WO2007013293A1 - Système de traitement laser hybride - Google Patents

Système de traitement laser hybride Download PDF

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Publication number
WO2007013293A1
WO2007013293A1 PCT/JP2006/313751 JP2006313751W WO2007013293A1 WO 2007013293 A1 WO2007013293 A1 WO 2007013293A1 JP 2006313751 W JP2006313751 W JP 2006313751W WO 2007013293 A1 WO2007013293 A1 WO 2007013293A1
Authority
WO
WIPO (PCT)
Prior art keywords
liquid
liquid column
workpiece
processing head
partition member
Prior art date
Application number
PCT/JP2006/313751
Other languages
English (en)
Japanese (ja)
Inventor
Yoshihiro Kawahara
Motoi Sasaki
Ryoji Koseki
Original Assignee
Shibuya Kogyo Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibuya Kogyo Co., Ltd. filed Critical Shibuya Kogyo Co., Ltd.
Publication of WO2007013293A1 publication Critical patent/WO2007013293A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/004—Severing by means other than cutting; Apparatus therefor by means of a fluid jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid

Definitions

  • the present invention relates to a hybrid laser cafe apparatus, and more particularly to a hybrid laser processing apparatus that ejects liquid from an ejection hole into a liquid column and ejects the liquid to the outside and guides laser light to the liquid column.
  • a processing head having an injection hole, a liquid supply unit that supplies a high-pressure liquid to the processing head, and a laser oscillator that oscillates laser light, the liquid supplied from the liquid supply unit is provided.
  • a hybrid laser processing apparatus for processing a workpiece by making a liquid column from an injection hole to be ejected to the outside and guiding a laser beam to the liquid column.
  • Patent Document 1 Japanese Patent Publication No. 10-500903
  • the present invention provides a laser beam processing apparatus capable of forming a stable liquid column long even when an injection hole and a workpiece are close to each other. Means for solving the problem
  • the hybrid laser carriage device oscillates laser light, a processing head having an injection hole, a liquid supply means for supplying high-pressure liquid to the processing head, and the like.
  • a laser oscillator, and the liquid supplied from the liquid supply means is ejected to the outside as a liquid column from the ejection hole, and the laser beam is guided to the liquid column to process the object to be coated.
  • the hybrid laser carriage system In the hybrid laser carriage system,
  • a partition member with a passage hole through which the liquid column passes is provided between the processing head and the workpiece, and the partition member prevents the liquid bounced off the workpiece from reaching the processing head.
  • a gas passage is formed between the processing head and the partition member.
  • the partition member by providing the partition member, the liquid that has bounced off the workpiece does not reach the periphery of the spray hole, and the inside of the gas passage formed between the heating head and the partition member Since the airflow flowing through the pipe is not disturbed, a stable liquid column can be formed long even if the injection hole and the workpiece are brought close to each other.
  • FIG. 1 shows a hybrid laser processing apparatus 1 that works according to the present invention, and guides a laser beam L to a liquid column W formed by jetting a liquid, thereby processing the workpiece.
  • This is a device that cuts object 2 into the required shape.
  • the hybrid laser carriage apparatus 1 includes a processing table 3 that supports the above-described object 2, a laser oscillator 4 that oscillates laser light L, and a liquid supply means that supplies liquid such as high-pressure water. 5 and a processing head 6 for injecting the liquid as a liquid column W toward the object 2 and guiding the laser beam L to the liquid column W. These are controlled by control means (not shown). To be controlled.
  • the machining table 3 is conventionally known and will not be described in detail. However, the workpiece 2 is moved in the horizontal direction with respect to the machining head 6, and the machining head 6 is Not shown, moved vertically by lifting and lowering means!
  • a thin semiconductor wafer is cut as the above-described object 2 and, in addition, a composite material such as an epoxy resin board and a resin can be cut. it can.
  • grooving can also be performed on the surface of the workpiece 2.
  • the laser oscillator 4 is a YAG laser oscillator, which can perform CW oscillation or pulse oscillation according to processing, and can adjust processing conditions such as its output and pulse oscillation period as appropriate. .
  • a shotter means 11 for blocking the laser light L, a reflection mirror 12 for reflecting the laser light L toward the processing head 6, and the irradiated laser light L are collected.
  • a condensing lens 13 is provided.
  • the shatter means 11 is controlled by the control means, and a reflection mirror 11a that reciprocates on and off the optical path of the laser light L by driving means (not shown), and the energy of the laser light L reflected by the reflection mirror 11a. It is equipped with 1 lb of damper that absorbs.
  • the reflection mirror 11a When the reflection mirror 11a is positioned on the optical path of the laser light L, the laser light L is reflected by the reflection mirror 11a, and the energy of the laser light is absorbed by the damper ib.
  • the reflecting mirror 11a is moved out of the optical path of the laser beam L, the laser beam L is reflected by the reflecting mirror 12 and then irradiated to the processing head 6 through the condenser lens 13.
  • Other laser oscillators such as semiconductor lasers and CO laser oscillators are used.
  • the laser light L oscillated like a CO laser oscillator is absorbed by water.
  • the liquid ejected from the heating head 6 may be a liquid that is difficult for laser light to absorb.
  • the liquid supply means 5 includes a water storage tank 21 for storing water, and a pump 22 for feeding the water stored in the water storage tank 21 toward the carriage head 6, which includes a conduit 23 Are connected to each other.
  • the water storage tank 21 is connected to a water supply source 24.
  • a conduit 23 connecting the water supply source 24 and the water storage tank 21 has an on-off valve 25 for controlling the supply of water from the water supply source 24, and a water supply source 24.
  • a spillage filter 26 for removing foreign substances contained in the water supplied from the water.
  • a check valve 27 for preventing the backflow of water to the pump 22, and the pulsation of the water to be fed are prevented, and the processing head
  • An accumulator 28 for supplying high-pressure water, a filter 29 for removing foreign substances in the water, and a first electromagnetic valve 30 whose opening / closing is controlled by the control means are provided in 6.
  • conduit 23 from the water supply source 24 to the water storage tank 21 and the conduit 23 from the pump 22 to the processing head 6 are connected by two parallel conduits 23, and one conduit 23 is connected to the second electromagnetic
