JP5128275B2 - 導電性ペースト及び回路基板並びに回路物品及びその製造方法 - Google Patents

導電性ペースト及び回路基板並びに回路物品及びその製造方法 Download PDF

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Publication number
JP5128275B2
JP5128275B2 JP2007512921A JP2007512921A JP5128275B2 JP 5128275 B2 JP5128275 B2 JP 5128275B2 JP 2007512921 A JP2007512921 A JP 2007512921A JP 2007512921 A JP2007512921 A JP 2007512921A JP 5128275 B2 JP5128275 B2 JP 5128275B2
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JP
Japan
Prior art keywords
circuit board
circuit
electrode
resin
conductive paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007512921A
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English (en)
Japanese (ja)
Other versions
JPWO2006109627A1 (ja
Inventor
誠 今堀
隆 中谷
雅典 秋田
高正 野上
照郎 多賀井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toagosei Co Ltd
Toray Engineering Co Ltd
Kyoritsu Chemical and Co Ltd
Original Assignee
Toagosei Co Ltd
Toray Engineering Co Ltd
Kyoritsu Chemical and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toagosei Co Ltd, Toray Engineering Co Ltd, Kyoritsu Chemical and Co Ltd filed Critical Toagosei Co Ltd
Priority to JP2007512921A priority Critical patent/JP5128275B2/ja
Publication of JPWO2006109627A1 publication Critical patent/JPWO2006109627A1/ja
Application granted granted Critical
Publication of JP5128275B2 publication Critical patent/JP5128275B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/322—Multilayered die-attach connectors, e.g. a coating on a top surface of a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
JP2007512921A 2005-04-06 2006-04-04 導電性ペースト及び回路基板並びに回路物品及びその製造方法 Expired - Fee Related JP5128275B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007512921A JP5128275B2 (ja) 2005-04-06 2006-04-04 導電性ペースト及び回路基板並びに回路物品及びその製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005110369 2005-04-06
JP2005110369 2005-04-06
PCT/JP2006/307133 WO2006109627A1 (ja) 2005-04-06 2006-04-04 導電性ペースト及び回路基板並びに回路物品及びその製造方法
JP2007512921A JP5128275B2 (ja) 2005-04-06 2006-04-04 導電性ペースト及び回路基板並びに回路物品及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2006109627A1 JPWO2006109627A1 (ja) 2008-11-06
JP5128275B2 true JP5128275B2 (ja) 2013-01-23

Family

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Family Applications (1)

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JP2007512921A Expired - Fee Related JP5128275B2 (ja) 2005-04-06 2006-04-04 導電性ペースト及び回路基板並びに回路物品及びその製造方法

Country Status (5)

Country Link
US (1) US20090071703A1 (https=)
JP (1) JP5128275B2 (https=)
CN (1) CN101133462A (https=)
TW (1) TW200707468A (https=)
WO (1) WO2006109627A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101551758B1 (ko) 2012-12-11 2015-09-09 제일모직주식회사 이방 도전성 필름용 조성물 및 이방 도전성 필름

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JP5114846B2 (ja) * 2006-02-02 2013-01-09 東レ・ファインケミカル株式会社 酸化亜鉛分散ペーストの製造方法
JP5428339B2 (ja) 2007-10-26 2014-02-26 東レ株式会社 平面アンテナおよびその製造方法
KR101204812B1 (ko) * 2009-03-31 2012-11-27 도레이 카부시키가이샤 감광성 도전 페이스트 및 그것을 사용한 디스플레이의 제조 방법, 및 디스플레이
JP2011014656A (ja) * 2009-06-30 2011-01-20 Toshiba Corp 電子機器およびフレキシブルプリント配線板
JP5410176B2 (ja) * 2009-07-02 2014-02-05 株式会社フジクラ メンブレン配線板の製造方法
JP5580701B2 (ja) * 2010-09-13 2014-08-27 日東電工株式会社 ダイシング・ダイボンドフィルム
SG10201913296SA (en) * 2010-11-03 2020-02-27 Frys Metals Inc Sintering materials and attachment methods using same
JP5780147B2 (ja) * 2011-01-06 2015-09-16 スリーボンドファインケミカル株式会社 導電性塗料
CN103597547B (zh) * 2011-03-29 2016-12-21 太阳化学公司 含有蜡触变胶的可高纵横比丝网印刷的厚膜糊剂组合物
EP2571341A4 (en) * 2011-04-27 2013-12-11 Panasonic Corp REUSE PULP, AND METHOD FOR MANUFACTURING THE SAME
US8502391B2 (en) * 2011-12-08 2013-08-06 Stats Chippac, Ltd. Semiconductor device and method of making single layer substrate with asymmetrical fibers and reduced warpage
JP6128495B2 (ja) * 2012-07-04 2017-05-17 パナソニックＩｐマネジメント株式会社 電子部品実装構造体、ｉｃカード、ｃｏｆパッケージ
WO2017219233A1 (en) * 2016-06-21 2017-12-28 3M Innovative Properties Company Self-supporting antenna
US20190355277A1 (en) 2018-05-18 2019-11-21 Aidmics Biotechnology (Hk) Co., Limited Hand-made circuit board
JPWO2023079913A1 (https=) * 2021-11-02 2023-05-11

