Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
  • H01B1/20—Conductive material dispersed in non-conductive organic material
  • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
  • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
  • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
  • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/36—Assembling printed circuits with other printed circuits
  • H05K3/361—Assembling flexible printed circuits with other printed circuits
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/01—Dielectrics
  • H05K2201/0137—Materials
  • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
  • H05K2201/0203—Fillers and particles
  • H05K2201/0242—Shape of an individual particle
  • H05K2201/0245—Flakes, flat particles or lamellar particles
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
  • H05K2201/10954—Other details of electrical connections
  • H05K2201/10977—Encapsulated connections
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
  • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/14—Related to the order of processing steps
  • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/30—Die-attach connectors
  • H10W72/321—Structures or relative sizes of die-attach connectors
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/30—Die-attach connectors
  • H10W72/321—Structures or relative sizes of die-attach connectors
  • H10W72/322—Multilayered die-attach connectors, e.g. a coating on a top surface of a core
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/30—Die-attach connectors
  • H10W72/321—Structures or relative sizes of die-attach connectors
  • H10W72/325—Die-attach connectors having a filler embedded in a matrix
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/30—Die-attach connectors
  • H10W72/351—Materials of die-attach connectors
  • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
  • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Definitions

• the present invention relates to a conductive paste, a circuit board, a circuit article, and a method for manufacturing the circuit article. More specifically, the present invention relates to a conductive paste suitable for forming and protecting circuits, electrodes and the like by coating or printing on a film such as polyethylene terephthalate, polycarbonate, polysulphated bulle, and polyimide. The present invention also relates to a circuit board using this conductive paste. Furthermore, the present invention relates to a circuit product in which the circuit boards are connected to each other, or to a method of manufacturing the same, using the circuit boards or the circuit board and another circuit board.
• a conductive paste is blended with a binder, conductive fine powder, and the like.
• thermosetting epoxy resin saturated copolymerized polyester resin, salted bulle 'butyl acetate copolymer, polyurethane resin, acrylic resin, and the like are used.
• conductive fine powder powder made of copper, silver, silver alloy or the like is used (see Patent Document 1).
• Conductive pastes are widely used in various fields.
• the conductive paste is used as a circuit pattern material of a circuit board and a constituent material of an electrode for connecting (conducting) electrodes of a plurality of circuit boards.
• a heat treatment is usually required at a temperature of 140 ° C. or higher for about 30 minutes.
• electrodes made of a one-pack type conductive base containing thermoplastic resin are connected to each other, heating at 150 ° C. or higher is required.
• Patent Document 1 Japanese Patent Laid-Open No. 7-41706
• thermosetting conductive paste In the case of an electrode made of a thermosetting conductive paste, there is a problem that the productivity of a circuit article formed by joining a plurality of circuit boards is not sufficient. Also contains thermoplastic rosin In the case of an electrode made of a conductive paste, when heat treatment is performed at a high temperature as described above, depending on the type of the substrate, stress due to expansion or contraction of the substrate may concentrate on the connection portion, resulting in poor conduction.
• An object of the present invention is suitable for forming and protecting circuits, electrodes and the like, and can connect electrodes between a plurality of circuit boards in a short time, thereby improving the productivity of circuit articles. Is to provide a sex paste. Moreover, the objective of this invention is providing a circuit board provided with the electrode formed with this electrically conductive paste. Furthermore, an object of the present invention is to provide a circuit article made of this circuit board and having excellent environmental resistance such as moisture and heat resistance, and a method for producing the same.
• adhesion includes adhesion.
• At least one conductive material that is scaly has an average particle diameter of 1 m or more and 10 m or less, and is selected from Ag, Ag alloy, Ag coating, and Ag alloy coating;
• Conductive pace characterized by containing a resin whose storage elastic modulus at 25 ° C is lOOMPa or more
• a circuit board comprising a substrate and an electrode formed on at least one surface side of the substrate using the conductive paste according to [1].
• an adhesive insulating part is provided on the surface of the electrode, and the storage elastic modulus at 25 ° C. of the composition constituting the adhesive insulating part is 25 ° of the resin constituting the conductive paste.
• the above-mentioned adhesive insulating portion is made of styrene 'isoprene' styrene block copolymer, styrene • butadiene ⁇ styrene block copolymer, and at least one polymer selected from these hydride forces, and a tackifying resin.
• the circuit board according to [6] above comprising oil and Z or a liquid hydrocarbon plasticizer.
• the total content of the oil and Z or the liquid hydrocarbon plasticizer is 5 to 30 parts by mass when the total of the polymer and the tackifying resin is 100 parts by mass.
• circuit board according to [6] and another circuit board having electrodes on the surface thereof, and the circuit board and the other circuit board constitute an adhesive insulating portion of the circuit board.
• electrodes of one circuit board and another circuit board A method for producing a circuit article comprising: bonding each circuit board with an adhesive insulating composition that constitutes the adhesive insulating portion of the circuit board facing the electrode and contacting each electrode.
• Adhesiveness that forms the adhesive insulating portion of the circuit board by using the circuit board according to the above [6] and another circuit board having electrodes on the surface so that the electrodes of each circuit board face each other A method of manufacturing a circuit article, comprising bonding each circuit board with an insulating composition and contacting each electrode.
• the conductive paste of the present invention is suitable for forming and protecting circuits, electrodes and the like by coating or printing on a film of polyethylene terephthalate, polycarbonate, polysulphated bulle, polyimide or the like.
• the conductive paste of the present invention can connect electrodes of a plurality of circuit boards in a short time, and can improve the productivity of circuit articles.
• a circuit board of the present invention includes a base and an electrode formed on at least one surface side of the substrate using the conductive paste described in 1 or 2 above.
• the circuit board according to the present invention has an adhesive insulating portion made of a composition having a storage elastic modulus lower than the storage elastic modulus at 25 ° C. of the resin constituting the conductive paste on the surface of the electrode.
