CN105632855B - A kind of magnetron and semiconductor processing equipment - Google Patents
A kind of magnetron and semiconductor processing equipment Download PDFInfo
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- CN105632855B CN105632855B CN201410593234.1A CN201410593234A CN105632855B CN 105632855 B CN105632855 B CN 105632855B CN 201410593234 A CN201410593234 A CN 201410593234A CN 105632855 B CN105632855 B CN 105632855B
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Abstract
The present invention provides a kind of magnetron and magnetron sputtering apparatus, including multiple magnets and the first backboard, for fixing multiple magnets on it with default arrangement mode, each magnet of stating is directly anchored to using detachable connection on first backboard first backboard.Magnetron provided by the invention, magnetic pole therein can be not only convenient for assembling with direct-assembling on first baffle, but also can reduce built-up time；In addition, the magnetic pole in the magnetron will not fall off, and can reuse, so as to avoid the waste of magnet, and then can increase economic efficiency.
Description
Technical field
The invention belongs to microelectronic processing technique fields, and in particular to a kind of magnetron and semiconductor body process equipment.
Background technology
Magnetron sputtering apparatus is to be collided by the particle in plasma and target with the material that will be sputtered from target
Material is deposited on the equipment that film is formed on workpiece to be machined.In practical applications, in order to improve the profit of the efficiency of sputtering and target
With rate, magnetron is equipped at the back of target, increases the run duration of electronics using magnetic field caused by magnetron, to increase electricity
Son and the probability of process gas (such as argon gas) collision so as to improve the density of plasma, and then improve the efficiency and target of sputtering
The utilization rate of material.
Fig. 1 is the structure diagram of the reaction chamber of typical magnetron sputtering apparatus.Referring to Fig. 1, reaction chamber 10 wraps
Pallet 11, target 12 and magnetron 13 are included, wherein, pallet 11 is arranged on the bottom of reaction chamber, for carrying substrates S, target
12 are arranged on the top of reaction chamber 10, and the surface of the positive ion bombardment target 12 in the indoor plasma of reaction chamber makes target
The atom effusion on 12 surfaces, deposition is on the surface of the substrate；Magnetron 13 generally includes more in the back side of target 12, magnetron 13
A magnetic pole 131, when installing magnetron, each magnetic pole 131 is usually only by magnetic-adsorption using two made of permeability magnetic material
Between backboard, still, larger due to interacting between magnetic pole 131, magnetic pole 131 is easily drawn onto in other magnetic poles 131, this is not
Only causing to arrange multiple magnetic poles, to need to expend the time very long, and the finger for be easy to causeing operating personnel is jammed.For this purpose, as schemed
Shown in 2, it is provided in each magnetic pole 131 and for fixing between the backboard 132 of multiple magnetic poles 131 using made of permeability magnetic material
Fixed plate 133 is fixed between magnetic pole 131 and fixed plate 133 by seccotine, the surface that fixed plate 133 and backboard 132 are in contact
Upper be correspondingly arranged on respectively on internal perisporium has threaded recess portion and through hole, and the through hole and recess portion screw thread are passed through by screw 134
Connection, to realize that backboard 132 is fixed with magnetic pole 131.
However, it still can inevitably be had the following problems in practical applications using above-mentioned magnetron：
First, since magnetron 13 needs to be immersed in deionization cooling water, and adopted between fixed plate 133 and magnetic pole 131
It is fixed with seccotine, the bonding of seccotine is uneven and seccotine can cause seccotine in reasons such as deionization cooling water immersions
Cohesive force declines, therefore, stronger in the magnetic field of magnetic pole 131, and the mutually absorption between magnetic pole 131 is larger to be easy to cause
The phenomenon that magnetic pole 131 comes off.For this reason, it may be necessary to which fixed plate 133 is disassembled, magnetic pole 131 is first bonded in fixed plate 133 again
On, then fixed plate 133 is fixed on backboard 132, and due to being bonded with seccotine in magnetic pole 131, multiplicating reuses
Seccotine can cause strength gluing knot less magnetic pole 131 uniformly to be caused to be easier to come off, and therefore, be repeated after magnetic pole 131 comes off
It cannot be recycled discarded using after certain number, so as to the waste of magnetic pole 131；
Second, due to seccotine to be reached cementation, it is necessary to smear seccotine 24 it is small when after could use, because
This causes the time of assembling magnetron long.