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JPH10188670A (ja) * 1996-12-27 1998-07-21 Hitachi Chem Co Ltd 扁平状導電性金属粉及びその製造法並びに扁平状導電性金属粉を用いた導電性ペースト
WO2001086716A1 (en) * 2000-05-12 2001-11-15 Matsushita Electric Industrial Co., Ltd. Semiconductor device mounting circuit board, method of producing the same, and method of producing mounting structure using the same
JP2002072468A (ja) * 2000-09-04 2002-03-12 Toyo Ink Mfg Co Ltd 活性エネルギー線硬化型導電性ペースト、それを用いた導体回路および非接触ｉｄ
JP2002094211A (ja) * 2000-07-13 2002-03-29 Ngk Spark Plug Co Ltd 埋め込み樹脂及びそれを用いた配線基板並びにその埋め込み樹脂を用いた配線基板の製造方法
JP2002203427A (ja) * 2000-12-28 2002-07-19 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路板の製造方法、回路板
JP2002204052A (ja) * 2000-12-28 2002-07-19 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路端子の接続方法、接続構造
JP2002226807A (ja) * 2001-01-31 2002-08-14 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた回路接続方法、接続構造体
WO2004038793A1 (ja) * 2002-10-24 2004-05-06 Toray Engineering Company,Limited 非接触ｉｄカード類及びその製造方法

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JP4595471B2 (ja) * 2004-09-30 2010-12-08 住友電気工業株式会社 導電性ペースト、及びそれを用いた多層プリント配線板の製造方法
WO2006070652A1 (ja) * 2004-12-27 2006-07-06 Nec Corporation 半導体装置およびその製造方法と、配線基板およびその製造方法と、半導体パッケージ並びに電子機器

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Publication number Priority date Publication date Assignee Title
JPH10188670A (ja) * 1996-12-27 1998-07-21 Hitachi Chem Co Ltd 扁平状導電性金属粉及びその製造法並びに扁平状導電性金属粉を用いた導電性ペースト
WO2001086716A1 (en) * 2000-05-12 2001-11-15 Matsushita Electric Industrial Co., Ltd. Semiconductor device mounting circuit board, method of producing the same, and method of producing mounting structure using the same
JP2002094211A (ja) * 2000-07-13 2002-03-29 Ngk Spark Plug Co Ltd 埋め込み樹脂及びそれを用いた配線基板並びにその埋め込み樹脂を用いた配線基板の製造方法
JP2002072468A (ja) * 2000-09-04 2002-03-12 Toyo Ink Mfg Co Ltd 活性エネルギー線硬化型導電性ペースト、それを用いた導体回路および非接触ｉｄ
JP2002203427A (ja) * 2000-12-28 2002-07-19 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路板の製造方法、回路板
JP2002204052A (ja) * 2000-12-28 2002-07-19 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路端子の接続方法、接続構造
JP2002226807A (ja) * 2001-01-31 2002-08-14 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた回路接続方法、接続構造体
WO2004038793A1 (ja) * 2002-10-24 2004-05-06 Toray Engineering Company,Limited 非接触ｉｄカード類及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101551758B1 (ko) 2012-12-11 2015-09-09 제일모직주식회사 이방 도전성 필름용 조성물 및 이방 도전성 필름

Also Published As

Publication number Publication date
US20090071703A1 (en) 2009-03-19
TWI319579B (https=) 2010-01-11
CN101133462A (zh) 2008-02-27
WO2006109627A1 (ja) 2006-10-19
TW200707468A (en) 2007-02-16
JPWO2006109627A1 (ja) 2008-11-06

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