• the adhesive elastic part formed on the surface of the electrode can be suitably formed, and the storage elastic modulus at 25 ° C. of the composition constituting the adhesive insulating part constitutes the conductive paste. If the storage modulus of the resin is less than 25 ° C, the connection between the electrodes of each circuit can be made in a short time with another circuit board having electrodes. If the 10-point average roughness of the electrode surface is 15 m or more, the adhesive insulation will be broken through when bonding to other circuit boards by crimping etc. These electrodes can be brought into contact and conducted.
• the adhesive insulating part contains a specific polymer and a tackifier resin in a specific ratio
• the interelectrode connection can be performed in a low temperature range of about 20 to 80 ° C. Therefore, the productivity of circuit articles is improved.
• circuit parts when joining a plurality of circuit boards, if other electrodes (circuit parts) do not face each other than the electrodes to be connected, it is not necessary to mask those parts. Therefore, in this case, a circuit board provided with an adhesive insulating portion on the entire surface of the substrate can also be used. As a result, it is possible to obtain a circuit article having a simple process and firmly adhered.
• the circuit article of the present invention is excellent in electrical continuity between a plurality of circuit boards, particularly each electrode.
• the adhesive insulating portion has at least one polymer selected from styrene 'isoprene' styrene block copolymer, styrene 'butadiene' styrene block copolymer, and hydrogenated products thereof, and adhesive.
• styrene 'isoprene' styrene block copolymer styrene 'butadiene' styrene block copolymer
• hydrogenated products thereof and adhesive.
• an imparting resin and oil and Z or liquid hydrocarbon plasticizer it is excellent in environmental resistance such as moisture and heat resistance.
• the circuit board of the present invention and another circuit board having electrodes are pressure-bonded so that the electrodes face each other. While the portion is deformed, the space around the electrode is filled. As a result, it is possible to obtain a circuit article in which each circuit board is joined and each electrode is well conducted.
• the adhesive insulating portion of the circuit board is a pressure-sensitive adhesive layer made of a specific polymer, tackifying resin, or the like, a plurality of circuit boards can be easily joined simply by pressure bonding without heating.
• the adhesive insulating part is a hot-melt adhesive layer, it is easy to combine multiple circuit boards by combining heating and pressure bonding based on the softening temperature of the polymer or tackifying resin. Can be joined.
• the method of manufacturing a circuit article according to the present invention is a highly productive circuit that can cope with lighter, thinner, and lower cost electronic components such as RF tags (including contactless ID tags and contactless ID cards). It is a connection method.
• FIG. 1 is a schematic cross-sectional view showing an example of a circuit board (I) of the present invention.
• FIG. 2 is a schematic plan view showing an example of a circuit board (II) of the present invention.
• 3 is a cross-sectional view taken along the line XX of the circuit board ( ⁇ ) in FIG.
• FIG. 4 is a schematic sectional view showing another example of the circuit board (II) of the present invention.
• FIG. 5 is a schematic sectional view showing another example of the circuit board (II) of the present invention.
• FIG. 6 is a schematic sectional view showing another example of the circuit board (II) of the present invention.
• FIG. 7 is a schematic sectional view showing another example of the circuit board (II) of the present invention.
• FIG. 8 is a schematic sectional view showing another example of the circuit board (II) of the present invention.
• FIG. 9 is a schematic cross-sectional view showing an example of a circuit article (K1) and a method for producing the same according to the present invention.
• FIG. 10 is a schematic cross-sectional view showing an example of a circuit article ( ⁇ 2) and a method for producing the same according to the present invention.
• FIG. 11 is a schematic cross-sectional view showing another example of the circuit article ( ⁇ 2) and the method for producing the same according to the present invention.
• FIG. 12 is a schematic sectional view showing another example of the circuit article of the present invention.
• FIG. 13 is a schematic plan view showing an electrode formed in Example 5.
• FIG. 14 is a schematic plan view showing the circuit board manufactured in Example 5 and shows that an adhesive insulating portion is formed on the surface of the electrode in FIG. 13 (L).
• FIG. 15 is a schematic plan view showing a circuit article manufactured and evaluated in Example 5.
• the conductive paste of the present invention is scaly, has an average particle size of 1 ⁇ m or more and 10 ⁇ m or less, and at least one selected from Ag, Ag alloy, Ag coating, and Ag alloy coating It contains a conductive material and a resin having a storage elastic modulus at 25 ° C of lOOMPa or more.
• the conductive paste of the present invention is a film, paper, woven fabric, non-woven fabric, or plate. Or they are applied, printed, etc. on the surface of a substrate formed by combining them. Therefore, the electrically conductive paste of this invention contains a solvent, an additive, etc. as needed.
• the conductive material according to the present invention (hereinafter also referred to as "conductive material [A]”) is at least one selected from Ag (silver), an Ag alloy, an Ag coating, and an Ag alloy coating. It is a seed.
• the conductive material [A] can be used in combination of two or more thereof.
• the Ag alloy include an Ag—Pd alloy, an Ag—Ni alloy, an Au—Ag alloy, and an Ag—Cu alloy.
• the constituent material of the core member constituting the coating include resins such as polymethyl methacrylate and polystyrene. The shape of this core member is usually scaly.
• the shape of the conductive material [A] is substantially flat and fine scaly.
• the aspect ratio is preferably 6 or more, more preferably 8 or more. When the aspect ratio is small, it is difficult to obtain contact between conductive materials, particularly in the lateral direction, and the resistance value tends to increase.
• the conductive material [A] has an average particle size of 1 to 10 ⁇ m, preferably 1.5 to 8 ⁇ m. When the average particle size is within this range, the conductive paste is excellent in printability. In addition, when the average particle diameter is within this range, the 10-point average roughness (according to JIS B0601-2001) of the surface of the film formed from the conductive paste can be 15 m or more. The average particle diameter can be measured with a laser diffraction Z-scattering particle size distribution measuring apparatus or the like.
