WO2007072603A1 - Matériau métallique comportant une partie de jonction avec un matériau dissimilaire et son procédé de traitement au moyen d’un laser - Google Patents

Matériau métallique comportant une partie de jonction avec un matériau dissimilaire et son procédé de traitement au moyen d’un laser Download PDF

Info

Publication number
WO2007072603A1
WO2007072603A1 PCT/JP2006/315425 JP2006315425W WO2007072603A1 WO 2007072603 A1 WO2007072603 A1 WO 2007072603A1 JP 2006315425 W JP2006315425 W JP 2006315425W WO 2007072603 A1 WO2007072603 A1 WO 2007072603A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal material
scanning direction
metal
laser
joint
Prior art date
Application number
PCT/JP2006/315425
Other languages
English (en)
Japanese (ja)
Inventor
Seio Kobayashi
Atsushi Hishinuma
Masayuki Satoh
Original Assignee
Yamase Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamase Electric Co., Ltd. filed Critical Yamase Electric Co., Ltd.
Priority to JP2007509773A priority Critical patent/JP4020957B2/ja
Publication of WO2007072603A1 publication Critical patent/WO2007072603A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B23K2103/05—Stainless steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/15—Magnesium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics

Definitions

  • the present invention relates to a metal surface treatment technique for increasing the degree of bonding with different materials! in addition
  • the present invention relates to a technique for firmly joining a different material to a metal surface using the metal surface treatment technique.
  • mobile phone casings are lightweight (density 0.8 to 1.4g / cm 3 ), and can be mass-produced by injection molding and the like, and the low cost associated therewith. In most cases, molded products such as synthetic resins were molded. In recent years, however, the functions of mobile phones have been increasing and diversifying, such as camera functions and music functions, and as a result, the volume of electronic components mounted on the casing and the number of push buttons are 'liquid crystal The ratio of the display part is also increasing. Therefore, as the mass of electronic parts and the like increases with the improvement of the functions, there is a demand for weight reduction (thinning) of a housing for mounting the electronic parts and the like.
  • the above-mentioned greaves are generally inferior in mechanical properties such as tensile strength, elastic modulus, impact strength and the like as compared with metal materials. For this reason, as a result of the need to reinforce by installing a rib etc. inside the housing, the mountable volume is inevitably reduced. In addition, when the resin casing is made thin, residual stress is generated, so that deformation is likely to occur and the thermal reliability is low.
  • Japanese Patent Application Laid-Open No. 2001-1445 discloses a method in which a metal material is subjected to an organic plating process and bonded to a resin.
  • this technology it is expected to increase the bonding strength because it is a covalent bond, but it must be treated before the surface treatment such as anodic acid soot.
  • Pre-treatment is necessary to remove metal oxides' activation, high adhesive temperature cannot be obtained unless molding temperature is high at the time of molding, molding cycle becomes longer, mold release problem depending on the shape , Partial processing is difficult, visual confirmation of processing status is difficult, storage management of processed products must be strictly controlled, the number of processing steps is relatively large, etc. .
  • etching force is applied to a metal material and then bonded to a resin.
  • Japanese Patent Application Laid-Open No. 2004-050488 which is a method for performing a corrosion treatment (etching treatment) on a metal surface with chemicals and injection molding a resin on the surface.
  • etching treatment a corrosion treatment
  • the bonding strength itself can be expected to be high, but it uses a highly harmful chemical (hydrazine) that needs to be treated before the surface treatment such as anodic acid soot.
  • hydrazine highly harmful chemical
  • Patent Document 1 discloses a technique in which a metal surface is irradiated with laser light to form irregularities, and then, the resin is injection-molded and coated on the irregularity forming portion. If this technology is adopted, only the necessary parts can be processed, the processing part can be easily changed on the equipment program, it is relatively safe, there are few processing steps, and it supports automation. Easy, can be assembled in later processes other than outsert molding, can confirm processing relatively easily by observing the processing surface, does not require other materials only by processing materials, etc. It is excellent in that there are merits.
  • Patent Document 1 cannot achieve extremely high adhesion between the metal material and the resin. Therefore, the adhesion problem has been a barrier to the application of the technology to electronic products such as mobile phones.
  • a metal material and a dissimilar material are extremely high in a technique for joining a metal material and a dissimilar material (for example, a resin) by utilizing the laser processing technology having the above-mentioned many merits. ! To provide technology for bonding with adhesive properties.
  • Patent Document 1 JP-A-10-294024
  • the scanning direction crosses the scanning direction. It is a metal material characterized by being formed by laser scanning.
  • the present invention (2) is the metal material according to the present invention (1), wherein both of the laser scanning calories in the one scanning direction and the other scanning direction are performed in a plurality of times.
  • the laser scanning calories in the one scanning direction and the other scanning direction are both implemented with a hatching width of 0.02 to 0.6 mm.
  • the invention (4) is the metal material according to any one of the inventions (1) to (3), wherein an angle at which the certain scanning direction and the other scanning direction cross each other is 45 ° or more. is there. In the present invention (5), an angle at which the certain scanning direction and the other scanning direction cross each other is approximately 90.
  • the metal material of the invention (4).
  • the joint portion has an uneven shape, and at least a part of the convex portion has a bridge shape or an overhang shape.
  • V one of the metal materials.
  • the present invention (7) is the metal material according to any one of the inventions (1) to (6), wherein the peel strength when a specific resin is bonded to the bonded portion is 4 MPa or more. is there.
  • the present invention (8) is the metal according to any one of the inventions (1) to (7), wherein the dissimilar material is a thermoplastic resin, a thermosetting resin, an elastomer, or a plastic alloy. Material.
  • the present invention is the metal material according to any one of the inventions (1) to (8), wherein the metal material is aluminum, magnesium or stainless steel.
  • the metal material is a component for electric or electronic equipment.
  • the electrical / electronic device component is a mobile phone casing.
  • the dissimilar material-bonded metal material is a component for electric or electronic equipment.
  • the dissimilar material-bonded metal material of the invention (12).
  • the present invention (14) is an electric or electronic device in which the electric or electronic device is mounted on the electric or electronic device component of the present invention (13).
  • the present invention is the electrical or electronic device of the present invention (14), wherein the electrical or electronic device is a mobile phone.
  • the present invention (16) includes a step of laser scanning a metal surface in a certain scanning direction and a step of laser scanning the metal surface in another scanning direction crossing the scanning direction. This is a laser processing method of a metal surface for forming a joint with a different material.
  • the laser scanning process in one scanning direction and the other scanning direction is performed with a hatching width of 0.02 to 0.6 mm. ) Method.
  • the present invention (19) is the method according to any one of the inventions (16) to (18), wherein an angle at which the certain scanning direction crosses the other scanning direction is 45 ° or more.
  • an angle at which the certain scanning direction and the other scanning direction cross each other is approximately 9
  • the method according to the invention (19) is 0 °.
  • the present invention (21) includes the inventions (16) to (16), wherein the joint portion has a concavo-convex shape, and at least a part of the convex portion has a bridge shape or an overhang shape. (20)! , One way.
  • the present invention (22) is a method according to any one of the inventions (16) to (21), wherein the peel strength when a specific resin is bonded to the bonded portion is 4 MPa or more. is there.
  • the dissimilar material is a thermoplastic resin, a thermosetting resin, an elastomer, or a plastic alloy, and any one of the inventions (16) to (22) Is the method.
  • the present invention (24) is any one of the above inventions (16) to (23), wherein the metal material is aluminum, magnesium or stainless steel.
  • the present invention (25) includes the steps of any one of the above-described inventions (16) to (24), and is a method for producing a metal material having a joint with a different material formed therein. It is a method.
  • the present invention (26) includes the steps in any one of the methods of the inventions (16) to (24), and a step of bonding a dissimilar material to the metal surface subjected to the laser scanning process. This is a method for joining a metal surface and a dissimilar material.
  • the present invention (27) is the method according to the invention (26), wherein the joining step comprises injection molding of a different material on the metal surface.
  • the present invention (28) is a method for producing a dissimilar material-bonded metal material, comprising the steps of the method of the invention (26) or (27).
  • the present invention (29) includes each step in the method of the invention (28), and the metal part is electrically or electrically connected.
  • a joining portion composed of a large number of protrusions (uneven portions) derived from the cross-shaped laser scanning force and having an excellent anchor effect is provided on the metal surface. Therefore, when compared to conventional laser-treated metal surfaces, it exhibits a very high bonding strength with different materials.
  • the laser scanning force is superimposed several times, so that the shape of the protrusion at the joint is further complicated, It has the effect of exerting a superior anchor effect.
  • the laser scanning force is carried out with a hatching width of 0.02 to 0.6 mm.
  • a hatching width 0.02 to 0.6 mm.
  • the cross angle in the laser scanning carriage is set to 45 ° or more, so that the strength is maintained against the force from any direction.
  • excellent bonding strength can be expected in a specific direction.
  • the cross angle in the laser scanning carriage is approximately 90 °, so that it is uniformly excellent for any directional force. If the bonding strength is shown, the effect is effective.
  • the present invention (6) in addition to the above-described effect, when the convex portion has a bridge shape, the foreign material is solidified in a state where the different type material enters the hole, and the convex portion has an overhang shape. Since the foreign material solidifies while the foreign material wraps around the head, it will have an excellent effect if it exhibits a better anchor effect.
  • the peel strength is 4 MPa or more in view of the above effects, and thus, until now, a strong adhesive must be used to join different materials. It has the effect that it can be used for various products that require high bonding strength.
  • a general-purpose material such as aluminum, magnesium or stainless steel can be joined by changing the laser processing conditions. Since the portion can be formed, there is an effect that the range of material selection is widened compared with chemical etching or the like.
  • the bonding strength between the metal material and the dissimilar material is extremely high. Even if the electrical / electronic equipment is dropped, vibrated, or shocked, the joint is not easily damaged. As a result, it is possible to effectively prevent the failure of the electrical / electronic equipment caused by the damage of the joint. It has the effect of being able to.
  • the frequency of dropping / vibration is the highest among electric / electronic devices due to its availability or portability, and it is applied to mobile phones. Therefore, there is an effect that it is possible to effectively prevent a mobile phone failure due to the breakage of the joint portion.
  • the effects relating to the product obtained by the method are as described above.
  • organic plating and etching which can be changed freely by the program and can be used for general purposes, it is easier to process as much as required in a given location, and is safer than chemical etching with chemicals.
  • Due to the nature of the marking cage the surface of the workpiece before processing does not require degreasing and is easy to manage. Compared with other processing methods, it has fewer steps and is easy to handle automation. Because it is a bridge shape (0.01-0.1 mm), it is easy to check whether or not it has been treated without special equipment, and it can be processed with both surface-treated and untreated products such as anodized.
  • the metal material according to the present invention is not particularly limited, but examples thereof include aluminum, magnesium, and stainless steel.
  • the metal material When used as a casing for electrical and electronic equipment such as mobile phones and laptop computers, from the viewpoint of light weight, light metals such as aluminum and magnesium or a density of 5 gZcm 3 or less are used alone or as a main component. It is preferable to use an alloy of
  • the metal material may or may not be subjected to surface treatment such as anodizing treatment or coating, and it is confirmed that the deviation forms a bridge shape by the laser scanning treatment described later.
  • the metal material according to the present invention has a joint with a different material on its surface.
  • the joint portion has a concavo-convex shape, and preferably at least a part of the convex portion has a bridge shape or an overhang shape.
  • the “bridge shape” refers to a shape in which the tops of the generated convex portions are melted and connected to form an arch shape with a hole at the bottom.
  • the protrusions not all of the protrusions have a bridge shape, and some of the protrusions are overhanging to form a mushroom-like cedar tree, or a simple protrusion that is not overhanging. Also good.
  • Fig. 1 shows an example of the bridge-like conceptual diagram. First, Fig.
  • FIG. 1 (a) shows a shape in which a hole is formed between both convex bodies in such a way that one convex body and the other convex body collapse.
  • FIG. 1 (b) shows a shape in which a hole is formed between both convex bodies in such a way that one convex body falls into the other convex body.
  • Fig. 1 (c) shows a shape in which a hanging sag is hung between both convex bodies as a result of melting of one convex body and the upper part of the other convex body.
  • FIG. 1 (d) shows a shape (tunnel shape) in which a hole is formed in the center in a state where one convex body and the other convex body are aligned.
  • the joint portion forms a fine three-dimensional network shape.
  • dissimilar materials are joined to the joint portion having such a surface structure (for example, the resin is joined by injection molding)
  • the concave portion of the fine three-dimensional network shape and the void below the bridge portion As a result of the dissimilar material entering the surface, the surface area where the joint surface comes into contact with the dissimilar material increases, and at the same time, an extremely high anchor effect is exhibited.
  • the metal and the dissimilar material can be firmly and stably bonded without using a bonding agent such as an adhesive or without treating the metal surface with a chemical.
  • the peel strength when a specific resin (standard sample) is bonded to the bonded portion is preferably 4 MPa or more, more preferably 6 MPa or more, and more preferably lOMPa or more. Is preferred. If this level of peel strength is achieved, the metal and the dissimilar material can be firmly and stably bonded without using a bonding agent such as an adhesive or without treating the metal surface with a chemical. However, this strength is the peel strength when “specific grease” is bonded, and the actual peel strength varies depending on the type of “dissimilar material”.
  • peel strength as used in the claims and in the present specification shall be performed in accordance with “Test method for tensile bond strength of adhesive-rigid substrate” in JIS K6850. The test is roughly performed by fixing both ends of the test piece to the chuck, applying a tensile load at a constant speed, and recording the load when the joint surface peels or the load when the material breaks (tensile strength). carry out.
  • the “specific fat” used as the standard sample is PBT fat (for example, “Toray Toraycon 1101G30 Bk”).
  • PBT fat for example, “Toray Toraycon 1101G30 Bk”.
  • FIG. 1 indicates a metal material
  • PBT specific resin
  • FIG. 2 indicates a specific resin
  • FIG. 3 indicates a support
  • A indicates a joint area.
  • the peel strength is a value obtained by dividing the tensile strength by the area of the joint, it is not basically restricted by the conditions shown in FIG.
  • Toyo Seiki Strograph V10-C was used as the tensile tester, the distance between chucks (the distance between the upper and lower chuck tips) was set to 30 mm, and the pulling speed was set to 5 mmZmin.
  • the joint is irradiated with laser light and gold It is formed by grooving the metal surface and processing it under the conditions of melting and re-solidifying. More specifically, the laser scanning scan is performed in a certain scanning direction, and then the laser scanning process is performed in another scanning direction crossing the scanning direction.
  • the preferred conditions for cross laser scanning the preferred conditions relating to “cross angle” and “number of repeated machining”, which are particularly important parameters, will be explained first, and then the preferred conditions relating to other parameters will be explained sequentially. To do.
  • the cross angle is preferably such that the angle between one scanning direction and another scanning direction is 10 ° or more, and more preferably 45 ° or more. That is, it is important that the scanning direction of the next processing is not the same as the previous processing. Further, when the joint strength is high with respect to the tensile load from any direction, it is optimal that the cross angle is approximately 90 °.
  • the number of repeated caches (the number of overlaps and the number of cross-hatchings) is appropriately determined by those skilled in the art based on the output of the type of metal material to be processed, such as “cross angle (machining direction)”.
  • cross angle machining direction
  • the number of times of repeated processing is too small, it is difficult to form a joint portion having a high anchor effect (for example, a convex portion has a bridge shape or an overhang shape).
  • the number of times of repeated machining is too large, the machining time may increase and the joint portion having a high anchor effect may be damaged.
  • the cross angle is approximately 90 °
  • 8 to 10 times is preferable for SUS
  • 4 to 5 times is preferable for Mg.
  • the processing conditions of a certain process and the subsequent process may be changed. For example, a mode in which deep and roughening processing is performed at the first time with a relatively large output, and a shape is adjusted at the second time.
  • the laser processability due to the difference in color it is generally considered that the processability of the black system is lower than that of the black system. Yes.
  • it is confirmed that the same effect can be obtained even if the processing method is rotated by 45 ° after processing at 0 ° in the scanning direction and added four times.
  • the "processing machine output" is preferably set to 80% or more, more preferably 92 to 95% in a model having an average output of about 20W.
  • increasing the set output can reduce the number of machining operations and shorten the machining time.
  • 40W direction force workability is higher than 20W (the laser scanning set speed / frequency can be increased).
  • it is possible to reduce the number of cross-hatching somewhat for example, in the case of SUS, it is 8-10 times at 20W, but about 6-8 times at 40W).
  • the output In the case of a metal material that has not been anodized, the output must be set higher than that of an anodized material.
  • the "hatching width" is preferably 0.02 to 0.6 mm.
  • FIG 14 shows the concept of notching width.
  • the notching width is preferably determined by the type of metal material.
  • the caulking material such as Mg has a large hatching width because the unevenness is crushed unless the hatching width is relatively wide.
  • the hatch width can be set in a relatively wide range.
  • you increase the output of the processing machine it is powerful! It is preferable to set the hatching width in a brushy manner because it increases the properties and has a large effect on the periphery of the force-carrying part and tends to be flat.
  • the hatching width it is preferable to set the hatching width to 50 to 300% of the beam spot diameter, and to 60 to 150%. Is more preferred.
  • the setting hatch width is 0.05 to 0.3 mm, more preferably 0.06 to 0.15 mm.
  • the “foreign material” is not particularly limited as long as it is lower than the melting point of the metal material and can be joined at a temperature.
  • thermoplastic resin, thermosetting resin, elastomer Or a plastic alloy can be mentioned.
  • it may be a material that is hardened by heat other than heat, such as a material that is hardened by energy other than heat, such as a photo-curable resin, or a material that is chemically solidified by mixing a plurality of components.
  • thermoplastic resin examples include polyethylene ( ⁇ ), polypropylene ( ⁇ ), polystyrene (PS), acrylonitrile / styrene resin (AS), acrylonitrile / butadiene Z styrene resin.
  • thermoplastic resin for example, polyamide (PA), polyacetal (POM), ultra high molecular weight polyethylene (UHPE) ), Polybutylene terephthalate (PBT), GF reinforced polyethylene terephthalate (GF—PET), polymethylpentene (TPX), polycarbonate (PC), modified polyphenylene ether (PPE), thermoplastic resin (super engineering resin)
  • PPS polyphenylene sulfide
  • PEEK polyether ether ketone
  • LCP liquid crystal polymer
  • polytetrafluoroethylene for example, polyamide (PA), polyacetal (POM), ultra high molecular weight polyethylene (UHPE) ), Polybutylene terephthalate (PBT), GF reinforced polyethylene terephthalate (GF—PET), polymethylpentene (TPX), polycarbonate (PC), modified polyphenylene ether (PPE), thermoplastic resin (super engineering resin)
  • PPS polyphenylene sulfide
  • PEEK polyether ether
  • thermoplastic resins include chloroethylene (PTFE), polyetherimide (PEI), polyarylate (PAR), polysulfone (PSF), polyethersulfone (PES), polyamideimide (PAI), and thermosetting resin.
  • rubber resins, urea resins, melamine resins, unsaturated polyesters, alkyd resins, epoxy resins, diallyl phthalates, and elastomers include thermoplastic elastomers and rubbers such as styrene butadiene series, polyolefins, etc. Examples include urethanes, urethanes, polyesters, polyamides, 1,2-polybutadiene, polyvinyl chloride, and ionomers.
  • a thermoplastic resin added with glass fiber and a polymer alloy can also be used.
  • the injection molding may be either outsert molding or insert molding.
  • the viewpoint power of the necessity to transfer the laser bridge processing surface with force is more suitable because the mold temperature is set higher and the injection pressure is higher because the transferability is better. is there.
  • the surface roughness of the laser bridge processing surface is 0.05-5.1 at the maximum height (Rmax), so even if the resin temperature is not set too high, it can be sufficiently flown over the caloric surface. it can.
  • the laser marker used in this example is Cobra
  • Electrox ⁇ Laser type continuous wave with ZQswich Nd: YAG
  • oscillation wavelength 1.064 m
  • maximum rated output 20 W (average) ⁇
  • “XY” in the “scanning situation” means that after the scanning process in the ⁇ ° direction, the operation process is performed in the ⁇ ° direction.
  • Example 1 Measurement of peel strength for each base material
  • the number of breaks is the number of resin breaks other than the joint surface.
  • Fig. 6 (1) is an SEM image showing the surface condition of the joint when the number of additions is three
  • Fig. 6 (2) is the joint when the number of machining is five. It is the SEM image which showed the surface state of.
  • the beam spot diameter was set to about 130 m.
  • Example 7 (Various tensile strength test using different material 4)
  • thermoplastic resin was used as the dissimilar material, but in this example, the case where a thermoplastic elastomer was used as the dissimilar material was tested. Specifically, aluminum
  • the beam spot diameter was about 130 ⁇ m.
  • a temperature cycle test was performed on the joining member according to Example 1 in which a standard material (PBT resin) was applied to aluminum under the conditions shown in FIG.
  • a strength measurement test was conducted before and after the test to examine the effect of the strength on the temperature change.
  • the outline of the test is that a 20-cycle test is performed in the range of 20 to 100 ° C with 4 hours as one cycle (test machine: ETAC HIFLEX TH4114).
  • the results are shown in Table 21 and FIG.
  • the underline in Table 21 indicates material failure (the grease material itself is broken at the joint).
  • the metal material and the dissimilar material were joined via the thermal adhesive sheet and the adhesive, and the tensile strength was measured.
  • the following examples are examples in which the present invention is applied to a drawing processed product in the image of a liquid crystal side exterior panel of a mobile phone.
  • the “peel strength” described in the following examples was obtained by a measurement method different from the above (strength based on the measured value according to the peel strength CilS K6850). Should be recognized.
  • Anodized acid on the drawing processed product (thickness 0.5mm) that imaged the exterior panel of mobile phone LCD The treatment was performed. Then, as shown in FIG. 10, a laser marking force was applied in the vicinity of the outsert molding of the boss shape.
  • Table 24 shows the processing conditions of Example 9A ⁇ Alumite (blue) ⁇
  • Table 25 shows the processing conditions of Example 9B ⁇ Alumite (silver) ⁇ .
  • the beam spot diameter was set to about 124 m.
  • Example 9A ⁇ Alumite (Blue) ⁇ ⁇ 9 ⁇ ⁇ Alumite (Silver) ⁇
  • a shape with overhanging convex and concave portions was obtained, and resin was formed during molding.
  • FIG. 11 and FIG. 12 show electrophotographic images of irregularities formed on the metal surface part (joint part) of Example 9 and Example 9%.
  • Fig. 11 is an electrophotographic image according to Example 9 ⁇
  • Fig. 11 (1) is an electrophotographic image taken from the upper surface of the processed surface
  • FIG. 11 (3) are processed images of the processed surface. This is an electrophotography with an oblique 30 ° force (difference in scale). As can be seen from Fig. 11 (2) and Fig. 11 (3), a very complicated bridge shape can be observed from the perspective.
  • Fig. 12 is an electrophotographic image according to Example 9-4
  • Fig. 12 (1) is an electrophotographic image from the top surface of the processed surface
  • Fig. 12 (2) and Fig. 12 (3) are processed images. This is an electrophotograph with an angle of 30 ° on the surface (difference in scale). As shown in Fig. 12 (2) and Fig. 12 (3), when looking obliquely, intricate anchor shapes and holes can be seen in the standing wall.
  • this processed product was outsert-molded to produce a composite member of metal and resin. After molding, the sebum part was peeled off and the joint surface was observed. As a result, it was confirmed that the debris that had rubbed in and remained in the metal groove part was sufficiently transferred. . Then, as a result of measuring the peel strength according to the protocol of FIG. 10, Example 9 mm was 17. Okg-cm / cm 2 (166.6NZcm), and Example 9B was 20. Okg-cm / cm 2 (196. ONZcm). This is compared to joining with other adhesives or thermal adhesive sheets. Then, the bonding strength is remarkably high.
  • the embodiment implemented this time is less than half of the processing area of adhesives and thermal bonding sheets as shown in the figure below. Therefore, if the processing ranges are compared as the same area, this difference is expected to become even wider.
  • the peel strength was calculated according to the following formula.
  • a drawn product (thickness 0.5 mm) was used in the image of the exterior panel on the LCD side of a mobile phone. Then, as shown in FIG. 10, laser marking was performed in the vicinity of outsert molding of the boss shape.
  • Table 27 shows the processing conditions of Example 10. The beam spot diameter was set to about 130 m.
  • FIG. 13 shows an uneven-shaped electrophotography formed on the metal surface portion (joint portion) of Example 11.
  • FIG. 13 (1) is an electrophotography of the upper surface force of the processed surface
  • Fig. 13 (2) and Fig. 13 (3) are electrophotographic images of the processed surface at an oblique 30 ° force (difference in scale). From the perspective, as shown in Fig. 13 (2) and Fig. 13 (3), the bridge shape and anchor shape can be observed. The peel strength was measured and found to be 13. Okg-cm / cm 2 (127.4 NZcm). Furthermore, in the temperature cycle test, peeling of the joint was not recognized.
  • the force-molded boss was bonded to a predetermined position on the back of the metal panel with an adhesive, and the breaking strength was measured.
  • the contact area per boss was 62.60 mm 2 .
  • adhesive 1 was 0.4 kg-cm / cm 2 (4.07 N / cm), and adhesive 2 was 1.3 kg-cm / cm 2 (1 2.5 NZcm). Met.
  • NITTO M-5205 t 90. 0 ⁇ m
  • thermal bonding sheet 1 was 2. lkg-cm / cm 2 (21.5 NZcm), and the thermal bonding sheet 2 was 1.6 kg-cm / cm 2 (16. ONZcm).
  • FIG. 1 shows an example of a “bridge shape” conceptual diagram on a laser-treated surface (joint portion).
  • FIG. 2 shows an outline of the measurement method of “peel strength” according to JIS K6850 as referred to in the claims and in the present specification.
  • Fig. 2 (A) is an example of the measurement of "peel strength”
  • Fig. 2 (B) shows a state in which the support is applied to both the resin surface and the metal surface to match the thickness.
  • FIG. 3 is an SEM image of a joint formed on the magnesium surface in Example 1.
  • FIG. 4 is an SEM image of the joint formed on the stainless steel surface in Example 1.
  • FIG. 5 is an SEM image of a cross section of the joint formed on the stainless steel surface in Example 1.
  • FIG. 6 shows the results of a joint surface state confirmation test in Example 3.
  • Fig. 6 (1) is an SEM image showing the surface condition of the joint when the number of times of machining is three
  • Fig. 6 (2) is the joint when the number of times of machining is five. It is the SEM image which showed the surface condition of.
  • FIG. 7 shows an outline of the temperature cycle test in Example 8.
  • FIG. 8 shows the results of a temperature cycle test in Example 8.
  • FIG. 9 shows the results of a tensile strength test in Comparative Example 1.
  • “1” is laser processing
  • “2” is an adhesive
  • “3” is a thermal bonding sheet.
  • FIG. 10 describes a method of measuring “peel strength” in Example 9 and below (different from “peel strength” defined in the claims and the like).
  • FIG. 11 is an uneven-shaped electronic photograph formed on the metal surface portion (joint portion) of Example 9A.
  • FIG. 12 is an uneven-shaped electronic photograph formed on the metal surface portion (joint portion) of Example 9B.
  • FIG. 13 is an uneven-shaped electronic photograph formed on the metal surface part (joint part) of Example 10.
  • FIG. 14 shows the concept of knotting width.

Abstract

La présente invention concerne une technologie servant à lier un matériau métallique à un matériau dissimilaire au moyen d’une technologie de traitement laser susceptible d’offir une variété d’avantages, la liaison du matériau métallique avec un matériau dissimilaire étant réalisée avec une adhésion extrêmement élevée. Ledit matériau métallique comporte une partie de jonction avec un matériau dissimilaire, et est caractérisé en ce que la partie de jonction est une portion résultant d'un traitement par balayage laser dans une certaine direction de balayage suivi d'un traitement par balayage laser dans une direction de balayage différente croisant la direction de balayage précédente.
PCT/JP2006/315425 2005-12-19 2006-08-03 Matériau métallique comportant une partie de jonction avec un matériau dissimilaire et son procédé de traitement au moyen d’un laser WO2007072603A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007509773A JP4020957B2 (ja) 2005-12-19 2006-08-03 異種材料との接合部を有する金属材料及びレーザーを用いてのその加工方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005-364854 2005-12-19
JP2005364854 2005-12-19

Publications (1)

Publication Number Publication Date
WO2007072603A1 true WO2007072603A1 (fr) 2007-06-28

Family

ID=38188387

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/315425 WO2007072603A1 (fr) 2005-12-19 2006-08-03 Matériau métallique comportant une partie de jonction avec un matériau dissimilaire et son procédé de traitement au moyen d’un laser

Country Status (2)

Country Link
JP (1) JP4020957B2 (fr)
WO (1) WO2007072603A1 (fr)

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009274308A (ja) * 2008-05-14 2009-11-26 Mitsubishi Electric Corp 筐体用パネルおよびその製造方法と、この筐体用パネルを備えた電子機器
JP2011529404A (ja) * 2008-07-28 2011-12-08 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 複合部材並びに複合部材を製造する方法
WO2012073694A1 (fr) * 2010-11-29 2012-06-07 ポリプラスチックス株式会社 Corps moulé par insertion et procédé de production d'un corps moulé par insertion
JP2013502329A (ja) * 2009-08-17 2013-01-24 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 構成部分複合体、並びに構成部分複合体を製造するための方法
CN103036086A (zh) * 2011-09-28 2013-04-10 日立汽车系统株式会社 金属构件与成形树脂构件的复合成形体及金属构件的表面加工方法
US8518521B2 (en) 2009-10-16 2013-08-27 Aisin Seiki Kabushiki Kaisha Composite molded article
CN103282156A (zh) * 2010-12-28 2013-09-04 株式会社大赛璐 复合成形体的制造方法
WO2013146900A1 (fr) 2012-03-29 2013-10-03 帝人株式会社 Procédé de fabrication d'un élément de joint et élément de joint
JP2014004823A (ja) * 2012-05-29 2014-01-16 Polyplastics Co 複合成形体の製造方法
CN103862164A (zh) * 2012-12-14 2014-06-18 宝理塑料株式会社 金属部件的制造方法和复合成型体
WO2015008771A1 (fr) * 2013-07-18 2015-01-22 ダイセルポリマー株式会社 Corps moulé composite
JP2015116684A (ja) * 2013-12-17 2015-06-25 ヤマセ電気株式会社 金属表面と異種材料との接合方法、異種材料接合金属材料の製造方法及び異種材料接合金属材料
JP2015166188A (ja) * 2011-09-26 2015-09-24 日本軽金属株式会社 アルミ樹脂接合体及びその製造方法
JP5816763B1 (ja) * 2015-01-19 2015-11-18 ヤマセ電気株式会社 異種材料と金属材料との界面が気密性を有する異種材料接合金属材料、異種材料同士との界面が気密性を有する異種材料接合材料
JP2016036884A (ja) * 2014-08-08 2016-03-22 ダイセルポリマー株式会社 研磨材
JP2016107609A (ja) * 2014-12-03 2016-06-20 ダイセルポリマー株式会社 複合成形体とその製造方法
JP2016203643A (ja) * 2016-08-26 2016-12-08 ダイセルポリマー株式会社 複合成形体の製造方法
US9517532B2 (en) 2013-12-09 2016-12-13 Denso Corporation Metal member, metal member surface processing method, semiconductor device, semiconductor device manufacturing method, and composite molded body
WO2018139034A1 (fr) 2017-01-27 2018-08-02 Dic株式会社 Structure composite métal/résine et procédé de fabrication d'une telle structure composite métal/résine
US10486391B2 (en) * 2016-12-26 2019-11-26 Honda Motor Co., Ltd. Bonded structure and method for manufacturing the same
JP2020158035A (ja) * 2019-03-27 2020-10-01 日産自動車株式会社 車体フロア構造体
US11090908B2 (en) * 2017-11-16 2021-08-17 Mutsuki Electric Co., Ltd. Metal member, method for producing metal member, metal-resin joined body and method for producing metal-resin joined body
WO2022196190A1 (fr) 2021-03-17 2022-09-22 東ソー株式会社 Complexe d'élément métallique-résine de sulfure de polyarylène et son procédé de production
WO2023017762A1 (fr) 2021-08-11 2023-02-16 東ソー株式会社 Complexe élément métallique-élément de sulfure de polyarylène et son procédé de production
WO2023068186A1 (fr) 2021-10-19 2023-04-27 東ソー株式会社 Composition de sulfure de polyarylène et son procédé de production

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010167475A (ja) * 2009-01-26 2010-08-05 Yamase Denki Kk 異種材料と金属材料との界面が気密性を有する異種材料接合金属材料及びその製造方法
JP5701414B1 (ja) 2013-03-26 2015-04-15 ダイセルポリマー株式会社 複合成形体の製造方法
JP5932700B2 (ja) * 2013-03-29 2016-06-08 ダイセルポリマー株式会社 複合成形体の製造方法
JP2016010811A (ja) 2014-06-30 2016-01-21 ミネベア株式会社 金属材料の表面処理方法及びこの方法を用いたフォースセンサ
JP6455021B2 (ja) 2014-08-22 2019-01-23 オムロン株式会社 接合構造体の製造方法
US10449698B2 (en) 2014-08-22 2019-10-22 Omron Corporation Bonded structure and method for producing bonded structure
JP2016078090A (ja) * 2014-10-20 2016-05-16 ダイセルポリマー株式会社 表層部に多孔構造を有する金属成形体の製造方法
JP2016115704A (ja) 2014-12-11 2016-06-23 トヨタ自動車株式会社 半導体装置
JP6496554B2 (ja) * 2015-01-08 2019-04-03 三井化学株式会社 蓋体、電気部品、及び、蓋体の製造方法
WO2019082983A1 (fr) 2017-10-27 2019-05-02 三井化学株式会社 Structure composite de métal/résine et procédé de fabrication de structure composite de métal/résine
JP7035455B2 (ja) * 2017-10-31 2022-03-15 株式会社豊田自動織機 車載電気機器用のカバー及びその製造方法
JP6729535B2 (ja) * 2017-11-07 2020-07-22 Dic株式会社 金属樹脂接合成形品の製造方法
JP7217598B2 (ja) * 2018-08-06 2023-02-03 キヤノンマシナリー株式会社 接合部材作成方法
JP7249408B2 (ja) 2019-05-28 2023-03-30 三井化学株式会社 冷却装置及び冷却装置の製造方法
CN114009158A (zh) 2019-10-04 2022-02-01 三井化学株式会社 发热体收容箱及结构体
WO2021153778A1 (fr) 2020-01-31 2021-08-05 三井化学株式会社 Élément pour conduction électrique, procédé de fabrication d'élément pour conduction électrique, dispositif de conversion d'énergie, moteur, module de batterie secondaire et bloc-batterie secondaire
JPWO2021256328A1 (fr) 2020-06-15 2021-12-23
JP7324371B2 (ja) 2020-07-14 2023-08-09 三井化学株式会社 熱交換装置及び熱交換装置の製造方法
KR20230093489A (ko) 2020-12-02 2023-06-27 미쯔이가가꾸가부시끼가이샤 온도 제어 유닛 및 온도 제어 유닛의 제조 방법
JPWO2023013557A1 (fr) 2021-08-05 2023-02-09
JP2023046975A (ja) 2021-09-24 2023-04-05 株式会社ダイヘン 異種材料の接続方法および異種材料の接続体
JP2023059627A (ja) * 2021-10-15 2023-04-27 日本軽金属株式会社 金属部材及び金属樹脂接合体並びにそれらの製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0542379A (ja) * 1991-08-09 1993-02-23 Komatsu Ltd Ｙａｇレーザマスクマーカ
JP2000503596A (ja) * 1995-12-18 2000-03-28 マクニール―ピーピーシー・インコーポレイテッド 布およびフィルムの形成装置を作成するためのレーザー穴あけ方法
JP2001287070A (ja) * 2000-03-31 2001-10-16 Matsushita Electric Ind Co Ltd マスク上へのビームのスキャニングによるレーザビームホモジナイゼーション
JP2004520942A (ja) * 2001-05-18 2004-07-15 ザ ウェルディング インスティテュート 表面改質法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5916462A (en) * 1993-09-13 1999-06-29 James; William A. Laser drilling processes for forming an apertured film

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0542379A (ja) * 1991-08-09 1993-02-23 Komatsu Ltd Ｙａｇレーザマスクマーカ
JP2000503596A (ja) * 1995-12-18 2000-03-28 マクニール―ピーピーシー・インコーポレイテッド 布およびフィルムの形成装置を作成するためのレーザー穴あけ方法
JP2001287070A (ja) * 2000-03-31 2001-10-16 Matsushita Electric Ind Co Ltd マスク上へのビームのスキャニングによるレーザビームホモジナイゼーション
JP2004520942A (ja) * 2001-05-18 2004-07-15 ザ ウェルディング インスティテュート 表面改質法

Cited By (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009274308A (ja) * 2008-05-14 2009-11-26 Mitsubishi Electric Corp 筐体用パネルおよびその製造方法と、この筐体用パネルを備えた電子機器
JP2011529404A (ja) * 2008-07-28 2011-12-08 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 複合部材並びに複合部材を製造する方法
JP2013502329A (ja) * 2009-08-17 2013-01-24 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 構成部分複合体、並びに構成部分複合体を製造するための方法
US8518521B2 (en) 2009-10-16 2013-08-27 Aisin Seiki Kabushiki Kaisha Composite molded article
JPWO2012073694A1 (ja) * 2010-11-29 2014-05-19 ポリプラスチックス株式会社 インサート成形体及びインサート成形体の製造方法
WO2012073694A1 (fr) * 2010-11-29 2012-06-07 ポリプラスチックス株式会社 Corps moulé par insertion et procédé de production d'un corps moulé par insertion
CN103282156A (zh) * 2010-12-28 2013-09-04 株式会社大赛璐 复合成形体的制造方法
JP2015166188A (ja) * 2011-09-26 2015-09-24 日本軽金属株式会社 アルミ樹脂接合体及びその製造方法
CN103036086A (zh) * 2011-09-28 2013-04-10 日立汽车系统株式会社 金属构件与成形树脂构件的复合成形体及金属构件的表面加工方法
JP2013071312A (ja) * 2011-09-28 2013-04-22 Hitachi Automotive Systems Ltd 金属部材と成形樹脂部材との複合成形体および金属部材の表面加工方法
WO2013146900A1 (fr) 2012-03-29 2013-10-03 帝人株式会社 Procédé de fabrication d'un élément de joint et élément de joint
US9527230B2 (en) 2012-03-29 2016-12-27 Teijin Limited Method for manufacturing joint member and joint member
JP5634641B2 (ja) * 2012-03-29 2014-12-03 帝人株式会社 接合部材の製造方法及び接合部材
JPWO2013146900A1 (ja) * 2012-03-29 2015-12-14 帝人株式会社 接合部材の製造方法及び接合部材
JP2014004823A (ja) * 2012-05-29 2014-01-16 Polyplastics Co 複合成形体の製造方法
TWI513531B (zh) * 2012-12-14 2015-12-21 Polyplastics Co A method of manufacturing a metal element, and a composite molded body
CN103862164A (zh) * 2012-12-14 2014-06-18 宝理塑料株式会社 金属部件的制造方法和复合成型体
WO2015008771A1 (fr) * 2013-07-18 2015-01-22 ダイセルポリマー株式会社 Corps moulé composite
JP5860190B2 (ja) * 2013-07-18 2016-02-16 ダイセルポリマー株式会社 複合成形体
US10434741B2 (en) 2013-07-18 2019-10-08 Daicel Polymer Ltd. Composite molded article
JP2016175126A (ja) * 2013-07-18 2016-10-06 ダイセルポリマー株式会社 金属成形体
JPWO2015008771A1 (ja) * 2013-07-18 2017-03-02 ダイセルポリマー株式会社 複合成形体
US9517532B2 (en) 2013-12-09 2016-12-13 Denso Corporation Metal member, metal member surface processing method, semiconductor device, semiconductor device manufacturing method, and composite molded body
JP2015116684A (ja) * 2013-12-17 2015-06-25 ヤマセ電気株式会社 金属表面と異種材料との接合方法、異種材料接合金属材料の製造方法及び異種材料接合金属材料
JP2016036884A (ja) * 2014-08-08 2016-03-22 ダイセルポリマー株式会社 研磨材
JP2016107609A (ja) * 2014-12-03 2016-06-20 ダイセルポリマー株式会社 複合成形体とその製造方法
JP5816763B1 (ja) * 2015-01-19 2015-11-18 ヤマセ電気株式会社 異種材料と金属材料との界面が気密性を有する異種材料接合金属材料、異種材料同士との界面が気密性を有する異種材料接合材料
JP2016203643A (ja) * 2016-08-26 2016-12-08 ダイセルポリマー株式会社 複合成形体の製造方法
US10486391B2 (en) * 2016-12-26 2019-11-26 Honda Motor Co., Ltd. Bonded structure and method for manufacturing the same
WO2018139034A1 (fr) 2017-01-27 2018-08-02 Dic株式会社 Structure composite métal/résine et procédé de fabrication d'une telle structure composite métal/résine
US11911974B2 (en) 2017-01-27 2024-02-27 Dic Corporation Metal/resin composite structure and method for manufacturing same
US11090908B2 (en) * 2017-11-16 2021-08-17 Mutsuki Electric Co., Ltd. Metal member, method for producing metal member, metal-resin joined body and method for producing metal-resin joined body
JP2020158035A (ja) * 2019-03-27 2020-10-01 日産自動車株式会社 車体フロア構造体
JP7291516B2 (ja) 2019-03-27 2023-06-15 日産自動車株式会社 車体フロア構造体
WO2022196190A1 (fr) 2021-03-17 2022-09-22 東ソー株式会社 Complexe d'élément métallique-résine de sulfure de polyarylène et son procédé de production
WO2023017762A1 (fr) 2021-08-11 2023-02-16 東ソー株式会社 Complexe élément métallique-élément de sulfure de polyarylène et son procédé de production
WO2023068186A1 (fr) 2021-10-19 2023-04-27 東ソー株式会社 Composition de sulfure de polyarylène et son procédé de production

Also Published As

Publication number Publication date
JP4020957B2 (ja) 2007-12-12
JPWO2007072603A1 (ja) 2009-05-28

Similar Documents

Publication Publication Date Title
WO2007072603A1 (fr) Matériau métallique comportant une partie de jonction avec un matériau dissimilaire et son procédé de traitement au moyen d’un laser
US8315043B2 (en) Methods and systems for forming housings from multi-layer materials
JP3016331B2 (ja) 電子機器筐体の製造方法
TWI701988B (zh) 框體
US7989079B2 (en) Insert-molded cover and method for manufacturing same
JP2009262530A (ja) 電子装置用筐体及びその製造方法
JP2009266195A (ja) 電子装置の筐体及びその製造方法
JP2003170531A (ja) 金属と樹脂の複合体及びその製造方法
JP6326782B2 (ja) 金属樹脂接合成形品
JP2007320215A (ja) プレコートアルミニウム合金板
JP2015116684A (ja) 金属表面と異種材料との接合方法、異種材料接合金属材料の製造方法及び異種材料接合金属材料
JP2003103563A (ja) 金属と樹脂の複合体とその製造方法
WO2017047441A1 (fr) Boîtier
JPH08116140A (ja) フレキシブルプリント配線板
CN111093932B (zh) 金属树脂复合成型品及其制造方法
JP3294724B2 (ja) インモールド成形方法及び筐体
US9607739B2 (en) Method for bonding flat cable and bonding object, ultrasonic bonding device, and cable
JP3762313B2 (ja) 金属筐体
JP6278822B2 (ja) 金属樹脂複合成形体及びその製造方法
JP3432603B2 (ja) 筐体の製造方法
JP2000289145A (ja) 複合体及びその製造方法
JP2017059793A (ja) 筐体
KR101369476B1 (ko) 열경화성 접착 필름을 이용한 초음파 접합방법
JP2004356319A (ja) 超音波接合用銅材
JP2005183424A (ja) 薄型基板固定治具

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 2007509773

Country of ref document: JP

121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 06782285

Country of ref document: EP

Kind code of ref document: A1