CN105632855A - Magnetron and magnetron sputtering equipment - Google Patents

Magnetron and magnetron sputtering equipment Download PDF

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Publication number
CN105632855A
CN105632855A CN201410593234.1A CN201410593234A CN105632855A CN 105632855 A CN105632855 A CN 105632855A CN 201410593234 A CN201410593234 A CN 201410593234A CN 105632855 A CN105632855 A CN 105632855A
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backboard
magnet
magnetron
recess
hole
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CN201410593234.1A
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CN105632855B (en
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杨玉杰
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Beijing NMC Co Ltd
Beijing North Microelectronics Co Ltd
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Beijing North Microelectronics Co Ltd
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Abstract

The invention provides a magnetron and magnetron sputtering equipment. The magnetron comprises a plurality of magnets and a first backboard. The first backboard is used for fixing a plurality of magnets on the first backboard in a preset arrangement manner. The magnets are directly fixed on the first backboard in a detachable connecting manner. According to the magnetron provided by the invention, magnetic poles can be directly assembled on the first backboard, thereby facilitating assembling and reducing assembling time. Furthermore the magnetic poles in the magnetron do not fall and can be recycled, thereby preventing magnet wastage and furthermore improving economic benefit.

Description

A kind of magnetron and magnetron sputtering apparatus
Technical field
The invention belongs to microelectronic processing technique field, be specifically related to a kind of magnetron and magnetron sputtering apparatus.
Background technology
Magnetron sputtering apparatus is to be collided by the particle in plasma and target to form the equipment of thin film to be deposited on workpiece to be machined by the material sputtered from target. In actual applications, the utilization rate of efficiency and target in order to improve sputtering, it is provided with magnetron at the back of target, magnetic field produced by magnetron is utilized to increase the movement time of electronics, to increase the probability that electronics and process gas (such as argon) collide, thus improving the density of plasma, and then improve the efficiency of sputtering and the utilization rate of target.
Fig. 1 is the structural representation of the reaction chamber of typical magnetron sputtering apparatus. Refer to Fig. 1, reaction chamber 10 includes pallet 11, target 12 and magnetron 13, wherein, pallet 11 is arranged on the bottom of reaction chamber, for carrying substrates S, target 12 is arranged on the top of reaction chamber 10, and the surface of the positive ion bombardment target 12 in the plasma in reaction chamber makes the atom on target 12 surface overflow, and deposition is on the surface of the substrate; Magnetron 13 is at the back side of target 12, magnetron 13 generally includes multiple magnetic post 131, when magnetron is installed, each magnetic post 131 generally only by magnetic-adsorption between two backboards that employing permeability magnetic material is made, but, owing to the interphase interaction of magnetic post 131 is relatively big, magnetic post 131 is easily drawn onto on other magnetic posts 131, this not only causes arrangement multiple magnetic posts needs to expend time in very long, and the finger easily causing operator is jammed. For this, as shown in Figure 2, it is provided with, between the backboard 132 of multiple magnetic post 131, the fixing plate 133 that permeability magnetic material is made at each magnetic post 131 with for fixing, fixed by seccotine between magnetic post 131 and fixing plate 133, the surface that fixing plate 133 and backboard 132 contact is correspondingly arranged on internal perisporium respectively and has threaded recess and through hole, threaded with recess through this through hole by screw 134, fixing with magnetic post 131 to realize backboard 132.
But, adopt above-mentioned magnetron still can inevitably there is problems in that in actual applications
One, owing to magnetron 13 needs to be immersed in deionization cooling water, and between fixing plate 133 and magnetic post 131, adopt seccotine to fix, the uneven reasons such as water soaking that cool down at deionization with seccotine of the bonding of seccotine can cause the cohesive force of seccotine to decline, therefore, when the magnetic field of magnetic post 131 is stronger, the absorption mutually between magnetic post 131 easily causes more greatly the phenomenon that magnetic post 131 comes off. For this, need to disassemble fixing plate 133, again first magnetic post 131 is bonded on fixing plate 133, again fixing plate 133 is fixed on backboard 132, and owing to magnetic post 131 being bonded with seccotine, repeatedly repeats to reuse seccotine, seccotine bonding can be made more uneven to cause magnetic post 131 to be easier to come off, therefore, can not recycle discarded after reusing certain number of times after magnetic post 131 comes off, thus the waste of magnetic post 131;