• the conductive paste of the present invention may contain other conductive material (hereinafter also referred to as "conductive material [8]").
• the conductive material [8 ′] is not particularly limited as long as it does not contain Ag and an Ag alloy.
• Examples of the conductive material [8 ′] include metals such as Co, Ni, Cr, Cu, W, Al, and In; alloys thereof (Au—Pd alloy, Au—Pt alloy, Pt—Pd alloy, Cu — Sn alloy, Cu—Zn alloy, etc.); carbon such as graphite and carbon.
• the shape and size of the conductive material [ ⁇ '] is not limited.
• the conductive material [ ⁇ ′] may have a spherical shape, a polyhedral shape, a linear shape (dendritic shape), a saddle shape, a scale shape, or the like.
• the average particle diameter of the conductive material [A ′] is preferably 1 ⁇ m or more and 10 ⁇ m or less.
• the amount of the conductive material [8'] used is preferably 400 parts by mass or less with respect to 100 parts by mass of the conductive material [A]. Preferably it is more than 0 parts by mass and 100 parts by mass or less.
• the content of the entire conductive material is preferably 85 to 93 parts by mass, more preferably 87 to 90, when the total solid content of the conductive paste is 100 parts by mass. Part by mass. This is true even when the conductive material [A] is used alone as the conductive material in the conductive paste of the present invention, and when the conductive material [A] and the conductive material [ ⁇ ′] are used in combination. If the content of the conductive material is too small, high conductivity may not be obtained. On the other hand, if the content is too large, the adhesiveness of the conductive paste may be weakened and peeled off.
• the content of the conductive material in the conductive paste of the present invention is preferably 50 to 85% by mass, more preferably 52 to 80% by mass, and still more preferably 55 to 75% with respect to the entire paste. %. If the content is too small, the contact between the conductive materials is lowered, and the conductivity may be lowered. On the other hand, if the amount is too large, the viscosity of the conductive paste increases, and the conductive pattern with the conductive base may not be formed with high accuracy. As a result, the strength of the conductive pattern may decrease and the conductivity may decrease.
• the resin according to the present invention (hereinafter, also referred to as “resin [ ⁇ ]”) has thermoplasticity as long as the storage elastic modulus at 25 ° C. is 1 OOMPa or more, preferably 100 to 1, OOOMPa.
• the resin may be any of a resin, a thermosetting resin, a photocurable (UV curable) resin, and the like.
• this storage elastic modulus is a value measured when the above-mentioned rosin [B] is in a solid state.
• the storage elastic modulus is adjusted to an appropriate viscosity by a method for preparing a test piece used for measurement of solid physical properties (for example, by heating, Furthermore, it is a measured value with respect to the solid substance obtained by the method of cooling. Further, in the case where the resin [B] is a thermosetting resin (composition) or a photocurable resin (composition), the storage elastic modulus is measured on a cured product obtained by heating or light irradiation. Value.
• thermoplastic polyester resin epoxy resin, polyurethane resin, phenol resin, unsaturated polyester resin, vinyl chloride and vinyl acetate copolymer are used in accordance with the above properties. Combined, (meth) acrylic resin, polybutadiene resin, polyacetic acid resin, polyimide resin, and the like can be used. These can be used alone or in combination of two or more.
• thermoplastic polyester resin which is preferred by thermoplastic polyester resin, epoxy resin, and polyurethane resin, due to its adhesion to the substrate for circuit boards, compatibility with conductive materials, and the like. Particularly preferred.
• the above-mentioned resin [B] has a storage elastic modulus at 25 ° C. of not less than lOOMPa, it may contain a resin having a storage elastic modulus at 25 ° C. of less than lOOMPa.
• the content of the resin [B] in the conductive paste of the present invention is preferably 6.5 to 15% by mass when the total of the conductive material and the resin [B] is 100% by mass. More preferably, it is 9.5-13 mass%, More preferably, it is 10-13 mass%. Further, the ⁇ of [B], the content of the conductive paste of the present invention, with respect to the entire paste, preferably 10 to 20 weight 0/0, yo Ri preferably 10 to 15 wt% . If the content is too small, the adhesion to the substrate and the printability may be insufficient. On the other hand, if the content is too large, the conductivity of the formed electrode may be insufficient.
• the conductive paste of the present invention may contain a solvent and an additive in addition to the conductive material [A] and the resin [B].
• the solvent include ester solvents, ketone solvents, ether ester solvents, chlorine solvents, alcohol solvents, ether solvents, and hydrocarbon solvents. These can be used alone or in combination of two or more. Of these, ester solvents, ketone solvents and ether ester solvents are preferred.
• ester solvent examples include methyl acetate, ethyl acetate, isopropyl acetate, isobutyl acetate, butyl acetate, and amyl acetate.
• ketone solvent examples include methyl ethyl ketone, methyl isobutyl ketone, methyl isoamyl ketone, methyl amyl ketone, ethyl amyl ketone, isobutyl ketone, methoxymethyl pentanone, cyclohexanone, diacetone alcohol, and isophorone.
• ether ester solvents examples include 2-methoxyethyl acetate (methyl acetate sorbate), 2-ethoxyethyl acetate (ethyl acetate sorb acetate), 2-butoxychet acetate (butyl acetate sorb acetate), 3-methoxybutyl acetate, diethylene glycol mono Examples include methyl ether acetate (methyl carbitol acetate), diethylene glycol monoethyl ether acetate (ethyl carbitol acetate), and diethylene glycol mono n-butyl ether acetate (butyl carbitol acetate).
• the content of the solvent in the conductive paste of the present invention is preferably 10 to 70 parts by mass, more preferably 15 to 60 parts by mass, when the total of the conductive material and the resin is 100 parts by mass. More preferably, it is 20-50 mass parts. Further, the solvent, the content of the conductive paste of the present invention, with respect to the entire paste, preferably 10 to 50 mass 0/0, more preferably 2 5 to 45 wt%. If the content is too small, the viscosity may be too high and the conductive pattern may not be uniformly applied. On the other hand, if the content is too large, the printability of the conductive paste and the adhesion to the substrate may be insufficient. There is a case.
• Examples of the additive include a corrosion inhibitor, a coupling agent, a curing agent, a leveling agent, an antifoaming agent, a dispersion stabilizer, and a habit modifier.
• the corrosion inhibitor examples include benzothiazole and benzimidazole.
• the amount used is usually miB] loo parts by mass,
• Coupling agents include titanium-based coupling agents such as titanium di (dioctylpyrophosphate) oxyacetate and di (dioctylbiphosphate) ethylene titanate; ⁇ - (2-aminoethyl) aminopropyltrimethoxysilane And silane coupling agents such as ⁇ -glycidoxypropyltrimethoxysilane.
• the conductive paste of the present invention is suitable for forming an electrode constituting a circuit board of the present invention described later.
• the circuit board of the present invention (hereinafter also referred to as “circuit board (1)”) includes a base and an electrode formed on at least one surface side of the base using the conductive base.
• the circuit board (I) of the present invention is a composition having a storage elastic modulus smaller than the storage elastic modulus at 25 ° C. of the resin constituting the conductive paste (hereinafter referred to as “adhesive insulating composition”). )) Can be used to form on the surface of the electrode.
• the substrate may be a substrate made of a film, paper, woven fabric, nonwoven fabric, mat, plate or the like, or a substrate formed by combining two or more of these.
• the main components of the substrate include polyester resin such as polyethylene terephthalate, polycarbonate resin such as aromatic polycarbonate, polyolefin resin, polyamide resin, polyimide resin, ethylene Coalesced polybutyl alcohol resin, polyvinyl chloride resin, polysalt vinylidene resin, polystyrene resin, acrylonitrile 'butadiene' styrene resin, polyethersulfone resin and cellulose And the like.
• the substrate is a woven fabric or a nonwoven fabric
• inorganic fibers or organic fibers such as glass fibers, alumina fibers, polyester fibers and polyamide fibers can be used as the fibers constituting the woven fabric or nonwoven fabric.
• polyester-based resin, polyamide-based resin, and poly-vinyl chloride-based resin are preferable.
• the surface of the substrate is subjected to a primer treatment, a corona discharge treatment, a plasma treatment, an ultraviolet irradiation treatment, an electron beam irradiation treatment, a frame plasma treatment. Or a substrate that has been subjected to treatment such as ozone treatment.
• the electrode is formed using the conductive paste.
• the electrode is formed by forming a film based on a predetermined pattern by coating or printing, and then drying and coating the film.
• the surface of the electrode preferably has a 10-point average roughness measured in accordance with JIS B0601-2001 of 15 ⁇ m or more, more preferably 20 ⁇ m or more. However, the upper limit is usually 50 / z m.
• an adhesive insulating part is formed using the adhesive insulating composition, and another circuit board of the present invention (hereinafter also referred to as “circuit board ( ⁇ )”). In this case, when the circuit board (I) and the circuit board (11) or the circuit boards ( ⁇ ) are pressure-bonded so that the electrodes face each other, the adhesive insulating part cannot be pierced, which is good. In some cases, continuity is not obtained.
• the surface of the electrode may be flat or uneven.
• the thickness (average thickness) is usually 10 to 150 ⁇ m, preferably 15 to: LOO ⁇ m. If the thickness is too thin, the resistance value will be high, and if it is too thick, the surface printing may be affected in the case of applications such as cards and tags.
• the electrode is formed on at least one surface side of the substrate, and may be formed via an intermediate layer between the electrode and the substrate. Further, the substrate may have two or more electrodes on the same surface. Further, the electrode may be formed on any surface of the substrate.
• circuit board (I) of the present invention will be described with reference to the drawings.
• FIG. 1 is a schematic cross-sectional view showing an example of the circuit board (I).
• the circuit board 1 ′ includes a base 11 and an electrode 12 disposed on the surface of the base 11.
• Another circuit board (II) of the present invention includes an adhesive insulating portion on the surface of the electrode.
• the adhesive insulating part is formed using the above-mentioned adhesive insulating composition.
• This adhesive insulating portion is insulative at the operating temperature of the circuit board ( ⁇ ) and the circuit article using the same, particularly at a temperature around 20 to 30 ° C. (hereinafter referred to as “room temperature”). If it has, it will not specifically limit the constituent material.
• the adhesiveness of the adhesive insulating part may have already been developed at normal temperature, may be expressed by being pressurized, may be expressed by being heated, or may be irradiated with light. It may be expressed by doing so.
• the adhesive insulating part includes a polymer such as a gen-based polymer, polyurethane, and polyester, a tackifying resin, oil, Z, or a liquid hydrocarbon plasticizer (hereinafter referred to as a plasticizer). And also referred to as “liquid substance”).
• the polymer is preferably a gen-based polymer.
• the gen-based polymer include styrene 'isoprene' styrene block copolymer, styrene 'butadiene' styrene block copolymer, and hydrogenated products thereof. These can be used alone or in combination of two or more. This gen-based polymer can also be used in combination with other polymers.
• SIS block copolymer As the styrene “isoprene” styrene block copolymer, commercially available products called “SIS block copolymer” and “SIS (thermoplastic) elastomer” can be used.
• the Examples of commercially available products include “Clayton D-1107CP”, “Clayton D-1112” and “Clayton D-1117” (above, trade names) manufactured by Shell Chemical Co., Ltd.
