WO2007132751A1 - 光電気混載フィルムおよびそれを収納した電子機器 - Google Patents
光電気混載フィルムおよびそれを収納した電子機器 Download PDFInfo
- Publication number
- WO2007132751A1 WO2007132751A1 PCT/JP2007/059710 JP2007059710W WO2007132751A1 WO 2007132751 A1 WO2007132751 A1 WO 2007132751A1 JP 2007059710 W JP2007059710 W JP 2007059710W WO 2007132751 A1 WO2007132751 A1 WO 2007132751A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film
- opto
- optical waveguide
- electric hybrid
- hybrid film
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09109—Locally detached layers, e.g. in multilayer
Definitions
- the present invention relates to an opto-electric hybrid film having an optical waveguide film and an electric wiring film force.
- a flexible electrical wiring board (also called “electrical wiring film”! / ⁇ ⁇ ) is placed and used across two parts joined by a hinge (hinge) over a mobile phone or the like.
- the electric wiring film is wound around a hinge shaft or the like with a radius of curvature corresponding to the thickness of the hinge.
- Patent Document 1 discloses a method of providing a slit penetrating a film in a stress concentration portion of an electric wiring film.
- a very narrow space for example, 0.1 mm or less
- An optical waveguide is known as a member that performs optical transmission.
- the optical waveguide is made of an inorganic material such as quartz glass or multi-component glass, which has the characteristics of a small transmission loss and a wide transmission band.
- an inorganic material such as quartz glass or multi-component glass
- optical waveguides with high polymer materials with excellent processability and low cost Is attracting attention.
- a polymer optical waveguide film a polymer material having excellent transparency such as polymethylmethalate (PMMA) or polystyrene is used as a core, and a polymer material having a lower refractive index than the core material is used as a cladding material.
- Planar optical waveguides with a core-cladding structure have been proposed.
- a low-loss flat optical waveguide using polyimide which is a polymer material excellent in heat resistance and transparency, has been proposed (Patent Document 2). Since these optical waveguide films are flexible, they are expected to be an alternative to electrical wiring films.
- optical waveguides When optical waveguides are used in electronic devices, electrical wiring and electrical wiring are often required to supply power and the like.
- a flexible opto-electric hybrid board also referred to as “opto-electric hybrid film” in which the optical waveguide and the electric wiring board are integrated. This is because space saving, thinness and downsizing, and improved workability can be achieved.
- Patent Document 1 Japanese Patent Laid-Open No. 2005-57259
- Patent Document 2 Japanese Patent No. 2813713
- an object of the present invention is to provide an opto-electric hybrid film having high bending resistance.
- optical waveguide film and an opto-electric hybrid film having an electrical wiring film on the optical waveguide film, wherein the opto-electric hybrid film is interposed between both ends in the longitudinal direction thereof
- the optical waveguide film is fixed, and has a separating portion.
- the optical waveguide film has a slit extending in the longitudinal direction, and the slit penetrates the optical waveguide film. the film.
- an opto-electric hybrid film having high bending resistance can be provided.
- FIG. 1A is a perspective view showing an example of the opto-electric hybrid film of the present invention.
- FIG. 1B Perspective view of the opto-electric hybrid film of Fig. 1A viewed from the opposite side
- FIG. 2 is a view showing an example of a method for producing an opto-electric hybrid film according to the present invention.
- FIG. 4 is a diagram showing an example of a method for producing an opto-electric hybrid film according to the present invention.
- the opto-electric hybrid film of the present invention is an optical waveguide film and an opto-electric hybrid film having an electric wiring film on the optical waveguide film, wherein the opto-electric hybrid film is interposed between both ends in the longitudinal direction.
- the optical waveguide film has a slit, and the slit penetrates the optical waveguide film. It is characterized by that.
- the optical waveguide film is a film-like device having a core and a clad and transmitting light through the core.
- the core refers to a portion having a high refractive index that mainly propagates light in the optical waveguide
- the cladding refers to a portion having a lower refractive index than the core.
- the optical waveguide film is preferably made of a polymer material because it has flexibility.
- the polymer material forming the optical waveguide film is not limited, but polyimide is particularly preferable.
- the electrical wiring film refers to a member having a conductor layer on an insulator film made of a polymer material.
- the polymer material for forming the insulator film is not particularly limited, but is preferably polyimide.
- the conductor layer of the electric wiring film includes a structure in which the electric wiring pattern is formed on the surface of the insulator film.
- An electrical wiring pattern refers to an electrical wiring circuit, and noting means to form a circuit.
- the conductor layer can be provided with a metal such as copper, and the electric wiring pattern can be provided by etching the metal. Further, the conductor layer and the electric wiring pattern may be provided using a resin filled with a conductor such as a conductive paste.
- the electrical wiring film only needs to have a conductor layer on one side or both sides. In the case of a multilayer electric wiring film, a conductor layer may be provided on the inner surface.
- FIG. 1 shows a first embodiment of the opto-electric hybrid film of the present invention.
- 1 is an optical waveguide film
- 2 is an electrical wiring film laminated on the optical waveguide film
- both are fixed with an adhesive 3 at both ends.
- Reference numeral 4 denotes an unfixed spacing portion.
- the optical waveguide film 1 includes a core and a clad extending in the longitudinal direction (both not shown).
- Adherence means that the optical waveguide film and the electric wiring film are fixedly bonded together.
- the fixing method includes a method of fusing both by applying ultrasonic waves and heat, a method of mechanically fixing the two using a jig such as a clip, a method of mechanically fixing both by fitting them, A method of adhering both using an adhesive is included.
- FIG. 1B is a perspective view of the opto-electric hybrid film of FIG. 1A as viewed from the back side.
- the optical waveguide film 1 is provided with a slit 5 penetrating the optical waveguide film in the longitudinal direction.
- the shape of the opto-electric hybrid film of the present invention is not particularly limited, but the length in the longitudinal direction is 50. It is preferably ⁇ 200mm and the width is 1 ⁇ 30mm. In particular, the length in the longitudinal direction is preferably 80 to 150 mm and the width is 1.5 to 3 mm, or 7 to 15 mm.
- the thickness of the optical waveguide film in the separation portion is preferably 10 to 200 m, more preferably 20 to LOO m.
- the thickness of the electric wiring film in the separated portion is preferably 20 to 80 / ⁇ ⁇ , more preferably 20 to 50 / ⁇ ⁇ . In the present invention, “to” includes values at both ends thereof.
- the opto-electric hybrid film of the present invention has a separation portion, the stress generated in the film when the opto-electric hybrid film is bent or twisted can be reduced. As a result, resistance to bending or twisting is improved.
- the separation portion refers to a portion where the electric wiring film and the optical waveguide film are fixed to each other.
- the opto-electric hybrid film often has an optical waveguide film and an electric wiring film fixed at both ends, but they are fixed to portions other than both ends! It's okay.
- both are fixed at or near the optical waveguide film input / output portion of the optical waveguide.
- the optical input / output part and the conversion element are arranged with high positional accuracy, because the photoelectric conversion element is often mounted on the electric wiring film side. Because.
- the position of the separation portion is not particularly limited as long as it is between both ends of the opto-electric hybrid film.
- the opto-electric hybrid film of the present invention may be partially bent or twisted in a state of being housed in an electronic device. Accordingly, it is preferable that a part of the opto-electric hybrid film separating portion is present at a position where the film can be bent or twisted when stored in an electronic device or the like. That is, the opto-electric hybrid film housed in an electronic device or the like is preferably separated from the electric wiring film and the optical waveguide film at a position where it can be bent or twisted.
- the length of the separation portion in the longitudinal direction is preferably a force of 5 to 150 mm depending on the shape of the opto-electric hybrid film.
- an adhesive may be used as described above.
- Known adhesives can be used in the present invention. Examples include epoxy adhesives.
- the opto-electric hybrid film of the present invention has a slit on the opto-electric hybrid film at the separation portion. Is provided. Due to the synergistic effect of the slit and the separation portion, the stress generated in the film when the opto-electric hybrid film is bent or twisted can be reduced. That is, it is extremely excellent in high bending resistance.
- the slit is a notch, and the slit is provided so as to penetrate the optical waveguide film.
- the width of the slit is preferably 10 to: LOO ⁇ m.
- One or more slits should be provided V, but the width of the opto-electric hybrid film is large!
- the slits may be formed on both ends of the opto-electric hybrid film (in the entire longitudinal direction), which may be formed only in the separated portion.
- the electrical wiring film 2 is longer in the longitudinal direction than the optical waveguide film 1 at the separation portion! This is because the electrical wiring film 2 is slack! /, So it is easy to bend the opto-electric hybrid film.
- the longitudinal force of the electrical wiring film 2 is longer than the longitudinal length of the optical waveguide film 1 at the separation portion, when the film is bent and stress is generated in the film, the stress is applied to the optical waveguide film 1. Concentrate on.
- the optical waveguide film 1 is provided with the slit as described above, the stress can be relieved and the bending resistance of the film can be improved.
- the difference in length between the electrical wiring film and the optical waveguide film in the separated portion is preferably 0.1 to 5 mm.
- the shape of the slit of the optical waveguide film may be a shape having a curved portion in a state where the optical waveguide film is placed flat, but it is preferable that the slit is linear in the separated portion. This is because when the slit is curved, there is a possibility that the optical waveguide films defined by the slit may interfere with each other when the opto-electric hybrid film is bent.
- the core is also formed linearly in the longitudinal direction at the separation portion. If the core is a straight line, there is no stress concentration point when bent or twisted, so the burden on the core can be further reduced.
- FIG. 2 shows an example of a method for producing the opto-electric hybrid film of the present invention.
- First core 10 An optical waveguide film 1 having clad 11 is prepared.
- the adhesive 3 is applied to the surface of the optical waveguide film 1 other than the separation portion (FIG. 2A).
- the step of applying the adhesive is not particularly limited, but it is preferable to apply the cover with a separate film or the like on the part of the optical waveguide film 1 where the surface is separated.
- an electrical wiring film 2 provided with electrical wiring by the copper pattern 21 is prepared, and the electrical wiring film 2 and the optical waveguide film 1 are bonded by hot pressing (FIG. 2B).
- the electrical wiring film 2 is slackened and overlapped and heated only at the place where it is bonded, an opto-electric hybrid film in which the electrical wiring film 2 sags is obtained.
- the thermal expansion coefficient of the electrical wiring film 2 is smaller than that of the optical waveguide film 1, the thermal expansion coefficient can be obtained by laminating and heating the entire electrical wiring film 2 without having to sag and set the electrical wiring film 2. Therefore, an opto-electric hybrid film in which the electric wiring film 2 is slack can be formed.
- the slit 5 is provided in the optical waveguide film 1 of the opto-electric hybrid film obtained as described above.
- the method of providing the slit is not particularly limited, but it is preferable to use a dicing saw.
- the optical waveguide film 1 is set on the dicing apparatus with the optical waveguide film 1 facing up. If the dicing blade is adjusted to such a height that only the optical waveguide film 1 can be cut and cut, a slit 5 penetrating the optical waveguide film 1 can be provided.
- the slits 5 may be provided only in the separated portions which may extend over both ends of the optical waveguide film 1 in the longitudinal direction.
- FIG. 2 shows an opto-electric hybrid film in which slits 5 are provided at both ends in the longitudinal direction.
- FIG. 2C is a cross-sectional view of the opto-electric hybrid film as viewed from the end surface
- FIG. 2D is a cross-sectional view when the opto-electric hybrid film is cut at the separation portion.
- a large-area opto-electric hybrid film is manufactured in advance, and a slit is provided in the film as described above, and then the desired size is obtained by using a dicing saw or a mold outer casing. Can be cut out and manufactured.
- the end portion can be connected to the connector by being inserted into the connector connecting portion.
- the end portion is not fixed, it is possible to connect the connector to the connector while fixing the electric wiring film and the optical waveguide film by placing the end portion in the connector connecting portion.
- the opto-electric hybrid film of the present invention is used in electronic devices such as mobile phones.
- the opto-electric hybrid film housed in the electronic device can be bent or twisted at the separated portion. Being able to bend means that when an electronic device is used, the opto-electric hybrid film housed inside can be bent. Being able to twist means that when an electronic device is used, the opto-electric hybrid film housed inside can be twisted. Twisting is one form of bending, and twisting is also called twisting and bending. Since the opto-electric hybrid film of the present invention has excellent high bending resistance, it is suitable for the case where it is used by being wound around the hinge part of a mobile phone or the like.
- the torsion test was performed by fixing both ends of the sample to fixing jigs 70 and 71, and repeatedly twisting and rotating one end of the sample with the sample as a rotation axis.
- the twist angle was set to 180 ° clockwise (counterclockwise) when the vertical vertical force of the sample was also seen.
