WO2008004520A1 - Procédé de modification de la surface d'une couche de résine de polyimide et procédé servant à produire un stratifié métallisé - Google Patents

Procédé de modification de la surface d'une couche de résine de polyimide et procédé servant à produire un stratifié métallisé Download PDF

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Publication number
WO2008004520A1
WO2008004520A1 PCT/JP2007/063238 JP2007063238W WO2008004520A1 WO 2008004520 A1 WO2008004520 A1 WO 2008004520A1 JP 2007063238 W JP2007063238 W JP 2007063238W WO 2008004520 A1 WO2008004520 A1 WO 2008004520A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
polyimide resin
resin layer
metal
polyimide
Prior art date
Application number
PCT/JP2007/063238
Other languages
English (en)
Japanese (ja)
Inventor
Ryuzo Shinta
Yasufumi Matsumura
Hironobu Kawasato
Hiroyuki Hayashida
Original Assignee
Nippon Steel Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co., Ltd. filed Critical Nippon Steel Chemical Co., Ltd.
Priority to JP2008523673A priority Critical patent/JP5215182B2/ja
Priority to CN200780025386XA priority patent/CN101484513B/zh
Priority to KR1020097002148A priority patent/KR101451264B1/ko
Publication of WO2008004520A1 publication Critical patent/WO2008004520A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • C08J5/121—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives by heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Procédé de traitement en surface d'une couche de résine de polyimide qui permet à des cartes de câblage imprimé de conserver une force d'adhésion suffisante pour la réduction du pas et peut être adapté pour la réduction extrême de l'épaisseur de couches de résine isolante ; et procédé servant à produire un stratifié métallisé. Le procédé de traitement d'une surface d'une couche de résine de polyimide comprend une étape dans laquelle la surface de la couche de résine de polyimide est modifiée avec une solution aqueuse alcaline et une étape dans laquelle une solution polaire contenant un composé amino tel qu'un composé amino aromatique ou un diaminosiloxane est appliquée sur la surface modifiée de la couche de résine de polyimide et séchée pour former une couche traitée avec le composé amino. Le procédé peut en outre comprendre une étape dans laquelle la couche traitée avec le composé amino présente sur la couche de résine de polyimide est soumise à une imidation. Une feuille de métal est collée par pressage à chaud sur la couche de résine de polyimide traitée en surface ou un métal est déposé par dépôt en phase vapeur sur ladite couche pour obtenir un stratifié métallisé. Deux de ces couches de résine de polyimide traitées en surface sont collées par pressage à chaud pour obtenir un stratifié de résine de polyimide.
PCT/JP2007/063238 2006-07-04 2007-07-02 Procédé de modification de la surface d'une couche de résine de polyimide et procédé servant à produire un stratifié métallisé WO2008004520A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008523673A JP5215182B2 (ja) 2006-07-04 2007-07-02 ポリイミド樹脂層の表面改質方法及び金属張積層板の製造方法
CN200780025386XA CN101484513B (zh) 2006-07-04 2007-07-02 聚酰亚胺树脂层的表面改性方法以及覆金属层合板的制造方法
KR1020097002148A KR101451264B1 (ko) 2006-07-04 2007-07-02 폴리이미드수지층의 표면개질방법 및 금속장 적층판의 제조방법

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP2006184942 2006-07-04
JP2006184943 2006-07-04
JP2006-184943 2006-07-04
JP2006-184942 2006-07-04
JP2006185162 2006-07-05
JP2006-185162 2006-07-05
JP2006-218242 2006-08-10
JP2006218242 2006-08-10
JP2006-245371 2006-09-11
JP2006245371 2006-09-11
JP2007-061722 2007-03-12
JP2007061722 2007-03-12

Publications (1)

Publication Number Publication Date
WO2008004520A1 true WO2008004520A1 (fr) 2008-01-10

Family

ID=38894490

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/063238 WO2008004520A1 (fr) 2006-07-04 2007-07-02 Procédé de modification de la surface d'une couche de résine de polyimide et procédé servant à produire un stratifié métallisé

Country Status (5)