Its two, owing to reach the cementation of seccotine, it is necessary to could use smearing seccotine after 24 hours, the time thus resulting in assembling magnetron is long.
Summary of the invention
It is contemplated that at least solve one of technical problem of existence in prior art, it is proposed that a kind of magnetron and magnetron sputtering apparatus, the magnetic post in its magnetron can directly assemble with the first backboard, is not only convenient for assembling, but also can reduce built-up time; It addition, the magnet in this magnetron does not come off, and can reuse, such that it is able to avoid the waste of magnet, and then can increase economic efficiency.
For solving one of the problems referred to above, the invention provides a kind of magnetron, including multiple magnets and the first backboard, described first backboard is for fixing multiple magnet with default arrangement mode thereon, and each described magnet adopts the mode of removably connecting to be directly anchored on described first backboard.
Wherein, described in, the mode of removably connecting includes thread connecting mode.
Wherein, the surface that described first backboard and described magnet contact is correspondingly arranged on through hole and recess respectively, the medial wall of described recess is provided with screw thread, threadeds with described recess through described through hole by screw, to realize being fixed on described first backboard described magnet.
Wherein, described through hole is reducing hole, and matches with described screw, so that described screw is positioned at described through hole.
Wherein, the surface that described first backboard and each described magnet contact is correspondingly arranged on the protuberance and recess that are mutually matched respectively; Or, the surface that described first backboard and described magnet contact is correspondingly arranged on recess and protuberance respectively that be mutually matched, the lateral wall of described protuberance and the medial wall of described recess are provided with screw thread, threaded with described recess realizing described protuberance.
Wherein, the central shaft of described protuberance each described magnet corresponding to described recess is arranged; Or, described protuberance or described recess deviate the central shaft of each described magnet and arrange.
Wherein, the central shaft of described through hole each described magnet corresponding to described recess is arranged; Or, described through hole or described recess deviate the central shaft of each described magnet and arrange.
Wherein, each described magnet is formed the upper cover plate closing space and lower cover by sleeve and sleeve, in closing space, the magnetic material of setting forms; Wherein, described bush material non-magnet_conductible material is made, and described upper cover plate and lower cover adopt permeability magnetic material to make; The upper cover plate of each described magnet or lower cover and described first backboard are fixed.
Wherein, corresponding each magnet, also include the second backboard adopting permeability magnetic material to make, unfixing with the described first backboard upper cover plate or lower cover of described magnet are formed with protuberance, described second backboard is provided with the through hole corresponding with described protuberance, the top end face described through hole of traverse of described protuberance, and mutually concordant with the upper surface of described second backboard.
The present invention also provides for a kind of magnetron sputtering apparatus, and including target and be arranged at the magnetron above target, described magnetron adopts the magnetron of the above-mentioned offer of the present invention.
The method have the advantages that
Magnetron provided by the invention, it adopts the mode of removably connecting to be directly anchored on the first backboard by each magnet, to realize fixing multiple magnet with default arrangement mode on the first backboard, only need to be directly anchored on the first backboard by each magnet successively when assembling this magnetron, therefore, magnetron provided by the invention compared with prior art, is not only convenient for assembling, such that it is able to reduce built-up time; It addition, the magnet in this magnetron does not come off, and can reuse, such that it is able to avoid the waste of magnet, and then can increase economic efficiency.
Magnetron sputtering apparatus provided by the invention, it, by adopting above-mentioned magnetron provided by the invention, is possible not only to the built-up time of reduction equipment, but also can reduce the input cost of equipment, such that it is able to increase economic efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of the reaction chamber of typical magnetron sputtering apparatus;
