WO2008041273A1 - Procédé de capture et appareil de capture - Google Patents

Procédé de capture et appareil de capture Download PDF

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Publication number
WO2008041273A1
WO2008041273A1 PCT/JP2006/319443 JP2006319443W WO2008041273A1 WO 2008041273 A1 WO2008041273 A1 WO 2008041273A1 JP 2006319443 W JP2006319443 W JP 2006319443W WO 2008041273 A1 WO2008041273 A1 WO 2008041273A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive sheet
pellet
peeled
pellets
receiving portion
Prior art date
Application number
PCT/JP2006/319443
Other languages
English (en)
Japanese (ja)
Inventor
Akira Nakatsu
Original Assignee
Canon Machinery Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Machinery Inc. filed Critical Canon Machinery Inc.
Priority to KR1020097004113A priority Critical patent/KR101133963B1/ko
Priority to JP2008537331A priority patent/JP4850916B2/ja
Priority to PCT/JP2006/319443 priority patent/WO2008041273A1/fr
Priority to CN2006800559527A priority patent/CN101512746B/zh
Publication of WO2008041273A1 publication Critical patent/WO2008041273A1/fr

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Definitions

  • the present invention relates to a pickup method and a pickup apparatus.
  • a diced semiconductor pellet hereinafter simply referred to as a pellet
  • a conventional pickup device there is one provided with a stage for holding an adhesive sheet, a push-up stand that moves forward and backward with respect to the stage, and a dollar that is pushed up by the push-up stand. That is, it is configured such that the pressure-sensitive adhesive sheet of the stage is pushed from the back side by one dollar pushed up by the push-up stand, and the pellet is detached from the pressure-sensitive adhesive sheet.
  • the pellet is adsorbed by a collet and taken out.
  • the pellet is tilted and pushed up, a mistake in adsorption of the pellet due to the collet occurs. If a collet pellet pick-up error occurs, the subsequent work will be hindered. In some cases, the pellet was damaged by the needle being pushed up.
  • the pickup device includes a stage 3 that holds an adhesive sheet 2 on which a pellet 1 is attached. Further, the stage 3 is provided with a receiving portion 4 whose upper surface 4a protrudes from the stage upper surface 3a. For this reason, a gap 6 is formed on the outer peripheral side of the receiving portion 4 between the adhesive sheet 2 and the adhesive sheet 2 as shown in FIG. Furthermore, the stage 3 is provided with a suction hole 5 communicating with the gap 6. These suction holes 5, 5 As shown in FIG. 8, a part thereof protrudes outside the first side 8a of the pellet 1 in a plan view.
  • the pressure-sensitive adhesive sheet 2 is sucked through the suction hole 5 while the pellet 1 is sucked (held) by the collet (adsorption collet) 7 from above.
  • the air in the gap 6 is sucked as indicated by an arrow A
  • the pressure-sensitive adhesive sheet 2 around the receiving portion 4 is sucked, and the pressure-sensitive adhesive sheet 2 is peeled off on the outer peripheral side of the pellet 1.
  • the receiving portion 4 is moved in the direction of arrow B. That is, it is moved to the second side 8b facing the first side 8a.
  • the receiving area of the pellet 1 received by the receiving part 4 is reduced, and the adsorption (suction) area of the adhesive sheet 2 is increased. Can be completely peeled off.
  • Patent Document 1 Patent No. 3209736
  • the adhesive sheet 2 is peeled from the first side 8a toward the second side 8b facing the first side 8a. For this reason, the length of the first side 8a is peeled off and a relatively large peeling force is required.
  • the tip 1 is held only by the collet 7 adsorption force at the time of peeling, the tip (pellet) 1 side loses against the peeling force at the time of sliding, and the tip 1 is detached from the collet 7 or received. There is a risk that the adhesive sheet 2 is pulled by the sliding movement of the part 4 and the chip 1 is displaced.
  • the present invention provides a pickup method and pickup apparatus that can reliably and easily peel and take out pellets to be peeled.
  • the pickup method of the present invention comprises a plurality of rectangular thin-walled sheets affixed on an adhesive sheet.