The content of the invention
It is contemplated that at least solve one of technical problem in the prior art, it is proposed that a kind of magnetron and magnetic control
Sputtering equipment, the magnetic pole in magnetron can be assembled directly with the first backboard, be not only convenient for assembling, but also can reduce group
ETL estimated time of loading；In addition, the magnet in the magnetron will not fall off, and can reuse, so as to avoid the waste of magnet, into
And it can increase economic efficiency.
One of in order to solve the above problem, it is described including multiple magnets and the first backboard the present invention provides a kind of magnetron
For first backboard for fixing multiple magnets on it with default arrangement mode, each magnet is straight using detachable connection
It connects and is fixed on first backboard.
Wherein, the detachable connection includes thread connecting mode.
Wherein, through hole and recess portion are correspondingly arranged on respectively on the surface being in contact in first backboard and the magnet,
The madial wall of the recess portion is provided with screw thread, is threadedly coupled by screw through the through hole with the recess portion, to realize institute
Magnet is stated to be fixed on first backboard.
Wherein, the through hole is reducing hole, and is matched with the screw, so that the screw is located in the through hole.
Wherein, it is correspondingly arranged on and is mutually matched respectively on the surface being in contact in first backboard and each magnet
Protrusion and recess portion；Alternatively, mutual is correspondingly arranged on respectively on the surface being in contact in first backboard and the magnet
Screw thread is both provided on the madial wall of the recess portion matched somebody with somebody and protrusion, the lateral wall of the protrusion and the recess portion, it is described convex to realize
Portion is threadedly coupled with the recess portion.
Wherein, the protrusion and the recess portion correspond to the central shaft setting of each magnet；Alternatively, the protrusion or institute
State the central shaft setting that recess portion deviates each magnet.
Wherein, the through hole and the recess portion correspond to the central shaft setting of each magnet；Alternatively, the through hole or institute
State the central shaft setting that recess portion deviates each magnet.
Wherein, each magnet formed by sleeve, with sleeve enclosure space upper cover plate and lower cover, in enclosure space
The magnetic material composition of interior setting；Wherein, the bush material un-conducted magnetic material is made, and the upper cover plate and lower cover are used and led
Magnetic material is made；The upper cover plate or lower cover of each magnet are fixed with first backboard.
Wherein, corresponding each magnet, further includes using the second backboard made of permeability magnetic material, the magnet not with institute
It states and is formed with protrusion on the fixed upper cover plate of the first backboard or lower cover, be provided on second backboard and the protrusion pair
The through hole answered, the top end face of the protrusion through the through hole, and with the upper surface flush with each other of second backboard.
It is described including target and the magnetron being arranged above target the present invention also provides a kind of magnetron sputtering apparatus
Magnetron uses the magnetron of the above-mentioned offer of the present invention.
The invention has the advantages that：
Magnetron provided by the invention is directly anchored to the first backboard by each magnet using detachable connection
On, multiple magnets are fixed with default arrangement mode on the first backboard to realize, successively will only be needed when assembling the magnetron
Each magnet is directly anchored on the first backboard, therefore, magnetron provided by the invention compared with prior art, not only just
In assembling, so as to reduce built-up time；In addition, the magnet in the magnetron will not fall off, and can reuse, so as to
Can be to avoid the waste of magnet, and then can increase economic efficiency.
Magnetron sputtering apparatus provided by the invention by using above-mentioned magnetron provided by the invention, can not only subtract
The built-up time of skinny device, but also the input cost of equipment can be reduced, so as to increase economic efficiency.
Description of the drawings
Fig. 1 is the structure diagram of the reaction chamber of typical magnetron sputtering apparatus；
Fig. 2 is the structure diagram figure of magnetron in Fig. 1；
Fig. 3 is the structure diagram for the magnetron that first embodiment of the invention provides；
Fig. 4 is the structure diagram of magnet in Fig. 3；
Fig. 5 is the structure diagram of the first backboard in Fig. 3；
Fig. 6 is another structure diagram of magnet in Fig. 3；
Fig. 7 is the structure diagram of corresponding first backboard of magnet shown in Fig. 6；
Fig. 8 is a kind of structure diagram for magnetron that second embodiment of the invention provides；
Fig. 9 is the structure diagram for another magnetron that second embodiment of the invention provides.
Specific embodiment
For those skilled in the art is made to more fully understand technical scheme, come below in conjunction with the accompanying drawings to the present invention
The magnetron and magnetron sputtering apparatus of offer are described in detail.
Fig. 3 is the structure diagram for the magnetron that first embodiment of the invention provides.Fig. 4 is that the structure of magnet in Fig. 3 is shown
It is intended to.Fig. 5 is the structure diagram of the first backboard in Fig. 3.Also referring to Fig. 3, Fig. 4 and Fig. 5, magnetic control provided in this embodiment
Pipe, including multiple 20 and first backboards 21 of magnet, the first backboard 21 is on it with the multiple magnets of default arrangement mode fixation
20, each magnet 20 is directly anchored to using detachable connection on the first backboard 21, specifically, in the present embodiment, can
Dismantling connection mode is thread connecting mode, is correspondingly arranged on respectively on the surface being in contact in the first backboard 21 and magnet 20 logical
Hole 211 and recess portion 205, the madial wall of recess portion 205 are provided with screw thread, connect by screw 23 through through hole 211 and 205 screw thread of recess portion
It connects, magnet 20 is fixed on the first backboard 21 with realizing.
Preferably, through hole 211 is reducing hole, and is matched with screw 23, so that screw 23 is located in through hole, such as Fig. 3 institutes
Show, through hole 211 is inverted " t " type through hole, and screw 23 is located in through hole 211.Certainly, in practical applications, through hole 211 or
Clear opening, in this case, the stud 231 of screw 23 are threadedly coupled through the clear opening with recess portion 205, the diameter of screw 23
Head of screw 232 more than stud 231 is stuck on the end face of through hole 211.
In the present embodiment, through hole 211 and recess portion 205 correspond to the central shaft 206 of each magnet 20 and set, in addition, first
The through hole 211 that quantity is more than magnet 20 is provided on backboard 21, coarse adjustment can be carried out to the position of magnet 20, as shown in Figure 5.
In practical applications, it is also possible that the central shaft 206 that through hole 211 or recess portion 205 deviate each magnet is set, such as
Shown in Fig. 6, recess portion 205 deviates the central shaft 206 of magnet 20, in this case, since magnet 20 and the first backboard 21 use
Above-mentioned thread connecting mode is fixed, it is thereby achieved that the two can relatively rotate, so as to realize the position to the magnet
It is finely adjusted.In this case, the first backboard 21 structure diagram as shown in fig. 7, through hole 211 compared with the first backboard 21
Place plane is evenly spaced distribution by the way of rectangular array, and one is established in the plane with first in the first backboard 21
The center of backboard 21 is the two-dimensional coordinate system of origin, wherein, X-axis is abscissa；Y-axis is ordinate, and the first backboard 21 is from origin
Distribution is evenly spaced by the way of rectangular array to its edge, it is preferable that the center between two neighboring backboard through hole
Away from scope in 3~5mm, and hence it is also possible to carry out coarse adjustment to the position of magnet 20.
In the present embodiment, each magnet 20 by sleeve 201, with sleeve 201 formed enclosure space upper cover plate 202 and under
Cover board 203, the magnetic material 204 set in the enclosed space form；Wherein, sleeve 201 is made of non-magnetic material, on
Cover board 202 and lower cover 203 are made of permeability magnetic material, and un-conducted magnetic material includes SUS403 stainless steels, and permeability magnetic material includes
SUS410B stainless steels.The upper cover plate 202 or lower cover 203 of each magnet 20 are fixed with the first backboard 21.Also, sleeve 201,
Upper cover plate 202 and lower cover 203 are fixed together by the way of welding.
Since multiple magnets 20 are fixed on the first backboard 21, and the N poles of a part of magnet 20 are fixed with the first backboard 21,
And the S poles of another part magnet 20 are fixed with the first backboard 21, therefore, the first backboard 21 using permeability magnetic material can will as figure
When magnetron shown in 3 is upside down in the top of target, the magnetic field that magnet 20 generates is avoided to disturb the generations such as the device above it.
In the present embodiment, corresponding each magnet 20, further includes using the second backboard 24 made of permeability magnetic material, in magnet
20 not with being formed with protrusion 207 on 21 fixed upper cover plate 202 of the first backboard or lower cover 203, set on the second backboard 24
It is equipped with and is mutually put down through through hole, and with the surface of the second backboard 24 with 207 corresponding through hole of protrusion, the top end face of protrusion 207
Together, the magnetic field intensity this can enable one end with the protrusion 207 of magnet 20 is uniform.
It should be noted that in the present embodiment, the detachable connection that 20 and first backboard 21 of magnet directly uses
Including thread connecting mode.But the present invention is not limited thereto, in practical applications, detachable connection can also adopt
In other ways, for example, pin connection,
From the foregoing, it will be observed that magnetron provided in this embodiment, only needs successively when assembling the magnetron by each magnet 20
It is directly anchored on the first backboard 21, therefore, magnetron provided by the invention compared with prior art, is not only convenient for group
Dress, but also built-up time can be reduced；In addition, the magnet of magnetron provided in this embodiment will not fall off, and can repeat
It utilizes, so as to avoid the waste of magnet, and then can increase economic efficiency.
Fig. 8 is a kind of structure diagram for magnetron that second embodiment of the invention provides.Referring to Fig. 8, the present embodiment
The magnetron of offer and the magnetron that above-described embodiment provides are similar, equally include magnet 20, the first backboard 21 and second gear
Plate 24, due to magnet 20, the structure of the first backboard 21 and second baffle 24 and relation between it in the above-described first embodiment
Existing to describe in detail, details are not described herein.
Only the difference of the two is described below.Specifically, as shown in fig. 6, in the first backboard 21 and each magnet
The recess portion 30 being mutually matched and protrusion 40 are correspondingly arranged on 20 surfaces being in contact respectively；Wherein, in the lateral wall of protrusion 40
Screw thread is both provided with on the madial wall of recess portion 30, to realize that protrusion 40 is threadedly coupled with recess portion 30.
In the present embodiment, protrusion 40 and recess portion 30 correspond to the central shaft 206 of each magnet 20 and set.But in reality
In, the central shaft 206 that can also deviate each magnet 20 is set, in this case, due to 20 and first backboard of magnet
21 are fixed by protrusion 40 and recess portion 30 using thread connecting mode, it is thereby achieved that the two can relatively rotate, so as to
The position of the magnet is finely adjusted with realizing.
It should be noted that in practical applications, as shown in figure 9, can also be in contact in the first backboard 21 and magnet 20
Surface on be correspondingly arranged on the protrusion 40 being mutually matched and recess portion 30 respectively, similarly, in the lateral wall of protrusion 40 and recess portion 30
Madial wall on be both provided with screw thread, consolidated with realizing that the first backboard 21 and magnet 20 are threadedly coupled by protrusion 40 with recess portion 30
It is fixed.
Certainly, in practical applications, can be fixed in a manner that part magnet 20 uses Fig. 6 with the first backboard 21, another portion
Magnet 20 is divided to be fixed with the first backboard 21 by the way of Fig. 7.
As another technical solution, the present embodiment also provides a kind of magnetron sputtering apparatus, including target and setting
Magnetron above target, magnetron use the magnetron that the above embodiment of the present invention provides.
Magnetron sputtering apparatus provided in this embodiment, the above-mentioned magnetic control provided by using the above embodiment of the present invention
Pipe, can not only reduce the built-up time of equipment, but also can reduce the input cost of equipment, so as to improve economic effect
Benefit.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, the essence of the present invention is not being departed from
In the case of refreshing and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (9)
1. a kind of magnetron, including multiple magnets and the first backboard, first backboard is on it with default arrangement mode
Fixed multiple magnets, which is characterized in that each magnet is directly anchored to first backboard using detachable connection
On, the detachable connection includes thread connecting mode, the surface being in contact on the magnet with first backboard
Upper setting recess portion, the madial wall of the recess portion are provided with screw thread.
2. magnetron according to claim 1, which is characterized in that be in contact on first backboard with the magnet
Through hole is provided on surface, the through hole is corresponding with the position of the recess portion, by screw through the through hole with it is described recessed
Portion is threadedly coupled, and the magnet is fixed on first backboard with realizing.
3. magnetron according to claim 2, which is characterized in that the through hole be reducing hole, and with the screw phase
Match somebody with somebody, so that the screw is located in the through hole.
4. magnetron according to claim 1, which is characterized in that connect on first backboard with each magnet
Protrusion is provided on tactile surface, the protrusion is corresponding with the position of the recess portion,
Screw thread is both provided on the madial wall of the lateral wall of the protrusion and the recess portion, to realize the protrusion and the recess portion
It is threadedly coupled.