Fig. 2 is the structural representation figure of magnetron in Fig. 1;
The structural representation of the magnetron that Fig. 3 provides for first embodiment of the invention;
Fig. 4 is the structural representation of magnet in Fig. 3;
Fig. 5 is the structural representation of the first baffle plate in Fig. 3;
Fig. 6 is the alternative structural representation of magnet in Fig. 3;
Fig. 7 is the structural representation of the first baffle plate that the magnet shown in Fig. 6 is corresponding;
The structural representation of a kind of magnetron that Fig. 8 provides for second embodiment of the invention;
The structural representation of the another kind of magnetron that Fig. 9 provides for second embodiment of the invention.
Detailed description of the invention
For making those skilled in the art be more fully understood that technical scheme, below in conjunction with accompanying drawing, magnetron provided by the invention and magnetron sputtering apparatus are described in detail.
The structural representation of the magnetron that Fig. 3 provides for first embodiment of the invention. Fig. 4 is the structural representation of magnet in Fig. 3. Fig. 5 is the structural representation of the first baffle plate in Fig. 3. see also Fig. 3, Fig. 4 and Fig. 5, the magnetron that the present embodiment provides, including multiple magnets 20 and the first backboard 21, first backboard 21 is for fixing multiple magnet 20 with default arrangement mode thereon, each magnet 20 adopts the mode of removably connecting to be directly anchored on the first backboard 21, specifically, in the present embodiment, the mode of removably connecting is thread connecting mode, the surface that first backboard 21 and magnet 20 contact is correspondingly arranged on through hole 211 and recess 205 respectively, the medial wall of recess 205 is provided with screw thread, threaded with recess 205 through through hole 211 by screw 23, to realize being fixed on the first backboard 21 magnet 20.
Preferably, through hole 211 is reducing hole, and matches with screw 23, so that screw 23 is positioned at through hole, as it is shown on figure 3, through hole 211 is inverted " t " type through hole, screw 23 is positioned at through hole 211. Certainly, in actual applications, through hole 211 can also be clear opening, and in this case, the stud 231 of screw 23 is threadeded through this clear opening with recess 205, and the diameter of screw 23 is stuck on the end face of through hole 211 more than the head of screw 232 of stud 231.
In the present embodiment, the central shaft 206 of through hole 211 and the corresponding each magnet 20 of recess 205 is arranged, it addition, be provided with the quantity through hole 211 more than magnet 20 on the first baffle plate 21, it is possible to the position of magnet 20 is carried out coarse adjustment, as shown in Figure 5.
In actual applications, it is also possible that the central shaft 206 that through hole 211 or recess 205 deviate each magnet is arranged, as shown in Figure 6, recess 205 deviates the central shaft 206 of magnet 20, in this case, owing to magnet 20 and the first baffle plate 21 adopt above-mentioned thread connecting mode to fix, therefore, can be realized the two can relatively rotate, such that it is able to realize the position of this magnet is finely tuned. In this case, the structural representation of the first baffle plate 21 is as shown in Figure 7, through hole 211 is spaced apart equably relative to the mode of the first backboard 21 place plane employing rectangular array, the two-dimensional coordinate system that one is initial point with the center of the first backboard 21 is set up in the plane at the first backboard 21, wherein, X-axis is abscissa; Y-axis is vertical coordinate, and the first backboard 21 is spaced apart equably to the mode of its edge employing rectangular array from initial point, it is preferable that the scope of the centre-to-centre spacing between adjacent two backboard through holes 421 is at 3��5mm, and hence it is also possible to the position of magnet 20 is carried out coarse adjustment.
In the present embodiment, each magnet 20 is formed the upper cover plate 202 closing space and lower cover 203 by sleeve 201 and sleeve 201, in closing space, the magnetic material 204 of setting forms; Wherein, sleeve 201 adopts non-magnetic material to make, and upper cover plate 202 and lower cover 203 adopt permeability magnetic material to make, and non-magnet_conductible material includes SUS403 rustless steel, and permeability magnetic material includes SUS410B rustless steel. The upper cover plate 202 of each magnet 20 or lower cover 203 and the first backboard 21 are fixed. Further, sleeve 201, upper cover plate 202 and lower cover 203 adopt the mode of welding to be fixed together.
Owing to multiple magnets 20 are fixed on the first backboard 21, and the N pole of a part of magnet 20 fixes with the first backboard 21, and the S pole of another part magnet 20 is fixing with the first backboard 21, therefore, first backboard 21 adopts the permeability magnetic material can when being upside down in above target by magnetron as shown in Figure 3, it is to avoid the device etc. of side on which, the magnetic field that magnet 20 produces produces interference.
In the present embodiment, corresponding each magnet 20, also include the second backboard 24 adopting permeability magnetic material to make, unfixing with the first backboard 21 upper cover plate 202 or lower cover 203 of magnet 20 are formed with protuberance 207, second backboard 24 is provided with the through hole corresponding with protuberance 207, the top end face of protuberance 207 is through through hole, and mutually concordant with the surface of the second backboard 24, and this can so that the magnetic field intensity of the one end with this protuberance 207 of magnet 20 be uniform.
It should be noted that in the present embodiment, the mode of removably connecting that magnet 20 and the first baffle plate 21 directly adopt includes thread connecting mode. But, the invention is not limited in this, in actual applications, the mode of removably connecting can also adopt other modes, for instance, pin connects,
From the foregoing, it will be observed that the magnetron that the present embodiment provides, only need to be directly anchored on the first backboard 21 by each magnet 20 successively when assembling this magnetron, therefore, magnetron provided by the invention compared with prior art, is not only convenient for assembling, but also can reduce built-up time; It addition, the magnet of the magnetron of the present embodiment offer does not come off, and can reuse, such that it is able to avoid the waste of magnet, and then can increase economic efficiency.
The structural representation of a kind of magnetron that Fig. 8 provides for second embodiment of the invention. Refer to Fig. 8, the magnetron that the magnetron that the present embodiment provides provides with above-described embodiment is similar, include magnet the 20, first baffle plate 21 and second baffle 24 equally, describe in detail owing to the structure of magnet the 20, first baffle plate 21 and second baffle 24 and relation between are existing in the above-described first embodiment, do not repeat them here.
Only the difference of the two is described below. Specifically, as shown in Figure 6, the surface that the first backboard 21 and each magnet 20 contact is correspondingly arranged on the recess 30 being mutually matched and protuberance 40 respectively; Wherein, the medial wall of the lateral wall of protuberance 40 and recess 30 is provided with screw thread, threadeds with recess 30 realizing protuberance 40.
In the present embodiment, the central shaft 206 of protuberance 40 and the corresponding each magnet 20 of recess 30 is arranged. But, in in actual applications, the central shaft 206 that can also deviate each magnet 20 is arranged, in this case, owing to magnet 20 and the first baffle plate 21 adopt thread connecting mode to fix by protuberance 40 and recess 30, it is thereby achieved that the two can relatively rotate, such that it is able to realize the position of this magnet is finely tuned.
It should be noted that, in actual applications, as shown in Figure 9, the protuberance 40 being mutually matched and recess 30 can also be correspondingly arranged on respectively on the surface that the first backboard 21 and magnet 20 contact, in like manner, the medial wall of the lateral wall of protuberance 40 and recess 30 is provided with screw thread, is threadeded with recess 30 by protuberance 40 and fix realizing the first backboard 21 and magnet 20.
Certainly, in actual applications, it is possible to part magnet 20 and the first backboard 21 adopt the mode of Fig. 6 to fix, another part magnet 20 and the first backboard 21 adopt the mode of Fig. 7 to fix.
As another one technical scheme, the present embodiment also provides for a kind of magnetron sputtering apparatus, and including target and be arranged at the magnetron above target, magnetron adopts the magnetron that the above embodiment of the present invention provides.
The magnetron sputtering apparatus that the present embodiment provides, its above-mentioned magnetron provided by adopting the above embodiment of the present invention, it is possible not only to the built-up time of reduction equipment, but also the input cost of equipment can be reduced, such that it is able to increase economic efficiency.
It is understood that the principle that is intended to be merely illustrative of the present of embodiment of above and the illustrative embodiments that adopts, but the invention is not limited in this. For those skilled in the art, without departing from the spirit and substance in the present invention, it is possible to make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.

