JP2015168261A - 金属基板及びその製造方法 - Google Patents
金属基板及びその製造方法 Download PDFInfo
- Publication number
- JP2015168261A JP2015168261A JP2014165273A JP2014165273A JP2015168261A JP 2015168261 A JP2015168261 A JP 2015168261A JP 2014165273 A JP2014165273 A JP 2014165273A JP 2014165273 A JP2014165273 A JP 2014165273A JP 2015168261 A JP2015168261 A JP 2015168261A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- layer
- substrate
- release layer
- insulating base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/14—Corona, ionisation, electrical discharge, plasma treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1536—Temporarily stacked PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
- Y10T428/1438—Metal containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
【解決手段】第1の改質表面及び第1の改質表面に対向する第2の表面を有する第1の絶縁基材と、第2の表面に対面する第1の金属層と、第1の改質表面に貼り合わせられ、第1の絶縁基材が離型層と第1の金属層との間に位置するようにする離型層と、離型層の片側に位置し、離型層が第1の改質表面と第2の絶縁基材との間に位置するようにする第2の絶縁基材と、第2の絶縁基材の片側に位置し、第2の絶縁基材が離型層と第2の金属層との間に位置するようにする第2の金属層と、を備え、第1の改質表面を離型層と分離した後、第1の改質表面の初期表面粗さの変化量が実質的に10%よりも小さい金属基板。
【選択図】図1E
Description
Claims (18)
- 第1の改質表面及び前記第1の改質表面に対向する第2の表面を有する第1の絶縁基材と、 前記第2の表面に対面する第1の金属層と、 前記第1の改質表面に貼り合わせられ、前記第1の絶縁基材が離型層と前記第1の金属層との間に位置するようにする離型層と、 前記離型層の片側に位置し、前記離型層が前記第1の改質表面と第2の絶縁基材との間に位置するようにする第2の絶縁基材と、 前記第2の絶縁基材の片側に位置し、前記第2の絶縁基材が前記離型層と第2の金属層との間に位置するようにする第2の金属層と、 を備え、 前記第1の絶縁基材と前記第2の絶縁基材の材質は、それぞれポリイミド(Polyimide;PI)、ポリエチレンテレフタレート(Polyethylene Terephthalate;PET)、テフロン(登録商標)(Teflon)、液晶高分子(Liquid Crystal Polymer;LCP)、ポリエチレン(Polyethylene;PE)、ポリプロピレン(Polypropylene;PP)、ポリスチレン(Polystyrene;PS)、ポリ塩化ビニル(Polyvinyl Chloride;PVC)、ナイロン(Nylon or Polyamides)、アクリル(Acrylic)、アクリロニトリルブタジエンスチレンプラスチック(Acrylonitrile‐Butadiene‐Styrene)、フェノール樹脂(Phenolic Resins)、エポキシ樹脂(Epoxy)、ポリエステル(Polyester)、シリコーン(Silicone)、ポリウレタン(Polyurethane;PU)、ポリアミド‐イミド(polyamide‐imide;PAI)及び上記の任意の組み合わせからなる群から選ばれたものであり、前記第1の改質表面は、初期表面粗さを有し、前記離型層と分離した後、前記初期表面粗さが実質的に10%よりも小さい変化量を有する金属基板。
- 前記第1の絶縁基材と前記第1の金属層との間に位置する第1の接着剤層を更に備える請求項1に記載の金属基板。
- 前記第2の絶縁基材と前記第2の金属層との間に位置する第2の接着剤層を更に備える請求項1に記載の金属基板。
- 前記第1の絶縁基材と前記第1の金属層との間に位置する第1の接着剤層と、 前記第2の絶縁基材と前記第2の金属層との間に位置する第2の接着剤層と、 を更に備える請求項1に記載の金属基板。
- 前記第2の絶縁基材の前記離型層に対面する側に、前記第1の改質表面と同様な第2の改質表面を有する請求項1に記載の金属基板。
- 前記離型層は、エラストマー系感圧接着剤又は樹脂系感圧接着剤を含む請求項1に記載の金属基板。
- 前記第1の改質表面は、‐CH3、‐CH2、‐O‐、‐COOH、‐COOHCH3、‐COOHC2H5、‐NH2、‐NO2、‐OH、‐CONH2、‐CONH、‐SiO2及び上記の任意の組み合わせからなる群から選ばれた少なくとも1つの官能基を含む請求項1に記載の金属基板。
