WO2007108192A1 - ガラス基板の静電吸着装置及びその吸着離脱方法 - Google Patents
ガラス基板の静電吸着装置及びその吸着離脱方法 Download PDFInfo
- Publication number
- WO2007108192A1 WO2007108192A1 PCT/JP2006/325957 JP2006325957W WO2007108192A1 WO 2007108192 A1 WO2007108192 A1 WO 2007108192A1 JP 2006325957 W JP2006325957 W JP 2006325957W WO 2007108192 A1 WO2007108192 A1 WO 2007108192A1
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- Prior art keywords
- adsorption
- glass substrate
- voltage
- time
- electrostatic
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/06—Work-clamping means
- B23Q3/08—Work-clamping means other than mechanically-actuated
- B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/10—Auxiliary devices, e.g. bolsters, extension members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Definitions
- the present invention relates to a glass substrate electrostatic adsorption device and a glass substrate adsorption separation method.
- the semiconductor substrate or the glass substrate is adsorbed on a support base or the like by using an electrostatic adsorption device using an electrostatic attraction force. Make sure to hold the glass substrate securely.
- Patent Document 1 Japanese Patent Laid-Open No. 06-085045
- Patent Document 2 JP 09-213780 A
- Patent Document 3 Japanese Patent Laid-Open No. 11-340307
- Figs. 7 (a) and 7 (b) show a conventional electrostatic chuck for a glass substrate.
- the conventional electrostatic chuck for glass substrates has a ceramics suction plate 33 in which a plurality of positive electrodes 31 and a plurality of negative electrodes 32 are arranged, and a positive voltage that supplies a positive DC voltage to the positive electrode 31.
- the power supply unit 34 includes a negative voltage power supply unit 35 that supplies a negative DC voltage to the negative electrode 32.
- the glass substrate 41 may be supported on the vertical lower surface side of the adsorption plate 33, and the adsorption force more than the weight of the glass substrate 41 is electrostatic. adsorption Required for equipment.
- the gap between the suction plate 33 and the glass substrate 41 and the suction force have a relationship as shown in FIG. 9 (b), and the gap between the suction plate 33 and the glass substrate 41 becomes larger.
- the gap is 50 m or more, the substantial adsorption force becomes substantially zero even though the adsorption force is greater than its own weight. Therefore, depending on the size of the deformation of the glass substrate 41, there may be a case where an adsorption force larger than its own weight does not occur. In particular, this problem has become serious as the glass substrate 41 becomes larger in recent years.
- a surface potential is generated near the suction plate 33 by the positive electrode 31 and the negative electrode 32, and particles may adhere due to the surface potential.
- the surface potential on the glass substrate 41 adsorbed on the adsorption plate 33 is measured along the arrow A shown in FIG. 7 (b)
- the surface potential is generated as shown in FIG.
- a large surface potential is generated at the end portion.
- a gap between the suction plate 33 and the glass substrate 41 is generated, and the suction force is reduced as described above. There is also a fear.
- the presence of particles in the vicinity of the glass substrate 41 may cause the particles to adhere to the glass substrate 41 itself when the glass substrate 41 is adsorbed and detached, and the particles are in the vicinity of the glass substrate 41.
- the presence is not preferable from the viewpoint of the process.
- a surface potential that is too large may adversely affect the device generated on the glass substrate 41.
- the volume resistivity of the glass substrate 41 has a physical property that it rapidly decreases as the temperature increases. For example, when the temperature of the glass substrate 41 increases by 10 ° C., the volume resistivity decreases by an order of magnitude, and as a result, the time required for adsorption increases with the same applied voltage.
- the adsorption force of the glass substrate 41 changes depending on the temperature of the glass substrate 41, and this characteristic is also a cause of hindering stable adsorption / desorption operation.
- the adsorption force changes greatly only by a few degrees, as shown in FIG. 11 (b).
- the glass substrate temperature changes from room temperature to a temperature of 50 ° C or higher during the process, so the time required for adsorption and desorption is expected to change significantly. Therefore, without taking this into account, it is difficult to perform the adsorption / desorption operation stably.
- the present invention has been made in view of the above problems, and an object of the present invention is to provide an electrostatic chucking apparatus and a chucking / detaching method for a glass substrate that can be reliably attracted and quickly detached.
- An electrostatic chucking device for a glass substrate according to a first invention for solving the above-mentioned problem is provided:
- An adsorption plate made of a dielectric material having at least one or more first electrodes and at least one or more second electrodes disposed therein;
- a first power source for applying a voltage to the first electrode
- a second power source for applying a voltage having a polarity opposite to that of the first electrode to the second electrode, an adsorption detection means for detecting that the glass substrate is adsorbed to the adsorption plate, and a temperature of the glass substrate. Temperature sensing means to measure or predict;
- Control means for controlling the voltage of the first power supply and the second power supply based on the detection result from the adsorption detection means and the temperature detection means;
- An electrostatic adsorption device for a glass substrate that electrostatically adsorbs the glass substrate to the adsorption plate by applying a voltage to the first electrode and the second electrode, and detaches the glass substrate from the adsorption plate.
- the control means includes The size, specific gravity, and electrical resistivity of the glass substrate are preset, and the adsorption time required for adsorption of the glass substrate, the holding time for adsorption holding the glass substrate, and the separation time required for detachment of the glass substrate. Preset,
- an adsorption voltage necessary for obtaining the adsorption force is obtained, and a holding voltage for holding the adsorption and Find the release voltage to leave,
- a comparison is made between the preset adsorption time and the measured adsorption time. If the preset adsorption time differs from the measured adsorption time, the holding voltage and the separation voltage are determined based on the measured adsorption time. Recalculate
- the control means gradually decreases at least one of the adsorption voltage, the holding voltage, and the separation voltage with time.
- An electrostatic chucking apparatus for a glass substrate according to a third invention for solving the above-mentioned problems is as follows.
- the adsorption detection means uses a first ammeter for measuring a current flowing through the first electrode, or a current flowing through a second electrode.
- the control means detects at least one of the second ammeter to be measured, and the control means detects a change in a current value flowing through the first ammeter or the second ammeter, and the glass substrate is placed on the suction plate. It is characterized by detecting the adsorption.
- the suction detection means is a position sensor provided in the vicinity of the suction surface of the suction plate, and the control means uses the position sensor to detect that the glass substrate is sucked to the suction plate.
- a deformation detection means for predicting or measuring the deformation amount of the glass substrate, wherein the control means is predicted or measured. Further, the adsorption force is obtained based on the deformation amount of the glass substrate.
- the glass substrate electrostatic chucking device is characterized in that a conductive member that covers a surface other than the suction surface of the suction plate and is grounded is provided.
- a glass substrate adsorption / desorption method according to a seventh invention for solving the above-mentioned problems is
- the size, specific gravity, and electrical resistivity of the glass substrate are set in advance, and the adsorption time required to adsorb the glass substrate, the holding time for adsorbing and holding the glass substrate, and the detaching time required for detaching the glass substrate are preset. ,
- the adsorption voltage necessary for obtaining the adsorption force is obtained, and the holding voltage for holding the adsorption and for releasing it.
- the adsorption of the glass substrate to the adsorption plate is detected, and the actual adsorption time required for adsorption of the glass substrate is measured,
- the recalculated holding voltage and release voltage are applied to at least one first electrode and at least one second electrode that are placed inside a dielectric adsorption plate and have opposite polarities. Then, the glass substrate is maintained to be adsorbed and detached.
- At least one of the adsorption voltage, the holding voltage, and the separation voltage is gradually decreased with time.
- the adsorption of the glass substrate is detected by detecting a change in at least one of the current values flowing through the first electrode or the second electrode.
- the adsorption to the plate is detected.
- the adsorption of the glass substrate to the adsorption plate is detected by a position sensor provided in the vicinity of the adsorption surface of the adsorption plate. To do.
- the deformation amount of the glass substrate is predicted or measured, and the adsorption force is obtained based on the predicted or measured deformation amount of the glass substrate.
- a glass substrate adsorption / desorption method according to a twelfth invention for solving the above-described problems is
- a potential of the surface other than the suction surface of the suction plate is set to 0 by a conductive member that covers the surface other than the suction surface of the suction plate and is grounded.
- the invention's effect when adsorbing a glass substrate, the size, specific gravity, electrical resistivity, substrate temperature, deformation amount, etc. are grasped, and the necessary adsorption force and the voltage necessary for the adsorption force are obtained. Because the voltage required for adsorption holding and desorption is controlled based on the actual adsorption time required, the adsorption and desorption operation should be performed quickly and stably even if there are variations in the temperature of the substrate and the adsorption time. Can do.
- surfaces other than the adsorption surface of the adsorption plate are shielded with a conductive member such as a metal so that the potential is 0, so that particles are prevented from adhering to the adsorption plate, It is possible to prevent the adsorption / desorption operation of the substrate from being hindered.
- FIG. 1 is a schematic diagram showing an example of an embodiment of an electrostatic attraction apparatus for a glass substrate according to the present invention.
- FIG. 2 is a flowchart for explaining an example of an embodiment of a glass substrate adsorption / desorption method according to the present invention.
- FIG. 3 is a diagram for explaining a pattern of an applied voltage in the glass substrate adsorption / desorption method according to the present invention.
- FIG. 4 is a diagram of an electrical equivalent circuit model of the glass substrate electrostatic adsorption device according to the present invention.
- FIG. 5 shows the measurement results of the adsorption / desorption time of the glass substrate in the conventional adsorption / desorption method and the measurement results of the adsorption / desorption time of the glass substrate in the adsorption / desorption method according to the present invention.
- FIG. 6 is a schematic view showing another example of the embodiment of the electrostatic attraction apparatus for a glass substrate according to the present invention.
- FIG. 7 is a schematic view showing a conventional electrostatic adsorption device for a glass substrate.
- FIG. 8 is a graph showing the relationship between adsorption force and adsorption time.
- FIG. 9 is a graph showing the deflection of the glass substrate due to its own weight and the change in the adsorption force due to the gap.
- FIG. 10 is a graph showing the surface potential of the glass substrate on the adsorption surface of the electrostatic adsorption device.
- FIG. 11 is a graph showing changes in volume resistivity and adsorption force of a glass substrate with temperature.
- FIG. 1 is a schematic view of an electrostatic chucking apparatus for a glass substrate according to the present invention.
- the glass substrate electrostatic adsorption device of this embodiment has at least one or more first electrodes 1 and at least one or more second electrodes 2 arranged therein, and is made of ceramics or the like.
- Suction plate 3 made of an insulator, first power supply unit 4 for supplying voltage to first electrode 1, and first electrode 1 for supplying voltage to second electrode 2 having a polarity opposite to the applied voltage.
- (2) Power supply unit 5 first ammeter 6 for measuring current flowing through first electrode 1, second ammeter 7 for measuring current flowing through second electrode 2, first ammeter 6, second current
- the control unit 8 (control means) that measures the current value of the total 7 and controls the voltage output from the first power supply unit 4 and the second power supply unit 5 is provided.
- the electrostatic adsorption device for the glass substrate of the present embodiment is configured such that the first electrode 1 and the second electrode 2 inside the adsorption plate 3 are alternately arranged in parallel, thereby It is configured so that even a large-sized glass substrate 11 can be reliably adsorbed.
- a plurality of suction plates 3 having a plurality of first electrodes 1 and a plurality of second electrodes 2 are arranged, and the plurality of suction plates 3 are used to suck the large glass substrate 11. You may do so.
- the first power supply unit 4 and the second power supply unit 5 are capable of applying a DC voltage of the opposite polarity with only a DC voltage of one polarity, and further capable of applying an AC voltage. It is.
- At least one temperature sensor 9 (infrared type or thermocouple type; temperature detection means) for measuring the temperature of the glass substrate 11 is provided in the vicinity of the adsorption plate 3, and the glass substrate 11 Measure the temperature of the plate 11 and input it to the control unit 8.
- At least one position sensor 10 (deformation detecting means) for measuring the deformation amount of the glass substrate 11 is provided. Is input to the control unit 8.
- the control unit 8 detects the change in at least one of the current values measured by the first ammeter 6 or the second ammeter 7 so that the glass substrate 11 is adsorbed to the adsorption plate 3.
- the first ammeter 6 and the second ammeter 7 function as adsorption detection means.
- the position sensor 10 may be used as a suction detection unit to detect whether or not the glass substrate 11 is sucked to the suction plate 3.
- the glass substrate 11 When adsorbing the glass substrate 11, the glass substrate 11 is brought into contact with the surface of the adsorption plate 3, and direct current is applied to the first electrode 1 and the second electrode 2 from the first power supply unit 4 and the second power supply unit 5.
- a voltage By applying a voltage, charges having different polarities are generated on the opposing surfaces of the suction plate 3 and the glass substrate 14, and the substrate 11 is attracted to the surface of the suction plate 3 by the electrostatic adsorption force of these charges. Let me hold it.
- a DC voltage or an AC voltage having a polarity opposite to the voltage applied during the adsorption is applied to the first electrode 1 and the second electrode 2 and accumulated during the adsorption.
- the glass substrate 11 is detached by reducing the charge.
- the glass substrate 11 is adsorbed on the vertical lower surface side of the adsorption plate 3 by using the electrostatic adsorption device having the above-described configuration.
- the vapor deposition process is performed on the vertical bottom side of 11.
- the electrostatic suction device is required to have an adsorption force that is greater than the weight of the glass substrate 11.
- the adsorption force is too strong, the glass substrate 11 may be prevented from being detached.
- the size (length X width X thickness) and material (specific gravity, electrical resistivity) of the glass substrate 11 are basically input.
- Step S1 Enter suction completion time t, hold completion time t, and release completion time t according to the process (step S1)
- the holding completion time t is the voltage application starting force.
- the adsorption time during adsorption is the adsorption completion time t, and the retention time during the adsorption state is
- T is one holding completion time t].
- the deformation amount of the glass substrate 11 is predicted based on the size (length X width X thickness) and material (specific gravity) of the glass substrate 11 (step S3).
- the deformation amount of the glass substrate 11 may be measured using the position sensor 10 (step S4).
- the deformation amount of the glass substrate 11 may be measured in advance. It is desirable that the position sensor 10 be arranged so that at least the central portion of the glass substrate 11 that is predicted to have the largest deformation amount can be measured. Then, by predicting or measuring the deformation amount of the glass substrate 11, a change in the adsorption force accompanying the deformation of the glass substrate 11 is obtained.
- the temperature change of the substrate 11 is predicted (step S5).
- the temperature of the glass substrate 11 may be actually measured using the thermocouple 9 (step S6). Then, by predicting or measuring the temperature of the glass substrate 11, the change in electrical resistivity accompanying the temperature change of the glass substrate 11 and further the change in adsorption force are obtained.
- the adsorption voltage pattern V (t) at the adsorption time is obtained so as to obtain an optimum adsorption force for adsorbing the glass substrate 11.
- the holding voltage pattern V c h at the holding time is obtained.
- the adsorption voltage pattern V (t), holding voltage pattern V (t), and release voltage pattern V (t) may be constant as shown in Fig. 3, such as the chr voltages V, V, and V. As shown in voltage V, V, and V shown in 3, cl hi rl c2 h2 r2
- the applied voltage may be gradually decreased with time.
- the change in adsorption force on glass substrate 11 The adsorption voltage pattern V (t) must be larger than the holding voltage pattern V (t).
- the change in the current value in the first ammeter 6 and the second ammeter 7 is measured.
- the current values in the first ammeter 6 and the second ammeter 7 increase momentarily. It can be determined that 11 is adsorbed to the adsorption plate 3.
- the actual measurement time t until the force glass substrate 11 is actually attracted to the suction plate 3 is measured by marking the suction voltage pattern V (t) (step S8). Instead of checking the suction status based on the change in the current value of the first ammeter 6 and the second ammeter 7, check the suction status and suction time separately with the position sensor 10. .
- the calculated holding voltage pattern V (t) and release voltage pattern V (t) are determined as the applied voltage at hr 2 at hold completion time t and the applied voltage at release completion time t (steps S9 and S10). .
- Step S9 Sl l. For example, if t ⁇ t, the holding voltage V (t) and the release voltage V (t) are
- the adsorption completion time t and the separation completion time t do not necessarily need to be fixed.
- the holding voltage pattern V (t) and the disconnection voltage pattern V (t) may be appropriately changed to c h r.
- the separation voltage pattern V (t) is too large or the separation completion time t r 3 is too long, the glass substrate 11 once detached may be adsorbed again. Therefore, for example, when the actual adsorption time t is shorter than the preset adsorption completion time t,
- the adsorption voltage pattern is reduced immediately after the actual adsorption time t has elapsed.
- the applied voltage is changed to V (t), or the application of the release voltage pattern V (t) is completed.
- FIG. 4 an electric equivalent circuit model of the electrostatic adsorption device for a glass substrate according to the present invention is shown in Fig. 4, and the adsorption force, adsorption voltage, and holding voltage in the electrostatic adsorption method for the glass substrate according to the present invention are shown. A calculation method for obtaining the separation voltage will be described.
- F can be calculated by the following formula (1) as an electrostatic force applied to the gap d between the glass part (glass substrate 11) and the electrode part (electrodes 1 and 2).
- F is the adsorption power (NZm 2 )
- Q is the amount of charge stored in the gap (c)
- C is the gap
- V is the gap potential difference (V)
- ⁇ is the dielectric constant in vacuum (F / m) go
- the capacitance C is a function of the gap d between the glass part and the electrode part as shown in the following formula (2).
- d is the gap distance (m)
- ⁇ is the dielectric constant in vacuum (F / m)
- ⁇ is the ratio of the target material.
- the gap d between the glass part and the electrode part is obtained from the deformation amount of the glass substrate 11 predicted or measured in steps S3 and S4, and the capacitance C can be obtained using the obtained gap d. That's fine.
- the capacitances C and C of the glass part and the electrode part are the gap d in the above formula (2).
- the capacitances C and C of each element are calculated. It is calculated.
- resistance components R, R, R of each element connected in parallel with capacitors C, C, C of each element
- R is the resistance of each element ( ⁇ / ⁇ 2 ), is the electrical resistivity of each element (Q 'm), L is each element e
- Element thickness (d in the gap part) (m) S is the adsorption area (m 2 ) of each element.
- the thickness L and the adsorption area S determine the size (length X width X thickness) of the glass substrate 11 and the like. Therefore
- Resistance R is the material (electrical resistivity p), temperature T, substrate size (thickness L, adsorption e
- the potential difference V in the gap part is the glass part, g a with respect to the applied voltage V.
- the potential difference V is a function of the material and temperature of each element, the size of the substrate, and the waveform of the applied voltage V a a
- the attractive force F which is an electrostatic force, is obtained as a function of the gap d between the glass part and the electrode part, the material and temperature of each part, the temperature, the magnitude, and the waveform of the applied voltage V, as shown in Equation (1). It is done.
- the conditions for the adsorption and separation of the glass substrate 11 and the value conditions are such that the adsorption force F is sufficiently larger than its own weight, which also requires the density force of the glass substrate 11.
- the time passing through this is used as the adsorption time t or desorption time t.
- the function f in the above equation (4) can be obtained analytically in advance, or a calibration curve can be obtained experimentally to obtain the adsorption force for each adsorption or separation input condition. You should prepare in advance.
- Fig. 5 (a) shows the measurement results of the conventional method
- Fig. 5 (b) shows the measurement results of this example.
- the applied voltage pattern of this example is that the adsorption completion time t, the retention completion time t, and the separation completion time t are set to preset times.
- the applied voltage at each time is fixed, such as voltage V ⁇ V ⁇ V in Fig. 3. cl hi rl
- the constant value is indicated by a dotted line, and the current measurement value is indicated by a solid line. Looking at the change in the applied current value with respect to this applied voltage, the glass substrate absorbs in a short actual measurement time t after application of the adsorption voltage [VI].
- the glass substrate is adsorbed in a short actual measurement time t after application of the adsorption voltage [VI]. Since the adsorption is maintained at a holding voltage [V3] smaller than the adsorption voltage [VI] obtained based on the adsorption time t, the applied current is also smaller than the conventional one. For this reason, it is determined based on the adsorption time t that no excessive charge is generated. Even with a separation voltage [—V4] smaller than the conventional separation voltage [V2], the glass substrate can be obtained with a short separation time t. The withdrawal of It is finished.
- the desorption time t in the adsorption and desorption method of this example is about r ra of the desorption time t in the conventional adsorption and desorption method.
- FIG. 6 is a schematic diagram showing another example of the embodiment of the electrostatic attraction apparatus for a glass substrate according to the present invention.
- the diagram is simplified so that the configuration is powerful, and the same components as those shown in FIG. 1 of the first embodiment are denoted by the same reference numerals. Therefore, detailed description of the equivalent configuration is omitted.
- the glass substrate electrostatic adsorption device of the present example has a configuration substantially equivalent to that of the glass substrate electrostatic adsorption device shown in FIG. 1 of Example 1, but as shown in FIG.
- the other surface of the suction plate 3 excluding the suction surface that sucks the glass substrate 11 is covered with a metal cover 21 made of a conductive member, and the metal cover 21 is grounded.
- the surface potential other than the suction surface of the suction plate 3 is set to 0, and particles or the like are charged and attached to the suction plate 3. This can be prevented.
- the adhesion of the particles is prevented in the adsorption plate 3 in the vicinity of the glass substrate 11, when adsorbing the glass substrate 11 to the adsorption plate 3, the glass substrate 11 and the adsorption surface of the adsorption plate 3 are not affected. It is also possible to prevent particles from being caught in between, and to suppress the influence on the adsorption force. In addition, the adhesion of particles to the glass substrate 11 during the process can be suppressed.
- the present invention is suitable for an insulating substrate such as a glass substrate, and can be applied to, for example, an organic EL manufacturing apparatus or a liquid crystal manufacturing apparatus using a glass substrate.
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Abstract
Description
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Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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CN200680053935XA CN101401198B (zh) | 2006-03-20 | 2006-12-26 | 用于玻璃基板的静电吸引设备和吸引和释放玻璃基板的方法 |
US12/225,167 US7995324B2 (en) | 2006-03-20 | 2006-12-26 | Electrostatic attraction apparatus for glass substrate and method of attracting and releasing the same |
EP06843341.6A EP1998365B1 (en) | 2006-03-20 | 2006-12-26 | Electrostatic attraction apparatus for glass substrate and method for attracting and releasing such glass substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2006-076033 | 2006-03-20 | ||
JP2006076033A JP4884811B2 (ja) | 2006-03-20 | 2006-03-20 | ガラス基板の静電吸着装置及びその吸着離脱方法 |
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WO2007108192A1 true WO2007108192A1 (ja) | 2007-09-27 |
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PCT/JP2006/325957 WO2007108192A1 (ja) | 2006-03-20 | 2006-12-26 | ガラス基板の静電吸着装置及びその吸着離脱方法 |
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US (1) | US7995324B2 (ja) |
EP (1) | EP1998365B1 (ja) |
JP (1) | JP4884811B2 (ja) |
KR (1) | KR100995176B1 (ja) |
CN (1) | CN101401198B (ja) |
TW (1) | TW200810000A (ja) |
WO (1) | WO2007108192A1 (ja) |
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JP5246583B2 (ja) * | 2008-02-29 | 2013-07-24 | 旭硝子株式会社 | ガラス基板吸着テーブル、及びガラス基板加工方法 |
KR101125430B1 (ko) * | 2009-09-04 | 2012-03-28 | 주식회사 디엠에스 | 피처리물의 디척킹과 함께 반응 챔버 내부 및 정전 척의 드라이 클리닝을 실행하는 플라즈마 반응기의 피처리물 디척킹 장치 및 방법 |
WO2011031589A2 (en) * | 2009-09-10 | 2011-03-17 | Lam Research Corporation | Methods and arrangement for detecting a wafer-released event within a plasma processing chamber |
JP5401343B2 (ja) * | 2010-01-28 | 2014-01-29 | 株式会社日立ハイテクノロジーズ | 静電チャック用電源回路、及び静電チャック装置 |
US20140064905A1 (en) * | 2011-01-10 | 2014-03-06 | Sri International | Electroadhesive System for Capturing Objects |
DE102011050322B4 (de) | 2011-05-12 | 2022-02-17 | Hanwha Q Cells Gmbh | Substrataufnahmeverfahren und Substrataufnahmevorrichtung |
JP5592833B2 (ja) * | 2011-05-20 | 2014-09-17 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置および静電チャック装置 |
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- 2006-12-26 WO PCT/JP2006/325957 patent/WO2007108192A1/ja active Application Filing
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Also Published As
Publication number | Publication date |
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JP2007251083A (ja) | 2007-09-27 |
KR100995176B1 (ko) | 2010-11-17 |
KR20080106270A (ko) | 2008-12-04 |
US7995324B2 (en) | 2011-08-09 |
CN101401198B (zh) | 2012-05-02 |
EP1998365B1 (en) | 2017-09-06 |
CN101401198A (zh) | 2009-04-01 |
TWI348197B (ja) | 2011-09-01 |
EP1998365A1 (en) | 2008-12-03 |
TW200810000A (en) | 2008-02-16 |
JP4884811B2 (ja) | 2012-02-29 |
US20090273879A1 (en) | 2009-11-05 |
EP1998365A4 (en) | 2016-11-30 |
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