WO2008004270A1 - Méthode de ramassage et appareil de ramassage - Google Patents

Méthode de ramassage et appareil de ramassage Download PDF

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Publication number
WO2008004270A1
WO2008004270A1 PCT/JP2006/313217 JP2006313217W WO2008004270A1 WO 2008004270 A1 WO2008004270 A1 WO 2008004270A1 JP 2006313217 W JP2006313217 W JP 2006313217W WO 2008004270 A1 WO2008004270 A1 WO 2008004270A1
Authority
WO
WIPO (PCT)
Prior art keywords
pellet
adhesive sheet
corner
peeled
pellets
Prior art date
Application number
PCT/JP2006/313217
Other languages
English (en)
Japanese (ja)
Inventor
Akira Nakatsu
Original Assignee
Canon Machinery Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Machinery Inc. filed Critical Canon Machinery Inc.
Priority to JP2008523552A priority Critical patent/JPWO2008004270A1/ja
Priority to PCT/JP2006/313217 priority patent/WO2008004270A1/fr
Publication of WO2008004270A1 publication Critical patent/WO2008004270A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Definitions

  • the present invention relates to a pickup method and a pickup apparatus.
  • a diced semiconductor pellet hereinafter simply referred to as a pellet
  • a conventional pickup device there is one provided with a stage for holding an adhesive sheet, a push-up stand that moves forward and backward with respect to the stage, and a dollar that is pushed up by the push-up stand. That is, it is configured such that the pressure-sensitive adhesive sheet of the stage is pushed from the back side by one dollar pushed up by the push-up stand, and the pellet is detached from the pressure-sensitive adhesive sheet.
  • the pellet is adsorbed by a collet and taken out.
  • the pellet is tilted and pushed up, a mistake in adsorption of the pellet due to the collet occurs. If a collet pellet pick-up error occurs, the subsequent work will be supported. In some cases, the pellet was damaged by the needle being pushed up.
  • the pickup device includes a stage 3 that holds an adhesive sheet 2 on which a pellet 1 is attached. Further, the stage 3 is provided with a receiving portion 4 whose upper surface 4a protrudes from the stage upper surface 3a. For this reason, a gap 6 is formed on the outer peripheral side of the receiving portion 4 between the adhesive sheet 2 as shown in FIG. Furthermore, the stage 3 is provided with a suction hole 5 communicating with the gap 6. These suction holes 5, 5 As shown in FIG. 3, part of the pellet 1 protrudes outside the first side 8a of the pellet 1 in plan view.
  • the pressure-sensitive adhesive sheet 2 is sucked through the suction hole 5 while the pellet 1 is sucked (held) by the collet (adsorption collet) 7 from above.
  • the air in the gap 6 is sucked as indicated by an arrow A
  • the pressure-sensitive adhesive sheet 2 around the receiving portion 4 is sucked, and the pressure-sensitive adhesive sheet 2 is peeled off on the outer peripheral side of the pellet 1.
  • Patent Document 1 Patent No. 3209736
  • the receiving part 4 is moved in a direction orthogonal to the first side 8a. For this reason, the movement of the receiving part 4 gives a dynamic bending stress to the pellets lb and lc adjacent to the peeled pellet la, which may cause cracking.
  • S indicates the cracked part
  • SI of pellets lb and Id indicates cracking that occurs when sliding
  • S2 of pellet lc indicates adsorption cracking that occurs during suction. Yes.
  • the adhesive sheet 2 is peeled from the first side 8a toward the second side 8b facing the first side 8a. For this reason, a relatively large peeling force is required to peel off the length of the first side 8a, and if the pressure-sensitive adhesive sheet 2 is strong, it is difficult to peel off. Furthermore, since the adsorption (suction stress) is dispersed in the two corners 7 and 9, when the pellet is a thin pellet 1, the pellet becomes a so-called “broken state” at the time of adsorption, and the end of the peeling start part. Will be difficult to peel off.
  • the present invention provides a pick-up method and a pick-up device capable of reliably and easily exfoliating and taking out pellets in which the adjacent pellets should not be easily cracked and have a combing force. .
  • the pick-up method of the present invention is a pick-up method in which a plurality of rectangular thin pellets affixed on the pressure-sensitive adhesive sheet are sequentially peeled from the pressure-sensitive adhesive sheet and taken out, and the pellets to be peeled hold an upward force. In this state, the pressure-sensitive adhesive sheet is sucked from below, and the pellet is peeled from one pellet corner of the pellet toward another pellet corner facing the pellet corner or the vicinity thereof. .
  • peeling occurs along the diagonal line of the pellet. For this reason, unlike the case of peeling by the length of one side of the pellet, the peeling force is small.
  • the peeling force is peeled off, it moves away from the side of the adjacent pellet corresponding to the two sides constituting the pellet corner of the pellet to start peeling.
  • dynamic bending stress is not applied to adjacent pellets.
  • the adsorption stress that sucks the adhesive sheet can be concentrated in one place. For this reason, even a pellet that is thin and easily deformed can be peeled off.
  • the peeled portion moves obliquely, the adhesive sheet is peeled off by the adsorption force while applying shear.
  • Another pick-up method of the present invention is a pick-up method in which a plurality of rectangular thin-walled pellets affixed on an adhesive sheet are sequentially peeled from the adhesive sheet and taken out.
  • the pellet to be peeled is received via the adhesive sheet, and after forming a gap with the adhesive sheet on the outer peripheral side of the receiving part, the pellet is held from above. Then, the air in the gap is sucked and at least the pressure-sensitive adhesive sheet on the outer peripheral side of the corner of the receiving part is peeled off.
  • the pellet corner force is moved in the direction inclined with respect to the two sides of the pellet constituting the pellet corner, and the pellet corner force is applied to the other pellet corner facing the pellet corner or in the vicinity thereof. Peel the pellet toward The way to go.
  • the corner of the receiving portion only needs to correspond to one pellet corner of the pellet to be peeled, so its width is slightly smaller than one side of the pellet, etc. There is no need to set it. In other words, it is not necessary to design the receiving part according to the size of the pellet and make it each time!
  • the pickup device of the present invention is a pickup device that sequentially removes a plurality of rectangular thin pellets attached on an adhesive sheet from the adhesive sheet and takes out the pellets to be peeled upward.
  • Holding means a stage on which the pressure-sensitive adhesive sheet is placed, a receiving portion for receiving the pellet via the pressure-sensitive adhesive sheet so that the corner corresponds to one pellet corner of the pellet, and an outer peripheral side of the receiving portion
  • An air suction means for sucking air in a gap formed between the adhesive sheet and a drive means for moving the receiving portion along the horizontal direction in a direction inclined with respect to the two sides constituting the pellet corner of the pellet; It is equipped with.
  • the pellets to be peeled can be received by the receiving part via the adhesive sheet. Then, while receiving the pellet at the receiving part and holding the pellet with the upward force by the holding means, the receiving part is sucked by the air in the gap formed between the receiving part and the adhesive sheet. On the outer peripheral side, the pressure-sensitive adhesive sheet is sucked and the pressure-sensitive adhesive sheet is peeled off from the pellet. Further, the receiving portion can be moved along the horizontal direction in a direction inclined with respect to two sides of the pellet constituting the pellet corner. As a result, the receiving area of the pellets by the receiving part decreases, and the adsorption (suction) area of the adhesive sheet increases.
  • the adsorption area is the same as or equal to the pellet area. If it is larger than the let area, the pressure-sensitive adhesive sheet can be completely peeled from the pellet to be peeled. That is, the other pickup method can be reliably executed.
  • the moving direction of the receiving portion by the driving means may be a direction that forms 45 degrees with respect to two sides constituting the pellet corner, and further, the driving means includes the receiving portion.
  • the movement direction of the part can be changed.
  • the pressure-sensitive adhesive sheet can be easily peeled off. Moreover, when exfoliating the pellets to be exfoliated, dynamic bending stress is not applied to the adjacent pellets. For this reason, the adjacent pellets (particularly, the sides corresponding to the pellets to be peeled) are not cracked. In addition, since the adsorption stress that sucks the adhesive sheet in the initial stage can be concentrated at one corner of the part, it can be peeled off even if it is a thin and easy to betlet. There is an advantage that the applicable range of pellet thickness can be expanded. Furthermore, since the peeling site moves obliquely, the pressure-sensitive adhesive sheet is peeled off by the adsorption force while applying shear, and the peeling performance can be improved.
  • the adhesive sheet can be completely peeled from the pellet to be peeled by moving the receiving portion, and the peeling reliability can be improved.
  • there are also effects such as preventing the adjacent pellets from cracking.
  • the receiving part to be used does not need to be matched to the size of the pellet, it can be adjusted to pellets of various sizes with a single type of receiving part, which is excellent in versatility and contributes to cost reduction.
  • the moving direction of the receiving part is 45 degrees with respect to the two sides constituting the pellet corner part, it can be peeled off with a uniform peeling force to the adhesive sheet. This eliminates unnecessary load on the product (pellet) and prevents product damage.
  • the 45 ° angle is It can be changed according to the nature of the robot. That is, since the pellet has a direction in which it easily breaks depending on the crystal orientation, the moving direction of the receiving portion can be set so that a force in a direction that is difficult to break acts on the adjacent pellet. For this reason, damage (cracking) of adjacent pellets can be prevented more stably.
  • the crystal orientation is the direction of the crystal expressed by the plane index of the crystal.
  • FIG. 1 is a simplified process diagram illustrating a pickup method according to an embodiment of the present invention.
  • FIG. 2 shows a pickup device according to an embodiment of the present invention, and is a simplified sectional view of a pickup using this device.
  • FIG. 3 is a simplified plan view showing pellets attached to an adhesive sheet.
  • FIG. 4 is a cross-sectional view of a pickup device according to another embodiment of the present invention.
  • FIG. 5 is a simplified plan view of a conventional pickup device.
  • FIG. 6 is a simplified cross-sectional view of a conventional pickup device.
  • FIG. 7 is a simplified cross-sectional view showing a peeling process using a conventional pickup device.
  • FIG. 8 is a simplified diagram showing problems of a pickup method using a conventional pickup device.
  • FIG. 2 shows the pickup device of the present invention.
  • This pickup device is a device that sequentially peels and takes out a plurality of rectangular thin-walled pellets (semiconductor chips) 11 affixed on the pressure-sensitive adhesive sheet 12 from the pressure-sensitive adhesive sheet 12.
  • the pellet 11 is made from woofer W (see Fig. 3) as a raw material, and the final product is obtained by cutting the raw material into a rectangular shape. For this reason, the pellets 11 include squares and strips. That is, as shown in FIG. 3, wafer W is generally circular, and is divided into individual pellets 11 by dicing, and these pellets 11 are affixed to adhesive sheet 12! /, Ru. Further, a frame 13 having a ring strength is attached to the outer peripheral side of the adhesive sheet 12. That is, the frame 13 and the adhesive sheet 12 are integrated. Then, in a state where the frame 13 and the adhesive sheet 12 are integrated, the pellet 11 is taken out by this pickup device.
  • the pick-up device holds the pellet 11 to be peeled upward by holding means 15, a stage 16 on which the adhesive sheet 12 is placed, and the pellet 11 through the adhesive sheet 12.
  • the holding means 15 is constituted by an adsorbing member (collet) 21 having a head 20 that adsorbs the pellets 11.
  • the head 20 is provided with an adsorption hole in its lower end surface 20 a, and the pellet 11 is vacuumed through the adsorption hole, and the pellet 11 is adsorbed on the lower end surface 20 a of the head 20. For this reason, when this vacuum suction (evacuation) is released, the pellet 20 is also removed from the head 20 force.
  • the adsorbing member 21 is connected to, for example, a robot arm, and can move in the vertical direction (arrows C and D in FIG. 2), the horizontal direction (arrow E in FIG. 2), or a combination of these. Is done.
  • a recess 22 is provided on the upper surface of the stage 16, and a receiving portion 17 is disposed in the recess 22. Further, as shown in FIG. 1, the receiving portion 17 is provided with a tapered portion 17a that narrows toward the tip. That is, the taper 17a is constituted by a first side 22 of the pellet 11 parallel to the first side 28a and a second side 23 parallel to the third side 28c of the pellet 11, and the first side 22 and What is second side 23? 90 Make a degree.
  • the corner 25 of the taper 17a corresponds to one pellet corner 26 to be peeled off.
  • the one pellet corner 26 is a joint formed by the first side 28a and the third side 28c.
  • the pellet 11 is a square, and connects the pellet corner 26 and another pellet corner 27 (the corner formed by the second side 28b and the fourth side 28d) opposite to the pellet corner 26.
  • the corner portion 25 of the receiving portion 17 is disposed.
  • the recess 22 is formed on the main body portion 22a whose depth dimension is substantially the same as the thickness dimension of the receiving portion 17 and on the tip side of the tapered portion 17a (the front side of the first side 22 and the second side 23).
  • a tapered portion 22b is formed on the main body portion 22a whose depth dimension is substantially the same as the thickness dimension of the receiving portion 17 and on the tip side of the tapered portion 17a (the front side of the first side 22 and the second side 23).
  • the tapered portion 22b gradually becomes shallower from the main body portion 22a toward the tip.
  • suction holes 30 constituting the suction means 18 are communicated with the recesses 22 corresponding to the first side 28a and the third side 28c of the pellet 11.
  • suction holes 30a are provided corresponding to the corners of the first side 28a and the fourth side 28d
  • suction holes 30b are provided corresponding to the intermediate part of the first side 28a.
  • a suction arch I hole 30c is provided corresponding to the corner of the first side 28a and the third side 28c
  • a suction arch I hole 30d is provided corresponding to the middle part of the third side 28c.
  • Suction holes 30e are provided corresponding to the corners of 28c and the second side 28b. A part of each suction hole 30 protrudes outward from the pellet 11 so as to be divided in plan view.
  • the suction means 18 has the suction holes 30a, 30b, 30c, 30d, and 30e, and a vacuum pump (not shown) is connected to the suction holes 30a and the like. That is, when the vacuum pump is driven, air in the gap 19 is sucked through the suction hole 30a and the like.
  • the receiving portion 17 moves along the horizontal direction in a direction inclined with respect to the two sides 28a, 28c of the pellet 1 constituting the pellet corner portion 26 via the driving means. That is, the receiving part 17 moves in the direction along the diagonal L.
  • the driving means various mechanisms such as a bolt shaft member and a reciprocating mechanism having a nut member force engaged with the bolt shaft member or a cylinder mechanism can be used.
  • the receiving portion 17 also has a flat body force, and a support member 31 is continuously provided on the receiving portion 17.
  • the receiving block 17 and the support member 31 constitute a moving block body 32.
  • FIG. 3 in a state where the frame 13 and the adhesive sheet 12 are integrated together, as shown in FIG. 1, two sides (in this case, the second side 28b and the fourth side 28d) As shown in Fig. 2 (A), select the pellet 11 that does not correspond to the other pellet 11 (in this case, pellet 11a) and place the stage 16 of this pickup device below the pellet 11a. Then, it is received by the receiving portion 17 of the moving block body 32 via the adhesive sheet 12. At this time, as shown in FIG. 1 (A), the first side 22 of the receiving portion 17 is parallel to the first side 28a of the pellet 11a, and the second side 23 of the receiving portion 17 is the second side 23 of the pellet 11a.
  • the corner portions 25 of the receiving portion 17 are arranged on the diagonal line L of the pellet 11a so as to be parallel to the three sides 28c. Further, the corner portion 25 is displaced from the corner portion 26 of the pellet 11a toward the corner portion 27 facing the corner portion 26 along the direction of the arrow ⁇ in FIG.
  • the receiving portion 17 is moved (slid) along the diagonal line as shown by an arrow ⁇ .
  • the receiving area of the pellet 1 by the receiving portion 17 decreases, and the area of adsorption (suction) downward of the adhesive sheet 12 increases.
  • the adhesive sheet 12 is peeled from the pellet 11a sequentially.
  • FIG. 2D if the adsorption area is the same as the pellet area or larger than the pellet area, thus, the pressure-sensitive adhesive sheet 12 can be completely peeled off.
  • the pellet 11a can be removed from the adhesive tape 12 by raising the collet 21 as indicated by arrow C and releasing the stage 16 force.
  • the receiving portion 17 returns to the standby state as shown by an arrow G, and is placed so that the receiving portion 17 receives the pellet 11 to be peeled next.
  • the receiving portion 17 returns to the standby state as shown by an arrow G, and is placed so that the receiving portion 17 receives the pellet 11 to be peeled next.
  • All the pellets 11 on 12 can be peeled off from the adhesive sheet 12.
  • the pickup device side is moved, the adhesive sheet 12 side to which the pellet 11 is attached is moved, or both are moved. May be.
  • peeling occurs along the diagonal L of the pellet 11. For this reason, unlike the case of peeling along the length of one side of the pellet 11, the peeling force is small, and the pressure-sensitive adhesive sheet can be easily peeled off.
  • the receiving portion 17 is separated from the side of the adjacent pellet 11 corresponding to the two sides 28a and 28c constituting the pellet corner portion 26 of the pellet 11 from which peeling is started. become. As a result, the dynamic bending stress is not applied to the adjacent pellets 11, and the adjacent pellets 11 (particularly, the sides corresponding to the pellets to be peeled) are not cracked.
  • the adsorption stress that sucks the adhesive sheet 12 can be concentrated in one place, and even if the pellet 11 is thin, it is peeled off. This has the advantage that the application range of pellets 11 that can be peeled off is expanded. Further, since the peeling site moves obliquely, the adhesive sheet 12 is peeled off by the adsorption force while applying shear, and the peeling performance can be improved.
  • the corner portion 25 of the receiving portion 17 may be made to correspond to one pellet corner portion 26 of the pellet 11 to be peeled, so that the width dimension is larger than one side of the pellet 11.
  • the receiving part 17 can be adjusted to pellets of various sizes simply by adjusting the position of the receiving part 17 with one type of receiving part without matching the size of the pellet 11, and it is highly versatile. Contributes to reduction.
  • the moving direction of the receiving portion 17 is a direction that forms 45 degrees with respect to the two sides 28a and 28c constituting the pellet corner portion 26, it is peeled off with a uniform peeling force with respect to the adhesive sheet 12. This eliminates unnecessary load on the product (pellet) and prevents product damage.
  • FIG. 4 shows another embodiment.
  • the receiving portion 17 protrudes from the upper surface of the stage 16. For this reason, when the pellet 11 to be peeled is received at the receiving portion 17, the pellet 11 is received at a higher position than the upper surface of the stage 16.
  • the gap 19 is formed on the front side of the tapered portion 17 a of the receiving portion 17. Therefore, if air is sucked into the gap 19 while the pellet 11 is held upward by the collet 21, the adhesive sheet 12 is peeled from the pellet 11 on the front side of the tapered portion 17 a of the receiving portion 17.
  • the receiving part 17 is provided integrally with the stage 16 and the stage 16 is moved.
  • the receiving part 17 may be moved relative to the pellet 11. Even in this case, it can be peeled along the diagonal line L of the pellet 11, and the same effect as the pickup device shown in FIG. 2 or FIG. 4 can be obtained.
  • the receiving portion 17 moves along the diagonal line L of the pellet 11, and each of the receiving portion 17 forms 45 degrees with respect to the two sides 28a and 28c constituting the pellet corner portion 26. It was moving in the direction.
  • the direction is not limited to 45 degrees, and for example, the first side 28a may be 30 degrees and the third side 28c may be moved 60 degrees along the direction. It is also possible to move along the direction that makes 60 degrees with respect to the first side 28a and 30 degrees with respect to the third side 28c.
  • one side for example, one pellet corner (for example, pellet corner 26) force rather than a direction orthogonal to the first side 28a) force other pellet corner (for example, All It is only necessary that the receiving portion 17 moves toward the vicinity of the let corner portion 27).
  • the receiving portion 17 it is possible to allow the receiving portion 17 to arbitrarily change the moving direction. That is, in the pickup device shown in FIGS. 1 and 2, the moving (sliding) direction of the receiving portion 17 with respect to the pellet 11 can be changed.
  • the movement direction of the receiving portion 17 can be changed, the movement direction can be changed according to the properties of the pellet 11 to be peeled. That is, since the pellet 11 has a fragile direction depending on the crystal orientation, the moving direction of the receiving portion 17 can be set so that a force in a direction in which it is difficult to break acts on the adjacent pellet 1. For this reason, damage (cracking) of adjacent pellets can be prevented more stably.
  • the present invention has been described.
  • the present invention is not limited to the above-described embodiment, and various modifications are possible.
  • the suction hole 30 provided in the stage 16 The size, number, shape, etc. can be arbitrarily set within the air suckable range of the gap 19. For this reason, one suction hole 30 may be provided.
  • the pellet 11 to be peeled may be a rectangle having a short side and a long side that is not limited to a square, or may be a strip having a very long side compared to the short side.
  • the thickness of the pressure-sensitive adhesive sheet 12 is not limited so long as it can be deformed so that it can be peeled off from the pellet 11 when the air in the gap 19 is sucked by the force suction means 18 depending on the suction force or the like.
  • the thickness of the receiving portion 17 can be arbitrarily set depending on the range in which the air can be peeled off from the pellet 11 when the air in the gap 19 is sucked by the suction means 18.
  • the shape of the receiving portion 17 may be a rectangular flat plate as shown in FIG. In short, there is a corner corresponding to one pellet corner (for example, pellet corner 26) of the pellet 11, and this corner faces the sides 28a and 28c constituting the pellet corner 26 of the pellet 11. It is sufficient if two side forces are also formed, and it is only necessary that the receiving portion 17 for the pellet 11 can move along the horizontal direction in a direction inclined with respect to the two sides constituting the pellet corner. Further, the angle of the corner portion 25 of the receiving portion 17 is not limited to 90 degrees, and may be slightly acute or obtuse! /.
  • the number of pellets 11 affixed on the pressure-sensitive adhesive sheet 12 is arbitrary, and in the present invention, all the pellets 11 on the pressure-sensitive adhesive sheet 12 that are not affected by the number are sequentially peeled off. be able to. Also, as shown in FIG. 1, the second side 28b and the fourth side 28 of the pellet 11 to be peeled off Since the other pellets 11 do not have to correspond to d, the order of peeling can be arbitrarily set within the range that satisfies this condition.
  • a plurality of pellets can be formed by attaching the cut wafer or the plate material before becoming the final product to an adhesive sheet and cutting with a dicing saw or the like in this state. And this pick-up apparatus can peel and take out the pellet from the adhesive sheet one by one. The removed pellets can be supplied to a predetermined land of the lead frame.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)

Abstract

L'invention concerne un procédé de ramassage, et un appareil de ramassage, permettant de détacher et retirer des granulés devant être détachés d'une manière simple tout en supprimant tout fendillement des granulés voisins. De multiples granulés minces rectangulaires (11) collés sur une feuille adhésive sensible à la pression (12) sont détachés de manière séquentielle de la feuille adhésive sensible à la pression (12) et retirés. Tout en maintenant chaque granulé (11) devant être détaché par le dessus, on détache le granulé (11) vers l'avant d'une partie d'angle (26) du granulé (11) vers l'autre partie d'angle (27) du granulé opposée à la partie d'angle (26) du granulé ou à proximité de celle-ci en aspirant la feuille adhésive sensible à la pression (12) depuis le dessous.