• Styrene / Butadiene 'Styrene block copolymers may be commercially available products called “SBS block copolymers” and “SBS (thermoplastic) elastomers”.
• SBS block copolymers and “SBS (thermoplastic) elastomers”.
• examples of such commercial products include linear block polymers such as “Clayton D-1101” and “Clayton D-1118” (hereinafter referred to as trade names) manufactured by Shell Chemical Co., Ltd., and “Clayton D-1184” and “ Examples include side chain block polymers such as “Clayton D-1122X” (trade name).
• These hydrogenated substances are generally called “SEBS (thermoplastic) elastomers”. These hydrogenated products can be used as commercial products. For example, “Clayton G-1650”, “Clayton G-1652”, and “Clayton G-1 657” (trade name) manufactured by Shell Chemical Co., Ltd. “Septon 2002”, “Septon 2043”, and “Septon” 2007 “(above, product name).
• the hydrogenation rate of these hydrogenated products is not particularly limited, but is usually 90 to 100%.
• the preferred weight average molecular weight in terms of polystyrene by gel permeation chromatography (GPC) of each block in each of the above block copolymers is from 2,000 to 125,000 for styrene block, and butadiene
• the block or isoprene block is from 10,000 to 250,000.
• the ratio of the total amount of styrene blocks is preferably 10 to 50% by mass with respect to the whole polymer.
• styrene 'isoprene' styrene block copolymers and hydrogenated products thereof are particularly preferred.
• the adhesiveness between the circuit board (I) and the circuit board ( ⁇ ) or between the circuit boards (II) is excellent.
• a circuit article having heat resistance can be obtained.
• the combined proportion of styrene 'isoprene' styrene block copolymer and its hydrogenated product shall be 30-80% by mass and 20-70% by mass, respectively, when the total of these polymers is 100% by mass. Is preferred.
• the content ratio of the polymer constituting the adhesive insulating part is preferably 5 to 70% by mass, more preferably 10 to 60% by mass, and still more preferably based on the entire adhesive insulating part. Is 20-50% by mass.
• tackifier resin examples include petroleum-based resin, rosin-based resin, and terpene-based resin. These can be used alone or in combination of two or more.
• Examples of the petroleum-based resin include aliphatic petroleum resin, aromatic petroleum resin, copolymerized petroleum resin, and hydrogenated petroleum resin. Of these, hydrogenated petroleum resins are preferred.
• a commercial item can be used as this petroleum-based rosin.
• Examples of the commercially available products include “Arcon P” and “Arcon M” (trade name) manufactured by Arakawa Chemical Industries, Ltd. “Escollet” (trade name) manufactured by Tonen Petrochemical Co., Ltd. (Product name), ZEON Corporation (Quinton) (product name), Goodyear Co., Ltd. (Wing Tuck) (product name), Dainippon Ink & Chemicals Co., Ltd. (STATACK) (product name), Tonen Petrochemical “Toho Petrogene” (trade name) manufactured by Mitsui Engineering Co., Ltd. “Tac Ace” (trade name) manufactured by Mitsui Engineering Co., Ltd.
• Examples of the rosin-based rosin include natural rosin and polymerized rosin.
• Examples of the phlegm-based rosin include derivatives thereof, for example, ester rosins such as pentaerythrester rosin and glycerin ester rosin, and hydrogenated products thereof.
• a commercially available product can be used as this rosin-based rosin.
• the commercially available products include “Gum rosin”, “Wood rosin”, “Ester gum A”, “Ester gum H”, “Pencel A” and “Pencel C” (above, trade names) manufactured by Arakawa Chemical Industries, and Rika Hercules. “Pentalin A”, “Foral AX”, “Foral 85”, “Foral 105” and “Pentalin C” (trade name) etc.
• Examples of the terpene resin include polyterpene resin and terpene phenol resin, and these hydrogenated products can also be used.
• this terpene resin a commercially available product can be used.
• Examples of the commercially available products include “Picolite S” and “Picolite A” (above, trade names) manufactured by RIH Hercules, and “YS Resin”, “YS Polystar T” and “Clearon” (above, manufactured by Yashara Chemical Co., Ltd.). Product name).
• the content of the tackifying resin constituting the adhesive insulating part is preferably 20 to 80% by mass, more preferably 30 to 70% by mass, based on the entire adhesive insulating part. Further To preferably 40 to 60 weight 0/0.
• the content of the polymer and the tackifying resin constituting the adhesive insulating part are preferably 10 to 60% by mass and 40 to 90% by mass, respectively, when the total of these is 100% by mass. %, More preferably 30 to 60% by mass and 40 to 70% by mass. By setting it within the above range, sufficient tackiness can be obtained.
• the liquid substance is oil and Z or a liquid hydrocarbon plasticizer.
• the liquid material preferably has a kinematic viscosity at 40 ° C. of 1 to 10,000 mm 2 Zs. If the kinematic viscosity force S is within this range, the circuit board (I) and the circuit board ( ⁇ ), or the circuit board ( ⁇ ) are bonded to each other, the liquid substance is added to the polymer and the tackifier. It becomes easy to move to the peripheral part of electrode surface force together with resin.
• the oil is preferably used as an oil for increasing the amount of synthetic rubber and a processing oil (process oil).
• processing oil examples include norafine, naphthenic and aromatic hydrocarbon mineral oils and their high boiling fractions, and liquid rosin and liquid terpenes. These can be used alone or in combination of two or more.
• a commercially available product can be used as this oil.
• process oils include “Diana Process Oil” manufactured by Idemitsu Kosan Co., Ltd., “Shelf Rex” manufactured by Shelly Chemical Co., Ltd., “Dimaron”, “YS Oil” and “Rubber Soft” manufactured by Yashara Chemical.
• liquid hydrocarbon plasticizer examples include liquid hydrocarbon synthetic rubbers such as polybutene, polyisobutylene, polyisoprene, polybutadiene, and hydrogenated products thereof. These can be used alone or in combination of two or more.
• a commercially available product can be used as the liquid hydrocarbon plasticizer. Examples of the commercially available products include “Kuraprene LIR” and “Hydrogenated LIR” manufactured by Kuraren, and “Idemitsu Polybutene” manufactured by Idemitsu Petrochemical Co., Ltd.
• liquid substance only the oil may be used, or only the liquid hydrocarbon plasticizer may be used. Further, as the liquid substance, the oil and the liquid hydrocarbon plasticizer may be used in combination.
• the content ratio of the liquid material constituting the adhesive insulating portion is the same as that of the adhesive insulating portion.
• the whole preferably 20 to 80%, more preferably 30 to 70 wt%, further preferred properly 40 to 60 weight 0/0.
• the content of the liquid substance is preferably 5 to 30 parts by mass, more preferably 15 to 30 parts by mass, when the total of the polymer and the tackifying resin is 100 parts by mass.
• the content ratio of the liquid substance exceeds 30 parts by mass, the cohesive force of the polymer and the tackifying resin may be reduced, and the adhesiveness may be reduced.
• the content of the liquid substance is less than 5 parts by mass, the adhesiveness at a temperature as low as about 20 to 60 ° C. may be lowered.
• the adhesive insulating part further comprises a flame retardant, an antifoaming agent, a coupling agent, an antioxidant, an anti-aging agent, a heat stabilizer, a colorant, and an inorganic filler.
• a flame retardant include bromine compounds and phosphorus-containing compounds.
• the antifoaming agent include silicone compounds.
• the colorant include carbon black and organic pigments.
• inorganic fillers include calcium carbonate and talc. These other additives may be used alone or in combination of two or more.
• the storage elastic modulus at 25 ° C of the adhesive insulating composition is smaller than the storage elastic modulus at 25 ° C of the resin constituting the conductive paste. Thereby, when crimping or the like, the conduction of each electrode can be improved.
• the storage elastic modulus at 25 ° C. of the adhesive insulating composition is preferably 20% or less, more preferably the storage elastic modulus at 25 ° C. of the resin constituting the conductive paste. It is 10% or less, more preferably 0.01 to 5%.
• the preferable storage elastic modulus of the said adhesive insulating composition is 10 kPa-10MPa, More preferably, it is 20kPa-5MPa. If the storage elastic modulus is too large, the pressure-sensitive adhesive composition may spread when it is pressure-bonded. On the other hand, if the storage elastic modulus is too small, the cohesiveness is lowered and sufficient tackiness may not be exhibited.
• the thickness of the adhesive insulating part is preferably 10 to 400 m, more preferably 15 to 200 m.
• the circuit board ( ⁇ ) of the present invention will be described with reference to the drawings.
• the circuit board 1 in FIG. 2 is a schematic plan view showing an example of the circuit board (II).
• the circuit board 1 includes a base 11, an electrode 12 disposed on the surface of the base 11, and an adhesive insulating portion 13 disposed on a part of the surface of the electrode 12.
• FIG. 3 is a cross-sectional view taken along the line X--X in FIG. 2 and shows that the adhesive insulating portion 13 is formed on the surface of the electrode 12 with the same width as the electrode 12.
• FIGS. Similarly, it is a schematic sectional view showing a circuit board (II) of the present invention.
• FIG. 4 to 8 are views when the vicinity of the center of the portion where the electrode 12 and the adhesive insulating portion 13 (131, 132) are formed is cut vertically.
• FIG. 4 is an embodiment in which adhesive insulating portions 131 and 132 are provided on both ends of the surface of the electrode 12.
• FIG. 5 is a mode in which the adhesive insulating portion 13 is provided on the inner side of the surface of the electrode 12.
• FIG. 6 shows a mode in which the adhesive insulating portion 13 is provided so as to cover the entire surface of the electrode 12.
• FIG. 7 shows an aspect in which adhesive insulating portions 131 and 132 are provided so as to cover both ends of the surface of the electrode 12 and its end portions.
• FIG. 8 is an embodiment in which another adhesive insulating portion 133 is provided on the surface of the base 11 in addition to the embodiment of FIG.
• the adhesive insulating portion 133 may have the same composition as the adhesive insulating portion 13.
• the electrode 12 and the adhesive insulating portion 13 are arranged on the opposite surface!
• the circuit board (II) of the present invention includes a step of applying or printing the conductive paste on a substrate to form an electrode (hereinafter referred to as “step (1)”), and a surface of the electrode. It can be produced by a method comprising a step of forming a pressure-sensitive insulating portion using the pressure-sensitive insulating composition (hereinafter referred to as “step (2)”).
• a method for forming an electrode on the substrate is not particularly limited.
• the electrode is usually formed by forming a film based on a predetermined pattern by coating or printing, and then drying and coating.
• the printing method can be screen printing, inkjet printing, or the like.
• the drying may be natural drying at room temperature, drying with heating (hot air drying, vacuum drying, etc.), and the like.
• the drying method, conditions, and the like are selected in consideration of the components and properties of the conductive paste used, in particular, resin and solvent.
• the adhesive is removed from the surface of the electrode by using an adhesive insulating composition. Form an edge.
• the above-mentioned adhesive insulating composition should have one or more properties of room temperature type, pressure sensitive type, heat sensitive type and photosensitive type. Are preferred.
• a pressure-sensitive composition and a pressure-sensitive heat-sensitive composition are particularly preferred.
• the adhesive insulating composition preferably has a melt viscosity at 190 ° C of 100, OOOmPa or less in consideration of printability on the electrode surface and the like. More preferably, it is 1,000 to 20, OOOmPa. If this melt viscosity is too high, stringing may occur when the adhesive insulating composition is used, and workability may be reduced. On the other hand, if the melt viscosity is too low, it spreads from the printing position and may cause poor conduction, poor appearance, and the like.
• the storage elastic modulus at 25 ° C of the above adhesive insulating composition is preferably lOkPa to 10 MPa, more preferably 20 kPa to 5 MPa. If the storage elastic modulus is too large, the adhesive insulating composition may spread when it is pressure-bonded. On the other hand, if the storage elastic modulus is too small, the cohesiveness is lowered and sufficient tackiness may not be exhibited.
• the method for forming the adhesive insulating portion is not particularly limited.
• the above-mentioned adhesive insulating part is usually applied by brush coating, roll coating, etc .; applied by printing such as screen printing to form a film, left as it is to form a film, or heat-treated to form a film. By doing so, it can be formed.
• a film having a predetermined shape is formed on a release material composed of a polyolefin such as polypropylene, a polyester such as polyethylene terephthalate, or a fluorine-based resin such as polytetrafluoroethylene, and then pressed onto the electrode surface. And a method of forming by transfer.
• the above-mentioned adhesive insulating composition is a hot melt type composition, this pressure bonding may be performed while heating.
• the circuit article of the present invention is characterized by comprising the circuit boards (I) and Z or ( ⁇ ) of the present invention. That is, the circuit article of the present invention may include [1] one or more of each of the circuit boards (I) and Z or ( ⁇ ), and [2] the circuit board (I). And one or more of each of Z and ( ⁇ ) and other members (other circuit boards, electronic components, etc.). Yes.
• the circuit article of the present invention may include [1] one or more of each of the circuit boards (I) and Z or ( ⁇ ), and [2] the circuit board (I). And one or more of each of Z and ( ⁇ ) and other members (other circuit boards, electronic components, etc.).
• a particularly complex circuit article for example, (A) a plurality of circuit boards (I) are integrated and an adhesive insulating agent (separated separately) is used to make the electrodes conductive.
• the above-mentioned adhesive insulating composition is used to integrally bond the circuit article in which each circuit surface of the circuit board (I) is joined, and (B) the circuit boards (I) and ( ⁇ ) by pressure bonding.
• circuit article (K1) includes a plurality of circuit boards (II) of the present invention, and one of the circuit boards (one or more).
• Another circuit board is a circuit article bonded (on each circuit surface) with the adhesive insulating composition constituting the adhesive insulating portion of the one circuit board, and the circuit of the circuit board of the above one And the circuit of the other circuit board are electrically connected to each other by contact of the electrode of the one circuit board and the electrode of the other circuit board.
• the method for producing the circuit article (K1) of the present invention uses a plurality of the circuit boards ( ⁇ ) of the present invention, and joins each circuit board with the electrode of one circuit board facing the electrode of the other circuit board. Each electrode is brought into contact with each other.
• each circuit board may be pressure-bonded at room temperature, or may be pressed (pressure-bonded) while being heated to 30 to 80 ° C. (more preferably 30 to 60 ° C.). What is necessary is just to select the pressure at the time of crimping
• the adhesive insulating part is a hot-melt type composition
• the adhesive insulating composition constituting the adhesive insulating part softens and moves faster to the peripheral part of the contact surface of each electrode. Thereby, each electrode is in good contact, and high adhesiveness in each circuit board is obtained, which is preferable.
• the circuit article 2 of the present invention includes a circuit board la including a base 11a, an electrode 12a formed on the surface of the base 11a, and an adhesive insulating portion 13a formed on the surface of the electrode 12a, and A circuit board lb comprising a substrate l ib, an electrode 12b formed on the surface of the substrate l ib, and an adhesive insulating part 13b formed on the surface of the electrode 12b. It is crimped so that it faces.
• the adhesive insulating composition constituting the adhesive insulating portion of each circuit board is At the same time when the circuit boards are joined to each other, the electrodes 12a of the circuit board 11a and the electrodes 12b of the circuit board lib are brought into contact with each other.
• the electrodes 12a and 12b are surrounded by the adhesive insulating composition (bonding parts 135a and 135b) that constitutes the adhesive insulating part of each circuit board.
• circuit article (K2) is a circuit board ( ⁇ ) of the present invention and another circuit board having electrodes on its surface (included in the present invention).
• Circuit board), and the circuit board (II) and the other circuit board are joined by the adhesive insulating composition constituting the adhesive insulating portion of the circuit board (II).
• a circuit article, wherein each circuit of each circuit board is electrically connected to each other by contact between the electrode of the circuit board (II) and the electrode of the other circuit board.
• the number of can be 1 or more.
• Another manufacturing method of the circuit article (K2) of the present invention uses the circuit board ( ⁇ ) of the present invention and another circuit board (circuit board not included in the present invention) having electrodes on the surface, It is characterized in that each electrode of the circuit board faces each other, each circuit board is joined, and each electrode is brought into contact.
• the joining method is the same as that for the circuit article (K1).
• the configuration of other circuit boards is not particularly limited. Constituent materials and shapes of bases constituting other circuit boards, constituent materials of electrodes arranged on the bases, pattern shapes, surface roughness and thickness, etc. shall be in accordance with the purpose and application. be able to.
• the circuit article (K2) of the present invention will be described with reference to FIG. That is, the circuit article 2 ′ of the present invention includes a circuit board la including a base 11a, an electrode 12a formed on the surface of the base 11a, and an adhesive insulating portion 13a formed on the surface of the electrode 12a, and A circuit board lc including a base 11c and an electrode 12c (in the case of a smaller area than the electrode 12a) formed on the surface of the base 11c is pressure-bonded or the like so that each electrode of each circuit board faces. Yes.
• each circuit board moves to the peripheral part, and at the same time, each circuit board is joined, and at the same time, the electrode 12a of the circuit board 11a and the electrode 12c of the circuit board 11c Is in contact and is conducting.
• the electrodes 12a and 12c are surrounded by an adhesive insulating composition (bonding parts 135a and 135b) that constitutes the adhesive insulating part of each circuit board.
• the circuit article (K2) of the present invention may have an embodiment as shown in FIG. That is, Figure 11
• the circuit article 2 ′ shown in FIG. 1 includes a substrate 11 a, a circuit board la including an electrode 12 a formed on the surface of the substrate 11 a, and an adhesive insulating portion 13 a formed on the surface of the electrode 12 a, and the substrate A circuit board lc including 11c and an electrode 12c (when the area is larger than that of the electrode 12a) formed on the surface of the base body 11c is pressure-bonded or the like so that each electrode of each circuit board faces .
• the adhesive insulating composition constituting the adhesive insulating portion of each circuit board moves to the peripheral portion, and at the same time, each circuit board is bonded, and at the same time, the electrode 12a of the circuit board 11a and the circuit board 11c
• the electrode 12c is in contact and is conductive.
• the base 11a and the electrode 12c are joined by the force joint 135b joined to each base of each circuit board by the joint 135a.
• a circuit board including another base 11c and an electrode 12c formed on the base 11c is bonded to the other side (lower side in FIG. 12) of the circuit board.
• This is a composite circuit board in which a circuit board including 11c ′ and two electrodes 12c ′ formed on the base body 11c ′ is bonded.
• the electrodes 12c and 12c ′ on the two other circuit boards on both sides are the same as in FIG. 9 and FIG. 10, such as a polymer comprising an adhesive insulating part (joint parts 135a and 135b and 135c and 135d, respectively). ).
• circuit article of the present invention since the electrodes of the plurality of circuit boards are in close contact with each other, the circuits are electrically connected (electrically connected).
• the circuit article of the present invention is particularly suitable for thin products. Further, in the circuit article of the present invention, since the periphery of the closely contacted electrode is surrounded by the adhesive insulating composition, the circuit conduction with high heat and humidity resistance is not greatly reduced.
• the raw material components used for the preparation of the conductive paste are as follows.
• (A4) particulate silver powder having an average particle size of 0.3 / ⁇ ⁇ and a specific surface area of 2.4 m 2 Zg.
• (B1) Saturated copolymer polyester resin obtained by condensation polymerization using terephthalic acid, isophthalic acid, sebacic acid, ethylene glycol and neopentyl glycol as monomers.
• Weight average molecular weight is 20,000, glass transition temperature is 34 ° C, storage modulus is 210MPa (2
• acid value is 3KOHmgZg.
• the value is 3KOH mgz g.
• Epoxy equivalent is 875-975g / eq, softening point is 97 ° C, molecular weight is 1,600.
• the storage elastic modulus is 200 MPa (25 ° C).
• the glass transition temperature was measured according to JIS K7121 using a differential scanning calorimeter “RDC220 type” manufactured by Seiko Instruments Inc.
• the storage elastic modulus was measured at a measurement temperature range of 25 to 150 ° C, a temperature increase rate of 3 ° CZ, and a frequency of 1 Hz by the parallel plate method using a viscoelastic spectrometer “RDS” manufactured by Rheometrics. .
• the R & B soft spot was measured according to JIS K6863. Furthermore, butylcetone sorb acetate was used as a solvent.
• Conductive pastes (P2) to (P7) were prepared in the same manner as in Example 1 except that the conductive material [A], rosin [B], and butyl solvate sorb acetate were used in the proportions shown in Table 1. (See Table 1). The viscosity of each conductive paste at 25 ° C., the 10-point average roughness and the volume resistivity of each formed film were measured in the same manner as in Example 1, and the results are also shown in Table 1.
• an adhesive insulating composition (Q1) was prepared in the following manner.
• a SIS block copolymer “Clayton D-1107CP” manufactured by Shell Chemical Co., Ltd. was used.
• the adhesive insulating composition (Q1) was applied so as to be orthogonal to the two electrodes 12a and 12a 'of the multilayer substrate (L) in Fig. 13, and the adhesive was 5mm long, 10mm wide, and 50m thick.
• the insulating substrate 13a was formed to obtain the circuit board 1 (see FIG. 14). Thereafter, the circuit board 1 (see FIG. 14) and the circuit board (M) of FIG. 13 are overlaid as shown in FIG. 2 'got.
• a circuit board and a circuit article were produced and evaluated in the same manner as in Example 5 except that the conductive paste and the adhesive insulating composition were used in the combinations shown in Table 3 and Table 4. The results are shown in Table 3.
• the present invention is suitable for a highly productive circuit and a manufacturing method thereof corresponding to reduction in the size, cost, and cost of electronic components such as RF tags (including contactless ID tags and contactless ID cards).

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Chemical & Material Sciences (AREA)
• Dispersion Chemistry (AREA)
• Spectroscopy & Molecular Physics (AREA)
• Physics & Mathematics (AREA)
• Conductive Materials (AREA)
• Adhesives Or Adhesive Processes (AREA)
• Parts Printed On Printed Circuit Boards (AREA)
• Electric Connection Of Electric Components To Printed Circuits (AREA)
• Combinations Of Printed Boards (AREA)
• Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

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• 2006
  • 2006-04-03 TW TW095111793A patent/TW200707468A/zh not_active IP Right Cessation
  • 2006-04-04 CN CNA2006800068737A patent/CN101133462A/zh active Pending
  • 2006-04-04 WO PCT/JP2006/307133 patent/WO2006109627A1/ja not_active Ceased
  • 2006-04-04 JP JP2007512921A patent/JP5128275B2/ja not_active Expired - Fee Related
  • 2006-04-04 US US11/910,981 patent/US20090071703A1/en not_active Abandoned

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