  • the valve 31 is provided, and the other conduit 23 is provided with a pressure regulating valve 32.
  • the second solenoid valve 31 is used to return the liquid from the pump 22 to the water storage tank 21 when stopping the hybrid laser carriage device 1, and the pressure regulating valve 32 is used from the pump 22 to the carriage head. Up to 6 is provided to keep the pressure inside the conduit 23 constant.
  • FIG. 2 shows an enlarged view of the machining head 6.
  • the machining head 6 includes a housing 41 that is moved by the moving means, an injection nozzle 42 that is provided below the housing 41, and an injection nozzle 42. And a transparent glass plate 43 provided between the condenser lens 13 and a partition member 44 provided below the injection nozzle 42.
  • a side surface of the housing 41 is provided with a connection port 41a that communicates with a liquid passage 45 formed between the glass plate 43 and the injection nozzle 42 and is connected to the conduit 23.
  • the liquid supplied from the means 5 flows into the liquid passage 45 from the connection port 41a and is then ejected as the liquid column W from the ejection nozzle 42.
  • the injection nozzle 42 is fixed to the center of a stay 46 fitted to the lower end portion of the housing 41, and the stay 46 is fixed to the lower surface of the housing 41 with a ring-shaped fixing member 47.
  • An injection hole 48 is formed in the center of the injection nozzle 42.
  • the injection hole 48 is formed on the condensing lens 13 side and has a first inclined surface 48a having a diameter reduced toward the workpiece 2, and the first It is composed of a second inclined surface 48c whose diameter is expanded from the minimum diameter portion 48b of the inclined surface 48a toward the workpiece 2 side.
  • Under the injection nozzle 42 through holes 46a and 47a that penetrate the stay 46 and the fixing member 47 are formed.
  • the diameters of the through holes 46a and 47a are smaller than the outer diameter of the injection nozzle 42.
  • the diameter is set larger than the diameter of the lower end portion of the second inclined surface 48c.
  • the glass plate 43 is located between the spray nozzle 42 and the condenser lens 13 and is fixed to the housing 41 with a nut 49, so that the liquid in the liquid passage 45 is more liquid than the glass plate 43. The leakage of light into the upper space is prevented, and the laser light L collected by the condenser lens 13 is transmitted.
  • the partition member 44 is a circular plate-like member having a passage hole 44a formed in the center.
  • the partition member 44 is formed on the lower surface of the fixing member 47 with bolts 51 via four cylindrical spacers 50. It is fixed.
  • the partition member 44 forms a gas passage 52 between the partition member 44 and the fixing member 47, and the gas passage 52 communicates with the atmosphere through the space between the adjacent spacers 50. It is like that.
  • the passage hole 44a has a chamfered shape that expands downward, and the diameter of the passage hole 44a on the side of the injection nozzle 42 is directed toward the object 2 along the liquid column W. It is set so that it does not block the airflow that circulates! In the present embodiment, when the diameter of the liquid column to be ejected is 50 / z m, the diameter of the passage hole 44a is set to 0.5 mm to 5 mm.
  • the control means controls the liquid supply means 5 and starts feeding the water in the water storage tank 21 toward the carriage head 6 by the pump 22.
  • a sufficient amount of water is supplied to the water storage tank 21 from a water supply source 24 in advance.
  • the water fed by the pump 22 passes through the check valve 27 and then flows into the accumulator 28.
  • the filter 29 and It passes through the first solenoid valve 30 and flows into the liquid passage 45 via the connection port 41a of the above-described cache head 6.
  • control means controls the laser oscillator 4 and the laser oscillator 4 starts oscillation of the laser light L.
  • the reflection mirror 11a of the shirter means 11 is positioned on the optical path of the oscillated laser beam L, and the laser beam L is guided to the damper l ib by the reflection mirror 11a, and the energy of the laser beam L is Absorbed.
  • the control means When the liquid column W ejected from the ejection hole 48 becomes stable, the control means immediately controls the shutter means 11 to move the reflecting mirror 11a out of the optical path of the laser light L, thereby causing the laser light L Is reflected by the reflecting mirror 12 and then condensed by the condenser lens 13.
  • the condensed laser beam L passes through the liquid in the glass plate 43 and the liquid passage 45, is further reflected by the first inclined surface 48a of the injection hole 48, and is guided into the liquid column W, and then in the liquid column W.
  • the target object 2 is irradiated while repeating reflection.
  • a space is formed around the liquid column W ejected from the ejection hole 48 between the stay 46 and the inner wall surface of the through holes 46a and 47a formed in the fixing member 47.
  • This space functions as a so-called air pocket P.
  • the liquid column W injected from the injection hole 48 is not diffused for a while and remains stable for a while due to the airflow flowing toward the target object 2 along the liquid column W, while the laser beam L Reflects well in the liquid column W.
  • the liquid column W ejected from the ejection hole 48 in this way is a force that reaches the workpiece 2.
  • the liquid column W is processed. If the object 2 does not penetrate, the liquid column W will collide with the object 2 and the scattered liquid will bounce upward.
  • the liquid that bounces up to the bottom reaches the lower surface of the fixing member.
  • the bounced liquid is blocked by the partition member 44, and therefore reaches the lower surface of the fixing member 47.
  • the distance between the processing head 6 and the workpiece 2 is made longer than the height at which the rebounding liquid reaches, and the liquid column W is thickened by that amount.
  • the distance that W reaches stably has to be increased, and the cutting width becomes wider, which has been a factor in reducing the yield of semiconductor wafers.
  • the partition member 44 of the present embodiment is a bottomed cylindrical member, and is fixed so as to cover the lower surface of the processing head 6.
  • the partition member 44 has a lower surface center in the same manner as in the first embodiment.
  • the passage hole 44a is formed.
  • a plurality of communication ports 44b are formed in the side surface of the partition member 44 so that the gas passage 52 formed in the partition member 44 communicates with the atmosphere.
  • the workpiece 2 can be machined while the machining head 6 and the workpiece 2 are brought close to each other.
  • FIG. 1 is a layout view of a hybrid laser carriage device in the present embodiment.
  • FIG. 2 An enlarged cross-sectional view of the machining head.
  • FIG. 3 is an enlarged cross-sectional view of a machining head in a second embodiment.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Laser Beam Processing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