PCT/JP2006/313217 2006-07-03 2006-07-03 Méthode de ramassage et appareil de ramassage WO2008004270A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008523552A JPWO2008004270A1 (ja) 2006-07-03 2006-07-03 ピックアップ方法およびピックアップ装置
PCT/JP2006/313217 WO2008004270A1 (fr) 2006-07-03 2006-07-03 Méthode de ramassage et appareil de ramassage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/313217 WO2008004270A1 (fr) 2006-07-03 2006-07-03 Méthode de ramassage et appareil de ramassage

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WO2008004270A1 true WO2008004270A1 (fr) 2008-01-10

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WO2010052759A1 (fr) * 2008-11-04 2010-05-14 キヤノンマシナリー株式会社 Procédé de décollement de puce, appareil de décollement de puce et procédé de fabrication de dispositif semi-conducteur
WO2010052760A1 (fr) * 2008-11-04 2010-05-14 キヤノンマシナリー株式会社 Procédé de décollement de puce, procédé de fabrication de dispositif semi-conducteur et appareil de décollement de puce
WO2010052758A1 (fr) * 2008-11-04 2010-05-14 キヤノンマシナリー株式会社 Procédé de décollement de puce, appareil de décollement de puce et procédé de fabrication de dispositif semi-conducteur
JP2010114156A (ja) * 2008-11-04 2010-05-20 Canon Machinery Inc チップ剥離方法、チップ剥離装置、および半導体装置製造方法
JP2010114157A (ja) * 2008-11-04 2010-05-20 Canon Machinery Inc チップ剥離方法、チップ剥離装置、および半導体装置製造方法
WO2010100775A1 (fr) * 2009-03-05 2010-09-10 株式会社新川 Appareil et procédé aptes à permettre le prélèvement d'un dé de matériau semi-conducteur
JP2012508460A (ja) * 2008-11-12 2012-04-05 エセック アーゲー フォイルからの半導体チップの剥離及び取外し方法
JP2012174742A (ja) * 2011-02-17 2012-09-10 Fuji Mach Mfg Co Ltd ダイピックアップ装置
JP2020155703A (ja) * 2019-03-22 2020-09-24 トヨタ自動車株式会社 ピックアップ装置
WO2021240840A1 (fr) * 2020-05-26 2021-12-02 キヤノンマシナリー株式会社 Dispositif de saisie et procédé de saisie

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JP4668361B2 (ja) * 2008-11-04 2011-04-13 キヤノンマシナリー株式会社 チップ剥離方法、チップ剥離装置、及び半導体装置製造方法
WO2010052760A1 (fr) * 2008-11-04 2010-05-14 キヤノンマシナリー株式会社 Procédé de décollement de puce, procédé de fabrication de dispositif semi-conducteur et appareil de décollement de puce
WO2010052758A1 (fr) * 2008-11-04 2010-05-14 キヤノンマシナリー株式会社 Procédé de décollement de puce, appareil de décollement de puce et procédé de fabrication de dispositif semi-conducteur
JP2010114156A (ja) * 2008-11-04 2010-05-20 Canon Machinery Inc チップ剥離方法、チップ剥離装置、および半導体装置製造方法
JP2010114157A (ja) * 2008-11-04 2010-05-20 Canon Machinery Inc チップ剥離方法、チップ剥離装置、および半導体装置製造方法
WO2010052759A1 (fr) * 2008-11-04 2010-05-14 キヤノンマシナリー株式会社 Procédé de décollement de puce, appareil de décollement de puce et procédé de fabrication de dispositif semi-conducteur
JP5214739B2 (ja) * 2008-11-04 2013-06-19 キヤノンマシナリー株式会社 チップ剥離方法、半導体装置の製造方法、及びチップ剥離装置
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JP2012508460A (ja) * 2008-11-12 2012-04-05 エセック アーゲー フォイルからの半導体チップの剥離及び取外し方法
CN102308377A (zh) * 2009-03-05 2012-01-04 株式会社新川 半导体芯片的拾取装置及拾取方法
US7820006B2 (en) 2009-03-05 2010-10-26 Shinkkawa Ltd. Die pickup apparatus for picking up semiconductor dies and methods for picking up semiconductor dies
WO2010100775A1 (fr) * 2009-03-05 2010-09-10 株式会社新川 Appareil et procédé aptes à permettre le prélèvement d'un dé de matériau semi-conducteur
JP2012174742A (ja) * 2011-02-17 2012-09-10 Fuji Mach Mfg Co Ltd ダイピックアップ装置
JP2020155703A (ja) * 2019-03-22 2020-09-24 トヨタ自動車株式会社 ピックアップ装置
JP7135959B2 (ja) 2019-03-22 2022-09-13 株式会社デンソー ピックアップ装置
WO2021240840A1 (fr) * 2020-05-26 2021-12-02 キヤノンマシナリー株式会社 Dispositif de saisie et procédé de saisie
JP2021190457A (ja) * 2020-05-26 2021-12-13 キヤノンマシナリー株式会社 ピックアップ装置

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