- 前記第1の改質表面は、実質的に3ダイン/cm(dyn/cm)よりも大きい表面エネルギー(surface energy)を有する請求項1に記載の金属基板。
- 前記第1の金属層と前記第2の金属層は、銅(Cu)、アルミニウム(Al)、金(Au)、銀(Ag)、錫(Sn)、鉛(Pb)、鉛−錫合金(Sn−Pb Alloy)、鉄(Fe)、パラジウム(Pd)、ニッケル(Ni)、クロム(Cr)、モリブデン(Mo)、タングステン(W)、亜鉛(Zn)、マンガン(Mn)、コバルト(Co)、ステンレス(stainless steel)又は上記の任意の組み合わせを含む請求項1に記載の金属基板。
- 第1の表面及び前記第1の表面に対向する第2の表面を有する第1の絶縁基材と、第1の金属層とを含み、前記第2の表面が前記第1の表面と前記第1の金属層との間に位置する第1の片面基板構造を提供する工程と、 前記第1の表面に対して第1の改質プロセスを行う工程と、 離型層を提供する工程と、 第2の絶縁基材と、第2の金属層とを含む第2の片面基板構造を提供する工程と、 前記第1の片面基板構造、前記第2の片面基板構造及び前記離型層の3つを、前記離型層が前記第1の改質表面と前記第2の絶縁基材との間に位置し、前記第2の絶縁基材が前記離型層と前記第2の金属層との間に位置するように貼り合わせる工程と、 を備え、 前記第1の絶縁基材と前記第2の絶縁基材の材質は、それぞれポリイミド、ポリエチレンテレフタレート、テフロン(登録商標)、液晶高分子、ポリエチレン、ポリプロピレン、ポリスチレン、ポリ塩化ビニル、ナイロン、アクリル、アクリロニトリルブタジエンスチレンプラスチック、フェノール樹脂、エポキシ樹脂、ポリエステル、シリコーン、ポリウレタン、ポリアミド‐イミド及び上記の任意の組み合わせからなる群から選ばれたものであり、前記第1の表面は、初期表面粗さを有し、前記離型層と分離した後、前記初期表面粗さが実質的に10%よりも小さい変化量を有する金属基板の製造方法。
- 前記第1の片面基板構造を提供する工程は、前記第1の絶縁基材と前記第1の金属層との間に、第1の接着剤層を提供する工程を更に含む請求項10に記載の金属基板の製造方法。
- 前記第2の片面基板構造を提供する工程は、前記第2の絶縁基材と前記第2の金属層との間に、第2の接着剤層を提供する工程を更に含む請求項10に記載の金属基板の製造方法。
- 前記第1の片面基板構造、前記第2の片面基板構造及び前記離型層の3つを貼り合わせる前に、前記第2の絶縁基材の前記離型層に対面する表面に対して第2の改質プロセスを行う工程を更に含む請求項10に記載の金属基板の製造方法。
- 前記第1の改質プロセスは、プラズマ処理プロセス、紫外線照射プロセス、又はアルカリ性溶液浸潤プロセスを含む請求項10に記載の金属基板の製造方法。
- 前記離型層は、エラストマー系感圧接着剤又は樹脂系感圧接着剤を含む請求項10に記載の金属基板の製造方法。
- 前記第1の表面は、‐CH3、‐CH2、‐O‐、‐COOH、‐COOHCH3、‐COOHC2H5、‐NH2、‐NO2、‐OH、‐CONH2、‐CONH、‐SiO2及び上記の任意の組み合わせからなる群から選ばれた少なくとも1つの官能基を含む請求項10に記載の金属基板の製造方法。
- 前記第1の表面は、実質的に3ダイン/cmよりも大きい表面エネルギーを有する請求項10に記載の金属基板の製造方法。
- 前記第1の金属層と前記第2の金属層は、銅、アルミニウム、金、銀、錫、鉛、鉛−錫合金、鉄、パラジウム、ニッケル、クロム、モリブデン、タングステン、亜鉛、マンガン、コバルト、ステンレス又は上記の任意の組み合わせを含む請求項10に記載の金属基板の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103107985 | 2014-03-07 | ||
TW103107985A TWI488549B (zh) | 2014-03-07 | 2014-03-07 | 金屬基板及其製作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015168261A true JP2015168261A (ja) | 2015-09-28 |
JP6016858B2 JP6016858B2 (ja) | 2016-10-26 |
Family
ID=53937880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014165273A Active JP6016858B2 (ja) | 2014-03-07 | 2014-08-14 | 金属基板及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US9414485B2 (ja) |
JP (1) | JP6016858B2 (ja) |
KR (1) | KR101676107B1 (ja) |
CN (1) | CN104902668B (ja) |
TW (1) | TWI488549B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017052268A (ja) * | 2015-06-17 | 2017-03-16 | 長興材料工業股▲ふん▼有限公司Eternal Materials Co.,Ltd. | 金属張積層板、その製造方法、並びに、それを用いるフレキシブル回路基板の製造方法 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN204014250U (zh) * | 2014-05-16 | 2014-12-10 | 奥特斯(中国)有限公司 | 用于生产电子元件的连接系统的半成品 |