Claims (10)

1. a magnetron, including multiple magnets and the first backboard, described first backboard is for fixing multiple magnet with default arrangement mode thereon, it is characterised in that each described magnet adopts the mode of removably connecting to be directly anchored on described first backboard.
2. magnetron according to claim 1, it is characterised in that described in the mode of removably connecting include thread connecting mode.
3. magnetron according to claim 2, it is characterized in that, the surface that described first backboard and described magnet contact is correspondingly arranged on through hole and recess respectively, the medial wall of described recess is provided with screw thread, threaded with described recess through described through hole by screw, to realize being fixed on described first backboard described magnet.
4. magnetron according to claim 3, it is characterised in that described through hole is reducing hole, and matches with described screw, so that described screw is positioned at described through hole.
5. magnetron according to claim 2, it is characterised in that be correspondingly arranged on, on the surface that described first backboard and each described magnet contact, the protuberance and recess that are mutually matched respectively; Or, the surface that described first backboard and described magnet contact is correspondingly arranged on recess and protuberance respectively that be mutually matched,
The lateral wall of described protuberance and the medial wall of described recess are provided with screw thread, threaded with described recess realizing described protuberance.
6. magnetron according to claim 5, it is characterised in that the central shaft of described protuberance each described magnet corresponding to described recess is arranged; Or
Described protuberance or described recess deviate the central shaft of each described magnet and arrange.
7. magnetron according to claim 3, it is characterised in that the central shaft of described through hole each described magnet corresponding to described recess is arranged; Or
Described through hole or described recess deviate the central shaft of each described magnet and arrange.
8. magnetron according to claim 1, it is characterised in that each described magnet is formed the upper cover plate closing space and lower cover by sleeve and sleeve, the magnetic material of setting forms in closing space; Wherein, described bush material non-magnet_conductible material is made, and described upper cover plate and lower cover adopt permeability magnetic material to make;
The upper cover plate of each described magnet or lower cover and described first backboard are fixed.
9. magnetron according to claim 8, it is characterized in that, corresponding each magnet, also include the second backboard adopting permeability magnetic material to make, unfixing with the described first backboard upper cover plate or lower cover of described magnet are formed with protuberance, described second backboard is provided with the through hole corresponding with described protuberance, the top end face described through hole of traverse of described protuberance, and mutually concordant with the upper surface of described second backboard.
10. a magnetron sputtering apparatus, including target and be arranged at the magnetron above target, it is characterised in that described magnetron adopts the magnetron in claim 1-9 described in any one.
CN201410593234.1A 2014-10-28 2014-10-28 A kind of magnetron and semiconductor processing equipment Active CN105632855B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107435134A (en) * 2016-05-27 2017-12-05 北京北方华创微电子装备有限公司 Magnetron assembly and magnetron sputtering apparatus

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Publication number Priority date Publication date Assignee Title
JPH1150249A (en) * 1997-07-31 1999-02-23 Matsushita Electric Ind Co Ltd Magnetron sputtering apparatus and magnet unit used for the same
CN101107381A (en) * 2005-02-02 2008-01-16 日立金属株式会社 Magnetic circuit device for magnetron sputtering and its manufacturing method
CN101451231A (en) * 2007-12-07 2009-06-10 胜华科技股份有限公司 Magnetron sputtering cathode mechanism
CN202054889U (en) * 2011-04-01 2011-11-30 苏州凡特真空溅镀科技有限公司 Magnetic control device with integral structure
CN202148349U (en) * 2011-02-17 2012-02-22 上海德化机电科技有限公司 Cathode for magnetron sputtering
CN102737928A (en) * 2011-04-02 2012-10-17 北京北方微电子基地设备工艺研究中心有限责任公司 Magnetic pole component, magnetron provided with magnetic pole component, sputtering chamber apparatus, and substrate processing device
CN103972016A (en) * 2013-01-25 2014-08-06 北京北方微电子基地设备工艺研究中心有限责任公司 Magnetron module and magnetron sputtering equipment

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1150249A (en) * 1997-07-31 1999-02-23 Matsushita Electric Ind Co Ltd Magnetron sputtering apparatus and magnet unit used for the same
CN101107381A (en) * 2005-02-02 2008-01-16 日立金属株式会社 Magnetic circuit device for magnetron sputtering and its manufacturing method
CN101451231A (en) * 2007-12-07 2009-06-10 胜华科技股份有限公司 Magnetron sputtering cathode mechanism
CN202148349U (en) * 2011-02-17 2012-02-22 上海德化机电科技有限公司 Cathode for magnetron sputtering
CN202054889U (en) * 2011-04-01 2011-11-30 苏州凡特真空溅镀科技有限公司 Magnetic control device with integral structure
CN102737928A (en) * 2011-04-02 2012-10-17 北京北方微电子基地设备工艺研究中心有限责任公司 Magnetic pole component, magnetron provided with magnetic pole component, sputtering chamber apparatus, and substrate processing device
CN103972016A (en) * 2013-01-25 2014-08-06 北京北方微电子基地设备工艺研究中心有限责任公司 Magnetron module and magnetron sputtering equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107435134A (en) * 2016-05-27 2017-12-05 北京北方华创微电子装备有限公司 Magnetron assembly and magnetron sputtering apparatus

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