WO2006082863A1 - マグネトロンスパッタリング用磁気回路装置及びその製造方法 - Google Patents
マグネトロンスパッタリング用磁気回路装置及びその製造方法 Download PDFInfo
- Publication number
- WO2006082863A1 WO2006082863A1 PCT/JP2006/301694 JP2006301694W WO2006082863A1 WO 2006082863 A1 WO2006082863 A1 WO 2006082863A1 JP 2006301694 W JP2006301694 W JP 2006301694W WO 2006082863 A1 WO2006082863 A1 WO 2006082863A1
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- WIPO (PCT)
- Prior art keywords
- permanent magnet
- magnetic
- side plate
- plate portion
- protective cover
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3452—Magnet distribution
Definitions
- the present invention relates to a magnetic circuit device mounted on a magnetron sputtering apparatus that forms a thin film on a substrate surface and a method for manufacturing the magnetic circuit device.
- a magnetron sputtering apparatus includes a target disposed in a vacuum chamber so as to face the substrate on the anode side, a magnetic circuit device disposed behind the target, and a target so that the target is a force sword. And a high-frequency power source connected to the.
- a vacuum Chiya Nba After introducing, for example, 10- 1 ⁇ 10- 3 Torr (13.33 ⁇ 0.13 Pa) of inert gas, by applying a voltage between the substrate (anode) and the target (Power Sword) A glow discharge occurs to ionize the inert gas, and a magnetic field acts on the secondary electrons emitted from the target at a right angle to cause a cycloid motion on the target surface, causing collisions with gas molecules. Promotes soot, and deposits the target material on the substrate as a neutral atom (thin film).
- the magnetron sputtering system has the advantage that it can be deposited at low temperature because there is no collision of electrons on the substrate where the deposition rate is high, and various alloy thin films can be formed with good reproducibility. Widely used in applications such as manufacturing processes.
- Japanese Patent Application Laid-Open No. 10-46334 forms a closed-loop magnetic field on the surface of a target and a magnetron force sword with a target disposed on the wall of a vacuum vessel in which a substrate is transferred.
- a magnetron magnetic circuit device positioned on the back side of the magnetron force sword, a first mechanism for swinging the magnetic circuit device in parallel with the target and in the substrate transport direction, and a magnetic circuit device in parallel with the target and the substrate Swing in the direction perpendicular to the transport direction
- a sputter deposition apparatus having a second mechanism is disclosed.
- a magnetron magnetic circuit device described in Japanese Patent Application Laid-Open No. 10-46334 includes a rod-shaped central magnet, a rectangular outer peripheral magnet magnetized so that the surface on the target side has a polarity opposite to that of the central magnet, and these magnets. And a flat magnetic yoke plate for supporting.
- Japanese Patent Laid-Open No. 2000-248360 has a film forming chamber (first vacuum chamber) in which a substrate and a target facing the substrate are arranged, and a magnetic field generating mechanism for generating a tunnel-shaped poloidal magnetic field on the surface of the target.
- a magnetron sputtering apparatus is disclosed that includes the magnet chamber (second vacuum chamber) and a drive device that reciprocates the magnetic field generation mechanism in parallel with the target.
- a backing plate and a target are sequentially arranged in the vicinity of the magnetic field generating mechanism, and the knocking plate is connected to a power source for applying a negative potential.
- a high-density plasma is generated on the surface of the target by the magnetic field generation mechanism, the backing plate, and the power source.
- the distance from the surface of the magnetic circuit device (the surface of the permanent magnet) to the target surface should be shortened to increase the strength of the magnetic field generated on the target surface. is required.
- the permanent magnet interferes with the backing plate (or force sword) on the back of the target, and the permanent magnet falls off when it comes into contact with the target. May be damaged.
- the permanent magnet collides with other members due to packing conditions, errors on the ring, etc. There is also a problem that the magnet may fall off or be partially damaged
- the permanent magnet in the magnetic field generating mechanism is fixed to the yoke with an adhesive.
- a gas at a molecular weight of about 300 or less
- the surface of the magnetic circuit device is contaminated, causing defective products.
- the glass transition temperature of the resin that is the main component of the adhesive for example, 150 to 200. It is necessary to heat the entire magnetic circuit device to a temperature above ° C). Therefore, it is not possible to detach only the damaged permanent magnet, and all the permanent magnets will be detached.
- Many large sputtering equipment Since the magnetic circuit device having a number of permanent magnets (for example, 100 or more) is provided, replacement of the permanent magnets is too expensive considering the working number.
- an object of the present invention is to provide a magnetic circuit device for magnetron sputtering in which a permanent magnet can be accurately and detachably mounted, and the permanent magnet is not dropped or damaged during use. It is to provide a manufacturing method.
- the first magnetic circuit device for magnetron sputtering includes an inner permanent magnet array composed of a plurality of permanent magnets arranged in series so as to have magnetic poles of a predetermined polarity on the upper surface, and the inner permanent magnet array.
- An outer permanent magnet array comprising a plurality of permanent magnets surrounding the magnet array and having a magnetic pole having a polarity opposite to that of the inner permanent magnet array on the upper surface; the inner permanent magnet array and the outer permanent magnet array;
- a first side plate portion that is mechanically fixed to the magnetic yoke plate, a second side plate portion that covers the other side surface of the permanent magnet, and both side plate portions are integrally connected together while covering one side surface.
- the top plate Becomes, the permanent magnet by the opposite side plate portions of the protective cover member to feature that it is firmly gripped.
- the magnetic yoke plate has a rectangular parallelepiped permanent magnet on the upper surface. It is preferable to have a recess to receive stones.
- the recess for receiving the permanent magnets constituting the inner permanent magnet row is preferably a central groove, and the recess for receiving the permanent magnets constituting the outer permanent magnet row is preferably an outer peripheral step.
- the first side plate portion of the protective cover member has an outer flange portion having at least one opening, and the lower end portion of each permanent magnet is the magnetic yoke plate.
- the flange portion is fixed to the magnetic yoke plate by a bolt that engages with the opening in a state of being disposed in the recess.
- the magnetic yoke plate has a central groove for receiving the inner permanent magnet row and an outer peripheral step for receiving the outer permanent magnet row on an upper surface.
- the first side plate portion of each protective cover member in the outer permanent magnet row has at least one opening at a position in contact with the upper surface of the magnetic yoke plate.
- the second side plate portion has a length that reaches the horizontal groove and has an inward protrusion at the tip, and the inward protrusion engages with the horizontal groove.
- the outer flange portion of the first side plate portion is fixed to the magnetic yoke plate by a bolt engaged with the opening portion in a state where the permanent magnet is disposed at the outer circumferential step.
- a protrusion that abuts on the upper surface of the permanent magnet may be provided on the inner surface of the upper plate portion of the protective cover member.
- a third magnetron sputtering magnetic circuit device includes an inner permanent magnet array composed of a plurality of permanent magnets connected in series so as to have a magnetic pole of a predetermined polarity on the upper surface, and the inner permanent magnet array.
- An outer permanent magnet array comprising a plurality of permanent magnets surrounded and surrounded by a magnetic pole having a polarity opposite to that of the inner permanent magnet array on the upper surface; and the permanent magnets of the inner permanent magnet array and the outer permanent magnet array
- a magnetic yoke plate that detachably holds, a spacer provided between the inner permanent magnet row and the outer permanent magnet row, and a substantially U-shaped cross section that covers at least one of the permanent magnets.
- Each protective cover member in the outer permanent magnet row has a length that covers at least a part of one side surface of the permanent magnet and the side surface of the magnetic yoke plate.
- the magnetic yoke plate has a central groove for receiving the rectangular parallelepiped permanent magnet in the inner permanent magnet row on the upper surface, and a rectangular parallelepiped in the outer permanent magnet row.
- the first side plate portion of each protective cover member in the inner permanent magnet row has an outer flange portion having at least one opening
- the first side plate portion of each protective cover member in the outer permanent magnet row has at least one opening at a tip portion contacting the side surface of the magnetic yoke plate
- the lower end portion of each permanent magnet is the magnetic yoke.
- the first side plate portion is fixed to the magnetic yoke plate by a bolt engaging with the opening in a state of being arranged in the groove or step of the plate.
- the first side plate portion of each protective cover member in the inner permanent magnet row preferably has a notch for receiving the spacer.
- the protective cover member is preferably formed of an elastically deformable nonmagnetic metal plate. Further, the width W of the permanent magnet and the width W of the inner wall at the open end of both side plates of the protective cover member.
- P o and the inner wall width W of the upper plate portion preferably satisfy the relationship of w> w> w.
- the first method of manufacturing a magnetic circuit device for magnetron sputtering includes an inner permanent magnet row composed of a plurality of permanent magnets arranged in series so as to have magnetic poles of a predetermined polarity on the upper surface, An outer permanent magnet array comprising a plurality of permanent magnets surrounding the inner permanent magnet array and having a magnetic pole having a polarity opposite to that of the inner permanent magnet array on the upper surface is detachably assembled to the magnetic yoke plate.
- A a first side plate portion having an engaging portion with the magnetic yoke plate, a second side plate portion opposed to the first side plate portion, and an upper plate integrally connecting the both side plate portions.
- First and second non-magnetic protective cover members having a substantially U-shaped cross-section, and (b) magnetized in the height direction on the first protective cover member. Then, by inserting at least one permanent magnet so that the upper plate portion side has the same polarity, a first magnet assembly is produced. (C) The second protective cover member is magnetized in the height direction. A second magnet assembly is produced by inserting at least one of the permanent magnets so that the upper plate portion side is opposite in polarity to the first magnet assembly, and (d) The first and second magnet assemblies are each mechanically fixed to the magnetic yoke plate.
- the magnetic yoke plate has a concave portion for receiving the rectangular parallelepiped permanent magnet on an upper surface.
- the recess for receiving the permanent magnet constituting the inner permanent magnet row is preferably a central groove, and the recess for receiving the permanent magnet constituting the outer permanent magnet row is preferably an outer circumferential step.
- the first side plate portion of the protective cover member has an outer flange portion having at least one opening, and the lower end portion of each permanent magnet is connected to the magnetic yoke plate.
- the flange portion is fixed to the magnetic yoke plate with a screw that engages with the opening in a state of being disposed in the recess.
- the magnetic yoke plate has a central groove on the upper surface, an outer peripheral step, and a horizontal groove on the side surface, and the second nonmagnetic protection.
- the cover member has a first side plate portion having an outer flange portion having an engagement portion with the magnetic yoke plate, and a second side plate portion (length reaching the horizontal groove) facing the first side plate portion. And an inwardly protruding portion at the tip) and an upper plate portion integrally connecting the both side plate portions.
- the inner side protrusion of the second side plate is engaged with the horizontal groove of the magnetic yoke plate, and the outer side of the first side plate is disposed in the outer peripheral step.
- the flange portion is mechanically fixed to the magnetic yoke plate. That.
- a third method of manufacturing a magnetic circuit device for magnetron sputtering according to the present invention includes an inner permanent magnet row composed of a plurality of permanent magnets arranged in series so as to have magnetic poles of a predetermined polarity on the upper surface, An outer permanent magnet array composed of a plurality of permanent magnets surrounding the inner permanent magnet array and having a magnetic pole having a polarity opposite to the magnetic pole of the inner permanent magnet array on the upper surface, is connected to the magnetic yoke via a spacer.
- the magnetic plate A substantially cross section comprising a first side plate portion having an engagement portion with a first plate, a second side plate portion facing the first side plate portion, and an upper plate portion integrally connecting the both side plate portions.
- a first U-shaped first non-magnetic protective cover member a first side plate portion having a length reaching the horizontal groove and having an engagement portion with at least one magnetic yoke plate at the tip portion;
- a second non-magnetic protective cover member having a substantially U-shaped cross section comprising a second side plate portion facing the first side plate portion and an upper plate portion integrally connecting the both side plate portions. And (b) inserting at least one permanent magnet magnetized in the height direction into the first protective force bar member so that the upper plate portion side has the same polarity.
- a second magnet assembly is produced by inserting the upper plate portion side so as to have a polarity opposite to that of the first magnet assembly, and (d) a spacer is mechanically fixed to the magnetic yoke plate.
- a method comprising mechanically fixing through the first side plate portion.
- the method of manufacturing the third magnetic circuit device for magnetron sputtering includes an inner permanent magnet row composed of a plurality of permanent magnets arranged in series so as to have magnetic poles of a predetermined polarity on the upper surface, and the inner permanent magnet row. And an outer permanent magnet array composed of a plurality of permanent magnets connected in series so as to have a magnetic pole having a polarity opposite to the magnetic pole of the inner permanent magnet array on the upper surface in a predetermined direction on the upper surface via a spacer.
- a magnetic yoke plate having an extending central groove and an outer peripheral step is detachably assembled.
- A a first side plate portion having an outer flange portion having at least one opening, and the first side plate portion;
- a first non-magnetic protective cover member having a substantially U-shaped cross section comprising a second side plate portion facing each other and an upper plate portion integrally connecting the both side plate portions; and a length reaching the horizontal groove.
- a substantially U-shaped cross section comprising a first side plate portion having one opening, a second side plate portion facing the first side plate portion, and an upper plate portion integrally connecting the both side plate portions.
- C the second protective cover member in the height direction.
- a second magnet assembly is produced by inserting at least one magnetized permanent magnet so that the upper plate portion side is opposite in polarity to the first magnet assembly, and (d) the magnetic magnet (E) a bolt that engages with the opening of the outer flange in a state where the permanent magnet of the first magnet assembly is disposed in the central groove.
- the first magnet assembly is fixed to the magnetic yoke plate by the following: (£) In the state where the permanent magnet of the second magnet assembly is disposed at the outer circumferential step, the opening of the first side plate portion is The second magnet assembly is fixed to the magnetic yoke plate by a bolt that engages with a portion.
- the first protective cover member has a notch for receiving the spacer on at least the first side plate portion.
- the first magnet assembly is preferably fixed to the magnetic yoke plate so that the spacer enters the notch.
- the magnetic circuit device for magnetron sputtering of the present invention at least one permanent magnet is covered with a protective cover member, and the protective cover member is mechanically fixed to the magnetic yoke plate.
- the protective cover member is mechanically fixed to the magnetic yoke plate.
- the magnetic circuit device for magnetron sputtering of the present invention can be manufactured by mechanically fixing a protective cover member fitted with a permanent magnet to a magnetic yoke plate, so that accurate positioning of the permanent magnet is easy. Not only that, but the assembly time can be greatly reduced. In addition, since it is not necessary to use an adhesive, it is possible to maintain a good manufacturing environment.
- FIG. 1 is a plan view showing an example of a magnetic circuit device for magnetron sputtering according to the present invention.
- FIG. 2 is a cross-sectional view taken along line AA in FIG.
- FIG. 3 is an exploded view of FIG. 2 showing a state in which the first and second magnet assemblies are separated from each other by the magnetic yoke plate force.
- FIG. 4 is a cross-sectional view taken along the line BB in FIG.
- FIG. 5 is a cross-sectional view showing an example of a first protective cover member.
- FIG. 6 is a plan view of the first protective cover member shown in FIG.
- FIG. 7 is a cross-sectional view showing another example of the second protective cover member for the outer permanent magnet row.
- FIG. 8 is a cross-sectional view showing still another example of the second protective cover member for the outer permanent magnet row.
- FIG. 9 is a cross-sectional view showing another example of a magnetic circuit device for magnetron sputtering according to the present invention.
- FIG. 10 is a perspective view showing a first protective cover member for the inner permanent magnet array of FIG. 9.
- FIG. 10 is a perspective view showing a first protective cover member for the inner permanent magnet array of FIG. 9.