- the number of times immediately before the sample 72 was broken by the test was defined as the number of twisting resistances.
- the distance a between the fixtures was 10 mm, and the sample width at the twisted part was 2.5 mm.
- the sliding bending test was performed using an apparatus according to JIS C 5016 8.6 (bending resistance), with a plate interval of 4 mm, a sliding speed of 500 rpm, and a stroke of 30 mm. In this test, the number of times the opto-electric hybrid film breaks was measured.
- 6FDA and TFDB and 6FDA and 4, 4, mono-oxydialine (ODA) copolymerized polyamic acid solution (OPI-N3405 manufactured by Hitachi Chemical Co., Ltd.) were spin-coated on the film. Thereafter, the core layer 12 having a thickness of 80 ⁇ m was obtained by heat treatment.
- a polyamic acid solution of 6FDAZTFDB (OPI-N1005 manufactured by Hitachi Chemical Co., Ltd.) was coated to a thickness of 7 m after the heat treatment, and then heat treated to obtain a clad layer 14. Thereafter, the silicon wafer on which these polyimide films were laminated was immersed in an aqueous hydrofluoric acid solution, and the film was peeled off from the silicon wafer. In this way, a three-layer film 8 (photoelectric hybrid film precursor) made of a polyimide film in which the cladding layer 13, the core layer 12, and the cladding layer 14 were laminated in this order was produced (FIG. 4A). Next, the three-layer film 8 was cut at 100 mm ⁇ 100 mm square.
- 6FDAZTFDB OPI-N1005 manufactured by Hitachi Chemical Co., Ltd.
- An epoxy adhesive (Epox (registered trademark) -AH357 manufactured by Mitsui Engineering Co., Ltd.) is dried with an applicator on a release-treated pet film larger than 100mm x 100mm so that the thickness is 15 ⁇ m. Applied. The applied film was temporarily dried at 100 ° C. for 10 minutes to produce a 100 mm ⁇ 100 mm adhesive film on the pet film. A 40 mm ⁇ 100 mm portion of the center of the film was cut together with the pet film with a cutter. The pet film from which the central portion was cut out was laminated on the three-layer film 8 using an adhesive laminating apparatus.
- the adhesive layer formed on the pet film is in contact with the thick cladding layer 13 of the three-layer film 8, and the longest outermost side of the adhesive film is the three-layer film 8. It overlapped with the side. Subsequently, the pet film was peeled off, and the adhesive layer 3 was provided on the three-layer film 8 (FIG. 4B).
- a 100 mm ⁇ 100 mm electric wiring film 2 having a 12.5 ⁇ m polyimide film 22 as a base film, a cover film 23, and a copper pattern 21 was prepared.
- the electrical wiring film 2 and the three-layer film 8 provided with the adhesive layer were bonded by hot pressing at 160 ° C. and about 2 MPa (FIG. 4C) to obtain a laminate.
- the laminate was cooled to room temperature to obtain a laminate film having a central portion of about 40 mm ⁇ 100 mm apart.
- the obtained laminated film was warped with the electric wiring film 2 side convex. From this, it was clear that the electrical wiring film 2 side was longer than the three-layer film 8 at the separated portion. Furthermore, when both ends of the laminated film were held and pulled lightly in the vertical direction, it was found that the electrical wiring film 2 was loose.
- the resulting laminated film of 100 mm XI 00 mm is so that the three-layer film 8 is on top.
- a dicing saw was set, and grooves for forming slits and cores were formed in the three-layer film 8.
- the groove was provided in parallel to the short direction of the separation portion (40 ⁇ 100) of the laminated film.
- two linear grooves 61 and 62 were formed under the condition that the dicing blade penetrated the clad layer 14 and the core layer 12 of the three-layer film 8 and stopped within the clad layer 13.
- two straight grooves 63 and 64 are provided at a distance slightly from the groove 62, and the portion sandwiched between the groove 61 and the groove 62 and the portion sandwiched between the groove 63 and the groove 64 are provided.
- a core 10 for guiding light was formed.
- a dicing blade with a blade width of 30 m was used, so by setting the distance between groove 61 and groove 62 and the distance between groove 63 and groove 64 to 130 / zm, the width was about 100 m between both grooves.
- the core 10 was formed.
- the three-layer film could be turned into an optical waveguide film with a core pattern, and a flexible opto-electric hybrid board could be formed.