Country Link
JP (1) JP5215182B2 (fr)
KR (1) KR101451264B1 (fr)
CN (1) CN101484513B (fr)
TW (1) TWI424012B (fr)
WO (1) WO2008004520A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009149764A (ja) * 2007-12-20 2009-07-09 Nippon Steel Chem Co Ltd 接着性層を有するポリイミド樹脂層の製造方法及び金属張積層板の製造方法
JP2010125793A (ja) * 2008-11-28 2010-06-10 Arisawa Mfg Co Ltd ２層両面フレキシブル金属積層板及びその製造方法
CN101746103A (zh) * 2008-12-12 2010-06-23 比亚迪股份有限公司 一种聚酰亚胺金属箔层合体的制备方法
KR20150105178A (ko) * 2014-03-07 2015-09-16 아조텍 컴퍼니 리미티드 금속 기판 및 그의 제조방법
KR20150105177A (ko) * 2014-03-07 2015-09-16 아조텍 컴퍼니 리미티드 금속 기판 및 그의 제조방법
JP2017052268A (ja) * 2015-06-17 2017-03-16 長興材料工業股▲ふん▼有限公司Ｅｔｅｒｎａｌ Ｍａｔｅｒｉａｌｓ Ｃｏ．，Ｌｔｄ． 金属張積層板、その製造方法、並びに、それを用いるフレキシブル回路基板の製造方法
CN107852828A (zh) * 2015-08-21 2018-03-27 住友电气工业株式会社 印刷线路板用基板、印刷线路板以及印刷线路板用基板的制造方法
JP2020029475A (ja) * 2018-08-20 2020-02-27 東洋紡株式会社 耐熱高分子フィルム、表面処理された耐熱高分子フィルムの製造方法、及び、耐熱高分子フィルムロール
CN112601656A (zh) * 2018-09-28 2021-04-02 日铁化学材料株式会社 覆金属层叠板的制造方法及电路基板的制造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140227446A1 (en) * 2013-02-13 2014-08-14 Seiren Co., Ltd. Surface modifier for polyimide resin and surface-modifying method for polyimide resin
US11859110B2 (en) 2017-04-28 2024-01-02 Mitsui Chemicals, Inc. Substrate laminated body and method of manufacturing substrate laminated body
TWI624563B (zh) * 2017-07-14 2018-05-21 律勝科技股份有限公司 於感光性樹脂之表面形成金屬層的方法
KR102199544B1 (ko) * 2018-12-21 2021-01-07 (주)이녹스첨단소재 연성 동박 적층필름
KR102387069B1 (ko) * 2019-08-06 2022-04-18 주식회사 비티엘첨단소재 이차전지용 알루미늄 파우치 필름 및 이의 제조방법
CN113873748B (zh) * 2021-09-28 2022-05-10 广东合通建业科技股份有限公司 一种通透led显示屏的线路板及制作工艺