L’invention concerne un système de traitement laser hybride (1) comprenant un oscillateur laser (4) permettant de faire osciller la lumière laser (L) vers une tête de traitement (6), et un moyen d’alimentation de liquide (5) conçu pour injecter un liquide haute pression à la tête de traitement. Dans le système de traitement laser hybride, une colonne de liquide (W) est éjectée depuis un trou d’éjection (48) disposé à l’extrémité distale de la tête de traitement et une pièce d’usinage (2) est découpée par guidage de lumière laser vers la colonne de liquide. La colonne de liquide va heurter la pièce d’usinage et rebondir vers la tête de traitement, mais comme le liquide est bloqué par un élément de cloisonnement (44), l’écoulement d’air en direction de la colonne de liquide (W) dans un passage de gaz entre la tête de traitement et l’élément de cloisonnement n’est pas compromis et la colonne de liquide peut atteindre la pièce d’usinage sans être diffusé dans la mesure où l’air s’écoule le long de la colonne de liquide. On peut obtenir ainsi une longue colonne de liquide stabilisée même si le trou d’éjection et la pièce d’usinage sont proches l’un de l’autre.
PCT/JP2006/313751 2005-07-26 2006-07-11 Système de traitement laser hybride WO2007013293A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005-215394 2005-07-26
JP2005215394A JP2007029980A (ja) 2005-07-26 2005-07-26 ハイブリッドレーザ加工装置