5. magnetron according to claim 4, which is characterized in that the protrusion and the recess portion correspond to each magnet
Central shaft set；Or
The central shaft that the protrusion or the recess portion deviate each magnet is set.
6. magnetron according to claim 2, which is characterized in that the through hole and the recess portion correspond to each magnet
Central shaft set；Or
The central shaft that the through hole or the recess portion deviate each magnet is set.
7. magnetron according to claim 1, which is characterized in that each magnet is formed by sleeve and with sleeve
The upper cover plate and lower cover of enclosure space and the magnetic material composition set in the enclosed space；Wherein, the bush material
Un-conducted magnetic material is made, and the upper cover plate and lower cover are made of permeability magnetic material；
The upper cover plate or lower cover of each magnet are fixed with first backboard.
8. magnetron according to claim 7, which is characterized in that corresponding each magnet is further included using permeability magnetic material system
Into the second backboard, be formed with protrusion on the upper cover plate not fixed with first backboard or lower cover of the magnet,
Be provided with through hole corresponding with the protrusion on second backboard, the top end face of the protrusion through the through hole, and with
The upper surface flush with each other of second backboard.
9. a kind of magnetron sputtering apparatus, including target and the magnetron being arranged above target, which is characterized in that the magnetic control
Pipe uses the magnetron described in any one in claim 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410593234.1A CN105632855B (en) | 2014-10-28 | 2014-10-28 | A kind of magnetron and semiconductor processing equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410593234.1A CN105632855B (en) | 2014-10-28 | 2014-10-28 | A kind of magnetron and semiconductor processing equipment |
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| Publication Number | Publication Date |
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| CN105632855A CN105632855A (en) | 2016-06-01 |
| CN105632855B true CN105632855B (en) | 2018-05-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410593234.1A Active CN105632855B (en) | 2014-10-28 | 2014-10-28 | A kind of magnetron and semiconductor processing equipment |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107435134B (en) * | 2016-05-27 | 2020-06-19 | 北京北方华创微电子装备有限公司 | Magnetron assembly and magnetron sputtering equipment |
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|---|---|---|---|---|
| JPH1150249A (en) * | 1997-07-31 | 1999-02-23 | Matsushita Electric Ind Co Ltd | Magnetron sputtering apparatus and magnet unit used for the same |
| CN101107381A (en) * | 2005-02-02 | 2008-01-16 | 日立金属株式会社 | Magnetic circuit device for magnetron sputtering and its manufacturing method |
| CN101451231A (en) * | 2007-12-07 | 2009-06-10 | 胜华科技股份有限公司 | Magnetron sputtering cathode mechanism |
| CN202054889U (en) * | 2011-04-01 | 2011-11-30 | 苏州凡特真空溅镀科技有限公司 | Magnetic control device with integral structure |
| CN202148349U (en) * | 2011-02-17 | 2012-02-22 | 上海德化机电科技有限公司 | Cathode for magnetron sputtering |
| CN103972016A (en) * | 2013-01-25 | 2014-08-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Magnetron module and magnetron sputtering equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102737928B (en) * | 2011-04-02 | 2014-12-17 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Magnetic pole component, magnetron provided with magnetic pole component, sputtering chamber apparatus, and substrate processing device |
-
2014
- 2014-10-28 CN CN201410593234.1A patent/CN105632855B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1150249A (en) * | 1997-07-31 | 1999-02-23 | Matsushita Electric Ind Co Ltd | Magnetron sputtering apparatus and magnet unit used for the same |
| CN101107381A (en) * | 2005-02-02 | 2008-01-16 | 日立金属株式会社 | Magnetic circuit device for magnetron sputtering and its manufacturing method |
| CN101451231A (en) * | 2007-12-07 | 2009-06-10 | 胜华科技股份有限公司 | Magnetron sputtering cathode mechanism |
| CN202148349U (en) * | 2011-02-17 | 2012-02-22 | 上海德化机电科技有限公司 | Cathode for magnetron sputtering |
| CN202054889U (en) * | 2011-04-01 | 2011-11-30 | 苏州凡特真空溅镀科技有限公司 | Magnetic control device with integral structure |
| CN103972016A (en) * | 2013-01-25 | 2014-08-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Magnetron module and magnetron sputtering equipment |
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