WO2007088614A1 - Plaque a tuyeres et dispositif flottant par ecoulement de gaz et utilisant la plaque a tuyeres - Google Patents

Plaque a tuyeres et dispositif flottant par ecoulement de gaz et utilisant la plaque a tuyeres Download PDF

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Publication number
WO2007088614A1
WO2007088614A1 PCT/JP2006/301698 JP2006301698W WO2007088614A1 WO 2007088614 A1 WO2007088614 A1 WO 2007088614A1 JP 2006301698 W JP2006301698 W JP 2006301698W WO 2007088614 A1 WO2007088614 A1 WO 2007088614A1
Authority
WO
WIPO (PCT)
Prior art keywords
plate
nozzle plate
airflow
gas
nozzle
Prior art date
Application number
PCT/JP2006/301698
Other languages
English (en)
Japanese (ja)
Inventor
Akihiko Kawahara
Shinji Nakamura
Eiichi Taguchi
Original Assignee
Hirata Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirata Corporation filed Critical Hirata Corporation
Priority to PCT/JP2006/301698 priority Critical patent/WO2007088614A1/fr
Priority to TW096103742A priority patent/TWI405031B/zh
Priority to JP2007556914A priority patent/JP5042864B2/ja
Priority to PCT/JP2007/051712 priority patent/WO2007088936A1/fr
Priority to KR1020087019234A priority patent/KR101033908B1/ko
Priority to CN200780003160XA priority patent/CN101374741B/zh
Publication of WO2007088614A1 publication Critical patent/WO2007088614A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Definitions

  • Patent Document 5 discloses that air that passes through a horizontally extending horizontal passage is ejected from an inclined ejection hole that is greatly spread.
  • This inclined jet hole has a right triangle shape in cross-sectional view, and it is difficult to say that the direction of the jetted gas is well controlled.
  • Patent Document 1 Japanese Patent Laid-Open No. 7-228342
  • Patent Document 2 JP-A-8-181182
  • Patent Document 4 Japanese Patent Laid-Open No. 2000-72250
  • Patent Document 5 Japanese Patent Laid-Open No. 11-268830
  • an airflow levitation device (and application of the airflow levitation device) that floats a plate-like object by gas ejected from a plurality of inclined ejection holes and conveys it in a predetermined direction while maintaining a non-contact state.
  • the nozzle plate used in the device includes the plurality of inclined ejection holes and a flat portion where the plate-like object is close to each other, and each of the plurality of inclined ejection holes is At least a gas flow path of an ejected gas body long enough to sufficiently control the direction of the ejected gas is provided, and the plurality of inclined ejection holes form an air reservoir at a predetermined position by the ejected gas.
  • the gas flow is inclined so as to eject the gas in at least two directions. This predetermined position is preferably near the flat portion.
  • the gas may include air, nitrogen, and other gases
  • the plate-like object may include wafers, substrates, and other thin plate-like objects to be conveyed.
  • the non-contact state may include a state that does not become an obstacle when the plate-like object is levitated. For example, including a state in which a predetermined distance is maintained between the plate-like object and the conveying surface of the airflow levitation device. In addition to including a state in which a certain amount of drag force is generated between the transfer surface and the transfer surface, even if there is a part in contact with the transfer surface, it may include a state in which transfer is not hindered as a whole.
  • the transport surface may include a surface on which the plate-shaped object to be transported approaches (or approaches), particularly a surface closest to the transport surface.
  • the flat portion may form a substantially flat surface that is included in the transport surface.
  • the flat portion preferably does not include a protrusion protruding from the surface, but can include a portion recessed from the surface.
  • the gas flow path having a length sufficient to sufficiently control the direction of the gas to be ejected is a gas flow path through which the gas to be ejected passes, and the gas ejected by passing through this gas flow path.
  • the direction and speed of jetting are defined to some extent. In other words, if this gas flow path is sufficiently long, the direction of the gas that travels easily becomes one direction, and the direction of the gas that is easily ejected is easily collected by the inertial force. That is, if it is too short, the jetted gas tends to diffuse when it exits the inclined jet hole, and if it is too long, the flow velocity of the gas passing through the gas flow path tends to decrease due to tube resistance.
  • the inclined ejection hole force For the distance L to the air reservoir at the predetermined position
  • the predetermined position where the air reservoir is formed may be determined in relation to the plate-like object to be conveyed.
  • This air reservoir may be on the conveyance surface or in the vicinity of the flat portion.
  • the air reservoir may be a space partitioned by a wall or the like, but may include a free space that is not partitioned by a wall or the like.
  • This air reservoir may have a pressure larger than the ambient pressure, and the pressure of the air reservoir may contribute to the floating of the plate-like object to be conveyed.
  • the plurality of inclined ejection holes are inclined so as to be substantially perpendicular to the surface of the first wall, and the ejection direction is an opening of the plurality of inclined ejection holes.
  • the nozzle plate according to (2) is provided, wherein when it is virtually extended from the second wall, the nozzle plate directly contacts the second wall that defines the groove portion facing the first wall. it can.
  • the groove portion is formed in a shape recessed from the flat portion, and can form a larger gap with the plate-like object being conveyed.
  • the shape of the groove is not particularly limited, but the cross-sectional shape may include various shapes such as an ellipse, a semicircle, a rectangle, a square, and a triangle. As will be described later, a triangular shape (that is, a V-shaped groove) is more preferable. More preferably, the depth of the groove is substantially uniform in the longitudinal direction of the groove.
  • the gas ejected from the openings of the plurality of inclined ejection holes does not have a collision force with the counterpart wall (second wall) forming the groove before reaching the air reservoir. If this happens, the air flow may not reach the air reservoir, or there may be a slow speed when it reaches the air reservoir, and the contribution of the dynamic pressure of the air flow is reduced.
  • Such grooves may be continuous or discontinuous.
  • Various shapes such as a rectangle, a square, and a triangle can be used in addition to a circle or an ellipse, but a rectangle is more preferable.
  • the grooves are opposed to each other. It is preferable that at least one set of grooves is provided along the side.
  • a circle, an ellipse, or a triangle a pair of opposing sides (two sides) or grooves at positions of three or more sides are combined, and the inclined ejection hole force provided in the groove is ejected. It is preferable to provide such a groove portion so that the air reservoir is efficiently formed on the flat portion by the gas.
  • FIG. 29 the same flow as in FIG. 28 is performed using the nozzle plate 10 ′ of the present invention with the air levitation device 125 ′ having a force of 127 ′.
  • the corrugated shape of the plate-like object 50 can be freely formed by appropriately changing the arrangement of the nozzle plate 10 ′.
  • the nozzle plate 10 ′ is used in this way, it is more easily adapted to the characteristics of the plate-like object 50 without the need to adjust the air blowing from the jet outlet or to open the air jet outlet in a predetermined pattern. It is possible to design the conveying surface of the air levitation device 125 'to 127'.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Advancing Webs (AREA)
  • Delivering By Means Of Belts And Rollers (AREA)

Abstract

L'invention concerne un dispositif flottant par écoulement de gaz et une plaque à tuyères utilisée pour ledit dispositif. Le dispositif de l'invention est pleinement capable de faire flotter un objet semblable à une assiette avec une attitude stabilisée par écoulement de gaz à basse pression ou avec un faible volume. Le dispositif flottant par écoulement de gaz transporte un objet semblable à une assiette dans une direction prédéterminée, l'objet flottant sans contact grâce au gaz éjecté par des trous d'éjection inclinés. La plaque à tuyères utilisée pour ledit dispositif est dotée des trous d'éjection inclinés et présente une section plate à proximité immédiate de laquelle se trouve l'objet semblable à une assiette. Chacun des trous d'éjection inclinés comporte un canal de gaz d'éjection destiné au gaz d'éjection, et le canal de gaz présente une longueur grâce à laquelle la direction du gaz éjecté peut être suffisamment contrôlée. En outre, chaque trou d'éjection incliné est incliné de telle sorte que le gaz est éjecté dans au moins deux directions afin qu'un coussin d'air soit formé à un emplacement prédéterminé par le gaz éjecté.
PCT/JP2006/301698 2006-02-01 2006-02-01 Plaque a tuyeres et dispositif flottant par ecoulement de gaz et utilisant la plaque a tuyeres WO2007088614A1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
PCT/JP2006/301698 WO2007088614A1 (fr) 2006-02-01 2006-02-01 Plaque a tuyeres et dispositif flottant par ecoulement de gaz et utilisant la plaque a tuyeres
TW096103742A TWI405031B (zh) 2006-02-01 2007-02-01 氣流輸送裝置
JP2007556914A JP5042864B2 (ja) 2006-02-01 2007-02-01 気流搬送装置
PCT/JP2007/051712 WO2007088936A1 (fr) 2006-02-01 2007-02-01 Dispositif de transport par flux de gaz
KR1020087019234A KR101033908B1 (ko) 2006-02-01 2007-02-01 기류 반송 장치
CN200780003160XA CN101374741B (zh) 2006-02-01 2007-02-01 气流输送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/301698 WO2007088614A1 (fr) 2006-02-01 2006-02-01 Plaque a tuyeres et dispositif flottant par ecoulement de gaz et utilisant la plaque a tuyeres

Publications (1)

Publication Number Publication Date
WO2007088614A1 true WO2007088614A1 (fr) 2007-08-09

Family

ID=38327202

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2006/301698 WO2007088614A1 (fr) 2006-02-01 2006-02-01 Plaque a tuyeres et dispositif flottant par ecoulement de gaz et utilisant la plaque a tuyeres
PCT/JP2007/051712 WO2007088936A1 (fr) 2006-02-01 2007-02-01 Dispositif de transport par flux de gaz

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/051712 WO2007088936A1 (fr) 2006-02-01 2007-02-01 Dispositif de transport par flux de gaz

Country Status (4)

Country Link
KR (1) KR101033908B1 (fr)
CN (1) CN101374741B (fr)
TW (1) TWI405031B (fr)
WO (2) WO2007088614A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2388808A1 (fr) * 2010-05-20 2011-11-23 Westfälische Wilhelms-Universität Münster Système de transport sans contact
JP2015060925A (ja) * 2013-09-18 2015-03-30 三星ダイヤモンド工業株式会社 支持機構および搬送装置
CN104822613A (zh) * 2013-02-26 2015-08-05 株式会社Ihi 搬运装置
CN106144412A (zh) * 2015-03-19 2016-11-23 株式会社东明 栅架

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5239606B2 (ja) * 2007-10-04 2013-07-17 株式会社Ｉｈｉ 浮上搬送装置及び浮上ユニット
JP5581611B2 (ja) * 2009-06-02 2014-09-03 株式会社Ｉｈｉ 浮上搬送装置及び浮上ユニット
GB2471712A (en) 2009-07-10 2011-01-12 De Beers Centenary AG Gemstone alignment system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0891623A (ja) * 1994-09-28 1996-04-09 Fujitsu Ltd 基板搬送方法及び基板搬送装置
JPH08181182A (ja) * 1994-12-21 1996-07-12 Hitachi Ltd 半導体搬送装置および半導体製造装置
JP2004244186A (ja) * 2003-02-14 2004-09-02 Ckd Corp 薄板の搬送用支持装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06271028A (ja) * 1993-03-18 1994-09-27 Hitachi Ltd 電子部品の移送機構および前記移送機構を用いた電子部品用検査機
JP4358924B2 (ja) * 1998-11-25 2009-11-04 株式会社渡辺商行 板状基体の収納ユニットおよび収納装置
JP2002289670A (ja) 2001-03-28 2002-10-04 Takehide Hayashi 浮上ユニット

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0891623A (ja) * 1994-09-28 1996-04-09 Fujitsu Ltd 基板搬送方法及び基板搬送装置
JPH08181182A (ja) * 1994-12-21 1996-07-12 Hitachi Ltd 半導体搬送装置および半導体製造装置
JP2004244186A (ja) * 2003-02-14 2004-09-02 Ckd Corp 薄板の搬送用支持装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2388808A1 (fr) * 2010-05-20 2011-11-23 Westfälische Wilhelms-Universität Münster Système de transport sans contact
CN104822613A (zh) * 2013-02-26 2015-08-05 株式会社Ihi 搬运装置
US9469487B2 (en) 2013-02-26 2016-10-18 Ihi Corporation Conveyance device
JP2015060925A (ja) * 2013-09-18 2015-03-30 三星ダイヤモンド工業株式会社 支持機構および搬送装置
CN106144412A (zh) * 2015-03-19 2016-11-23 株式会社东明 栅架

Also Published As

Publication number Publication date
KR101033908B1 (ko) 2011-05-11
TWI405031B (zh) 2013-08-11
CN101374741A (zh) 2009-02-25
TW200801786A (en) 2008-01-01
KR20080084854A (ko) 2008-09-19
WO2007088936A1 (fr) 2007-08-09
CN101374741B (zh) 2012-05-09

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