Publications (1)

Publication Number Publication Date
WO2007013293A1 true WO2007013293A1 (fr) 2007-02-01

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WO (1) WO2007013293A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2189236A1 (fr) * 2008-11-21 2010-05-26 Synova S.A. Procédé et appareil pour améliorer la fiabilité d'un procédé d'usinage
EP2208568A1 (fr) * 2009-01-20 2010-07-21 Synova S.A. Appareil et procédé pour le traitement de matériaux avec un laser
CN101844274A (zh) * 2009-03-24 2010-09-29 速技能机械有限公司 激光加工装置、激光加工装置的制造方法、激光加工方法
CN102423875A (zh) * 2011-08-24 2012-04-25 上海交通大学 基于激光辅助加热的超高压水射流板材渐进加工喷头及其应用
CN102962774A (zh) * 2011-09-01 2013-03-13 海邦科技股份有限公司 硬脆材料的加工装置及方法
CN108581196A (zh) * 2018-04-27 2018-09-28 中国科学院宁波材料技术与工程研究所 水导激光加工装置及其应用、激光加工系统及方法
US10160059B2 (en) 2016-03-03 2018-12-25 General Electric Company Decoupled liquid-jet guided laser nozzle cap
US10335900B2 (en) 2016-03-03 2019-07-02 General Electric Company Protective shield for liquid guided laser cutting tools
CN110142502A (zh) * 2019-05-15 2019-08-20 哈尔滨工业大学 水导引激光发生装置、水导引激光加工系统及其加工方法

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JP4297066B2 (ja) * 2005-03-10 2009-07-15 セイコーエプソン株式会社 液滴吐出装置及び液滴吐出ヘッド
JP5326183B2 (ja) * 2005-10-14 2013-10-30 澁谷工業株式会社 レーザアニール方法
JP5171088B2 (ja) * 2007-03-29 2013-03-27 株式会社東芝 レーザ表面改質装置及びその方法
JP5147445B2 (ja) * 2007-09-28 2013-02-20 株式会社スギノマシン 噴流液柱内に導かれたレーザー光によるレーザー加工装置
JP5257745B2 (ja) * 2008-03-19 2013-08-07 澁谷工業株式会社 レーザ加工方法とその装置
JP2009241138A (ja) * 2008-03-31 2009-10-22 Sugino Mach Ltd レーザー加工装置
JP5013430B2 (ja) * 2008-06-18 2012-08-29 株式会社スギノマシン レーザー加工装置
JP5287448B2 (ja) * 2009-04-10 2013-09-11 澁谷工業株式会社 レーザ加工方法とレーザ加工装置
JP2012192420A (ja) * 2011-03-15 2012-10-11 Saishin Laser Gijutsu Kenkyu Center:Kk レーザ加工方法およびレーザ加工装置
JP5220914B2 (ja) * 2011-05-25 2013-06-26 株式会社スギノマシン レーザー加工装置
JP5877432B2 (ja) * 2012-02-29 2016-03-08 株式会社スギノマシン レーザー加工装置
US20160199941A1 (en) * 2015-01-08 2016-07-14 General Electric Company Method and system for confined laser drilling

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Publication number Priority date Publication date Assignee Title
JPH04201200A (ja) * 1990-11-30 1992-07-22 Daikin Ind Ltd ウォータージェット・ノズル
JPH04372399A (ja) * 1991-06-14 1992-12-25 Daikin Ind Ltd ウオータジェット切断装置
JPH0578472U (ja) * 1992-03-31 1993-10-26 ヤマザキマザック株式会社 ウォータージェット加工装置
JP2001321977A (ja) * 2000-05-16 2001-11-20 Shibuya Kogyo Co Ltd ハイブリッド加工装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04201200A (ja) * 1990-11-30 1992-07-22 Daikin Ind Ltd ウォータージェット・ノズル
JPH04372399A (ja) * 1991-06-14 1992-12-25 Daikin Ind Ltd ウオータジェット切断装置
JPH0578472U (ja) * 1992-03-31 1993-10-26 ヤマザキマザック株式会社 ウォータージェット加工装置
JP2001321977A (ja) * 2000-05-16 2001-11-20 Shibuya Kogyo Co Ltd ハイブリッド加工装置

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8946588B2 (en) 2008-11-21 2015-02-03 Synova Sa Method and apparatus for improving reliability of a machining process
WO2010057328A1 (fr) * 2008-11-21 2010-05-27 Synova Sa Procédé et appareil destinés à améliorer la fiabilité d'un procédé d'usinage
EP2189236A1 (fr) * 2008-11-21 2010-05-26 Synova S.A. Procédé et appareil pour améliorer la fiabilité d'un procédé d'usinage
CN102292188A (zh) * 2008-11-21 2011-12-21 辛诺瓦有限公司 用于提高机加工过程可靠性的方法和装置
EP2208568A1 (fr) * 2009-01-20 2010-07-21 Synova S.A. Appareil et procédé pour le traitement de matériaux avec un laser
CN101844274A (zh) * 2009-03-24 2010-09-29 速技能机械有限公司 激光加工装置、激光加工装置的制造方法、激光加工方法
CN101844274B (zh) * 2009-03-24 2013-04-24 速技能机械有限公司 激光加工装置、激光加工装置的制造方法、激光加工方法
CN102423875B (zh) * 2011-08-24 2013-11-06 上海交通大学 基于激光辅助加热的超高压水射流板材渐进加工喷头及其应用
CN102423875A (zh) * 2011-08-24 2012-04-25 上海交通大学 基于激光辅助加热的超高压水射流板材渐进加工喷头及其应用
CN102962774A (zh) * 2011-09-01 2013-03-13 海邦科技股份有限公司 硬脆材料的加工装置及方法
US10160059B2 (en) 2016-03-03 2018-12-25 General Electric Company Decoupled liquid-jet guided laser nozzle cap
US10335900B2 (en) 2016-03-03 2019-07-02 General Electric Company Protective shield for liquid guided laser cutting tools
CN108581196A (zh) * 2018-04-27 2018-09-28 中国科学院宁波材料技术与工程研究所 水导激光加工装置及其应用、激光加工系统及方法
CN108581196B (zh) * 2018-04-27 2020-08-11 中国科学院宁波材料技术与工程研究所 水导激光加工装置及其应用、激光加工系统及方法
CN110142502A (zh) * 2019-05-15 2019-08-20 哈尔滨工业大学 水导引激光发生装置、水导引激光加工系统及其加工方法

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