- FIG. 11 is a perspective view showing a second protective cover member for the outer permanent magnet row of FIG. 9.
- FIG. 12 is a perspective view showing how a permanent magnet is inserted into the second protective cover member for the outer permanent magnet row shown in FIG. 2.
- FIG. 12 is a perspective view showing how a permanent magnet is inserted into the second protective cover member for the outer permanent magnet row shown in FIG. 2.
- FIG. 13 is a perspective view showing how two permanent magnets are inserted into one protective cover member.
- FIG. 14 is a cross-sectional view showing a manufacturing process of the magnetic circuit device of FIG.
- FIG. 15 is a cross-sectional view showing an example of a magnetron sputtering apparatus provided with the magnetic circuit device of the present invention.
- the magnetic circuit device 1 includes a flat magnetic yoke plate 2 whose longitudinal ends are substantially semicircular, and an inner permanent magnet array 3 mechanically fixed to the upper surface of the magnetic yoke plate 2. And an outer permanent magnet row 4.
- the inner permanent magnet array 3 includes a plurality of, for example, rectangular parallelepiped permanent magnets 30 preliminarily magnetized in the height direction, and magnetic poles having a predetermined polarity (for example, S poles) on the upper surface. It is arranged in a straight line so as to have. The lower end portion of each permanent magnet 30 is held in a central groove 21 formed in the longitudinal direction on the magnetic yoke plate 2.
- At least one permanent magnet 30 is covered with a nonmagnetic protective cover member 31, and each protective cover member 31 is mechanically fixed to the upper surface of the magnetic yoke plate 2 with a screw bolt (hereinafter simply referred to as “bolt”) 5 or the like. Has been.
- each protective cover member 31 covers one side surface of the permanent magnet 30 and is fixed to the first side plate portion 31a that is mechanically fixed to the magnetic yoke plate 2.
- the second side plate portion 31b covering the other side surface of the magnet 30 and the upper plate portion 31c integrally connecting the both side plate portions 31a and 31b.
- the first side plate portion 31a has at least one opening 31d.
- the flange 31e is fixed to the magnetic yoke plate 2 by a bolt 5 having an outer flange 31e having an opening 31d. It is.
- the opening 31d is a through hole having a size that allows the threaded portion of the bolt 5 to pass through.
- the upper plate portion 3 is larger than the inner wall width W at the open ends of the side plate portions 31a and 31b of the protective cover member 31.
- the width W is changed to a permanent magnet.
- width W of 30 is slightly larger than the width W of 30, for example, 0 ⁇ W -W ⁇ 0.05 mm, and the width W is permanent magnet 30
- the width W is slightly smaller than the width W, for example, 0 ⁇ W -W ⁇ 0.1 mm. Therefore, W> W> W
- W-W is 0.15 mm at maximum.
- the permanent magnet 30 can be firmly held without adverse effects.
- the distal end portion 31g of the second side plate portion 31b may be slightly expanded as shown in FIG. 5 (c).
- the height H from the bottom surface of the outer flange portion 31e to the inner surface of the upper plate portion 31c is the same as or equal to the height H of the upper surface of the permanent magnet 30 (the portion protruding above the magnetic yoke plate 2). Slightly larger
- H—H O to 0.1 mm.
- the second side plate 31b is
- the length L (see FIG. 6) of the protective cover member 31 is preferably set to be slightly shorter than the length L of the permanent magnet 30 when the single permanent magnet 30 is accommodated (see FIG. 6). 12) and two more
- the permanent magnet 30 is accommodated, it is preferable to set it to 2L or slightly shorter
- the corners of the protective cover member 31 are rounded, but in order to increase the contact area between the inner surface of the protective cover member 31 and the outer surface of the permanent magnet 30, the curvature of the inner peripheral corner portion of the protective cover member 31 is For example, it is preferably 0.5 mm or less.
- the outer permanent magnet row 4 is magnetized in the direction opposite to the permanent magnet 30 (the upper surface side is N pole in the example shown), and the plurality of permanent magnets 40 are connected to the inner permanent magnet row.
- the lower end of each permanent magnet 40 is held by an outer circumferential step 22 formed on the magnetic yoke plate 2.
- At least one permanent magnet 40 is firmly held by the nonmagnetic protective cover member 41, and the outer flange portion 41e of each protective cover member 41 is mechanically fixed to the magnetic yoke plate 2 by bolts 5.
- the shape of the protective cover member 41 that holds the permanent magnet 40 is the same as that of the protective cover except that the inner wall width is larger because the permanent magnet 40 is thicker than the permanent magnet 30.
- the protective cover member 41 mounted near both ends of the magnetic yoke plate 2 has a shape that covers almost the entire surface of each permanent magnet 40.
- W, W and W it is preferable to satisfy the same relationship of W, W and W as the protective cover member 31.
- Permanent magnets 30 and 40 themselves are known ones, and a ferrite sintered magnet is used in the case of a low-priced device, and rare earths are used in a high-priced device that generates a strong magnetic field on the target surface.
- Magnet preferably RTB (R is one or more of rare earth elements including Y, Nd, Pr,
- Dy and Tb forces are group forces. At least one kind selected is essential, and T is Fe or Fe and Co. It is preferable to use an anisotropic RTB-based sintered magnet whose main phase is. During film formation, the temperature of the substrate rises, and the temperature of the vacuum chamber in which the magnetic circuit device is installed also rises, so a heat-resistant anisotropic RTB-based sintering with a coercive force Hcj of 119 S kA'm 1 or more It is particularly preferable to use a magnet.