  • the pellet is peeled off from the pressure-sensitive adhesive sheet in order, and the pellet to be peeled is received via the pressure-sensitive adhesive sheet at the receiving part, and the outer peripheral side of the receiving part is in contact with the pressure-sensitive adhesive sheet.
  • the pellet is held at the upper force and the gap is sucked by supporting the lower part of the pressure-sensitive adhesive sheet by the protrusions that enter the gap while supporting the lower portion.
  • the pressure-sensitive adhesive sheet is peeled off, and then the pellet is peeled by moving the receiving portion along the horizontal direction while supporting the pressure-sensitive adhesive sheet with protrusions and holding the pellet from above.
  • the pickup method of the present invention if the pellets to be peeled are received via the adhesive sheet and the air in the gap formed between the receiving portion and the adhesive sheet is sucked, the receiver At the outer peripheral side of the part, the pressure-sensitive adhesive sheet is sucked and peeled off from the pellet. After that, the receiving area of the pellet by the receiving part decreases by moving the receiving part along the horizontal direction. As a result, the adsorption (suction) area of the pressure-sensitive adhesive sheet increases, and finally, the pressure-sensitive adhesive sheet can be completely peeled off from the pellet to be peeled.
  • the pressure-sensitive adhesive sheet is supported downward by a protrusion that is inserted into a gap formed on the outer peripheral side of the receiving portion. Therefore, when air in the gap is sucked, Stress can be concentrated in the vicinity of the protrusions, and peeling of the pellets by adsorption becomes easy. Moreover, a protrusion will bite into an adhesive sheet by suction.
  • the pickup apparatus of the present invention is a pickup apparatus that sequentially removes a plurality of rectangular thin pellets attached on an adhesive sheet from the adhesive sheet and takes out the pellets to be peeled upward.
  • Holding means a stage on which the pressure-sensitive adhesive sheet is placed, a receiving part that receives the pellets via the pressure-sensitive adhesive sheet, and air in a gap formed between the pressure-sensitive adhesive sheet on the outer peripheral side of the receiving part Air suction means, a protrusion that is inserted into the gap and supports a part of the pressure-sensitive adhesive sheet from below, and a drive means that moves the receiving portion along the horizontal direction.
  • the pellets to be peeled can be received by the receiving part via the adhesive sheet. Then, the pellet is received by the receiving part and the upward force is also held by the holding means, and is formed between the adhesive sheet on the outer peripheral side of the receiving part.
  • the pressure-sensitive adhesive sheet is sucked and peeled off from the pellets on the outer peripheral side of the receiving portion. Further, the receiving portion can be moved along the horizontal direction by the driving means. As a result, the receiving area of the pellet by the receiving portion decreases, and the adsorption (suction) area of the adhesive sheet increases. For this reason, if the adsorption area is the same as the pellet area or larger than the pellet area, the pressure-sensitive adhesive sheet can be completely peeled from the pellet to be peeled.
  • the pressure-sensitive adhesive sheet is supported downward by a protrusion that is inserted into a gap formed on the outer peripheral side of the receiving portion. Therefore, when air in the gap is sucked, Stress can be concentrated in the vicinity of the protrusions, and peeling of the pellets by adsorption becomes easy. For this reason, the said pick-up method can be performed reliably.
  • the protrusion may be constituted by a pin that can move up and down. As a result, the height position of the pin can be adjusted. Further, it is possible to integrally attach the protrusion to the stage on which the receiving portion is arranged. In this case, it may extend in the vertical direction or may extend in the horizontal direction (horizontal direction).
  • protrusions it is preferable to arrange the protrusions in correspondence with the corner portions (corner portions) of the pellet. By arranging the protrusions in this manner, stress can be concentrated on the corner portions of the pellet that can be easily peeled off. The invention's effect
  • the stress when the air in the gap is sucked, the stress can be concentrated in the vicinity of the protrusion, and the peeling of the pellet by adsorption becomes easy. That is, the peeling can be performed with a relatively small force at the initial stage of peeling, and the peeling start time can be shortened.
  • the height position of the pin can be adjusted, so that the thickness of the adhesive sheet, the height of the stage on which the receiving portion is disposed, and the like can be adjusted.