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JPS6399282A (ja) * 1986-10-16 1988-04-30 Hitachi Chem Co Ltd ポリイミド成形品の接合法
JPS63125532A (ja) * 1986-11-14 1988-05-28 Hitachi Chem Co Ltd ポリイミド成形品の接着法
JPH02149666A (ja) * 1988-11-30 1990-06-08 Hitachi Chem Co Ltd 金属膜付ポリイミドフィルムの製造法
JPH04231474A (ja) * 1990-05-15 1992-08-20 Internatl Business Mach Corp <Ibm> ポリイミド表面の改質方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5119067A (fr) * 1974-07-03 1976-02-16 Amp Inc
JPS6399282A (ja) * 1986-10-16 1988-04-30 Hitachi Chem Co Ltd ポリイミド成形品の接合法
JPS63125532A (ja) * 1986-11-14 1988-05-28 Hitachi Chem Co Ltd ポリイミド成形品の接着法
JPH02149666A (ja) * 1988-11-30 1990-06-08 Hitachi Chem Co Ltd 金属膜付ポリイミドフィルムの製造法
JPH04231474A (ja) * 1990-05-15 1992-08-20 Internatl Business Mach Corp <Ibm> ポリイミド表面の改質方法
JPH05239657A (ja) * 1992-02-27 1993-09-17 Mitsubishi Gas Chem Co Inc 耐湿性銅張基板の製造法
JPH07273466A (ja) * 1994-03-29 1995-10-20 Hitachi Chem Co Ltd 多層配線板の製造方法
JPH07286041A (ja) * 1994-04-11 1995-10-31 Samsung Electron Co Ltd ポリイミド表面処理方法
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Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009149764A (ja) * 2007-12-20 2009-07-09 Nippon Steel Chem Co Ltd 接着性層を有するポリイミド樹脂層の製造方法及び金属張積層板の製造方法
JP2010125793A (ja) * 2008-11-28 2010-06-10 Arisawa Mfg Co Ltd ２層両面フレキシブル金属積層板及びその製造方法
CN101746103A (zh) * 2008-12-12 2010-06-23 比亚迪股份有限公司 一种聚酰亚胺金属箔层合体的制备方法
US9573352B2 (en) 2014-03-07 2017-02-21 Azotek Co., Ltd. Metal substrate and method of manufacturing the same
KR101721425B1 (ko) * 2014-03-07 2017-03-31 아조텍 컴퍼니 리미티드 금속 기판 및 그의 제조방법
JP2015168261A (ja) * 2014-03-07 2015-09-28 佳勝科技股▲ふん▼有限公司 金属基板及びその製造方法
JP2015168262A (ja) * 2014-03-07 2015-09-28 佳勝科技股▲ふん▼有限公司 金属基板及びその製造方法
US9414485B2 (en) 2014-03-07 2016-08-09 Azotek Co., Ltd. Peelable metal substrate having modified surface and method of manufacturing the same
JP2016182826A (ja) * 2014-03-07 2016-10-20 佳勝科技股▲ふん▼有限公司 金属基板及びその製造方法
KR101676107B1 (ko) * 2014-03-07 2016-11-14 아조텍 컴퍼니 리미티드 금속 기판 및 그의 제조방법
KR20150105178A (ko) * 2014-03-07 2015-09-16 아조텍 컴퍼니 리미티드 금속 기판 및 그의 제조방법
US11483934B2 (en) 2014-03-07 2022-10-25 Azotek Co., Ltd. Metal substrate and method of manufacturing the same
KR20150105177A (ko) * 2014-03-07 2015-09-16 아조텍 컴퍼니 리미티드 금속 기판 및 그의 제조방법
US10212829B2 (en) 2014-03-07 2019-02-19 Azotek Co., Ltd. Method of manufacturing metal substrate
US10765008B2 (en) 2015-06-17 2020-09-01 Eternal Materials Co., Ltd. Metal clad laminate, preparation method thereof, and method for preparing flexible circuit board by using the same
JP2017052268A (ja) * 2015-06-17 2017-03-16 長興材料工業股▲ふん▼有限公司Ｅｔｅｒｎａｌ Ｍａｔｅｒｉａｌｓ Ｃｏ．，Ｌｔｄ． 金属張積層板、その製造方法、並びに、それを用いるフレキシブル回路基板の製造方法
CN107852828A (zh) * 2015-08-21 2018-03-27 住友电气工业株式会社 印刷线路板用基板、印刷线路板以及印刷线路板用基板的制造方法
US11375615B2 (en) 2015-08-21 2022-06-28 Sumitomo Electric Industries, Ltd. Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
JP2020029475A (ja) * 2018-08-20 2020-02-27 東洋紡株式会社 耐熱高分子フィルム、表面処理された耐熱高分子フィルムの製造方法、及び、耐熱高分子フィルムロール
JP7116889B2 (ja) 2018-08-20 2022-08-12 東洋紡株式会社 耐熱高分子フィルム、表面処理された耐熱高分子フィルムの製造方法、及び、耐熱高分子フィルムロール
CN112601656A (zh) * 2018-09-28 2021-04-02 日铁化学材料株式会社 覆金属层叠板的制造方法及电路基板的制造方法

Also Published As

Publication number Publication date
TW200825128A (en) 2008-06-16
JPWO2008004520A1 (ja) 2009-12-03
KR20090033260A (ko) 2009-04-01
CN101484513B (zh) 2013-05-29
KR101451264B1 (ko) 2014-10-15
JP5215182B2 (ja) 2013-06-19
TWI424012B (zh) 2014-01-21
CN101484513A (zh) 2009-07-15

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