WO2006118994A3 - Module multi-puce et procede de fabrication associe - Google Patents

Module multi-puce et procede de fabrication associe Download PDF

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Publication number
WO2006118994A3
WO2006118994A3 PCT/US2006/016172 US2006016172W WO2006118994A3 WO 2006118994 A3 WO2006118994 A3 WO 2006118994A3 US 2006016172 W US2006016172 W US 2006016172W WO 2006118994 A3 WO2006118994 A3 WO 2006118994A3
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor chip
spacer
support material
chip module
disposed
Prior art date
Application number
PCT/US2006/016172
Other languages
English (en)
Other versions
WO2006118994A2 (fr
Inventor
Ying Lye Fong
Cheng Sim Kee
Lay Hong Lee
Abu-Hassan Mohammed Suhaiz Bin
Original Assignee
Spansion Llc
Ying Lye Fong
Cheng Sim Kee
Lay Hong Lee
Abu-Hassan Mohammed Suhaiz Bin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Spansion Llc, Ying Lye Fong, Cheng Sim Kee, Lay Hong Lee, Abu-Hassan Mohammed Suhaiz Bin filed Critical Spansion Llc
Priority to JP2008510068A priority Critical patent/JP4785917B2/ja
Priority to EP06751735A priority patent/EP1878049A2/fr
Priority to CN200680015142.9A priority patent/CN101171683B/zh
Publication of WO2006118994A2 publication Critical patent/WO2006118994A2/fr
Publication of WO2006118994A3 publication Critical patent/WO2006118994A3/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/0651—Wire or wire-like electrical connections from device to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06575—Auxiliary carrier between devices, the carrier having no electrical connection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06593—Mounting aids permanently on device; arrangements for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15182—Fan-in arrangement of the internal vias
    • H01L2924/15184—Fan-in arrangement of the internal vias in different layers of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne un module multi-puce (10) et un procédé de fabrication de celui-ci (10) modérant la rupture de fil. Une première puce semi-conductrice (40) est montée sur un substrat support et liée par des fils à celui-ci (12). Un espaceur (50) est couplé à la première puce semi-conductrice (40). Un matériau support (60) est disposé sur l'espaceur (50) et une seconde puce semi-conductrice (64) est positionnée sur le matériau support (60). La seconde puce semi-conductrice (64) est pressé dans le matériau support (60), comprimant celui-ci dans une région adjacente à l'espaceur (50) et entre les première (40) et seconde (64) puces semi-conductrices. Dans un autre mode de réalisation, le matériau support (60) est disposé sur la première puce semi-conductrice (40) et un matériau de fixation de matrice (62) est disposé sur l'espaceur (50). La seconde puce semi-conductrice (64) est pressé dans le matériau de fixation de matrice (62) et le matériau support (60), comprimant une partie du matériau support (60) sur les bords de l'espaceur (53, 55). Des connexions au moyen de fils sont formées entre le substrat support (12) et les première (40) et seconde (64) puces semi-conductrices.
PCT/US2006/016172 2005-05-04 2006-04-26 Module multi-puce et procede de fabrication associe WO2006118994A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008510068A JP4785917B2 (ja) 2005-05-04 2006-04-26 マルチチップモジュールの製造方法
EP06751735A EP1878049A2 (fr) 2005-05-04 2006-04-26 Module multi-puce et procede de fabrication associe
CN200680015142.9A CN101171683B (zh) 2005-05-04 2006-04-26 多芯片模块及制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/125,396 US8586413B2 (en) 2005-05-04 2005-05-04 Multi-chip module having a support structure and method of manufacture
US11/125,396 2005-05-04

Publications (2)

Publication Number Publication Date
WO2006118994A2 WO2006118994A2 (fr) 2006-11-09
WO2006118994A3 true WO2006118994A3 (fr) 2007-05-10

Family

ID=36677176

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/016172 WO2006118994A2 (fr) 2005-05-04 2006-04-26 Module multi-puce et procede de fabrication associe

Country Status (7)

Country Link
US (2) US8586413B2 (fr)
EP (1) EP1878049A2 (fr)
JP (2) JP4785917B2 (fr)
KR (1) KR20080003864A (fr)
CN (2) CN103531581B (fr)
TW (1) TW200717770A (fr)
WO (1) WO2006118994A2 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8183687B2 (en) * 2007-02-16 2012-05-22 Broadcom Corporation Interposer for die stacking in semiconductor packages and the method of making the same
US8421214B2 (en) * 2007-10-10 2013-04-16 Vishay General Semiconductor Llc Semiconductor device and method for manufacturing a semiconductor device
KR101406223B1 (ko) * 2007-10-25 2014-06-30 삼성전자주식회사 칩 온 칩 반도체 소자의 제조방법
TWI415201B (zh) * 2007-11-30 2013-11-11 矽品精密工業股份有限公司 多晶片堆疊結構及其製法
TWI468088B (zh) * 2013-05-28 2015-01-01 矽品精密工業股份有限公司 半導體封裝件及其製法
JP6478449B2 (ja) * 2013-08-21 2019-03-06 キヤノン株式会社 装置の製造方法及び機器の製造方法
KR102116987B1 (ko) 2013-10-15 2020-05-29 삼성전자 주식회사 반도체 패키지
KR102165024B1 (ko) * 2014-09-26 2020-10-13 인텔 코포레이션 와이어-접합 멀티-다이 스택을 구비한 집적 회로 패키지
US20170170108A1 (en) * 2015-12-15 2017-06-15 Intel Corporation Chip carrier having variably-sized pads
US9887119B1 (en) 2016-09-30 2018-02-06 International Business Machines Corporation Multi-chip package assembly
US11088087B2 (en) * 2018-07-25 2021-08-10 Stmicroelectronics, Inc. Micro module with a support structure
JP2021044362A (ja) * 2019-09-10 2021-03-18 キオクシア株式会社 半導体装置

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US20020151103A1 (en) * 2001-04-06 2002-10-17 Shigeru Nakamura Semiconductor device and method of manufacturing the same
US20040241907A1 (en) * 2003-05-30 2004-12-02 Tomoko Higashino Method of manufacturing a semiconductor device

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US20040241907A1 (en) * 2003-05-30 2004-12-02 Tomoko Higashino Method of manufacturing a semiconductor device

Also Published As

Publication number Publication date
EP1878049A2 (fr) 2008-01-16
JP4785917B2 (ja) 2011-10-05
US20140061895A1 (en) 2014-03-06
US8586413B2 (en) 2013-11-19
CN103531581B (zh) 2016-12-07
JP5518789B2 (ja) 2014-06-11
US20060249826A1 (en) 2006-11-09
JP2008541431A (ja) 2008-11-20
CN103531581A (zh) 2014-01-22
CN101171683B (zh) 2014-02-12
TW200717770A (en) 2007-05-01
KR20080003864A (ko) 2008-01-08
CN101171683A (zh) 2008-04-30
WO2006118994A2 (fr) 2006-11-09
JP2011205116A (ja) 2011-10-13

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