  • the height position of the pin it is possible to exhibit the optimum peeling performance for the pellet to be peeled.
  • the configuration of the entire apparatus can be simplified.
  • the adhesive sheet can support the downward force, and reliably exerts the function of improving the peelability. Can do.
  • FIG. 1 is a simplified process diagram illustrating a pickup method according to an embodiment of the present invention.
  • FIG. 2 shows a pickup device according to an embodiment of the present invention, and is a simplified sectional view of a pickup using this device.
  • FIG. 3 is a simplified plan view showing pellets attached to an adhesive sheet.
  • FIG. 4 is a simplified diagram showing the relationship between the protrusion of the pickup device and the receiving portion.
  • FIG. 5 is a cross-sectional view of a pickup device according to another embodiment of the present invention.
  • FIG. 6 is a simplified process diagram showing a pickup method using another pickup apparatus according to the embodiment of the present invention.
  • FIG. 7 is a simplified diagram showing a modification of the protrusion of the pickup device.
  • FIG. 8 is a simplified plan view of a conventional pickup device.
  • FIG. 9 is a simplified cross-sectional view of a conventional pickup device.
  • FIG. 10 is a simplified cross-sectional view showing a peeling process using a conventional pickup device.
  • FIG. 11 is a simplified diagram showing problems of a pickup method using a conventional pickup device.
  • FIG. 2 shows the pickup device of the present invention.
  • This pickup device is a device that sequentially peels and takes out a plurality of rectangular thin-walled pellets (semiconductor chips) 11 affixed on the pressure-sensitive adhesive sheet 12 from the pressure-sensitive adhesive sheet 12.
  • the pellet 11 is made from woofer W (see Fig. 3) as a raw material, and the final product is obtained by cutting the raw material into a rectangular shape. For this reason, the pellets 11 include squares and strips. That is, as shown in FIG. 3, wafer W is circular as a whole, and is divided into individual pellets 11 by dicing, and these pellets 11 are attached to the adhesive sheet 12! /, Ru. Further, a frame 13 having a ring strength is attached to the outer peripheral side of the adhesive sheet 12. That is, the frame 13 and the adhesive sheet 12 are integrated. Then, in a state where the frame 13 and the adhesive sheet 12 are integrated, the pellet 11 is taken out by this pickup device.
  • the pick-up device holds the pellet 11 to be peeled upward by holding means 15, a stage 16 on which the adhesive sheet 12 is placed, and the pellet 11 through the adhesive sheet 12.
  • the holding means 15 is constituted by an adsorbing member (collet) 21 having a head 20 that adsorbs the pellets 11.
  • the head 20 is provided with an adsorption hole in its lower end surface 20 a, and the pellet 11 is vacuumed through the adsorption hole, and the pellet 11 is adsorbed on the lower end surface 20 a of the head 20. For this reason, when this vacuum suction (evacuation) is released, the pellet 20 is also removed from the head 20 force.
  • the adsorbing member 21 is connected to a robot arm, for example, in the vertical direction (see FIG. 2). It is possible to move in the direction of arrows C and D), in the horizontal direction (in the direction of arrow E in Fig. 2), and in a combination of these directions.
  • a recess 22 is provided on the upper surface of the stage 16, and a receiving portion 17 is disposed in the recess 22.
  • the recess 22 includes a rectangular main body portion 22a and a tapered portion 22b disposed on the outer peripheral side of the main body portion 22a.
  • the receiving portion 17 is a rectangular flat body that fits into the main body portion 22a of the recess 22, and the thickness dimension is set to be substantially the same as the depth dimension of the main body portion 22a. Further, as shown in FIG. 1, the width dimension W of the receiving portion 17 is set to be smaller than the length (width dimension) W1 of one side of the pellet 11 which is a square.
  • one long side 17a of the receiving part 17 corresponds to the first side 23a of the pellet 11 to be peeled
  • the other long side 17b of the receiving part 17 is the second side 23b of the pellet 11 to be peeled off.
  • the short side 17c on the tip side of the receiving part 17 is the third side 23c of the pellet 11 (the side perpendicular to the first side 23a and the second side 23b) ).
  • the recess 22 has suction holes 30a, 30b corresponding to the middle part of the first side 23a, the middle part of the second side 23b, and the middle part of the third side 23c. 30c is provided. A part of each suction hole 30 protrudes outward from the pellet 11 so as to be divided in plan view.
  • the suction means 18 has the suction holes 30a, 30b, 30c, and a vacuum pump (not shown) is connected to the suction holes 30a. That is, when the vacuum pump is driven, air in the gap 19 is sucked through the suction holes 30a and the like.
  • the receiving portion 17 moves along the horizontal direction via the driving means while the short side 17c on the distal end side of the receiving portion 17 is kept parallel to the third side 23c of the pellet 11.
  • the driving means various mechanisms such as a bolt shaft member and a reciprocating mechanism having a nut member force screwed to the bolt shaft member or a cylinder mechanism can be used.
  • a support member 31 is connected to the receiving portion 17, and the receiving portion 17 and the support member 31 constitute a moving block body 32.
  • the stage 16 is provided with a protrusion 25 that is inserted into the gap 19.
  • a protrusion 25 that is, the corner portion (corner portion) formed by the first side 23a and the third side 23c of the pellet 11 to be peeled, and the corner portion (corner portion) formed by the second side 23b and the third side 23c of the pellet 11 ) are provided as pins 25 (small-diameter cylinders with a rounded tip) (see Fig. 4).
  • the stage 16 is provided with a hole (not shown) in the vertical direction, and a pin as the protrusion 25 is disposed in the hole so as to be movable up and down.
  • the protrusion 25 moves up and down by a vertical movement mechanism such as a cylinder mechanism or a ball screw mechanism (not shown).
  • a vertical movement mechanism such as a cylinder mechanism or a ball screw mechanism (not shown).
  • the height position of the tip 26 of the projection 25 is higher than the height position of the upper surface 27 of the receiving portion 17, or the height position of the tip 26 of the projection 25 However, the height can be lower than the height position of the upper surface 27 of the receiving portion 17.
  • the protrusion 25 has different forces depending on the size and thickness of the pellet 11 to be peeled off, the thickness of the adhesive sheet 12, etc. For example, 0.6 mn! It is about 0.7 mm, and the radius of curvature of the rounded portion at the tip is, for example, about 200 ⁇ m to 300 ⁇ m.
  • a gap 19 is formed on the lower side of the adhesive sheet 12 at least on the front side of the receiving portion 17 as shown in FIG. Further, in the gap 19, a corner portion (corner portion) formed by the first side 23a and the third side 23c of the pellet 11 and a corner portion (corner portion) formed by the second side 23b and the third side 23c of the pellet 11 are formed. Insert the protrusion 25 corresponding to the At this time, for example, as shown in FIG. 4 (a), the height position of the tip 26 of the protrusion 25 and the height position of the upper surface 27 of the receiving portion 17 are set to coincide with each other.
  • the gap 19 communicates with the suction holes 30a, 30b, 30c. Therefore Then, by driving the suction means 18, the air in the gap 19 is sucked through the suction holes 30a, 30b, 30c. As a result, as shown in FIG. 2 (B), in a state where a part of the adhesive sheet 12 is supported by the protrusion 25, a part of the adhesive sheet 12 around the protrusion 25 is sucked and the protrusion 25 The adjacent adhesive sheet 12 is peeled from the pellet 11a.
  • the receiving portion 17 is moved (slid) as indicated by an arrow F.
  • the receiving area of the pellet 1 by the receiving part 17 decreases, and the adsorption (suction) area of the adhesive sheet 12 downward increases.
  • the pellet 1 la is held (adsorbed) on the collet 21! /, So that the adhesive sheet 12 is peeled from the pellet 1 la in sequence. Therefore, as shown in FIG. 2D, if the adsorption area is the same as the pellet area or larger than the pellet area, the adhesive sheet 12 can be completely peeled from the pellet 1 to be peeled.
  • the pellet 11a can be taken out of the adhesive sheet 12 by raising the collet 21 as indicated by arrow C and releasing the force by 16 stages. .
  • the receiving portion 17 is returned as shown by an arrow G to be in a standby state, and the pellet 11 to be peeled next is arranged to be received by the receiving portion 17. In this case, it corresponds to the 1 lb pellet 11 in FIG.
  • the pressure-sensitive adhesive sheet 12 is also supported by the protrusion 25 that is inserted into the gap 19 formed on the outer peripheral side of the receiving portion 17. Therefore, when the air in the gap 19 is sucked, the protrusion 25 In the vicinity, it can be stressed and the pellet 11 can be easily peeled off by adsorption. That is, peeling can be performed with a relatively small force at the initial stage of peeling, and the peeling start time can be shortened.
  • the protrusion 25 bites into the adhesive sheet 12 by suction, and the protrusion 25 becomes an anchor with respect to the adhesive sheet 12. For this reason, peeling work
  • the adhesive sheet 12 is not pulled by the slide of the receiving part 17 and the chip (pellet) 1 side does not lose against the peeling force at the time of sliding. Therefore, the collet 21 (holding means) force does not come off the pellet 11, and there is no possibility that the pellet 11 will be displaced due to the adhesive sheet 12 being stretched.
  • the height position of the pin can be adjusted, so the thickness of the adhesive sheet 12 and the stage 16 on which the receiving portion 17 is disposed
  • the height position of the pin By adjusting the height position of the pin according to the height or the like, the optimum peeling performance can be exhibited for the pellet 11 to be peeled.
  • FIG. 5 shows another embodiment.
  • the receiving portion 17 protrudes from the upper surface of the stage 16. For this reason, when the pellet 11 to be peeled is received at the receiving portion 17, the pellet 11 is received at a higher position than the upper surface of the stage 16.
  • the protrusion 25 that can be moved up and down to enter the gap 19 is provided. For this reason, if air is sucked into the gap 19 with the pellet 11 holding the upward force with the collet 21, the pellet is supported with a part of the adhesive sheet 12 supported by the protrusion 25 on the front side of the receiving portion 17.
  • the adhesive sheet 12 can be peeled off from 11. Therefore, if the receiving portion 17 is moved in the horizontal direction in this state, the adhesive sheet 12 can be easily peeled off as in the pickup device shown in FIG.
  • the receiving portion 17 is moved with respect to the stage 16 as another embodiment in which the receiving portion 17 is moved with respect to the stage 16, the receiving portion 17 is provided integrally with the stage 16 and the stage 16 is moved. Thus, the receiving part 17 may be moved relative to the pellet 11.
  • FIG. 6 shows another embodiment, in which the receiving part 17 is provided with a tapered portion 35 that narrows toward the tip. That is, the tapered portion 35 includes a first side 36 parallel to the second side 23b of the pellet 11 and a second side 37 parallel to the second side 23c of the pellet 11, and the first side 36 and the second side Side 37 is 90 degrees.
  • the corner portion 38 of the tapered portion 35 corresponds to one pellet corner portion 39 to be peeled off.
  • the one pellet corner 39 has the second side 23b and the third side 23c. It is a joint part to make.
  • the receiving portion 17 is placed on a diagonal line L connecting the pellet corner portion 39 and another pellet corner portion 40 (the corner portion formed by the first side 23a and the fourth side 23d) facing the pellet corner portion 39.
  • the corners 38 are arranged.
  • suction holes 30d are provided corresponding to the corners of the second side 23b and the fourth side 23d, and suction holes 30e are provided corresponding to the intermediate part of the second side 23a.
  • the suction hole 30g is provided corresponding to the middle part of the third side 23c, and the suction hole 30h is provided corresponding to the corner part of the third side 23c and the first side 23a.
  • Each suction hole 30 protrudes outward from the pellet 11 as can be seen in plan view.
  • a vertically movable protrusion 25 that enters the gap 19 is provided corresponding to a corner 39 between the second side 23b and the third side 23c.
  • a pickup method using the pickup device shown in FIG. 6 will be described.
  • a pellet 11a that does not correspond to the other pellets 11 is selected on two sides (in this case, the first side 23a and the fourth side 23d).
  • the stage 16 of the pick-up device is positioned below the pellet 11a and is received by the receiving portion 17 of the moving block body 32 via the adhesive sheet 12.
  • the first side 36 of the receiving part 17 is parallel to the second side 23b of the pellet 11a
  • the second side 37 of the receiving part 17 is parallel to the third side 23c of the pellet 11a.
  • the corner portion 38 of the receiving portion 17 is arranged on the diagonal line L of the pellet 11a. Further, the corner portion 38 is shifted from the corner portion 39 of the pellet 11a toward the corner portion 40 facing the corner portion 39 along the direction of the arrow ⁇ in FIG.
  • a gap 19 is formed on the lower side of the adhesive sheet 12 on the front side of the tapered portion 35 of the receiving portion 17 (the front side of the first side 36 and the second side 37). A part of the adhesive sheet 12 is supported. In this state, the pellet 11 a is adsorbed by the collet 21 of the holding means 15 as in ( ⁇ ) of FIG.
  • the gap 19 sucks air in the gap 19 through the suction holes 30d, 30e, 30g, and 30h.
  • the receiving part 17 is moved (slid) along the diagonal line L as indicated by an arrow oc.
  • the receiving area of the pellets 11 by the receiving part 17 is reduced, and the adhesive sheet 12
  • the adsorption (suction) area downward increases.
  • the pressure-sensitive adhesive sheet 12 is sequentially peeled from the pellet 11a. Therefore, if the adsorption area is the same as the pellet area or larger than the pellet area, the pressure-sensitive adhesive sheet 12 can be completely peeled from the pellet 1 to be peeled.
  • the peeling occurs along the diagonal line L of the pellet 11. For this reason, unlike the case of peeling by the length of one side of the pellet 11, the peeling force is small, and the pressure-sensitive adhesive sheet can be easily peeled off.
  • the receiving part 17 moves away from the side of the adjacent pellet 11 corresponding to the two sides constituting the pellet corner of the pellet 11 from which peeling starts. As a result, no dynamic bending stress is applied to the adjacent pellets 11, and the adjacent pellets 11 (particularly, the sides corresponding to the pellets to be peeled) are not cracked.
  • the adsorption stress that sucks the pressure-sensitive adhesive sheet 12 can be concentrated in one place.
  • the corner portion of the receiving portion 17 only needs to correspond to one pellet corner portion of the pellet 11 to be peeled, so that the width dimension is slightly smaller than one side of the pellet 11.
  • the receiving part 17 can be adjusted to pellets of various sizes by simply adjusting the position of the receiving part 17 with one type of receiving part without matching the size of the pellet 11, and it is excellent in versatility and contributes to cost reduction.
  • the moving direction of the receiving part 17 is a direction that forms 45 degrees with respect to the two sides constituting the pellet corner part 39, it peels off with a uniform peeling force with respect to the adhesive sheet 12.
  • the moving direction of the receiving part 17 can be changed.
  • the movement direction of the receiving part 17 can be changed according to the properties of the pellet 11 to be peeled off.
  • the moving direction of the receiving portion 17 can be set so that a force in a direction in which cracking hardly occurs is applied to the adjacent pellet 1. For this reason, damage (cracking) of adjacent pellets can be prevented more stably.
  • the protrusion 25 may be formed integrally with the stage 16 as shown in FIG.
  • the protrusion 25 protrudes horizontally in the recess 22 and may extend in the vertical direction.
  • the protrusions are formed integrally with the stage 16, it is possible to simplify the configuration of the entire apparatus.
  • it can support the adhesive sheet 12 with downward force, whether it extends in the vertical direction or in the horizontal direction (horizontal direction), and reliably exerts the function to improve the peelability. can do.
  • the present invention has been described.
  • the present invention is not limited to the above-described embodiment, and various modifications are possible.
  • the suction hole 30 provided in the stage 16 The size, number, shape, etc. can be arbitrarily set within the air suckable range of the gap 19. For this reason, one suction hole 30 may be provided.
  • the pellet 11 to be peeled may be a rectangle having a short side and a long side that is not limited to a square, or may be a strip having a very long side compared to the short side.
  • the thickness of the pressure-sensitive adhesive sheet 12 is not limited so long as it can be deformed so that it can be peeled off from the pellet 11 when the air in the gap 19 is sucked by the force suction means 18 depending on the suction force or the like.
  • the thickness of the receiving portion 17 can also be arbitrarily set depending on the range in which the air can be peeled from the pellet 11 when the air in the gap 19 is sucked by the suction means 18. Further, in the case of the receiving portion 17 as shown in FIG. 6, the angle of the corner portion of the receiving portion 17 is not limited to 90 degrees, but may be a little acute or obtuse! / ⁇ .
  • the number of pellets 11 affixed on the pressure-sensitive adhesive sheet 12 is arbitrary, and in the present invention, all the pellets 11 on the pressure-sensitive adhesive sheet 12 that are not affected by the number are sequentially peeled off. be able to. Further, in the case shown in FIG. 1, it is sufficient that the other pellet 11 does not correspond to the fourth side 23d of the pellet 11 to be peeled. Since the other pellets 11 do not have to correspond to the second side 23b and the fourth side 23d, the order of separation can be arbitrarily set as long as this condition is satisfied.
  • the protrusion 25 includes a corner portion (corner portion) formed by the first side 23a and the third side 23c of the pellet 11 to be peeled, and the second side 23b and the third side 23c of the pellet 11.
  • Fig. 6 it is arranged at the corner (corner) 39 of the second side 23b and the third side 23c of the pellet 11 in FIG.
  • the arrangement position, the number, and the like can be arbitrarily changed. That is, it may be an intermediate part of the first side 23a, an intermediate part of the second side 23b, an intermediate part of the third side 23c, or the like.
  • the protrusion 25 may be provided corresponding to the suction hole 30 or may be avoided.
  • the projection 25 is constituted by a pin as shown in FIG. 2, it may be a fixed type that does not move up and down. In this case, the pin constituting member may be implanted on the stage 16.
  • a plurality of pellets can be formed by attaching the cut wafer or the plate material before becoming the final product to an adhesive sheet and cutting with a dicing saw or the like in this state. And this pick-up apparatus can peel the pellet from the adhesive sheet one by one and take it out. The removed pellets can be supplied to a predetermined land of the lead frame.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)

Abstract

L'invention concerne un procédé de capture et un appareil de capture qui diminue la possibilité de fissurer des pastilles avoisinantes et d'effectuer un détachement et un enlèvement faciles et sans faute des pastilles devant être détachées. De multiples pastilles minces rectangulaires (11) adhérant sur une feuille adhésive sensible à la pression (12) sont séquentiellement détachées de la feuille adhésive sensible à la pression (12) et retirées. Tout en retenant chaque pastille (11) devant être détachée par le dessus, une aspiration par en dessous est appliquée à la feuille adhésive sensible à la pression (12). Simultanément à l'aspiration d'air et à la rétention de la pastille par le dessus, tout en maintenant la feuille adhésive sensible à la pression (12) par en dessous au moyen de saillies (25) pour une introduction dans des ouvertures (19), la partie de réception (17) est déplacée dans la direction horizontale pour ainsi détacher la pastille (11).