TW201626864A (zh) * | 2015-01-13 | 2016-07-16 | 台虹科技股份有限公司 | 具有高尺寸安定特性的覆蓋膜及軟性印刷電路板之製作方法 |
CN106550478B (zh) * | 2015-09-22 | 2020-08-04 | 中兴通讯股份有限公司 | 一种多用户传输网络分配矢量设置方法和装置 |
CN106686932B (zh) * | 2015-11-05 | 2019-12-13 | 精能医学股份有限公司 | 植入式电子装置的防水结构 |
CN108353497A (zh) * | 2015-12-18 | 2018-07-31 | Dic株式会社 | 热固性粘接片、带有增强部的柔性印刷配线板、其制造方法以及电子设备 |
TWI589959B (zh) * | 2016-04-01 | 2017-07-01 | 台虹科技股份有限公司 | 單面板的製造方法 |
US20170313029A1 (en) * | 2016-04-27 | 2017-11-02 | Matrix Electronics Limited | Poly-supported copper foil |
JP6496882B2 (ja) | 2016-11-28 | 2019-04-10 | 三井金属鉱業株式会社 | 粘着シート及びその剥離方法 |
US11527415B2 (en) | 2016-11-28 | 2022-12-13 | Mitsui Mining & Smelting Co., Ltd. | Multilayer circuit board manufacturing method |
CN106714461A (zh) * | 2017-02-15 | 2017-05-24 | 昆山大洋电路板有限公司 | 一种高绝缘高电压耐漏电起痕精密线路板及其制备方法 |
US11225563B2 (en) | 2017-02-16 | 2022-01-18 | Azotek Co., Ltd. | Circuit board structure and composite for forming insulating substrates |
US10743423B2 (en) * | 2017-09-15 | 2020-08-11 | Azotek Co., Ltd. | Manufacturing method of composite substrate |
US11044802B2 (en) | 2017-02-16 | 2021-06-22 | Azotek Co., Ltd. | Circuit board |
KR102013283B1 (ko) * | 2017-12-05 | 2019-08-22 | 재단법인 오송첨단의료산업진흥재단 | 열팽창 계수를 이용한 박막전극 분리 방법 |
CN108504299A (zh) * | 2018-05-10 | 2018-09-07 | 合肥中科合聚光化学科技有限公司 | 一种万用高强度胶带及其制备方法 |
TWI767129B (zh) * | 2018-07-11 | 2022-06-11 | 台虹科技股份有限公司 | 複合材料 |
TWI711349B (zh) * | 2019-06-28 | 2020-11-21 | 連展科技股份有限公司 | 可撓電路板 |
US11453204B2 (en) | 2019-09-10 | 2022-09-27 | Advanced Copper Foil Inc. | Poly-supported copper foil |
TWI807216B (zh) * | 2020-09-01 | 2023-07-01 | 佳勝科技股份有限公司 | 複合基板及其製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002353582A (ja) * | 2001-05-22 | 2002-12-06 | Hitachi Chem Co Ltd | 樹脂付き金属箔ならびに多層プリント配線板およびその製造方法 |
JP2003338671A (ja) * | 2002-05-22 | 2003-11-28 | Asahi Kasei Corp | 多層積層板及びこれを用いた多層プリント配線板 |
WO2008004520A1 (fr) * | 2006-07-04 | 2008-01-10 | Nippon Steel Chemical Co., Ltd. | Procédé de modification de la surface d'une couche de résine de polyimide et procédé servant à produire un stratifié métallisé |
JP2010125794A (ja) * | 2008-11-28 | 2010-06-10 | Panasonic Electric Works Co Ltd | 片面金属箔張フレキシブル積層板の製造方法及び積層板構成体 |
JP2011020399A (ja) * | 2009-07-17 | 2011-02-03 | Toyobo Co Ltd | 剥離性ポリイミドフィルム積層体 |
WO2011093427A1 (ja) * | 2010-01-29 | 2011-08-04 | 新日鐵化学株式会社 | 片面金属張積層体の製造方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000056556A1 (en) * | 1999-03-19 | 2000-09-28 | 3M Innovative Properties Company | Image graphic adhesive system and method for using same |
WO2002034850A1 (en) * | 2000-10-20 | 2002-05-02 | Nippon Kayaku Kabushiki Kaisha | Varnish containing polyamide resin and use thereof |
JP4086768B2 (ja) * | 2003-12-10 | 2008-05-14 | 日東電工株式会社 | フレキシブル回路用基板の製造方法 |
JP3962039B2 (ja) * | 2004-06-17 | 2007-08-22 | 日東電工株式会社 | 配線回路形成用基板、配線回路基板および金属薄層の形成方法 |
EA010940B1 (ru) * | 2004-11-05 | 2008-12-30 | Дау Корнинг Айэлэнд Лимитед | Плазменная система |
GB0717430D0 (en) * | 2007-09-10 | 2007-10-24 | Dow Corning Ireland Ltd | Atmospheric pressure plasma |
TWI481499B (zh) * | 2008-04-07 | 2015-04-21 | Hitachi Chemical Co Ltd | 兩張合成的單面金屬箔積層板及其製造方法以及單面印刷配線板及其製造方法 |
CN101747522A (zh) * | 2009-12-16 | 2010-06-23 | 苏州爱迪尔自动化设备有限公司 | 一种塑胶材质镀膜预处理解决方法 |
JP5559674B2 (ja) * | 2010-12-21 | 2014-07-23 | パナソニック株式会社 | フレキシブルプリント配線板及びフレキシブルプリント配線板製造用積層物 |
TW201304633A (zh) * | 2011-07-08 | 2013-01-16 | Azotek Co Ltd | 可撓性基板的製造方法 |
US20140272440A1 (en) * | 2013-03-15 | 2014-09-18 | Illinois Tool Works Inc. | Transfer Foils Utilizing Plasma Treatment to Replace the Release Layer |
TWM483633U (zh) * | 2014-03-07 | 2014-08-01 | Azotek Co Ltd | 金屬基板 |
-
2014
- 2014-03-07 TW TW103107985A patent/TWI488549B/zh active
- 2014-07-10 CN CN201410327565.0A patent/CN104902668B/zh active Active
- 2014-08-14 JP JP2014165273A patent/JP6016858B2/ja active Active
- 2014-09-04 US US14/476,752 patent/US9414485B2/en active Active
- 2014-11-10 KR KR1020140155216A patent/KR101676107B1/ko active IP Right Grant
-
2016
- 2016-07-01 US US15/200,003 patent/US11483934B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002353582A (ja) * | 2001-05-22 | 2002-12-06 | Hitachi Chem Co Ltd | 樹脂付き金属箔ならびに多層プリント配線板およびその製造方法 |
JP2003338671A (ja) * | 2002-05-22 | 2003-11-28 | Asahi Kasei Corp | 多層積層板及びこれを用いた多層プリント配線板 |
WO2008004520A1 (fr) * | 2006-07-04 | 2008-01-10 | Nippon Steel Chemical Co., Ltd. | Procédé de modification de la surface d'une couche de résine de polyimide et procédé servant à produire un stratifié métallisé |
JP2010125794A (ja) * | 2008-11-28 | 2010-06-10 | Panasonic Electric Works Co Ltd | 片面金属箔張フレキシブル積層板の製造方法及び積層板構成体 |
JP2011020399A (ja) * | 2009-07-17 | 2011-02-03 | Toyobo Co Ltd | 剥離性ポリイミドフィルム積層体 |
