WO2008084848A1 - 蛍光体、その製造方法および発光器具 - Google Patents
蛍光体、その製造方法および発光器具 Download PDFInfo
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- WO2008084848A1 WO2008084848A1 PCT/JP2008/050258 JP2008050258W WO2008084848A1 WO 2008084848 A1 WO2008084848 A1 WO 2008084848A1 JP 2008050258 W JP2008050258 W JP 2008050258W WO 2008084848 A1 WO2008084848 A1 WO 2008084848A1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/0883—Arsenides; Nitrides; Phosphides
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
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- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
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- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
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- H—ELECTRICITY
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J31/00—Cathode ray tubes; Electron beam tubes
- H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
- H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
- H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
- H01J31/123—Flat display tubes
- H01J31/125—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection
- H01J31/127—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection using large area or array sources, i.e. essentially a source for each pixel group
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- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
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- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3284—Zinc oxides, zincates, cadmium oxides, cadmiates, mercury oxides, mercurates or oxide forming salts thereof
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
- C04B2235/3865—Aluminium nitrides
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
- C04B2235/3873—Silicon nitrides, e.g. silicon carbonitride, silicon oxynitride
- C04B2235/3878—Alpha silicon nitrides
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3895—Non-oxides with a defined oxygen content, e.g. SiOC, TiON
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5409—Particle size related information expressed by specific surface values
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5445—Particle size related information expressed by the size of the particles or aggregates thereof submicron sized, i.e. from 0,1 to 1 micron
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08703122.5A EP2135919B1 (en) | 2007-01-12 | 2008-01-11 | Fluorescent material, process for producing the same, and luminescent device |
US12/522,540 US8142685B2 (en) | 2007-01-12 | 2008-01-11 | Fluorescent material, process for producing the same, and luminescent device |
JP2008553121A JP5322053B2 (ja) | 2007-01-12 | 2008-01-11 | 蛍光体、その製造方法および発光器具 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007004628 | 2007-01-12 | ||
JP2007-004628 | 2007-01-12 |
Publications (1)
Publication Number | Publication Date |
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WO2008084848A1 true WO2008084848A1 (ja) | 2008-07-17 |
Family
ID=39608735
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/050258 WO2008084848A1 (ja) | 2007-01-12 | 2008-01-11 | 蛍光体、その製造方法および発光器具 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8142685B2 (ja) |
EP (1) | EP2135919B1 (ja) |
JP (2) | JP5322053B2 (ja) |
WO (1) | WO2008084848A1 (ja) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009073870A (ja) * | 2007-09-18 | 2009-04-09 | Toshiba Corp | 蛍光体および発光装置 |
WO2012101899A1 (ja) * | 2011-01-26 | 2012-08-02 | 電気化学工業株式会社 | α型サイアロン、発光装置及びその用途 |
JP2012241026A (ja) * | 2011-05-14 | 2012-12-10 | Sony Chemical & Information Device Corp | 赤色蛍光体、赤色蛍光体の製造方法、白色光源、照明装置、および液晶表示装置 |
JP2012241025A (ja) * | 2011-05-14 | 2012-12-10 | Sony Chemical & Information Device Corp | 赤色蛍光体、赤色蛍光体の製造方法、白色光源、照明装置、および液晶表示装置 |
JP2012241027A (ja) * | 2011-05-14 | 2012-12-10 | Sony Chemical & Information Device Corp | 赤色蛍光体、赤色蛍光体の製造方法、白色光源、照明装置、および液晶表示装置 |
JP2013522838A (ja) * | 2010-03-16 | 2013-06-13 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 照明装置 |
JPWO2012036016A1 (ja) * | 2010-09-17 | 2014-02-03 | 株式会社東芝 | 蛍光体および発光装置 |
KR20150086274A (ko) * | 2012-11-13 | 2015-07-27 | 덴끼 가가꾸 고교 가부시키가이샤 | 형광체, 발광소자 및 조명장치 |
KR20160012177A (ko) * | 2013-05-23 | 2016-02-02 | 오스람 옵토 세미컨덕터스 게엠베하 | 분말형 전구체 재료의 제조 방법, 분말형 전구체 재료 및 분말형 전구체 재료의 용도 |
JP2016028158A (ja) * | 2015-10-07 | 2016-02-25 | デクセリアルズ株式会社 | 赤色蛍光体、赤色蛍光体の製造方法、白色光源、照明装置、および液晶表示装置 |
JP2016084248A (ja) * | 2014-10-23 | 2016-05-19 | 国立大学法人九州工業大学 | 蛍光素子 |
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US8852453B2 (en) * | 2004-08-11 | 2014-10-07 | National Institute For Materials Science | Phosphor |
US8274215B2 (en) * | 2008-12-15 | 2012-09-25 | Intematix Corporation | Nitride-based, red-emitting phosphors |
CN102939355B (zh) * | 2010-05-14 | 2016-10-26 | 渲染材料公司 | 氧碳氮化物磷光体和使用该材料的发光器件 |
US8801969B2 (en) * | 2011-01-14 | 2014-08-12 | Lightscape Materials, Inc. | Carbonitride and carbidonitride phosphors and lighting devices using the same |
US8663502B2 (en) | 2011-12-30 | 2014-03-04 | Intematix Corporation | Red-emitting nitride-based phosphors |
US8951441B2 (en) | 2011-12-30 | 2015-02-10 | Intematix Corporation | Nitride phosphors with interstitial cations for charge balance |
JP5727955B2 (ja) | 2012-03-08 | 2015-06-03 | 株式会社東芝 | 蛍光体およびその製造方法 |
US8597545B1 (en) | 2012-07-18 | 2013-12-03 | Intematix Corporation | Red-emitting nitride-based calcium-stabilized phosphors |
DE102012106940A1 (de) * | 2012-07-30 | 2014-01-30 | Osram Gmbh | Verfahren zur Herstellung eines Leuchtstoffs, Leuchtstoff und optoelektronisches Bauelement |
US9337010B2 (en) * | 2014-09-05 | 2016-05-10 | Lawrence Livermore National Security, Llc | Fluorescent lighting with aluminum nitride phosphors |
EP3202751B1 (en) * | 2014-09-29 | 2019-11-20 | NGK Spark Plug Co., Ltd. | Sialon sintered body and cutting insert |
JP5951141B1 (ja) * | 2014-09-30 | 2016-07-13 | 三菱電機株式会社 | 照明装置 |
US10600604B2 (en) | 2017-06-23 | 2020-03-24 | Current Lighting Solutions, Llc | Phosphor compositions and lighting apparatus thereof |
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DE10133352A1 (de) | 2001-07-16 | 2003-02-06 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
EP1780255B1 (en) | 2004-07-13 | 2012-04-18 | Fujikura, Ltd. | Fluorescent substance and light bulb color light emitting diode lamp using the fluorescent substance and emitting light bulb color light |
US8852453B2 (en) * | 2004-08-11 | 2014-10-07 | National Institute For Materials Science | Phosphor |
JP4756261B2 (ja) | 2005-01-27 | 2011-08-24 | 独立行政法人物質・材料研究機構 | 蛍光体とその製造方法および発光器具 |
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Also Published As
Publication number | Publication date |
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US20100039020A1 (en) | 2010-02-18 |
JP5660471B2 (ja) | 2015-01-28 |
JP5322053B2 (ja) | 2013-10-23 |
JPWO2008084848A1 (ja) | 2010-05-06 |
US8142685B2 (en) | 2012-03-27 |
EP2135919A1 (en) | 2009-12-23 |
EP2135919B1 (en) | 2013-10-30 |
EP2135919A4 (en) | 2010-09-01 |
JP2013136758A (ja) | 2013-07-11 |
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