- a slit 5 was formed in the optical waveguide film 1 in parallel with the groove 62 by dicing at a location 130 m away from the groove 62.
- the dicing blade was made to reach the interface between the clad layer 13 and the adhesive layer 3.
- a slit 5 penetrating the optical waveguide film 1 was formed.
- the film on which the slit 5 was formed was cut into a size of 2.5 mm in width and 90 mm in length by a die cinder, and an opto-electric hybrid film having a separation portion having a length of 40 mm in the longitudinal direction was obtained. At this time, the slit 5 was set to be approximately the center of the width.
- FIG. 4D is a view as seen from the end face of the singulated opto-electric hybrid film
- FIG. 4E is a cross-sectional view cut at the separation portion.
- the slit 5 was provided so as to penetrate the optical waveguide film.
- the difference in length in the longitudinal direction between the electric wiring film 2 and the optical waveguide film 1 in the separated portion of the opto-electric hybrid film was 0.5 mm.
- the durability was 100,000 times.
- a sliding bending test without twisting was performed, and it was confirmed that it could withstand 50,000 cycles.
- Example 2 In the same manner as in Example 1, a three-layer film 8 of 100 mm ⁇ 100 mm was prepared. Before laminating with the electric wiring film 2, four grooves were formed in the same manner as in Example 1 from the clad layer 14 side of the three-layer film 8 using a dicing blade. The bottom of the groove is in the cladding layer 13 Provided to exist. The distance between two adjacent grooves for forming the core was 130 m, and the width of the core 10 sandwiched between both grooves was about 100 m. In this way, an optical waveguide film 1 was formed.
- An adhesive tape (T4100 manufactured by Sony Chemical Co., Ltd.) was attached to the portion other than the central 40 mm ⁇ 100 mm region of the optical waveguide film 1.
- the groove is parallel to the short direction (40 mm) of the area where the adhesive tape is not applied.
- the electric wiring film 2 was bonded at room temperature so as not to sag.
- the laminate thus obtained was set in a dicing machine, and a slit 5 penetrating the optical waveguide film along the core was formed at a position 130 m away from the groove for forming the core.
- the opto-electric hybrid film in which the slits 5 were formed was cut into a shape of 2.5 mm width and 90 mm length by Daishinda Kay, and an opto-electric hybrid film having slits was obtained. At this time, the slit 5 was set to be approximately the center of the width.
- Example 2 a 100 mm ⁇ 100 mm optical waveguide film 1 having grooves was prepared. Adhesive tape was affixed to portions other than the center 80 mm ⁇ 100 mm region of the film 1. On the optical waveguide film 1, the electrical wiring film 2 was attached at room temperature so as to sag, and an opto-electric hybrid film was obtained. At this time, the length force of the electric wiring film 2 in the short direction of the separated portion (8 Omm ⁇ 100 mm) of the opto-electric hybrid film was set to be 2 mm longer than the length of the optical waveguide film 1.
- Example 2 slits were provided in the opto-electric hybrid film to obtain an opto-electric hybrid film separated into pieces having a width of 2.5 mm and a length of 90 mm. At this time, the slit 5 was set to be approximately the center of the width.
- Example 2 In the same manner as in Example 1, a laminated film in which the electric wiring film 2 was slackened at the separated portion was obtained. The resulting laminated film is diced with a three-layer film 8 on top. The groove for forming the core was formed in the same manner as in Example 1. Next, by dicing, it was cut into a 2.5 mm wide and 90 mm long shape to obtain an opto-electric hybrid film separated into individual pieces. In the obtained opto-electric hybrid film, although the electric wiring film 2 was slack in the separated portion, no slit was provided in the optical waveguide film.
- an opto-electric hybrid film having a separation portion was obtained. Next, it was cut into a shape of 2.5 mm wide and 90 mm long by Daising Kalohe, and an opto-electric hybrid film separated into individual pieces was obtained. In the obtained opto-electric hybrid film, although the electric wiring film 2 was slack in the separated portion, no slit was provided in the optical waveguide film.
- the opto-electric hybrid film of the present invention is used in an electronic device that requires optical wiring.