- the magnetic yoke plate 2 also has a ferromagnetic metal force such as iron and steel.
- a ferromagnetic metal force such as iron and steel.
- a general structural rolled steel (SS40, etc.) or martensitic stainless steel (SUS403, etc.) ) Is preferred.
- the protective cover members 31, 41 need to be non-magnetic in order to prevent a short circuit of magnetic flux generated from the permanent magnets 30, 40.
- the protective cover members 31 and 41 may be formed of a plastic material such as FRP, but a metal such as austenitic stainless steel (for example, SUS304) or aluminum alloy (for example, A6063) that is elastically deformable and highly durable. It is preferred to form the plate by pre-scanning or extruding.
- the thickness of the protective cover members 31 and 41 can be appropriately set depending on the material and size of the permanent magnets 30 and 40. For example, when an anisotropic R-T-B sintered magnet is covered with a metal protective cover member, the thickness is preferably 3 mm or less, particularly 0.5 to 2 mm in order to facilitate elastic deformation.
- the shape of the protective cover member is not limited to the above, and may be the shape shown in FIG. In FIG. 7, parts having the same functions as those in FIGS. 1 to 6 are denoted by the same reference numerals (or the last two digits are the same).
- the magnetic yoke plate 2 has a central groove 21 for receiving the inner permanent magnet row 30 on the upper surface and an outer peripheral step 22 for receiving the outer permanent magnet row 40, and an outer peripheral step on the side surface. 22 has a horizontal groove 23, and the protective cover member 141 has a first side plate portion 141a having an outer flange portion 141e having at least one opening portion 141d at a position in contact with the upper surface of the magnetic yoke plate 2.
- a second side plate portion 141b having an inner protrusion 141 at the tip and an upper plate portion 141c integrally connecting the both side plate portions 141a and 141b, reaching the horizontal groove 23 beyond the lower end of the permanent magnet 40.
- the inward protruding portion 141f can be formed by bending the distal end portion of the second side plate portion 141b at a right angle inside.
- the outer flange 141e of the first side plate 141a is engaged by the screw 5 engaged with the opening 141d in a state where the inner protrusion 1413 ⁇ 4 engages with the horizontal groove 23 and the permanent magnet 40 is disposed at the outer peripheral step 22. Is fixed to the magnetic yoke plate 2. Since the permanent magnet 40 can be more firmly fixed to the magnetic yoke plate 2 by being engaged with the inner protrusion 141i and the horizontal groove 23, the protective cover member 141 can be made thinner.
- a protrusion 241g that contacts the upper surface of the permanent magnet 40 is provided on the inner surface of the upper plate portion 241c of the protective cover member 241.
- the protrusion 241g extends in the longitudinal direction of the protective cover member 241.
- the protrusion 241g can be formed by a method such as embossing. According to this shape, when the permanent magnet 40 inserted into the protective cover member 241 is attached to the outer circumferential step 22 of the magnetic yoke plate 2 and the protective cover member 241 is screwed to the magnetic yoke plate 2, the permanent magnet 40 is Since the protective cover member 4 can be pressed downward, the permanent magnet 40 can be more firmly fixed to the magnetic yoke plate 2.
- the width of the magnetic circuit device is set to, for example, 170 to 200 mm. In order to improve the utilization efficiency of the target by sputtering the target surface as uniformly as possible, the width is set to, for example, about 100 to 120 mm. It is preferable to have a structure in which a large number of magnetic circuit devices (for example, 12 or 14) are arranged. In this narrow-width magnetic circuit device, depending on the material of the target (for example, nonmagnetic metal), it is necessary to generate a high magnetic flux density on the surface of the target. ⁇ It is considered to fix the permanent magnets 30 and 40 to the magnetic yoke plate 2.
- the protective cover member 331 of the inner permanent magnet row 3 has a substantially U-shaped cross section, and is a first side plate that covers one side surface of the permanent magnet 30. It comprises a portion 331a, a second side plate portion 331b that covers the other side surface of the permanent magnet 30, and an upper plate portion 331c that integrally connects the side plate portions 331a and 331b.
- the first side plate portion 331a has an outer flange portion 331e at the tip, and the first side plate portion 331a and the outer flange portion 331e are provided with a notch 33 If for receiving the spacer 6.
- the outer flange portion 331e is provided with a bolt opening 331d.
- the second side plate portion 331b is shortened to a height at which the spacer 6 is received. Since the protective cover member 331 prevents the interference with the spacer 6 by the notch 331f and the short second side plate portion 331b, the inner permanent magnet row 3 and the outer permanent magnet row 4 are arranged at a narrow interval. Make it possible to install.
- the protective cover member 341 of the outer permanent magnet row 4 is close to an L shape, has a substantially U-shaped cross section, and one side surface of the permanent magnet 40 is The first side plate portion 341a to be covered, the second side plate portion 341b to cover the other side surface of the permanent magnet 40, and the upper plate portion 341c for integrally connecting the both side plate portions 341a and 341b.
- the first side plate portion 341a has a length that covers at least a part of the side surface of the magnetic yoke plate 2, and has an opening 341d for the bolt 52 at the tip.
- the second side plate portion 341b is shortened to a height at which the spacer 6 is received. Since the lower end portion of the first side plate portion 341a is fastened to the side surface of the magnetic yoke plate 2 in the protective cover member 341, the permanent magnet 40 can be firmly fixed to the magnetic yoke plate 2.
- the permanent magnets 30 and 40 are damaged by interference (collision) with other members. Opportunities are greatly reduced, and the angle between the permanent magnets 30, 40 and the magnetic yoke plate 2 is maintained at a right angle, so that the permanent magnets 30, 40 can be prevented from falling. Further, since the protective cover member 341 attached to the outer peripheral side of the magnetic yoke plate 2 does not have an outer flange portion, the permanent magnet The distance between the stone 30 and the permanent magnet 40 can be reduced (for example, 5 to 15 mm).
- FIG. 10 (b) shows another example of the protective cover member of the inner permanent magnet row 3.
- this protective cover member 431 not only the first side plate portion 431a but also the second side plate portion 431b are provided with notches 431f and 431g for receiving the spacers 6 and 6, respectively.
- the part 431b extends to the vicinity of the upper surface of the magnetic yoke plate 2.
- FIG. 11 (b) shows another example of the protective cover member of the outer permanent magnet row 4.
- the second side plate portion 441b has a notch 441 for receiving the spacer 6 and extends to the vicinity of the upper surface of the magnetic yoke plate 2.
- the permanent magnet 40 is inserted into the protective cover member 41. As shown in FIG. 12 (c), the jig 8 is removed after the permanent magnet 40 is inserted.
- the both side plate portions 41a and 41b are elastically deformed so as to expand slightly, so that they are pressed against the outer surface of the permanent magnet 40 by elastic restoring force. Accordingly, the permanent magnet 40 is firmly fixed to the protective cover member 41 until the adhesive is used.
- the following advantages can also be obtained by using a protective cover member. In other words, when magnetized permanent magnets are placed adjacent to each other with the same polarity, accurate positioning is not easy due to magnetic repulsion. Even if a jig is used, it is necessary to increase the force to hold the permanent magnet, which may damage the permanent magnet itself.
- each permanent magnet it is easy to insert into each protective cover member, and even if the protective cover member is gripped with a jig, the permanent magnet will not be damaged.
- Use makes it very easy to attach the permanent magnet to the magnetic yoke plate.
- the protective cover member it becomes easy to attach the permanent magnet to the magnetic yoke plate accurately (at right angles and in a straight line), so that the accuracy of the magnetic circuit device is improved and the manufacturing cost is reduced. Acupuncture can be achieved.
- FIG. 13 shows a case where two permanent magnets 40, 40 are inserted into one protective cover member 41.
- the length L of the protective cover member 41 is preferably set to be twice or more the length LP of the permanent magnet 40. Inserting two or more permanent magnets 40, 40 into one protective cover member 41 has the advantage that the work of attaching the protective cover member to the magnetic yoke plate 2 is shortened. Adjacent permanent magnets 40 and 40 repel each other, but the repulsive force of a thin permanent magnet is relatively small. Therefore, it is relatively easy to insert the two permanent magnets 40 and 40 into the protective cover member 41. Is possible.
- the inner permanent magnet row 3 and the outer permanent magnet row 4 are relatively separated from each other, so any of them may be attached to the magnetic yoke plate 2 first.
- the permanent magnet 30 is first inserted into the protective force bar member 31 to produce a first magnet assembly
- the permanent magnet 40 is inserted into the protective force bar member 41 to produce a second magnet assembly.
- the lower end of each permanent magnet 30 is magnetically attracted to the central groove 21 of the magnetic yoke plate 2, and the first magnet assembly is aligned along the central groove 21.
- the permanent magnet 40 is magnetically attracted to the outer circumferential step 22 of the magnetic yoke plate 2, and the second magnet assembly is aligned along the outer circumferential step 22.
- the outer permanent magnet row 4 is assembled by fixing all the protective cover members 41 to the magnetic yoke plate 2 with bolts. Of course, the outer permanent magnet row 4 can be assembled first.
- FIG. 14 shows an example of a method for manufacturing the magnetic circuit device according to the fourth embodiment shown in FIG.
- the spacers 6 and 6 are fixed to the magnetic yoke plate 2 by screwing the bolts 51 into the screw holes 26 [step (a)].
- the first magnet assembly formed by inserting the permanent magnet 30 into the protective cover member 31 is placed in the central groove 21 between the spacers 6 and 6, and the outer flange portion 31e of the protective cover member 31 is mounted. Fix to magnetic yoke plate 2 with bolt 5 [step (b)].
- the second magnet assembly formed by inserting the permanent magnet 40 into the protective cover member 41 is placed on the outer circumferential step 22, and the second side plate portion 41 b is fixed to the side surface of the magnetic yoke plate 2 with the bolt 52 [Process ( c)]. Finally, the remaining second magnet assembly is placed on the other outer circumferential step 22, and the second side plate portion 41 b is fixed to the side surface of the magnetic yoke plate 2 with the bolt 52 [step (d)].
- FIG. 15 shows a magnetron sputtering apparatus 100 including the magnetic circuit device 1 shown in FIG. Although not shown, a plurality (for example, six) of magnetic circuit devices 1 are installed in a direction perpendicular to the paper surface.
- the sputtering apparatus 100 includes a magnetic circuit device 1, a force sword 102 disposed near the magnetic circuit device 1, a target 103 in contact with the force sword 102, and a substrate 104. 103 and an anode 105 arranged at a position facing the same.
- the vacuum chamber 101 has a working gas inlet 101a connected to working gas supply means (not shown) and an exhaust outlet 101b connected to a vacuum pump (not shown).
- the vacuum chamber 101 is set to the ground potential, and the magnetic circuit device 1 and the force sword 102 are set to the same potential. Force sword 102 and anode 105 are each connected to DC voltage source 106. It is. The substrate 104 is transported between the target 103 and the anode 105.
- the distance between the two is appropriately set according to the size of the substrate 104 and the like. For example, in the case of the 7th to 8th generation substrates, this distance is generally set in the range of 50 to 60 mm. Even if the distance between the top surface of the magnetic circuit device 1 and the bottom surface of the force sword 102 is as narrow as several millimeters, the permanent magnet is covered with the protective cover member, so that the permanent magnet is prevented from being damaged during assembly. be able to.
- the film can be formed on the surface of the substrate 104 as follows.
- the vacuum chamber 101 as well as evacuation, introducing a working gas comprising an inert gas (e.g. Ar, Ar + N or Ar + O), 101
- a working gas comprising an inert gas (e.g. Ar, Ar + N or Ar + O)
- a negative voltage for example, ⁇ 300 V to ⁇ 800 V
- a glow discharge is performed.
- ions in the plasma collide with the surface of the target 103, and secondary electrons emitted at that time are captured by the magnetic field, and an elongated annular high-density plasma is formed along the magnetic field.
- the ion force in the high-density plasma collides with the S target 103, the substance in the target scatters, and the particles adhere to the surface of the substrate 104 to form a thin film.
- the magnetron sputtering apparatus 100 is preferably configured as follows. In other words, when the film is formed, the density of the high-density plasma increases at the position where the magnetic field component perpendicular to the surface of the target 103 is zero. A region is formed. Therefore, a driving device (not shown) is provided on the back side of the magnetic circuit device 1, and the magnetic circuit device 1 is translated in a plane parallel to the target 103, and the movement pitch is equal to or less than that of the high-density plasma. By using this pitch, the utilization efficiency of the target 103 is improved. With this configuration, the time during which the surface of the target 103 can be exposed to high-density plasma is averaged, so that a uniform erosion region is formed on the surface of the target 103.
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Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007501599A JP4924835B2 (ja) | 2005-02-02 | 2006-02-01 | マグネトロンスパッタリング用磁気回路装置及びその製造方法 |
KR1020077014470A KR101243068B1 (ko) | 2005-02-02 | 2006-02-01 | 마그네트론 스퍼터링용 자기 회로 장치 및 그 제조 방법 |
Applications Claiming Priority (2)
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JP2005026389 | 2005-02-02 | ||
JP2005-026389 | 2005-02-02 |
Publications (1)
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WO2006082863A1 true WO2006082863A1 (ja) | 2006-08-10 |
Family
ID=36777247
Family Applications (1)
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PCT/JP2006/301694 WO2006082863A1 (ja) | 2005-02-02 | 2006-02-01 | マグネトロンスパッタリング用磁気回路装置及びその製造方法 |
Country Status (5)
Country | Link |
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JP (1) | JP4924835B2 (ja) |
KR (1) | KR101243068B1 (ja) |
CN (1) | CN101107381A (ja) |
TW (1) | TWI400349B (ja) |
WO (1) | WO2006082863A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009209385A (ja) * | 2008-02-29 | 2009-09-17 | Fujitsu Ltd | マグネトロンスパッタ装置用磁石ユニット及び磁石着脱方法 |
JP2009235497A (ja) * | 2008-03-27 | 2009-10-15 | Shinmaywa Industries Ltd | スパッタリング装置 |
JP2015509138A (ja) * | 2011-12-09 | 2015-03-26 | シーゲイト テクノロジー エルエルシー | 交換可能な磁石パック |
EP3108027A4 (en) * | 2014-02-20 | 2017-08-30 | Intevac, Inc. | Sputtering system and method for highly magnetic materials |
Families Citing this family (9)
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JP5461264B2 (ja) * | 2010-03-25 | 2014-04-02 | キヤノンアネルバ株式会社 | マグネトロンスパッタリング装置、及び、スパッタリング方法 |
US10573500B2 (en) | 2011-12-09 | 2020-02-25 | Seagate Technology Llc | Interchangeable magnet pack |
CN102978725A (zh) * | 2012-12-03 | 2013-03-20 | 吴江市东飞化纤有限公司 | 化纤干燥装置 |
CN105632855B (zh) * | 2014-10-28 | 2018-05-25 | 北京北方华创微电子装备有限公司 | 一种磁控管及半导体加工设备 |
KR101694197B1 (ko) * | 2015-03-25 | 2017-01-09 | 주식회사 에스에프에이 | 스퍼터 장치 |
JP2019030063A (ja) * | 2017-07-26 | 2019-02-21 | Tdk株式会社 | 磁石構造体及びモータ |
CN111996505B (zh) * | 2020-07-10 | 2023-07-14 | 包头稀土研究院 | 磁控溅射铁磁性靶材的装置 |
KR102412882B1 (ko) * | 2020-10-30 | 2022-06-27 | (주)울텍 | 스퍼터 건용 마그넷 모듈 |
KR102340351B1 (ko) * | 2021-05-26 | 2021-12-16 | 고영효 | 마그네트론 스퍼터링 장치의 자기회로 및 그 제조 방법 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62142765A (ja) * | 1985-12-17 | 1987-06-26 | Rohm Co Ltd | マグネトロンスパツタにおける膜厚調整方法 |
JPS6310595A (ja) * | 1986-07-02 | 1988-01-18 | 松下電器産業株式会社 | 筐体取付装置 |
JPH0569158U (ja) * | 1992-02-27 | 1993-09-17 | 株式会社トーキン | スパッタリング装置用磁気回路 |
JPH05239640A (ja) * | 1991-08-02 | 1993-09-17 | Anelva Corp | スパッタリング装置 |
JPH08325726A (ja) * | 1995-05-29 | 1996-12-10 | Hitachi Ltd | カソード電極 |
JPH0925573A (ja) * | 1995-06-28 | 1997-01-28 | Daewoo Electron Co Ltd | スパッタリング装置 |
JPH1021978A (ja) * | 1996-06-28 | 1998-01-23 | Nippon Antenna Co Ltd | 同軸ケーブル固着部品 |
JP2001299604A (ja) * | 2000-04-20 | 2001-10-30 | Toto Ltd | 洗面化粧台 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2555004B2 (ja) * | 1993-12-30 | 1996-11-20 | アネルバ株式会社 | スパッタリング装置 |
JPH10317137A (ja) * | 1997-05-13 | 1998-12-02 | Fuji Elelctrochem Co Ltd | マグネット取付装置 |
JPH1136068A (ja) * | 1997-07-17 | 1999-02-09 | Sony Corp | スパッタリング用カソードマグネット取付け構造 |
JPH11340165A (ja) * | 1998-05-20 | 1999-12-10 | Applied Materials Inc | スパッタリング装置及びマグネトロンユニット |
EP1211332A4 (en) * | 1999-07-02 | 2004-09-01 | Applied Materials Inc | MAGNETIC UNIT AND SPRAYER |
JP3965479B2 (ja) * | 2003-07-28 | 2007-08-29 | 株式会社エフ・ティ・エスコーポレーション | 箱型対向ターゲット式スパッタ装置及び化合物薄膜の製造方法 |
-
2006
- 2006-02-01 WO PCT/JP2006/301694 patent/WO2006082863A1/ja not_active Application Discontinuation
- 2006-02-01 KR KR1020077014470A patent/KR101243068B1/ko not_active IP Right Cessation
- 2006-02-01 JP JP2007501599A patent/JP4924835B2/ja not_active Expired - Fee Related
- 2006-02-01 CN CNA2006800026734A patent/CN101107381A/zh active Pending
- 2006-02-03 TW TW095103754A patent/TWI400349B/zh not_active IP Right Cessation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62142765A (ja) * | 1985-12-17 | 1987-06-26 | Rohm Co Ltd | マグネトロンスパツタにおける膜厚調整方法 |
JPS6310595A (ja) * | 1986-07-02 | 1988-01-18 | 松下電器産業株式会社 | 筐体取付装置 |
JPH05239640A (ja) * | 1991-08-02 | 1993-09-17 | Anelva Corp | スパッタリング装置 |
JPH0569158U (ja) * | 1992-02-27 | 1993-09-17 | 株式会社トーキン | スパッタリング装置用磁気回路 |
JPH08325726A (ja) * | 1995-05-29 | 1996-12-10 | Hitachi Ltd | カソード電極 |
JPH0925573A (ja) * | 1995-06-28 | 1997-01-28 | Daewoo Electron Co Ltd | スパッタリング装置 |
JPH1021978A (ja) * | 1996-06-28 | 1998-01-23 | Nippon Antenna Co Ltd | 同軸ケーブル固着部品 |
JP2001299604A (ja) * | 2000-04-20 | 2001-10-30 | Toto Ltd | 洗面化粧台 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009209385A (ja) * | 2008-02-29 | 2009-09-17 | Fujitsu Ltd | マグネトロンスパッタ装置用磁石ユニット及び磁石着脱方法 |
US8157974B2 (en) | 2008-02-29 | 2012-04-17 | Fujitsu Limited | Magnet unit for magnetron sputtering system |
JP2009235497A (ja) * | 2008-03-27 | 2009-10-15 | Shinmaywa Industries Ltd | スパッタリング装置 |
JP2015509138A (ja) * | 2011-12-09 | 2015-03-26 | シーゲイト テクノロジー エルエルシー | 交換可能な磁石パック |
EP3108027A4 (en) * | 2014-02-20 | 2017-08-30 | Intevac, Inc. | Sputtering system and method for highly magnetic materials |
Also Published As
Publication number | Publication date |
---|---|
KR101243068B1 (ko) | 2013-03-13 |
KR20070102497A (ko) | 2007-10-18 |
JPWO2006082863A1 (ja) | 2008-06-26 |
TW200641173A (en) | 2006-12-01 |
TWI400349B (zh) | 2013-07-01 |
CN101107381A (zh) | 2008-01-16 |
JP4924835B2 (ja) | 2012-04-25 |
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