PCT/JP2006/319443 2006-09-29 2006-09-29 Procédé de capture et appareil de capture WO2008041273A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020097004113A KR101133963B1 (ko) 2006-09-29 2006-09-29 픽업 방법 및 픽업 장치
JP2008537331A JP4850916B2 (ja) 2006-09-29 2006-09-29 ピックアップ方法およびピックアップ装置
PCT/JP2006/319443 WO2008041273A1 (fr) 2006-09-29 2006-09-29 Procédé de capture et appareil de capture
CN2006800559527A CN101512746B (zh) 2006-09-29 2006-09-29 片状器件拾取方法及片状器件拾取装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/319443 WO2008041273A1 (fr) 2006-09-29 2006-09-29 Procédé de capture et appareil de capture

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010052758A1 (fr) * 2008-11-04 2010-05-14 キヤノンマシナリー株式会社 Procédé de décollement de puce, appareil de décollement de puce et procédé de fabrication de dispositif semi-conducteur
WO2010052759A1 (fr) * 2008-11-04 2010-05-14 キヤノンマシナリー株式会社 Procédé de décollement de puce, appareil de décollement de puce et procédé de fabrication de dispositif semi-conducteur
WO2010052760A1 (fr) * 2008-11-04 2010-05-14 キヤノンマシナリー株式会社 Procédé de décollement de puce, procédé de fabrication de dispositif semi-conducteur et appareil de décollement de puce
EP2211372A1 (fr) 2009-01-22 2010-07-28 Esec AG Ejecteur de puces
JP2016146425A (ja) * 2015-02-09 2016-08-12 キヤノンマシナリー株式会社 ピックアップ装置
JP2020155703A (ja) * 2019-03-22 2020-09-24 トヨタ自動車株式会社 ピックアップ装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7149238B2 (ja) * 2019-08-09 2022-10-06 Towa株式会社 樹脂成形装置及び樹脂成形品の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0217651A (ja) * 1988-07-06 1990-01-22 Sumitomo Electric Ind Ltd チップ実装装置
JPH07335720A (ja) * 1994-06-10 1995-12-22 Toshiba Corp 半導体チップ取上装置およびその取上方法
JPH1154594A (ja) * 1997-08-05 1999-02-26 Murata Mfg Co Ltd チップ状部品の取扱方法および装置
JP3209736B2 (ja) * 1999-11-09 2001-09-17 エヌイーシーマシナリー株式会社 ペレットピックアップ装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4482243B2 (ja) * 2001-03-13 2010-06-16 株式会社新川 ダイのピックアップ方法及びピックアップ装置
AU2002245560A1 (en) * 2001-03-20 2002-10-03 Numerial Technologies, Inc. System and method of providing mask defect printability analysis

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0217651A (ja) * 1988-07-06 1990-01-22 Sumitomo Electric Ind Ltd チップ実装装置
JPH07335720A (ja) * 1994-06-10 1995-12-22 Toshiba Corp 半導体チップ取上装置およびその取上方法
JPH1154594A (ja) * 1997-08-05 1999-02-26 Murata Mfg Co Ltd チップ状部品の取扱方法および装置
JP3209736B2 (ja) * 1999-11-09 2001-09-17 エヌイーシーマシナリー株式会社 ペレットピックアップ装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010052758A1 (fr) * 2008-11-04 2010-05-14 キヤノンマシナリー株式会社 Procédé de décollement de puce, appareil de décollement de puce et procédé de fabrication de dispositif semi-conducteur
WO2010052759A1 (fr) * 2008-11-04 2010-05-14 キヤノンマシナリー株式会社 Procédé de décollement de puce, appareil de décollement de puce et procédé de fabrication de dispositif semi-conducteur
WO2010052760A1 (fr) * 2008-11-04 2010-05-14 キヤノンマシナリー株式会社 Procédé de décollement de puce, procédé de fabrication de dispositif semi-conducteur et appareil de décollement de puce
JP4668361B2 (ja) * 2008-11-04 2011-04-13 キヤノンマシナリー株式会社 チップ剥離方法、チップ剥離装置、及び半導体装置製造方法
JP5214739B2 (ja) * 2008-11-04 2013-06-19 キヤノンマシナリー株式会社 チップ剥離方法、半導体装置の製造方法、及びチップ剥離装置
TWI452614B (zh) * 2008-11-04 2014-09-11 Canon Machinery Inc 晶片剝離方法、晶片剝離裝置以及半導體裝置製造方法
EP2211372A1 (fr) 2009-01-22 2010-07-28 Esec AG Ejecteur de puces
KR101621561B1 (ko) 2009-01-22 2016-05-16 에섹 에스에이 다이 이젝터
JP2016146425A (ja) * 2015-02-09 2016-08-12 キヤノンマシナリー株式会社 ピックアップ装置
JP2020155703A (ja) * 2019-03-22 2020-09-24 トヨタ自動車株式会社 ピックアップ装置
JP7135959B2 (ja) 2019-03-22 2022-09-13 株式会社デンソー ピックアップ装置

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JPWO2008041273A1 (ja) 2010-01-28
JP4850916B2 (ja) 2012-01-11
KR20090043538A (ko) 2009-05-06
CN101512746A (zh) 2009-08-19
CN101512746B (zh) 2010-08-11
KR101133963B1 (ko) 2012-04-05

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