- it since it has excellent high bending resistance, it is useful for electronic devices that can be bent or twisted in a narrow space.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/300,368 US7844143B2 (en) | 2006-05-12 | 2007-05-11 | Electrical and optical hybrid film, and electronic apparatus receiving the same |
JP2008515525A JP4418508B2 (ja) | 2006-05-12 | 2007-05-11 | 光電気混載フィルムおよびそれを収納した電子機器 |
CN2007800131449A CN101421648B (zh) | 2006-05-12 | 2007-05-11 | 光电混载薄膜以及收放了它的电子设备 |
EP07743145A EP2019327A4 (en) | 2006-05-12 | 2007-05-11 | HYBRID OPTOELECTRIC FILM AND ELECTRONIC APPARATUS INCLUDING THE SAME |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-134495 | 2006-05-12 | ||
JP2006134495 | 2006-05-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007132751A1 true WO2007132751A1 (ja) | 2007-11-22 |
Family
ID=38693845
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/059710 WO2007132751A1 (ja) | 2006-05-12 | 2007-05-11 | 光電気混載フィルムおよびそれを収納した電子機器 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7844143B2 (ja) |
EP (1) | EP2019327A4 (ja) |
JP (1) | JP4418508B2 (ja) |
KR (1) | KR101027206B1 (ja) |
CN (1) | CN101421648B (ja) |
TW (1) | TW200806145A (ja) |
WO (1) | WO2007132751A1 (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009096067A1 (ja) * | 2008-02-01 | 2009-08-06 | Hitachi Chemical Company, Ltd. | 光電気混載基板及び電子機器 |
JP2010113211A (ja) * | 2008-11-07 | 2010-05-20 | Hitachi Chem Co Ltd | フレキシブル光電気混載基板及び電子機器 |
JP2010164896A (ja) * | 2009-01-19 | 2010-07-29 | Sumitomo Bakelite Co Ltd | 光導波路および光導波路モジュール |
WO2010101201A1 (ja) * | 2009-03-06 | 2010-09-10 | ミツミ電機株式会社 | フィルム光導波路 |
JP2010266669A (ja) * | 2009-05-14 | 2010-11-25 | Sumitomo Bakelite Co Ltd | 光導波路組立体および電子機器 |
JP2011028158A (ja) * | 2009-07-29 | 2011-02-10 | Sumitomo Bakelite Co Ltd | 光導波路、光配線、光電気混載基板および電子機器 |
JP2011237524A (ja) * | 2010-05-07 | 2011-11-24 | Nippon Telegr & Teleph Corp <Ntt> | 光導波路フィルム |
JP2013127646A (ja) * | 2013-03-22 | 2013-06-27 | Sumitomo Bakelite Co Ltd | 光導波路、光配線、光電気混載基板および電子機器 |
JP2013228467A (ja) * | 2012-04-24 | 2013-11-07 | Nippon Mektron Ltd | 光電気混載フレキシブルプリント配線板、及びその製造方法 |
WO2018123389A1 (ja) * | 2016-12-28 | 2018-07-05 | 日東電工株式会社 | 光電気混載基板 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102057306A (zh) * | 2008-06-10 | 2011-05-11 | 住友电木株式会社 | 电子设备、便携电话机、挠性电缆、光波导形成体的制造方法 |
US9069128B2 (en) | 2008-11-21 | 2015-06-30 | Hitachi Chemical Company, Ltd. | Opto-electric combined circuit board and electronic devices |
KR102355459B1 (ko) | 2015-08-11 | 2022-01-26 | 삼성전자주식회사 | 스타일러스 펜 및 이를 포함하는 전자장치 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2813713B2 (ja) | 1990-04-27 | 1998-10-22 | 日本電信電話株式会社 | ポリイミド系光導波路 |
JP2001201670A (ja) * | 2000-01-18 | 2001-07-27 | Sony Corp | 光モジュール |
JP2004022666A (ja) * | 2002-06-13 | 2004-01-22 | Kyocera Corp | 半導体装置 |
JP2004118117A (ja) * | 2002-09-27 | 2004-04-15 | Toshiba Corp | 光導波路アレイフィルム |
JP2005057259A (ja) | 2003-07-24 | 2005-03-03 | Nec Access Technica Ltd | フレキシブル基板および電子装置 |
