TW200641173A - Magnetic loop device for magnetron sputtering - Google Patents

Magnetic loop device for magnetron sputtering

Info

Publication number
TW200641173A
TW200641173A TW095103754A TW95103754A TW200641173A TW 200641173 A TW200641173 A TW 200641173A TW 095103754 A TW095103754 A TW 095103754A TW 95103754 A TW95103754 A TW 95103754A TW 200641173 A TW200641173 A TW 200641173A
Authority
TW
Taiwan
Prior art keywords
permanent magnets
side plate
column
magnetic
internal
Prior art date
Application number
TW095103754A
Other languages
Chinese (zh)
Other versions
TWI400349B (en
Inventor
Hiroaki Yuasa
Yoshihiko Kuriyama
Original Assignee
Neomax Co Ltd
Neomax Kiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neomax Co Ltd, Neomax Kiko Co Ltd filed Critical Neomax Co Ltd
Publication of TW200641173A publication Critical patent/TW200641173A/en
Application granted granted Critical
Publication of TWI400349B publication Critical patent/TWI400349B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The magnetic loop device for magnetron sputtering of this invention comprises: internal permanent magnet columns 3 formed by a plurality of permanent magnets 30 arranged successively with the magnetic pole having predetermined polarity at upper side; external permanent magnet columns 4 encircling the internal permanent magnet column 3, which are formed by a plurality of permanent magnets 40 arranged successively with the magnetic pole having reverse polarity to that of the internal permanent magnets column 3 at upper side; magnetic yoke plates 2 which are used to hold the permanent magnets 30, 40 of the internal permanent magnets column 3 and the external permanent magnets column 4 in free-loading and unloading way; and non-magnetic protective cover members 31, 41 having approximate-shaped section, which are used to cover the permanent magnets 30, 40 one by one, each protective cover members 31, 41 including a first side plate 31a, 41a which covers one side face of the permanent magnets 30, 40, a second side plate 31b, 41b which covers the other side face of the permanent magnets 30, 40, and a upper plate 31c, 41c integrally connecting both the side plate 31a,41a and the side plate 31b, 41b, the permanent magnets 30, 40 being securely holded by the side plate 31a, 41a and the side plate 31b, 41b of each protective cover members 31, 41.
TW095103754A 2005-02-02 2006-02-03 Magnetic loop device for magnetron sputtering TWI400349B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005026389 2005-02-02

Publications (2)

Publication Number Publication Date
TW200641173A true TW200641173A (en) 2006-12-01
TWI400349B TWI400349B (en) 2013-07-01

Family

ID=36777247

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095103754A TWI400349B (en) 2005-02-02 2006-02-03 Magnetic loop device for magnetron sputtering

Country Status (5)

Country Link
JP (1) JP4924835B2 (en)
KR (1) KR101243068B1 (en)
CN (1) CN101107381A (en)
TW (1) TWI400349B (en)
WO (1) WO2006082863A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425108B (en) * 2010-03-25 2014-02-01 Canon Anelva Corp Magnetron sputtering device and sputtering method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5012571B2 (en) 2008-02-29 2012-08-29 富士通株式会社 Magnet unit for magnetron sputtering equipment
JP2009235497A (en) * 2008-03-27 2009-10-15 Shinmaywa Industries Ltd Sputtering system
US20160133445A9 (en) * 2011-11-04 2016-05-12 Intevac, Inc. Sputtering system and method for highly magnetic materials
US10573500B2 (en) 2011-12-09 2020-02-25 Seagate Technology Llc Interchangeable magnet pack
US9347129B2 (en) * 2011-12-09 2016-05-24 Seagate Technology Llc Interchangeable magnet pack
CN102978725A (en) * 2012-12-03 2013-03-20 吴江市东飞化纤有限公司 Chemical fiber drying device
CN105632855B (en) * 2014-10-28 2018-05-25 北京北方华创微电子装备有限公司 A kind of magnetron and semiconductor processing equipment
KR101694197B1 (en) * 2015-03-25 2017-01-09 주식회사 에스에프에이 Apparatus to sputter
JP2019030063A (en) * 2017-07-26 2019-02-21 Tdk株式会社 Magnet structure and motor
CN111996505B (en) * 2020-07-10 2023-07-14 包头稀土研究院 Device for magnetron sputtering ferromagnetic target
KR102412882B1 (en) * 2020-10-30 2022-06-27 (주)울텍 The margnet module for sputter gun
KR102340351B1 (en) * 2021-05-26 2021-12-16 고영효 Magnetic Circuit of Magnetron Sputtering Apparatus and Method of Manufacture Thereof

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JPH0726202B2 (en) * 1985-12-17 1995-03-22 ローム株式会社 Film thickness adjustment method in magnetron sputtering
JPH0719982B2 (en) * 1986-07-02 1995-03-06 松下電器産業株式会社 Case mounting device
KR950000906B1 (en) * 1991-08-02 1995-02-03 니찌덴 아넬바 가부시기가이샤 Sputtering apparatus
JP2555004B2 (en) * 1993-12-30 1996-11-20 アネルバ株式会社 Sputtering equipment
JP2571817Y2 (en) * 1992-02-27 1998-05-20 株式会社トーキン Magnetic circuit for sputtering equipment
JPH08325726A (en) * 1995-05-29 1996-12-10 Hitachi Ltd Cathode
KR970002891A (en) * 1995-06-28 1997-01-28 배순훈 Sputtering device for thin film deposition
JPH1021978A (en) * 1996-06-28 1998-01-23 Nippon Antenna Co Ltd Coaxial cable fixing part
JPH10317137A (en) * 1997-05-13 1998-12-02 Fuji Elelctrochem Co Ltd Magnet attaching device
JPH1136068A (en) * 1997-07-17 1999-02-09 Sony Corp Cathode magnet mounting structure for sputtering
JPH11340165A (en) * 1998-05-20 1999-12-10 Applied Materials Inc Sputtering device and magnetron unit
EP1211332A4 (en) * 1999-07-02 2004-09-01 Applied Materials Inc Magnetron unit and sputtering device
JP2001299604A (en) * 2000-04-20 2001-10-30 Toto Ltd Washstand dressing table
JP3965479B2 (en) * 2003-07-28 2007-08-29 株式会社エフ・ティ・エスコーポレーション Box type opposed target type sputtering apparatus and compound thin film manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425108B (en) * 2010-03-25 2014-02-01 Canon Anelva Corp Magnetron sputtering device and sputtering method

Also Published As

Publication number Publication date
KR101243068B1 (en) 2013-03-13
KR20070102497A (en) 2007-10-18
JPWO2006082863A1 (en) 2008-06-26
WO2006082863A1 (en) 2006-08-10
TWI400349B (en) 2013-07-01
CN101107381A (en) 2008-01-16
JP4924835B2 (en) 2012-04-25

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees