-24 住友化学株式会社 銀-共役化合物複合体
CN102740997B (zh) * 2009-11-27 2016-02-24 特线工业株式会社 含有微小金属粒子的组合物
KR20130042478A (ko) * 2010-03-15 2013-04-26 마사유키 가네하라 나노 잉크 조성물
KR101700615B1 (ko) * 2010-03-30 2017-01-31 주식회사 동진쎄미켐 금속 나노입자의 제조방법, 이에 의해 제조된 금속 나노입자 및 이를 포함하는 금속 잉크 조성물
JP2012057036A (ja) * 2010-09-08 2012-03-22 Ihi Corp インクの調製方法及びパターン形成方法
CN102675961B (zh) * 2011-03-08 2015-08-19 深圳市尊业纳米材料有限公司 一种导电油墨及其制备方法和使用方法
US9704612B2 (en) 2011-03-17 2017-07-11 Sumitomo Chemical Company, Limited Composition of silver-conjugated compound composite
JP5773148B2 (ja) * 2011-07-29 2015-09-02 戸田工業株式会社 銀微粒子並びに該銀微粒子を含有する導電性ペースト、導電性膜及び電子デバイス
WO2013018645A1 (ja) * 2011-07-29 2013-02-07 戸田工業株式会社 銀微粒子並びに該銀微粒子を含有する導電性ペースト、導電性膜及び電子デバイス
JP5773147B2 (ja) * 2011-07-29 2015-09-02 戸田工業株式会社 銀微粒子並びに該銀微粒子を含有する導電性ペースト、導電性膜及び電子デバイス
CN104254924A (zh) * 2012-03-16 2014-12-31 三洋电机株式会社 太阳能电池组件
JP6282616B2 (ja) * 2014-07-30 2018-02-21 Dowaエレクトロニクス株式会社 銀粉およびその製造方法
JP6948764B2 (ja) * 2015-06-05 2021-10-13 Dowaエレクトロニクス株式会社 銀微粒子分散液
TWI674302B (zh) * 2017-03-07 2019-10-11 日商同和電子科技有限公司 銀奈米線印墨之製造方法、銀奈米線印墨,以及透明導電塗膜

Citations (5)

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WO2004012884A1 (ja) 2002-08-01 2004-02-12 Daiken Chemical Co., Ltd. 金属ナノ粒子及びその製造方法
JP2005036309A (ja) * 2003-06-25 2005-02-10 Toda Kogyo Corp 銀超微粒子コロイド及びその製造方法
JP2006213955A (ja) * 2005-02-02 2006-08-17 Dowa Mining Co Ltd 銀の粒子粉末およびその製造法
JP2006219693A (ja) 2005-02-08 2006-08-24 Harima Chem Inc 金属銀微粒子の製造方法
JP2006241494A (ja) * 2005-03-01 2006-09-14 Dowa Mining Co Ltd 銀粒子粉末およびその製造法

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US20050173680A1 (en) * 2004-02-10 2005-08-11 Haixin Yang Ink jet printable thick film ink compositions and processes
JP2005330529A (ja) * 2004-05-19 2005-12-02 Dowa Mining Co Ltd 球状銀粉およびその製造方法
JP2006002228A (ja) * 2004-06-18 2006-01-05 Dowa Mining Co Ltd 球状銀粉およびその製造方法
JP2006118010A (ja) * 2004-10-22 2006-05-11 Toda Kogyo Corp Agナノ粒子及びその製造方法、Agナノ粒子の分散溶液
US7316475B2 (en) * 2004-11-10 2008-01-08 Robert Wilson Cornell Thermal printing of silver ink
JP5028695B2 (ja) * 2004-11-25 2012-09-19 Dowaエレクトロニクス株式会社 銀粉およびその製造方法
TWI285568B (en) * 2005-02-02 2007-08-21 Dowa Mining Co Powder of silver particles and process
JP5164239B2 (ja) * 2006-09-26 2013-03-21 Dowaエレクトロニクス株式会社 銀粒子粉末、その分散液および銀焼成膜の製造法
JP5139659B2 (ja) * 2006-09-27 2013-02-06 Dowaエレクトロニクス株式会社 銀粒子複合粉末およびその製造法
EP2101334B1 (en) * 2007-01-09 2015-05-13 DOWA Electronics Materials Co., Ltd. Silver particle dispersion and process for producing the same

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Publication number Priority date Publication date Assignee Title
WO2004012884A1 (ja) 2002-08-01 2004-02-12 Daiken Chemical Co., Ltd. 金属ナノ粒子及びその製造方法
JP2005036309A (ja) * 2003-06-25 2005-02-10 Toda Kogyo Corp 銀超微粒子コロイド及びその製造方法
JP2006213955A (ja) * 2005-02-02 2006-08-17 Dowa Mining Co Ltd 銀の粒子粉末およびその製造法
JP2006219693A (ja) 2005-02-08 2006-08-24 Harima Chem Inc 金属銀微粒子の製造方法
JP2006241494A (ja) * 2005-03-01 2006-09-14 Dowa Mining Co Ltd 銀粒子粉末およびその製造法

Non-Patent Citations (1)

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Title
See also references of EP2119518A4

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10941304B2 (en) 2016-04-04 2021-03-09 Nichia Corporation Metal powder sintering paste and method of producing the same, and method of producing conductive material
US11634596B2 (en) 2016-04-04 2023-04-25 Nichia Corporation Metal powder sintering paste and method of producing the same, and method of producing conductive material

Also Published As

Publication number Publication date
JP5252843B2 (ja) 2013-07-31
CN101583449B (zh) 2013-04-24
US7981326B2 (en) 2011-07-19
US20100006002A1 (en) 2010-01-14
EP2119518A4 (en) 2013-04-17
EP2119518B1 (en) 2016-12-07
CN101583449A (zh) 2009-11-18
JP2008190025A (ja) 2008-08-21
KR20090098838A (ko) 2009-09-17
KR101451603B1 (ko) 2014-10-17
EP2119518A1 (en) 2009-11-18

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