JP2006084488A (ja) * | 2004-09-14 | 2006-03-30 | Mitsui Chemicals Inc | 光導波路基板、および光電気混載基板 |
JP2006091706A (ja) * | 2004-09-27 | 2006-04-06 | Nec Corp | 光信号入出力機構を有する半導体装置 |
JP2006134495A (ja) | 2004-11-08 | 2006-05-25 | Matsushita Electric Ind Co Ltd | 属性情報管理システム |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05335696A (ja) * | 1992-05-29 | 1993-12-17 | Nippon Mektron Ltd | 折曲げ容易な可撓性回路基板及びその製造法 |
EP1286194A3 (en) * | 2001-08-21 | 2004-05-19 | Canon Kabushiki Kaisha | Optical waveguide apparatus |
JP2003258390A (ja) * | 2002-03-06 | 2003-09-12 | Sumitomo Electric Printed Circuit Inc | フレキシブルプリント配線板 |
JP4112448B2 (ja) * | 2003-07-28 | 2008-07-02 | 株式会社東芝 | 電気光配線基板及び半導体装置 |
US7184617B2 (en) * | 2004-03-12 | 2007-02-27 | Matsushita Electric Industrial Co., Ltd. | Portable device |
JP2006171625A (ja) * | 2004-12-20 | 2006-06-29 | Japan Aviation Electronics Industry Ltd | 光導波路及び電気配線混載回路、及びその製造方法 |
-
2007
- 2007-05-11 JP JP2008515525A patent/JP4418508B2/ja not_active Expired - Fee Related
- 2007-05-11 EP EP07743145A patent/EP2019327A4/en not_active Withdrawn
- 2007-05-11 US US12/300,368 patent/US7844143B2/en not_active Expired - Fee Related
- 2007-05-11 WO PCT/JP2007/059710 patent/WO2007132751A1/ja active Application Filing
- 2007-05-11 CN CN2007800131449A patent/CN101421648B/zh not_active Expired - Fee Related
- 2007-05-11 KR KR1020087027220A patent/KR101027206B1/ko not_active IP Right Cessation
- 2007-05-11 TW TW096116850A patent/TW200806145A/zh not_active IP Right Cessation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2813713B2 (ja) | 1990-04-27 | 1998-10-22 | 日本電信電話株式会社 | ポリイミド系光導波路 |
JP2001201670A (ja) * | 2000-01-18 | 2001-07-27 | Sony Corp | 光モジュール |
JP2004022666A (ja) * | 2002-06-13 | 2004-01-22 | Kyocera Corp | 半導体装置 |
JP2004118117A (ja) * | 2002-09-27 | 2004-04-15 | Toshiba Corp | 光導波路アレイフィルム |
JP2005057259A (ja) | 2003-07-24 | 2005-03-03 | Nec Access Technica Ltd | フレキシブル基板および電子装置 |
JP2006084488A (ja) * | 2004-09-14 | 2006-03-30 | Mitsui Chemicals Inc | 光導波路基板、および光電気混載基板 |
JP2006091706A (ja) * | 2004-09-27 | 2006-04-06 | Nec Corp | 光信号入出力機構を有する半導体装置 |
JP2006134495A (ja) | 2004-11-08 | 2006-05-25 | Matsushita Electric Ind Co Ltd | 属性情報管理システム |
Non-Patent Citations (3)
Title |
---|
See also references of EP2019327A4 |
SHIODA T. AND YAMADA K.: "Kokukkyoku Polyimide Kodo Haro Film", 2005 NEN THE INSTITUTE OF ELECTRONICS, INFORMATION AND COMMUNICATION ENGINEERS ELECTRONICS SOCIETY TAIKAI KOEN RONBUNSHU 1, 7 September 2005 (2005-09-07), XP003019328 * |
SHIODA T.: "Hikari Denki Konsai Kiban no Kaihatsu Doko", THE JOURNAL OF THE INSTITUE OF ELECTRONICS, INFORMATION AND COMMUNICATION ENGINEERS, vol. 88, no. 6, 1 June 2005 (2005-06-01), pages 435 - 439, XP003019329 * |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009096067A1 (ja) * | 2008-02-01 | 2009-08-06 | Hitachi Chemical Company, Ltd. | 光電気混載基板及び電子機器 |
JP2010113211A (ja) * | 2008-11-07 | 2010-05-20 | Hitachi Chem Co Ltd | フレキシブル光電気混載基板及び電子機器 |
JP2010164896A (ja) * | 2009-01-19 | 2010-07-29 | Sumitomo Bakelite Co Ltd | 光導波路および光導波路モジュール |
WO2010101201A1 (ja) * | 2009-03-06 | 2010-09-10 | ミツミ電機株式会社 | フィルム光導波路 |
JP2010266669A (ja) * | 2009-05-14 | 2010-11-25 | Sumitomo Bakelite Co Ltd | 光導波路組立体および電子機器 |
JP2011028158A (ja) * | 2009-07-29 | 2011-02-10 | Sumitomo Bakelite Co Ltd | 光導波路、光配線、光電気混載基板および電子機器 |
JP2011237524A (ja) * | 2010-05-07 | 2011-11-24 | Nippon Telegr & Teleph Corp <Ntt> | 光導波路フィルム |
JP2013228467A (ja) * | 2012-04-24 | 2013-11-07 | Nippon Mektron Ltd | 光電気混載フレキシブルプリント配線板、及びその製造方法 |
JP2013127646A (ja) * | 2013-03-22 | 2013-06-27 | Sumitomo Bakelite Co Ltd | 光導波路、光配線、光電気混載基板および電子機器 |
WO2018123389A1 (ja) * | 2016-12-28 | 2018-07-05 | 日東電工株式会社 | 光電気混載基板 |
JP2018106095A (ja) * | 2016-12-28 | 2018-07-05 | 日東電工株式会社 | 光電気混載基板 |
US10996395B2 (en) | 2016-12-28 | 2021-05-04 | Nitto Denko Corporation | Opto-electric hybrid board |
JP7101454B2 (ja) | 2016-12-28 | 2022-07-15 | 日東電工株式会社 | 光電気混載基板 |
Also Published As
Publication number | Publication date |
---|---|
KR20090007746A (ko) | 2009-01-20 |
US7844143B2 (en) | 2010-11-30 |
US20090317048A1 (en) | 2009-12-24 |
KR101027206B1 (ko) | 2011-04-06 |
TWI326571B (ja) | 2010-06-21 |
JP4418508B2 (ja) | 2010-02-17 |
CN101421648B (zh) | 2010-12-15 |
TW200806145A (en) | 2008-01-16 |
CN101421648A (zh) | 2009-04-29 |
EP2019327A4 (en) | 2012-09-05 |
EP2019327A1 (en) | 2009-01-28 |
JPWO2007132751A1 (ja) | 2009-09-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2007132751A1 (ja) | 光電気混載フィルムおよびそれを収納した電子機器 | |
JP4679580B2 (ja) | 光導波路フィルムおよび光電気混載フィルム | |
EP1921473A1 (en) | Optical waveguide film, method for manufacturing the film, optoelectrical hybrid film including the waveguide film, and electronic device | |
SE513183C2 (sv) | Förfarande för framställning av en optokomponent samt kapslad optokomponent | |
KR102189206B1 (ko) | 광전기 혼재 기판 | |
WO2007063813A1 (ja) | 光導波路部材、光配線基板、光配線モジュール及び表示装置、並びに光導波路部材および光配線基板の製造方法 | |
JP2014107064A (ja) | ケーブル整列構造およびケーブル整列構造の製造方法 | |
JP3729240B2 (ja) | 光モジュールの製造方法 | |
JPH10339818A (ja) | 光配線部品及びその製造方法 | |
US9031361B2 (en) | Optical module | |
JP4703441B2 (ja) | 光導波路素子および光電気混載素子 | |
WO2007013208A1 (ja) | 導波路フィルムケーブル | |
KR102092437B1 (ko) | 광전기 혼재 모듈 | |
JP2010060821A (ja) | フレキシブル光電気配線及びその製造方法 | |
JP2017536681A (ja) | フラットケーブル | |
JP2009103860A (ja) | 光導波路および光導波路製造方法 | |
JP4487772B2 (ja) | 光導波路モジュール | |
JP4594794B2 (ja) | 超電導マグネットの製造方法 | |
JP2002228876A (ja) | 光導波路ケーブル及びその接続方法 | |
JP2004246192A (ja) | 光ファイバアレイ及び光ファイバアレイの製造方法 | |
JP2003110068A (ja) | 熱伝導シートおよびその製法 | |
JP2009211979A (ja) | フラットケーブルの製造方法 | |
JP2010009994A (ja) | 同軸ケーブルアレイ及びその製造方法 | |
JP2002006147A (ja) | 光回路基板の配線パターンと光回路基板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 07743145 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2008515525 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 200780013144.9 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2007743145 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020087027220 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12300368 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |