WO2007072603A1

WO2007072603A1 - Metal material having junction portion with dissimilar material and method of processing the same with use of laser

Info

Publication number: WO2007072603A1
Application number: PCT/JP2006/315425
Authority: WO
Inventors: Seio Kobayashi; Atsushi Hishinuma; Masayuki Satoh
Original assignee: Yamase Electric Co., Ltd.
Priority date: 2005-12-19
Filing date: 2006-08-03
Publication date: 2007-06-28
Also published as: JPWO2007072603A1; JP4020957B2

Abstract

[PROBLEMS] To provide a technology for bonding of a metal material with a dissimilar material by the use of laser processing technology capable of exerting a variety of advantages, in which the bonding of metal material with dissimilar material is carried out with extremely high adhesion. [MEANS FOR SOLVING PROBLEMS] There is provided a metal material having a junction portion with dissimilar material, characterized in that the junction portion is one resulting from laser scanning processing in a certain scanning direction followed by laser scanning processing in a different scanning direction crossing the certain scanning direction.

Description

Specification

Metal materials having joints with dissimilar materials and methods of adding them using lasers

Technical field

TECHNICAL FIELD [0001] The present invention relates to a metal surface treatment technique for increasing the degree of bonding with different materials! in addition

The present invention relates to a technique for firmly joining a different material to a metal surface using the metal surface treatment technique.

Background art

[0002] Conventionally, mobile phone casings are lightweight (density 0.8 to 1.4g / cm ³ ), and can be mass-produced by injection molding and the like, and the low cost associated therewith. In most cases, molded products such as synthetic resins were molded. In recent years, however, the functions of mobile phones have been increasing and diversifying, such as camera functions and music functions, and as a result, the volume of electronic components mounted on the casing and the number of push buttons are 'liquid crystal The ratio of the display part is also increasing. Therefore, as the mass of electronic parts and the like increases with the improvement of the functions, there is a demand for weight reduction (thinning) of a housing for mounting the electronic parts and the like. However, the above-mentioned greaves are generally inferior in mechanical properties such as tensile strength, elastic modulus, impact strength and the like as compared with metal materials. For this reason, as a result of the need to reinforce by installing a rib etc. inside the housing, the mountable volume is inevitably reduced. In addition, when the resin casing is made thin, residual stress is generated, so that deformation is likely to occur and the thermal reliability is low.

[0003] Therefore, recently, a case using a metal material (for example, an aluminum alloy) instead of a resin has been used! /. Specific strength (tensile strength) of metal material (eg aluminum alloy)

Mechanical strength such as Z specific gravity) and specific rigidity (elastic modulus Z specific gravity) greatly exceeds those of plastics, so it is possible to achieve a thin wall and light weight while ensuring mechanical strength. Here, when a metal material is used as a housing, a member such as a holding member for fixing an electronic board housed in the housing to the housing, such as a screw boss, needs to be installed in the housing. In this case, the viewpoints of light weight and workability, etc. adopt a resin as the member, and injection molding the resin on a metal material as a method for forming the member (insert molding It is preferable to adopt a technique of outer sert molding. At this time, especially for products such as mobile phones on which electronic parts such as electronic boards are mounted, the product damage due to the separation of metal and resin cannot be measured. The degree of bonding must be particularly high.

Here, as a conventional technique for increasing the degree of joining of the metal material and the resin! /, For example, a technique of joining the resin on the metal material via an adhesive, a thermal adhesive sheet, a double-sided tape, etc. Exists. However, when this technology is adopted, in addition to the relatively low bonding strength, the bonding strength depends on the performance of the selected adhesive, thermal adhesive sheet, etc., and it is necessary to consider the bonding process and dedicated equipment. However, there are problems such as requiring a bonding agent in addition to the processed material, not being able to deal with very complicated shapes, and being difficult to deal with thin ribs. As another method, there is a technology in which an organic plating process is applied to a metal material and then bonded to a resin. For example, Japanese Patent Application Laid-Open No. 2001-1445 discloses a method in which a metal material is subjected to an organic plating process and bonded to a resin. When this technology is adopted, it is expected to increase the bonding strength because it is a covalent bond, but it must be treated before the surface treatment such as anodic acid soot. Pre-treatment is necessary to remove metal oxides' activation, high adhesive temperature cannot be obtained unless molding temperature is high at the time of molding, molding cycle becomes longer, mold release problem depending on the shape , Partial processing is difficult, visual confirmation of processing status is difficult, storage management of processed products must be strictly controlled, the number of processing steps is relatively large, etc. . As another method, there is a technique in which an etching force is applied to a metal material and then bonded to a resin. For example, it is disclosed in Japanese Patent Application Laid-Open No. 2004-050488, which is a method for performing a corrosion treatment (etching treatment) on a metal surface with chemicals and injection molding a resin on the surface. Even if this technology is adopted, the bonding strength itself can be expected to be high, but it uses a highly harmful chemical (hydrazine) that needs to be treated before the surface treatment such as anodic acid soot. There are problems such as the need for processing, partial processing is difficult, visual confirmation of processing status is difficult, the number of processing steps is relatively large, and processing is limited to aluminum materials.

Disclosure of the invention Problems to be solved by the invention

[0005] Further, there is a technique in which a metal material is subjected to laser processing and bonded to a resin. For example, Patent Document 1 discloses a technique in which a metal surface is irradiated with laser light to form irregularities, and then, the resin is injection-molded and coated on the irregularity forming portion. If this technology is adopted, only the necessary parts can be processed, the processing part can be easily changed on the equipment program, it is relatively safe, there are few processing steps, and it supports automation. Easy, can be assembled in later processes other than outsert molding, can confirm processing relatively easily by observing the processing surface, does not require other materials only by processing materials, etc. It is excellent in that there are merits.

[0006] However, the technique of Patent Document 1 cannot achieve extremely high adhesion between the metal material and the resin. Therefore, the adhesion problem has been a barrier to the application of the technology to electronic products such as mobile phones.

[0007] Therefore, according to the present invention, a metal material and a dissimilar material are extremely high in a technique for joining a metal material and a dissimilar material (for example, a resin) by utilizing the laser processing technology having the above-mentioned many merits. ! To provide technology for bonding with adhesive properties.

Patent Document 1: JP-A-10-294024

Means for solving the problem

[0008] According to the present invention (1), in a metal material having a joint portion with a different material, after the joint portion is subjected to laser scanning processing in a certain scanning direction, the scanning direction crosses the scanning direction. It is a metal material characterized by being formed by laser scanning.

[0009] The present invention (2) is the metal material according to the present invention (1), wherein both of the laser scanning calories in the one scanning direction and the other scanning direction are performed in a plurality of times.

[0010] According to the present invention (3), the laser scanning calories in the one scanning direction and the other scanning direction are both implemented with a hatching width of 0.02 to 0.6 mm. (2

) Metal material.

[0011] The invention (4) is the metal material according to any one of the inventions (1) to (3), wherein an angle at which the certain scanning direction and the other scanning direction cross each other is 45 ° or more. is there. In the present invention (5), an angle at which the certain scanning direction and the other scanning direction cross each other is approximately 90.

The metal material of the invention (4).

[0013] In the present invention (6), the joint portion has an uneven shape, and at least a part of the convex portion has a bridge shape or an overhang shape. (5)

V, one of the metal materials.

[0014] The present invention (7) is the metal material according to any one of the inventions (1) to (6), wherein the peel strength when a specific resin is bonded to the bonded portion is 4 MPa or more. is there.

[0015] The present invention (8) is the metal according to any one of the inventions (1) to (7), wherein the dissimilar material is a thermoplastic resin, a thermosetting resin, an elastomer, or a plastic alloy. Material.

[0016] The present invention (9) is the metal material according to any one of the inventions (1) to (8), wherein the metal material is aluminum, magnesium or stainless steel.

[0017] According to the present invention (10), the metal material is a component for electric or electronic equipment.

(9)! Is one metal material.

[0018] In the present invention (11), the electrical / electronic device component is a mobile phone casing.

(10) Metal material.

[0019] A dissimilar material-bonded metal material in which a dissimilar material is bonded onto the bonded portion of any one of the metal materials according to the present invention (1) to (11).

In the present invention (13), the dissimilar material-bonded metal material is a component for electric or electronic equipment.

The dissimilar material-bonded metal material of the invention (12).

[0021] The present invention (14) is an electric or electronic device in which the electric or electronic device is mounted on the electric or electronic device component of the present invention (13).

[0022] The present invention (15) is the electrical or electronic device of the present invention (14), wherein the electrical or electronic device is a mobile phone.

[0023] The present invention (16) includes a step of laser scanning a metal surface in a certain scanning direction and a step of laser scanning the metal surface in another scanning direction crossing the scanning direction. This is a laser processing method of a metal surface for forming a joint with a different material.

[0024] According to the present invention (17), laser scanning in the one scanning direction and the other scanning direction is added. Each of the methods is the method of the invention (16), which is carried out in a superimposed manner a plurality of times.

[0025] In the present invention (18), the laser scanning process in one scanning direction and the other scanning direction is performed with a hatching width of 0.02 to 0.6 mm. ) Method.

The present invention (19) is the method according to any one of the inventions (16) to (18), wherein an angle at which the certain scanning direction crosses the other scanning direction is 45 ° or more.

In the present invention (20), an angle at which the certain scanning direction and the other scanning direction cross each other is approximately 9

The method according to the invention (19) is 0 °.

[0028] The present invention (21) includes the inventions (16) to (16), wherein the joint portion has a concavo-convex shape, and at least a part of the convex portion has a bridge shape or an overhang shape. (20)! , One way.

[0029] The present invention (22) is a method according to any one of the inventions (16) to (21), wherein the peel strength when a specific resin is bonded to the bonded portion is 4 MPa or more. is there.

[0030] In the present invention (23), the dissimilar material is a thermoplastic resin, a thermosetting resin, an elastomer, or a plastic alloy, and any one of the inventions (16) to (22) Is the method.

[0031] The present invention (24) is any one of the above inventions (16) to (23), wherein the metal material is aluminum, magnesium or stainless steel.

[0032] The present invention (25) includes the steps of any one of the above-described inventions (16) to (24), and is a method for producing a metal material having a joint with a different material formed therein. It is a method.

[0033] The present invention (26) includes the steps in any one of the methods of the inventions (16) to (24), and a step of bonding a dissimilar material to the metal surface subjected to the laser scanning process. This is a method for joining a metal surface and a dissimilar material.

[0034] The present invention (27) is the method according to the invention (26), wherein the joining step comprises injection molding of a different material on the metal surface.

[0035] The present invention (28) is a method for producing a dissimilar material-bonded metal material, comprising the steps of the method of the invention (26) or (27).

[0036] The present invention (29) includes each step in the method of the invention (28), and the metal part is electrically or electrically connected. Is a method of manufacturing an electrical or electronic device, characterized by including a step of mounting an electronic component.

The invention's effect

[0037] According to the present invention (1) and (12), on the metal surface, a joining portion composed of a large number of protrusions (uneven portions) derived from the cross-shaped laser scanning force and having an excellent anchor effect is provided. Therefore, when compared to conventional laser-treated metal surfaces, it exhibits a very high bonding strength with different materials.

[0038] According to the present invention (2), in consideration of the above effect, the laser scanning force is superimposed several times, so that the shape of the protrusion at the joint is further complicated, It has the effect of exerting a superior anchor effect.

[0039] According to the present invention (3), in consideration of the above effect, the laser scanning force is carried out with a hatching width of 0.02 to 0.6 mm. As a result of being formed as a protruding shape, an excellent anchor effect is exhibited.

[0040] According to the present invention (4), in view of the above effects, the cross angle in the laser scanning carriage is set to 45 ° or more, so that the strength is maintained against the force from any direction. However, there is an effect that excellent bonding strength can be expected in a specific direction.

[0041] According to the present invention (5), in consideration of the above-mentioned effect, the cross angle in the laser scanning carriage is approximately 90 °, so that it is uniformly excellent for any directional force. If the bonding strength is shown, the effect is effective.

[0042] According to the present invention (6), in addition to the above-described effect, when the convex portion has a bridge shape, the foreign material is solidified in a state where the different type material enters the hole, and the convex portion has an overhang shape. Since the foreign material solidifies while the foreign material wraps around the head, it will have an excellent effect if it exhibits a better anchor effect.

[0043] According to the present invention (7), the peel strength is 4 MPa or more in view of the above effects, and thus, until now, a strong adhesive must be used to join different materials. It has the effect that it can be used for various products that require high bonding strength.

[0044] According to the present invention (8), in addition to the above-described effects, the anchor effect and! / Since it is a principle of holding the material, it has an effect that any of general-purpose materials such as thermoplastic resin, thermosetting resin, elastomer or plastic alloy can be bonded without any problem.

[0045] According to the present invention (9), in addition to the above effects, in the case of laser scanning force, a general-purpose material such as aluminum, magnesium or stainless steel can be joined by changing the laser processing conditions. Since the portion can be formed, there is an effect that the range of material selection is widened compared with chemical etching or the like.

[0046] According to the present invention (10), (13) and (14), in addition to the above effects, the bonding strength between the metal material and the dissimilar material is extremely high. Even if the electrical / electronic equipment is dropped, vibrated, or shocked, the joint is not easily damaged. As a result, it is possible to effectively prevent the failure of the electrical / electronic equipment caused by the damage of the joint. It has the effect of being able to.

[0047] According to the present invention (11) and (15), in addition to the above-mentioned effects, the frequency of dropping / vibration is the highest among electric / electronic devices due to its availability or portability, and it is applied to mobile phones. Therefore, there is an effect that it is possible to effectively prevent a mobile phone failure due to the breakage of the joint portion.

[0048] According to the methods of the present invention (16) to (29), the effects relating to the product obtained by the method are as described above. Unlike organic plating and etching, which can be changed freely by the program and can be used for general purposes, it is easier to process as much as required in a given location, and is safer than chemical etching with chemicals. Due to the nature of the marking cage, the surface of the workpiece before processing does not require degreasing and is easy to manage. Compared with other processing methods, it has fewer steps and is easy to handle automation. Because it is a bridge shape (0.01-0.1 mm), it is easy to check whether or not it has been treated without special equipment, and it can be processed with both surface-treated and untreated products such as anodized. High degree of freedom in the Not only in sart molding, it is possible to join the resin and metal by heating and combining the metal members at the temperature at which the resin melts. Dissolve the joint surface and apply pressure to the bridge-shaped part to join it, It is possible to develop techniques such as the heat generation of oil by frictional heating with ultrasonic waves. And other effects are not required.

BEST MODE FOR CARRYING OUT THE INVENTION

[0049] First, the metal material according to the present invention is not particularly limited, but examples thereof include aluminum, magnesium, and stainless steel. When used as a casing for electrical and electronic equipment such as mobile phones and laptop computers, from the viewpoint of light weight, light metals such as aluminum and magnesium or a density of 5 gZcm ³ or less are used alone or as a main component. It is preferable to use an alloy of In addition, the metal material may or may not be subjected to surface treatment such as anodizing treatment or coating, and it is confirmed that the deviation forms a bridge shape by the laser scanning treatment described later.

[0050] Next, the metal material according to the present invention has a joint with a different material on its surface. Here, the joint portion has a concavo-convex shape, and preferably at least a part of the convex portion has a bridge shape or an overhang shape. Here, the “bridge shape” refers to a shape in which the tops of the generated convex portions are melted and connected to form an arch shape with a hole at the bottom. Note that not all of the protrusions have a bridge shape, and some of the protrusions are overhanging to form a mushroom-like cedar tree, or a simple protrusion that is not overhanging. Also good. Here, Fig. 1 shows an example of the bridge-like conceptual diagram. First, Fig. 1 (a) shows a shape in which a hole is formed between both convex bodies in such a way that one convex body and the other convex body collapse. Next, FIG. 1 (b) shows a shape in which a hole is formed between both convex bodies in such a way that one convex body falls into the other convex body. Next, Fig. 1 (c) shows a shape in which a hanging sag is hung between both convex bodies as a result of melting of one convex body and the upper part of the other convex body. Next, FIG. 1 (d) shows a shape (tunnel shape) in which a hole is formed in the center in a state where one convex body and the other convex body are aligned.

[0051] For example, when a bridge shape exists, the joint portion forms a fine three-dimensional network shape. When dissimilar materials are joined to the joint portion having such a surface structure (for example, the resin is joined by injection molding), the concave portion of the fine three-dimensional network shape and the void below the bridge portion As a result of the dissimilar material entering the surface, the surface area where the joint surface comes into contact with the dissimilar material increases, and at the same time, an extremely high anchor effect is exhibited. As a result, the metal and the dissimilar material can be firmly and stably bonded without using a bonding agent such as an adhesive or without treating the metal surface with a chemical.

Next, the physical properties of the joint portion having the bridge shape will be described. The peel strength when a specific resin (standard sample) is bonded to the bonded portion is preferably 4 MPa or more, more preferably 6 MPa or more, and more preferably lOMPa or more. Is preferred. If this level of peel strength is achieved, the metal and the dissimilar material can be firmly and stably bonded without using a bonding agent such as an adhesive or without treating the metal surface with a chemical. However, this strength is the peel strength when “specific grease” is bonded, and the actual peel strength varies depending on the type of “dissimilar material”. For example, when an elastomer (elastic body) is applied as a “dissimilar material”, the actual peel strength itself is low (however, since the elastomer is strongly bonded to the joint, When the peel strength is measured, it is at a level where the elastomer remains on the joint surface). The “peel strength” as used in the claims and in the present specification shall be performed in accordance with “Test method for tensile bond strength of adhesive-rigid substrate” in JIS K6850. The test is roughly performed by fixing both ends of the test piece to the chuck, applying a tensile load at a constant speed, and recording the load when the joint surface peels or the load when the material breaks (tensile strength). carry out. Here, as shown in Fig. 2 (B), support is applied to both the resin surface and the metal surface so that only a horizontal tensile load is applied to the test piece (the vertical load is not applied). And adjust the thickness. In addition, the “specific fat” used as the standard sample is PBT fat (for example, “Toray Toraycon 1101G30 Bk”). For reference, an example of measurement of the peel strength in this specification is shown in FIG. Here, in the figure, “1” indicates a metal material, “2” indicates a specific resin (PBT), “3” indicates a support, and “A” indicates a joint area. However, since the peel strength is a value obtained by dividing the tensile strength by the area of the joint, it is not basically restricted by the conditions shown in FIG. In this example, Toyo Seiki Strograph V10-C was used as the tensile tester, the distance between chucks (the distance between the upper and lower chuck tips) was set to 30 mm, and the pulling speed was set to 5 mmZmin.

[0053] Next, a method for forming the joint will be described. The joint is irradiated with laser light and gold It is formed by grooving the metal surface and processing it under the conditions of melting and re-solidifying. More specifically, the laser scanning scan is performed in a certain scanning direction, and then the laser scanning process is performed in another scanning direction crossing the scanning direction. In the following, with regard to the preferred conditions for cross laser scanning, the preferred conditions relating to “cross angle” and “number of repeated machining”, which are particularly important parameters, will be explained first, and then the preferred conditions relating to other parameters will be explained sequentially. To do.

First, the cross angle (processing direction) is preferably such that the angle between one scanning direction and another scanning direction is 10 ° or more, and more preferably 45 ° or more. That is, it is important that the scanning direction of the next processing is not the same as the previous processing. Further, when the joint strength is high with respect to the tensile load from any direction, it is optimal that the cross angle is approximately 90 °.

Next, the number of repeated caches (the number of overlaps and the number of cross-hatchings) is appropriately determined by those skilled in the art based on the output of the type of metal material to be processed, such as “cross angle (machining direction)”. Here, generally, when the number of times of repeated processing is too small, it is difficult to form a joint portion having a high anchor effect (for example, a convex portion has a bridge shape or an overhang shape). On the other hand, if the number of times of repeated machining is too large, the machining time may increase and the joint portion having a high anchor effect may be damaged. For example, when the cross angle is approximately 90 °, 8 to 10 times is preferable for SUS, and 4 to 5 times is preferable for Mg. Here, the processing conditions of a certain process and the subsequent process may be changed. For example, a mode in which deep and roughening processing is performed at the first time with a relatively large output, and a shape is adjusted at the second time. In addition, regarding the laser processability due to the difference in color, it is generally considered that the processability of the black system is lower than that of the black system. Yes. However, it is confirmed that there is no significant difference in the machined surface even when the same condition is applied because the process is repeated repeatedly while changing the scanning direction. In addition, for example, it is confirmed that the same effect can be obtained even if the processing method is rotated by 45 ° after processing at 0 ° in the scanning direction and added four times.

[0056] Next, preferred conditions for other parameters relating to laser scanning will be described in detail. First, other parameters include machine output, tooling, stitching width, and laser beam scanning. The balance between pot diameter and hatching width can be mentioned. The suitable conditions for these parameters vary depending on the type of metal material to be processed, the required peel strength, the output of the laser device used, and the like. The general conditions for each parameter are explained below.

[0057] First, the "processing machine output" is preferably set to 80% or more, more preferably 92 to 95% in a model having an average output of about 20W. For equipment with high output, increasing the set output can reduce the number of machining operations and shorten the machining time. For example, 40W direction force workability is higher than 20W (the laser scanning set speed / frequency can be increased). In this case, it is possible to reduce the number of cross-hatching somewhat (for example, in the case of SUS, it is 8-10 times at 20W, but about 6-8 times at 40W). In the case of a metal material that has not been anodized, the output must be set higher than that of an anodized material.

[0058] Next, in general, the "hatching width" is preferably 0.02 to 0.6 mm.

If the setting value of the tooling width is small, the amount of program will increase and the equipment will be burdened with S

As the processing time increases, the processing cost increases. On the other hand, when the set value is large, the pitch width is too wide to form an uneven shape with a high anchor effect. Figure 14 shows the concept of notching width. The notching width is preferably determined by the type of metal material. For example, the caulking material such as Mg has a large hatching width because the unevenness is crushed unless the hatching width is relatively wide. For poor materials, the hatch width can be set in a relatively wide range. Furthermore, if you increase the output of the processing machine, it is powerful! It is preferable to set the hatching width in a brushy manner because it increases the properties and has a large effect on the periphery of the force-carrying part and tends to be flat.

[0059] Next, regarding the "balance between laser beam spot diameter and hatching width", it is preferable to set the hatching width to 50 to 300% of the beam spot diameter, and to 60 to 150%. Is more preferred. For example, when the laser beam spot diameter of the 20W model is set to ΦΟ.1 mm, the setting hatch width is 0.05 to 0.3 mm, more preferably 0.06 to 0.15 mm. Next, the use of the metal material having such a joint will be described. Since this metal material can be firmly joined to a different material at the joint, it is preferably used as a part for electrical or electronic equipment where impact such as dropping or vibration is not preferred. For example, it is useful as a casing for electrical and electronic equipment having a resin boss, a holding member, and the like inside. Here, as the case for electrical / electronic devices, in addition to mobile phones, cases for portable video electronic devices such as cameras, video-integrated cameras, digital cameras, notebook computers, pocket computers, calculators, etc. , Electronic notebook, PDC, PHS, mobile phone and other portable information or communication terminal casing, MD, cassette headphone stereo, radio and other portable acoustic electronic equipment casing, liquid crystal TV 'monitor, telephone, facsimile, A housing for household appliances such as a hand scanner can be cited.

Here, the “foreign material” is not particularly limited as long as it is lower than the melting point of the metal material and can be joined at a temperature. For example, thermoplastic resin, thermosetting resin, elastomer Or a plastic alloy can be mentioned. Furthermore, it may be a material that is hardened by heat other than heat, such as a material that is hardened by energy other than heat, such as a photo-curable resin, or a material that is chemically solidified by mixing a plurality of components. More specifically, examples of thermoplastic resin (general purpose resin) include polyethylene (ΡΕ), polypropylene (ΡΡ), polystyrene (PS), acrylonitrile / styrene resin (AS), acrylonitrile / butadiene Z styrene resin. (ABS), methacrylic resin (PMMA), butyl chloride (PVC), thermoplastic resin (general engineering resin), for example, polyamide (PA), polyacetal (POM), ultra high molecular weight polyethylene (UHPE) ), Polybutylene terephthalate (PBT), GF reinforced polyethylene terephthalate (GF—PET), polymethylpentene (TPX), polycarbonate (PC), modified polyphenylene ether (PPE), thermoplastic resin (super engineering resin) Examples of such materials include polyphenylene sulfide (PPS), polyether ether ketone (PEEK), liquid crystal polymer (LCP), and polytetrafluoroethylene. Examples of thermoplastic resins include chloroethylene (PTFE), polyetherimide (PEI), polyarylate (PAR), polysulfone (PSF), polyethersulfone (PES), polyamideimide (PAI), and thermosetting resin. Examples of rubber resins, urea resins, melamine resins, unsaturated polyesters, alkyd resins, epoxy resins, diallyl phthalates, and elastomers include thermoplastic elastomers and rubbers such as styrene butadiene series, polyolefins, etc. Examples include urethanes, urethanes, polyesters, polyamides, 1,2-polybutadiene, polyvinyl chloride, and ionomers. Furthermore, a thermoplastic resin added with glass fiber and a polymer alloy can also be used.

[0062] In addition, when joining a dissimilar material (for example, a resin) to this metal material, it is preferable to perform the joining by a well-known injection molding. The injection molding may be either outsert molding or insert molding. Here, the viewpoint power of the necessity to transfer the laser bridge processing surface with force is more suitable because the mold temperature is set higher and the injection pressure is higher because the transferability is better. is there. However, the surface roughness of the laser bridge processing surface is 0.05-5.1 at the maximum height (Rmax), so even if the resin temperature is not set too high, it can be sufficiently flown over the caloric surface. it can.

Example

Hereinafter, in order to deepen the understanding of the present invention, more specific description will be given with reference to examples. Note that the technical scope of the present invention is not limited in any way by this example. Here, the laser marker used in this example is Cobra, Electrox {Laser type: continuous wave with ZQswich Nd: YAG, oscillation wavelength: 1.064 m, maximum rated output: 20 W (average)} . Further, “XY” in the “scanning situation” means that after the scanning process in the Χ ° direction, the operation process is performed in the Υ ° direction.

[0064] Example 1 (Measurement of peel strength for each base material)

After forming joints for aluminum (A1050-H24), magnesium (AZ31) and stainless steel (SUS316) under the laser processing conditions shown in Table 1, the molding shown in Table 2 was performed according to the protocol shown in FIG. Under the conditions, a standard material (wax) was applied on the joint, and then the tensile shear strength was measured. The results are shown in Table 3. The values in Table 3 are peel strengths, which are values obtained by dividing the tensile shear strength (Ν) by the joint area (0.5 cm ² ). 3 and 4 show the SEM image of the joint formed on the magnesium surface and the SEM image of the joint formed on the stainless steel surface. Figure 5 shows an SEM image of the cross section of the joint formed on the stainless steel surface. The beam spot diameter was set to about 130 m.

[table 1]

[Table 2]

[Table 3]

* The number of breaks is the number of resin breaks other than the joint surface.

Example 2 (Peel strength test by difference in surface treatment)

We investigated how the strength of the metal surface subjected to laser scanning changes depending on the surface treatment. Specifically, for aluminum (A1050-H24, t = 0.6mm), (1) anodized silver (silver), (2) anodized black (black), ( 3) After forming the joints under the laser processing conditions shown in Table 4 for each of those without an anodizing treatment (without), according to the protocol shown in FIG. 2 and under the molding conditions shown in Table 5 A standard material (PBT resin) was applied on the joint, and then the tensile shear strength was measured. The results are shown in Table 6. Here, the numerical values in Table 6 are peel strengths, which are values obtained by dividing the tensile shear strength (N) by the joint area (0.5 cm ² ). The beam spot diameter was set to about 130 m.

[Table 4] Output Notching Frequency Speed Running Speed Width (mm) (kHz) (mm / sj

95% 0.09 9 80 0-90 5 times

[Table 5]

[Table 6]

Example 3 (Joint surface state confirmation test by difference in the number of machining operations)

The SEM confirmed how the joint (joint surface) changed when the number of machining operations was changed. Specifically, a joint was formed on magnesium (AZ31, t = 0.4 mm) under the laser processing conditions shown in Table 7. The results are shown in Table 8. Fig. 6 (1) is an SEM image showing the surface condition of the joint when the number of additions is three, and Fig. 6 (2) is the joint when the number of machining is five. It is the SEM image which showed the surface state of. The beam spot diameter was set to about 130 m.

[Table 7]

[Table 8]

Example 4 (Tensile strength test when using different materials 1 and V)

The bow I tension strength when different materials that are actually applied to products were joined to the joints of each metal material was investigated. Specifically, for aluminum (A1050-H24, t = 0.6mm), magnesium (AZ31, t = 0.4mm) and stainless steel (SUS316, t = 0.4mm) After forming the joint under the laser processing conditions shown in Fig. 9, ABS ABS was formed on the joint under the molding conditions shown in Table 10 (molding machine: Yamashiro Seiki, vertical molding machine, 50t) according to the protocol shown in Fig. 2. Fat (den force Maret force K-095 Bk, normal molding temperature: 230 ° C) was applied, and then the tensile shear strength was measured. The results are shown in Table 11. For SU S, standard sample (PBT) data is also shown. Note that the beam spot diameter is approximately 130 μm 〖7 ο ο

[Table 9]

[Table 10] Material Heat-resistant ABS

Cylinder temperature 260 ° C

Filling pressure lOOk f / cm

I? js / „., i, .. lOOk f / cm ²

Punishment i 曰 L 70 ° C [Table 11]

(Mpa)

SUS

18.27

17.39

17.95

5 Example 5 (Tensile strength test when using V2 with different material 2)

The tensile strength when different materials different from Example 4 were joined to the joint of the metal material was examined. Specifically, after forming a joint on stainless steel (SUS316, t = 0.4mm) under the laser processing conditions shown in Table 12, the molding conditions shown in Table 13 are followed according to the protocol shown in FIG. (Molding machine: Yamashiro Seiki, vertical molding machine, 50t) PC resin (polycarbonate; Mitsubishi Iupilon GS2030MKR) was applied to the joint, and then the tensile shear strength was measured. The results are shown in Table 14. Standard sample (PBT) data is also shown. The beam spot diameter was set to about 130 m.

[Table 12]

[Table 13]

[Table 14] ABS (Mpa) PBT

Number 7 5

Maximum strength 丄 tJ * 18.27

Minimum strength 13.37 17.39

Average strength 14.53 17.95

Number of ruptures 5 Example 6 (Tensile strength test when using V3 with dissimilar material 3)

The tensile strength when different materials different from those in Examples 4 and 5 were joined to the joint of the metal material was examined. Specifically, after forming a joint on stainless steel (SUS304CSP, t = 0.25mm) under the laser processing conditions shown in Table 15, the molding conditions shown in Table 16 ( Molding machine: Yamashiro Seiki, vertical molding machine, 50t) Apply PPS resin {Tosoh SUSTEEL GS40 3202 (GF40%)} and standard resin (PB T resin) on the joint, and then pull shear The strength was measured. The results are shown in Table 17. The beam spot diameter was set to about 130 m.

[Table 15]

[Table 16]

[Table 17]

Example 7 (Various tensile strength test using different material 4)

In Examples 4 to 6, thermoplastic resin was used as the dissimilar material, but in this example, the case where a thermoplastic elastomer was used as the dissimilar material was tested. Specifically, aluminum

The protocol shown in Fig. 2 is applied to each of -um (A1050-H24, t = 0.6mm), magnesium (AZ31, t = 0.4mm) and stainless steel (SUS316, t = 0.4mm). Therefore (however, the processing area was set to 4.5 mm X 9 mm = 40.5 mm ² ), and after forming the joint part under the laser heating conditions shown in Table 18, on the joint part under the molding conditions shown in Table 19 A polyester thermoplastic elastomer (Mitsubishi Primalloy AN1600N 68 degrees) was applied, and then the tensile shear strength was measured. The results are shown in Table 20. The beam spot diameter was about 130 μm.

[Table 18]

[Table 19] Cylinder temperature 190. C

Filling pressure 40kgf / cm ²

Holding pressure 40kgf / cm ²

Mold temperature 60 ° C

Example 8 (Temperature cycle test of metal dissimilar material joint member)

A temperature cycle test was performed on the joining member according to Example 1 in which a standard material (PBT resin) was applied to aluminum under the conditions shown in FIG. A strength measurement test was conducted before and after the test to examine the effect of the strength on the temperature change. The outline of the test is that a 20-cycle test is performed in the range of 20 to 100 ° C with 4 hours as one cycle (test machine: ETAC HIFLEX TH4114). The results are shown in Table 21 and FIG. In addition, the underline in Table 21 indicates material failure (the grease material itself is broken at the joint).

Comparative Example 1 (Comparison of strength with thermal adhesive sheet)

Instead of joining the metal material and the dissimilar material via the joint formed by laser processing, the metal material and the dissimilar material were joined via the thermal adhesive sheet and the adhesive, and the tensile strength was measured. Specifically, for the thermal adhesive sheet, first, a thermal adhesive sheet (NITTO M-5205, t = 90. Mm / zm) was temporarily attached to the joint of a metal test piece (SUS316, t = 0.4mm). The product was attached to a mold, subjected to outsert molding and bonded to a resin, and then the tensile shear strength was measured. Table 22 shows the molding conditions. Next, as for the adhesive, after degreasing the metal piece (SUS316, t = 0.4mm) with toluene, apply the adhesive (two-component epoxy resin adhesive: Kosik Quick 5) and mold it in advance. The absorptive portion was affixed and fixed, and allowed to stand for 2 days, and then the tensile shear strength was measured. The results are shown in Table 23 and Fig. 9. For comparison, data for the stainless steel of Example 1 is shown. Material PBT Toray Toraycon 1101G30 Bk Cylinder temperature 260 ° C

Filling pressure 60kgf / cm

Open IJ, 曰 70 ° C

[Table 23]

(Mpa;

[0073] Next, the following examples are examples in which the present invention is applied to a drawing processed product in the image of a liquid crystal side exterior panel of a mobile phone. The “peel strength” described in the following examples was obtained by a measurement method different from the above (strength based on the measured value according to the peel strength CilS K6850). Should be recognized.

[0074] Example 9 (anodized aluminum)

Material: Aluminum A1050- H24 Thickness = 0.5mm Anodized

Anodized acid on the drawing processed product (thickness 0.5mm) that imaged the exterior panel of mobile phone LCD The treatment was performed. Then, as shown in FIG. 10, a laser marking force was applied in the vicinity of the outsert molding of the boss shape. Here, Table 24 shows the processing conditions of Example 9A {Alumite (blue)}, and Table 25 shows the processing conditions of Example 9B {Alumite (silver)}. The beam spot diameter was set to about 124 m.

[Table 24]

[Table 25]

[0075] Example 9A {Alumite (Blue)} · 9Β {Alumite (Silver)} In each case, although there are slight differences in the shape of the processed surface, a shape with overhanging convex and concave portions was obtained, and resin was formed during molding. As a result of wrapping around the processed surface, a surface that can be firmly joined by the anchor effect was obtained. Here, FIG. 11 and FIG. 12 show electrophotographic images of irregularities formed on the metal surface part (joint part) of Example 9 and Example 9%. First, Fig. 11 is an electrophotographic image according to Example 9Α, Fig. 11 (1) is an electrophotographic image taken from the upper surface of the processed surface, and Fig. 11 (2) and Fig. 11 (3) are processed images of the processed surface. This is an electrophotography with an oblique 30 ° force (difference in scale). As can be seen from Fig. 11 (2) and Fig. 11 (3), a very complicated bridge shape can be observed from the perspective. Next, Fig. 12 is an electrophotographic image according to Example 9-4, Fig. 12 (1) is an electrophotographic image from the top surface of the processed surface, and Fig. 12 (2) and Fig. 12 (3) are processed images. This is an electrophotograph with an angle of 30 ° on the surface (difference in scale). As shown in Fig. 12 (2) and Fig. 12 (3), when looking obliquely, intricate anchor shapes and holes can be seen in the standing wall.

Subsequently, according to the protocol of FIG. 10, this processed product was outsert-molded to produce a composite member of metal and resin. After molding, the sebum part was peeled off and the joint surface was observed. As a result, it was confirmed that the debris that had rubbed in and remained in the metal groove part was sufficiently transferred. . Then, as a result of measuring the peel strength according to the protocol of FIG. 10, Example 9 mm was 17. Okg-cm / cm ² (166.6NZcm), and Example 9B was 20. Okg-cm / cm 2 (196. ONZcm). This is compared to joining with other adhesives or thermal adhesive sheets. Then, the bonding strength is remarkably high. In addition, the embodiment implemented this time is less than half of the processing area of adhesives and thermal bonding sheets as shown in the figure below. Therefore, if the processing ranges are compared as the same area, this difference is expected to become even wider. The peel strength was calculated according to the following formula.

[Table 26]

[0077] Further, as a result of the temperature cycle test and the drop impact test, no separation of the joint was observed, and in the subsequent fracture strength measurement, no significant difference was seen compared to the untested product. . The test method is as follows.

Temperature cycle test

-Perform 20-cycle tests under the setting conditions of 20 ° C 2 hours to 100 ° C 2 hours.

Drop impact test

Stainless steel dummy block 56. After fixing 2g to 4 bosses with Ml. 7L = 3 self-tapping screws, drop from the height of 1500mm once in each of 6 directions to check whether the joint and screw tightening are damaged. Check it out.

Example 10 (anodized untreated aluminum)

Material: Aluminum A1050-H24 Thickness = 0.5mm Anodized untreated product

A drawn product (thickness 0.5 mm) was used in the image of the exterior panel on the LCD side of a mobile phone. Then, as shown in FIG. 10, laser marking was performed in the vicinity of outsert molding of the boss shape. Here, Table 27 shows the processing conditions of Example 10. The beam spot diameter was set to about 130 m.

[Table 27]

By this treatment, a shape in which the convex and concave portions were overhanged was obtained. Here, FIG. 13 shows an uneven-shaped electrophotography formed on the metal surface portion (joint portion) of Example 11. FIG. First, figure 13 (1) is an electrophotography of the upper surface force of the processed surface, and Fig. 13 (2) and Fig. 13 (3) are electrophotographic images of the processed surface at an oblique 30 ° force (difference in scale). From the perspective, as shown in Fig. 13 (2) and Fig. 13 (3), the bridge shape and anchor shape can be observed. The peel strength was measured and found to be 13. Okg-cm / cm ² (127.4 NZcm). Furthermore, in the temperature cycle test, peeling of the joint was not recognized.

[0080] Comparative Example 2 (various adhesives)

1. Modified silicone adhesive Koshi FD107

2.Epoxy adhesive Konishi Quick 5

The force-molded boss was bonded to a predetermined position on the back of the metal panel with an adhesive, and the breaking strength was measured. Here, the contact area per boss was 62.60 mm ² . In addition, in the case of the adhesive, in addition to this contact area, since the adhesive protruded all around, the contact area became larger than other joints. As a result of measuring the peel strength, adhesive 1 was 0.4 kg-cm / cm ² (4.07 N / cm), and adhesive 2 was 1.3 kg-cm / cm ² (1 2.5 NZcm). Met.

[0081] Comparative Example 3 (thermal adhesive sheet)

1. Thermobond film Sumitomo 3M TB F615EG t = 62.5 ^ m

2. NITTO M-5205 t = 90. 0 ^ m

A thermal bonding sheet was temporarily attached in advance to the outsert molding position of the metal panel, the metal panel was molded under the same conditions as in Example 1, and the fracture strength was measured. As a result, the thermal bonding sheet 1 was 2. lkg-cm / cm ² (21.5 NZcm), and the thermal bonding sheet 2 was 1.6 kg-cm / cm ² (16. ONZcm).

Brief Description of Drawings

[0082] [FIG. 1] FIG. 1 shows an example of a “bridge shape” conceptual diagram on a laser-treated surface (joint portion).

[FIG. 2] FIG. 2 shows an outline of the measurement method of “peel strength” according to JIS K6850 as referred to in the claims and in the present specification. Fig. 2 (A) is an example of the measurement of "peel strength", and Fig. 2 (B) shows a state in which the support is applied to both the resin surface and the metal surface to match the thickness. Is. FIG. 3 is an SEM image of a joint formed on the magnesium surface in Example 1.

FIG. 4 is an SEM image of the joint formed on the stainless steel surface in Example 1.

FIG. 5 is an SEM image of a cross section of the joint formed on the stainless steel surface in Example 1.

[FIG. 6] FIG. 6 shows the results of a joint surface state confirmation test in Example 3. Here, Fig. 6 (1) is an SEM image showing the surface condition of the joint when the number of times of machining is three, and Fig. 6 (2) is the joint when the number of times of machining is five. It is the SEM image which showed the surface condition of.

FIG. 7 shows an outline of the temperature cycle test in Example 8.

FIG. 8 shows the results of a temperature cycle test in Example 8.

FIG. 9 shows the results of a tensile strength test in Comparative Example 1. In the figure, “1” is laser processing, “2” is an adhesive, and “3” is a thermal bonding sheet.

[FIG. 10] FIG. 10 describes a method of measuring “peel strength” in Example 9 and below (different from “peel strength” defined in the claims and the like).

[FIG. 11] FIG. 11 is an uneven-shaped electronic photograph formed on the metal surface portion (joint portion) of Example 9A.

[FIG. 12] FIG. 12 is an uneven-shaped electronic photograph formed on the metal surface portion (joint portion) of Example 9B.

FIG. 13 is an uneven-shaped electronic photograph formed on the metal surface part (joint part) of Example 10.

[FIG. 14] FIG. 14 shows the concept of knotting width.

Claims

The scope of the claims

[I] Laser scanning in another scanning direction that crosses the scanning direction after the joint is laser-scanned in a certain scanning direction over a metal material having a joint with a different material A metal material characterized by being formed by caulking.

[2] There is a deviation between the laser scanning carriage in one scanning direction and the other scanning direction.

The metal material according to claim 1, wherein the metal material is implemented in a plurality of times.

[3] There is a deviation between the laser scanning carriage in one scanning direction and the other scanning direction.

The metal material according to claim 1, wherein the metal material is formed with a pitch of 0.02-0.6 mm.

[4] The metal material according to any one of claims 1 to 3, wherein a crossing angle between the certain scanning direction and the other scanning direction is 45 ° or more.

5. The metal material according to claim 4, wherein an angle at which the certain scanning direction and the other scanning direction cross each other is approximately 90 °.

[6] The metal material according to any one of claims 1 to 5, wherein the joint portion has an uneven shape, and at least a part of the protrusion portion has a bridge shape or an overhang shape. .

[7] The metal material according to any one of [1] to [6], wherein the peel strength when a specific resin is bonded to the bonded portion is 4 MPa or more.

[8] The metal material according to any one of [1] to [7], wherein the dissimilar material is a thermoplastic resin, a thermosetting resin, an elastomer, or a plastic alloy.

[9] The metal material is aluminum, magnesium, or stainless steel.

The metal material according to any one of 8 above.

[10] The metal material according to any one of [1] to [9], wherein the metal material is a component for an electric or electronic device.

[II] The metal material according to claim 10, wherein the electrical / electronic device component is a casing for a mobile phone.

[12] A dissimilar material-bonded metal material, wherein a dissimilar material is bonded onto the bonded portion of the metal material according to any one of claims 1 to 11.

13. The dissimilar material-bonded metal material according to claim 12, wherein the dissimilar material-bonded metal material is an electrical or electronic device part.

[14] An electrical or electronic device, wherein the electrical or electronic device is mounted on the electrical or electronic device component according to claim 13.

15. The electric or electronic device according to claim 14, wherein the electric or electronic device is a mobile phone.

[16] The method includes: laser scanning the metal surface in a certain scanning direction; and laser scanning the metal surface in another scanning direction crossing the scanning direction. A laser processing method for metal surfaces to form joints with dissimilar materials.

17. The method according to claim 16, wherein the deviation of the laser scanning operation in the one scanning direction and the other scanning direction is also performed in a superimposed manner a plurality of times.

[18] The method according to claim 16 or 17, wherein both the laser scanning process in the one scanning direction and the other scanning direction are performed with a hatching width of 0.02-0. 6 mm.

[19] The method according to any one of claims 16 to 18, wherein an angle at which the certain scanning direction and the other scanning direction cross each other is 45 ° or more.

20. The method according to claim 19, wherein an angle at which the certain scanning direction crosses the other scanning direction is approximately 90 °.

[21] The method according to any one of claims 16 to 20, wherein the joint has an uneven shape, and at least a part of the protrusion has a bridge shape or an overhang shape.

[22] The method according to any one of [16] to [21] above, wherein a peel strength when a specific resin is bonded to the bonded portion is 4 MPa or more.

[23] The method according to any one of claims 16 to 22, wherein the dissimilar material is a thermoplastic resin, a thermosetting resin, an elastomer, or a plastic alloy.

24. The metal material is aluminum, magnesium or stainless steel.

~ 23 !, the method according to any one of the above.

[25] The method according to any one of claims 16 to 24, including each step. The manufacturing method of the metal material in which the junction part with a dissimilar material was formed.

[26] A metal comprising: each step in the method according to any one of claims 16 to 24; and a step of bonding a dissimilar material to the metal surface subjected to the laser scanning process. Bonding method of surface and dissimilar materials.

27. The method according to claim 26, wherein the joining step includes injection molding of a different material on the metal surface.

[28] A method for producing a dissimilar material bonded metal material, comprising the steps of the method according to claim 26 or 27.

[29] A method for manufacturing an electric or electronic device, comprising each step in the method according to [28], and a step of mounting an electric or electronic component on the metal component.