WO2011093427A1 (ja) * | 2010-01-29 | 2011-08-04 | 新日鐵化学株式会社 | 片面金属張積層体の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017052268A (ja) * | 2015-06-17 | 2017-03-16 | 長興材料工業股▲ふん▼有限公司Eternal Materials Co.,Ltd. | 金属張積層板、その製造方法、並びに、それを用いるフレキシブル回路基板の製造方法 |
US10765008B2 (en) | 2015-06-17 | 2020-09-01 | Eternal Materials Co., Ltd. | Metal clad laminate, preparation method thereof, and method for preparing flexible circuit board by using the same |
Also Published As
Publication number | Publication date |
---|---|
KR101676107B1 (ko) | 2016-11-14 |
US20160316568A1 (en) | 2016-10-27 |
US9414485B2 (en) | 2016-08-09 |
CN104902668A (zh) | 2015-09-09 |
TWI488549B (zh) | 2015-06-11 |
JP6016858B2 (ja) | 2016-10-26 |
TW201536121A (zh) | 2015-09-16 |
US11483934B2 (en) | 2022-10-25 |
US20150257253A1 (en) | 2015-09-10 |
KR20150105177A (ko) | 2015-09-16 |
CN104902668B (zh) | 2018-05-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6016858B2 (ja) | 金属基板及びその製造方法 | |
JP6147394B2 (ja) | 金属基板及びその製造方法 | |
KR100683086B1 (ko) | 수지 조성물 | |
JP2001072781A (ja) | ポリイミドフィルムおよびそれを用いた電気・電子機器用基板 | |
WO2005113645A1 (ja) | ポリイミド樹脂、積層フィルム、金属層付き積層フィルム、および半導体装置 | |
EP1881748A2 (en) | Multi-layer laminate substrates useful in electronic type appliactions | |
JP5095142B2 (ja) | フレキシブルプリント配線板用基板及びその製造方法 | |
KR102038137B1 (ko) | 다층 연성금속박 적층체 및 이의 제조방법 | |
JP4231511B2 (ja) | ポリイミドフィルム、ポリイミド金属積層体及びその製造方法 | |
JP2005186274A (ja) | フレキシブル積層板およびその製造方法 | |
TWM483633U (zh) | 金屬基板 | |
JP2011037157A (ja) | 金属箔ポリイミド積層体 | |
TWM484888U (zh) | 金屬基板 | |
KR101546393B1 (ko) | 플렉시블 금속장 적층판 및 그 제조 방법 | |
JP2009241597A (ja) | 基板材料及び基板 | |
TWI388260B (zh) | Single - sided soft copper foil laminated board and its manufacturing method | |
WO2023171705A1 (ja) | 片面金属張積層板の製造方法 | |
US20230106839A1 (en) | Laminate, single-sided metal-clad laminated sheet, and multi-layer printed wiring board | |
JP2013075255A (ja) | 接着剤付きポリイミドフィルムの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150623 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150924 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160301 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160525 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160920 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160927 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6016858 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |