JPWO2006082863A1 - Magnetic circuit device for magnetron sputtering and manufacturing method thereof - Google Patents

Abstract

The inner permanent magnet row 3 is composed of a plurality of permanent magnets 30 arranged in series so as to have magnetic poles of a predetermined polarity on the upper surface, and the inner permanent magnet row 3 is surrounded, and the magnetic poles of the inner permanent magnet row 3 are opposite in polarity to the upper surface. An outer permanent magnet row 4 composed of a plurality of permanent magnets 40 arranged in series so as to have magnetic poles, and a magnetic yoke plate 2 for detachably holding the inner permanent magnet row 3 and the permanent magnets 30 and 40 of the outer permanent magnet row 4 And non-magnetic protective cover members 31 and 41 having a substantially U-shaped cross-section covering at least one of the permanent magnets 30 and 40, and each of the protective cover members 31 and 41 is one of the permanent magnets 30 and 40. First side plate portions 31a and 41a that cover the side surfaces and are mechanically fixed to the magnetic yoke plate 2, second side plate portions 31b and 41b that cover the other side surfaces of the permanent magnets 30 and 40, and both side plate portions 31a and 31b, 41a and 41b, and upper plate portions 31c and 41c for integrally connecting each protective cover member 31. Side plate portions 31a and 31b of 41, 41a and the magnetic circuit unit for a magnetron sputtering permanent magnets 30 and 40 which are firmly gripped by 41b.

Description

  The present invention relates to a magnetic circuit device mounted on a magnetron sputtering apparatus for forming a thin film on a substrate surface and a method for manufacturing the magnetic circuit device.

The magnetron sputtering apparatus includes a target placed in a vacuum chamber so as to face the substrate on the anode side, a magnetic circuit device placed behind the target, and a high frequency connected to the target so that the target becomes a cathode. Power supply. After introducing an inert gas of, for example, 10 ^-1 to 10 ^-3 Torr (13.33 to 0.13 Pa) into the vacuum chamber, a glow discharge is applied by applying a voltage between the substrate (anode) and the target (cathode). And ionizing the inert gas, causing a magnetic field to act at right angles to the secondary electrons emitted from the target, causing cycloid motion on the target surface, and colliding with gas molecules to promote ionization, The material is deposited (thinned) on the substrate as neutral atoms. Magnetron sputtering equipment has the advantage that it can be deposited at low temperatures because it has a high deposition rate and does not collide with electrons on the substrate, and various alloy thin films can be formed with good reproducibility. Widely used in applications such as processes.

  In a magnetron sputtering apparatus, discharge concentrates at the center of the target where the electric field and magnetic field are orthogonal, and the portion is sputtered significantly, so that the target surface becomes non-uniform after long-term sputtering. Therefore, the entire magnetic circuit device disposed on the back surface of the target is usually reciprocated.

  For example, Japanese Patent Laid-Open No. 10-46334 discloses a magnetron cathode having a target mounted on a wall of a vacuum vessel in which a substrate is transported, and a magnetron cathode having a closed ring magnetic field formed on the surface of the target. A magnetron magnetic circuit device located on the back side, a first mechanism that swings the magnetic circuit device in parallel to the target and in the substrate transfer direction, and a magnetic circuit device in parallel to the target and perpendicular to the substrate transfer direction A sputter deposition apparatus including a second mechanism that swings is disclosed. A magnetron magnetic circuit device described in Japanese Patent Laid-Open No. 10-46334 includes a rod-shaped center magnet, a rectangular outer magnet magnetized so that the surface on the target side is opposite in polarity to the center magnet, and these magnets. And a flat magnetic yoke plate for supporting.

  Japanese Patent Laid-Open No. 2000-248360 describes a magnet in which a film forming chamber (first vacuum chamber) in which a substrate and a target facing the substrate are arranged, and a magnetic field generating mechanism for generating a tunnel-shaped poloidal magnetic field on the surface of the target A magnetron sputtering apparatus is disclosed that includes a chamber (second vacuum chamber) and a drive device that reciprocates a magnetic field generating mechanism in parallel with the target. A backing plate and a target are sequentially arranged in the vicinity of the magnetic field generation mechanism, and the backing plate is connected to a power source for applying a negative potential. High-density plasma is generated on the surface of the target by the magnetic field generation mechanism, the backing plate, and the power source.

  In order to increase the deposition rate on the substrate, it is necessary to shorten the distance from the surface of the magnetic circuit device (the surface of the permanent magnet) to the target surface to increase the strength of the magnetic field generated on the target surface. However, if the distance between the magnetic circuit device and the target is narrowed, the permanent magnet interferes with the backing plate (or cathode) on the back surface of the target, and the permanent magnet falls off or the edge portion is damaged when it comes into contact. There is a risk of In addition, during assembly of the magnetic circuit device, while the magnetic circuit device is being transported to or attached to the magnetron sputtering device, the permanent magnet collides with other members due to packaging conditions, handling errors, etc. There is also a problem that it falls off or part of it is damaged.

  Usually, as described in JP-A-2000-248360, the permanent magnet in the magnetic field generating mechanism is fixed to the yoke with an adhesive. However, since outgas (with a molecular weight of about 300 or less) is generated during or after curing of the adhesive, the surface of the magnetic circuit device is contaminated, causing defective products. When replacing a dropped or damaged permanent magnet with a healthy permanent magnet, it is necessary to peel off the adhesive. To that end, the glass transition temperature of the resin that is the main component of the adhesive (for example, 150 to 200 ° C) It is necessary to heat the entire magnetic circuit device to the above temperature. Therefore, it is not possible to detach only the damaged permanent magnet, and all the permanent magnets are detached. In particular, since a large sputtering apparatus includes a magnetic circuit device including a large number (for example, 100 or more) of permanent magnets, replacement of the permanent magnets is too expensive considering the number of work steps.

  Therefore, as described in JP-A-10-317137 and JP-A-11-36068, there is a problem that sufficient assembly accuracy cannot be obtained if the permanent magnet is fixed by a mechanical means such as a bolt.

  Accordingly, an object of the present invention is to provide a magnetic circuit device for magnetron sputtering that can mount a permanent magnet accurately and detachably, and in which the permanent magnet is not dropped or damaged during use, and a manufacturing method thereof. is there.

  As a result of diligent research in view of the above object, if at least one permanent magnet is attached to a protective cover member and mechanically fixed to a magnetron sputtering magnetic circuit device, the permanent magnet can be accurately attached to and detached from the magnetic circuit device. The present inventors have found that they can be fixed, that permanent magnets are not dropped or damaged during use, and that there is no risk of outgassing because no adhesive is used.

  Accordingly, the first magnetic circuit device for magnetron sputtering according to the present invention surrounds the inner permanent magnet row including an inner permanent magnet row composed of a plurality of permanent magnets connected in series so as to have a magnetic pole of a predetermined polarity on the upper surface. An outer permanent magnet array composed of a plurality of permanent magnets arranged on the upper surface so as to have a magnetic pole having a polarity opposite to that of the inner permanent magnet array, and a permanent magnet of the inner permanent magnet array and the outer permanent magnet array. A magnetic yoke plate that is detachably held; and a non-magnetic protective cover member having a substantially U-shaped cross section that covers at least one of the permanent magnets. Each protective cover member has one side surface of the permanent magnet. A first side plate portion mechanically fixed to the magnetic yoke plate, a second side plate portion covering the other side surface of the permanent magnet, and an upper plate portion integrally connecting the side plate portions Each The permanent magnet by the opposite side plate portions of the protection cover member is characterized in that it is firmly gripped.

  In the magnetic circuit device, it is preferable that the magnetic yoke plate has a concave portion for receiving the rectangular parallelepiped permanent magnet on an upper surface. It is preferable that the concave portion for receiving the permanent magnet constituting the inner permanent magnet row is a central groove, and the concave portion for receiving the permanent magnet constituting the outer permanent magnet row is an outer peripheral step.

  In the magnetic circuit device, the first side plate portion of the protective cover member has an outer flange portion having at least one opening, and a lower end portion of each permanent magnet is disposed in the concave portion of the magnetic yoke plate. In this state, it is preferable that the flange portion is fixed to the magnetic yoke plate by a bolt that engages with the opening.

  In the magnetic circuit device for magnetron sputtering of the second aspect of the present invention, the magnetic yoke plate has a central groove for receiving the inner permanent magnet row and an outer peripheral step for receiving the outer permanent magnet row on the upper surface, The first side plate portion of each protective cover member in the outer permanent magnet row has an outer flange portion having at least one opening at a position in contact with the upper surface of the magnetic yoke plate. The second side plate portion has a length reaching the horizontal groove and has an inward projection at the tip, so that the inward projection engages with the horizontal groove and the permanent magnet is in the outer periphery. The outer flange portion of the first side plate portion is fixed to the magnetic yoke plate by a bolt that engages with the opening in a state of being arranged at a step.

  You may provide the projection part contact | abutted on the upper surface of the said permanent magnet in the inner surface of the said upper board part of the said protective cover member.

  A third magnetron sputtering magnetic circuit device of the present invention surrounds an inner permanent magnet row composed of a plurality of permanent magnets arranged in series so as to have a magnetic pole of a predetermined polarity on the upper surface, and surrounds the inner permanent magnet row. The outer permanent magnet array composed of a plurality of permanent magnets connected in series so as to have a magnetic pole having a polarity opposite to that of the inner permanent magnet array, and the inner permanent magnet array and the permanent magnets of the outer permanent magnet array are detachable. A non-magnetic protective cover member having a substantially U-shaped cross-section that covers at least one of the permanent magnets, a magnetic yoke plate that is held on a spacer, a spacer provided between the inner permanent magnet row and the outer permanent magnet row, and Each protective cover member in the inner permanent magnet row covers one side surface of the permanent magnet and is mechanically fixed to the magnetic yoke plate; A second side plate portion that covers the other side surface of the magnet, and an upper plate portion that integrally connects both side plate portions, and each protective cover member in the outer permanent magnet row includes one side surface of the permanent magnet and A first side plate portion having a length that covers at least a part of the side surface of the magnetic yoke plate and mechanically fixed to the magnetic yoke plate, and a second side plate portion that covers the other side surface of the permanent magnet And an upper plate portion integrally connecting the both side plate portions, and the permanent magnet is firmly held by the both side plate portions of each protective cover member.

  In the third magnetic circuit device for magnetron sputtering, the magnetic yoke plate has a central groove for receiving the rectangular parallelepiped permanent magnet in the inner permanent magnet row on the upper surface, and the rectangular parallelepiped shaped magnet in the outer permanent magnet row. An outer peripheral step for receiving a permanent magnet; the first side plate portion of each protective cover member in the inner permanent magnet row has an outer flange portion having at least one opening; and the outer permanent magnet row The first side plate portion of each protective cover member has at least one opening at a tip portion in contact with a side surface of the magnetic yoke plate, and a lower end portion of each permanent magnet is formed in the groove or step of the magnetic yoke plate. In the arranged state, it is preferable that the first side plate portion is fixed to the magnetic yoke plate by a bolt that engages with the opening. It is preferable that the first side plate portion of each protective cover member in the inner permanent magnet row has a notch for receiving the spacer.

In any of the magnetron sputtering magnetic circuit devices, the protective cover member is preferably formed of an elastically deformable nonmagnetic metal plate. Further, the width W _{P of the} permanent magnet, the inner wall width W _O at the open end of both side plate portions of the protective cover member, and the inner wall width W _{D at the} upper plate portion satisfy the relationship of W _D > W _P > W _O. Is preferred.

  According to the first method of manufacturing a magnetic circuit device for magnetron sputtering of the present invention, an inner permanent magnet row comprising a plurality of permanent magnets arranged in series so as to have a magnetic pole of a predetermined polarity on the upper surface, and the inner permanent magnet row And an outer permanent magnet array composed of a plurality of permanent magnets connected so as to have a magnetic pole having a polarity opposite to the magnetic pole of the inner permanent magnet array on the upper surface, and is detachably assembled to the magnetic yoke plate. ) A first side plate portion having an engaging portion with the magnetic yoke plate, a second side plate portion facing the first side plate portion, and an upper plate portion integrally connecting the both side plate portions. Producing first and second non-magnetic protective cover members having a substantially U-shaped cross section; (b) at least one permanent magnet magnetized in the height direction on the first protective cover member; By inserting so that the part side has the same polarity, (C) At least one permanent magnet magnetized in the height direction is provided on the second protective cover member, and the upper plate portion side has a polarity opposite to that of the first magnet assembly. (D) The first and second magnet assemblies are each mechanically fixed to the magnetic yoke plate.

  In the method of manufacturing a magnetic circuit device, it is preferable that the magnetic yoke plate has a recess for receiving the rectangular parallelepiped permanent magnet on an upper surface. It is preferable that the concave portion for receiving the permanent magnet constituting the inner permanent magnet row is a central groove, and the concave portion for receiving the permanent magnet constituting the outer permanent magnet row is an outer peripheral step.

  In the method of manufacturing the magnetic circuit device, the first side plate portion of the protective cover member has an outer flange portion having at least one opening, and a lower end portion of each permanent magnet is disposed in the concave portion of the magnetic yoke plate. Preferably, the flange portion is fixed to the magnetic yoke plate with a screw that engages with the opening.

  According to the second method of manufacturing a magnetic circuit device for magnetron sputtering of the present invention, the magnetic yoke plate has a central groove and an outer circumferential step on the upper surface and a horizontal groove on a side surface, and the second nonmagnetic protective cover member is A first side plate portion having an outer flange portion having an engagement portion with the magnetic yoke plate, and a second side plate portion facing the first side plate portion (having a length reaching the horizontal groove, The second side plate of the second magnet assembly having a substantially U-shaped cross section comprising an inward projection at the tip) and an upper plate that integrally connects the side plates. The outer flange portion of the first side plate portion is made to be magnetically engaged with the inner projection portion of the first portion being engaged with the horizontal groove of the magnetic yoke plate and the permanent magnet being disposed at the outer circumferential step. It is mechanically fixed to the yoke plate.

  The third method of manufacturing a magnetic circuit device for magnetron sputtering according to the present invention comprises: an inner permanent magnet row comprising a plurality of permanent magnets connected in series so as to have a magnetic pole of a predetermined polarity on the upper surface; and the inner permanent magnet row. And an outer permanent magnet array composed of a plurality of permanent magnets connected so as to have a magnetic pole having a polarity opposite to the magnetic pole of the inner permanent magnet array on the upper surface is detachably assembled to the magnetic yoke plate via a spacer. (A) a first side plate portion having an engaging portion with the magnetic yoke plate, a second side plate portion facing the first side plate portion, and a side plate portion integrally connected to each other. A first non-magnetic protective cover member having a substantially U-shaped cross section comprising a plate portion, a first non-magnetic protective cover member having a length reaching the horizontal groove and having an engagement portion with at least one magnetic yoke plate at the tip portion. One side plate portion and the first side plate A second non-magnetic protective cover member having a substantially U-shaped cross-section composed of a second side plate portion facing the portion and an upper plate portion integrally connecting the both side plate portions, and (b) A first magnet assembly is produced by inserting at least one permanent magnet magnetized in the height direction into the first protective cover member so that the upper plate portion side has the same polarity, and (c) By inserting at least one permanent magnet magnetized in the height direction into the second protective cover member so that the upper plate portion side has a polarity opposite to that of the first magnet assembly, (D) mechanically fixing a spacer to the magnetic yoke plate, and (e) mechanically attaching the first magnet assembly to the magnetic yoke plate via the first side plate portion. (F) mechanically fixing the second magnet assembly to the magnetic yoke plate via the first side plate portion. Method which is characterized in that.

  A preferred method of manufacturing the third magnetic circuit device for magnetron sputtering includes an inner permanent magnet row composed of a plurality of permanent magnets arranged in series so as to have a magnetic pole of a predetermined polarity on the upper surface, and surrounds the inner permanent magnet row. A central groove extending in a predetermined direction on the upper surface via a spacer, and an outer permanent magnet row composed of a plurality of permanent magnets arranged so as to have a magnetic pole having a polarity opposite to that of the inner permanent magnet row on the upper surface; A magnetic yoke plate having an outer peripheral step is detachably assembled. (A) a first side plate portion having an outer flange portion having at least one opening, and a second side plate facing the first side plate portion. A first non-magnetic protective cover member having a substantially U-shaped cross section comprising a side plate portion and an upper plate portion integrally connecting both side plate portions; and a length reaching the horizontal groove and at least at the tip portion 1 The first side plate portion having two openings, the second side plate portion facing the first side plate portion, and the upper plate portion integrally connecting the both side plate portions are substantially U-shaped in cross section. And (b) inserting at least one permanent magnet magnetized in the height direction into the first protective cover member so that the upper plate portion side has the same polarity. To produce a first magnet assembly, and (c) at least one permanent magnet magnetized in the height direction on the second protective cover member, and the first magnet on the upper plate side. (B) mechanically fixing a spacer to the magnetic yoke plate, and (e) the first magnet assembly. With the permanent magnet arranged in the central groove, the bolt is engaged by the bolt engaged with the opening of the outer flange portion. The first magnet assembly is fixed to the magnetic yoke plate, and (f) the permanent magnet of the second magnet assembly is disposed at the outer circumferential step, and is engaged with the opening of the first side plate portion. The second magnet assembly is fixed to the magnetic yoke plate by a bolt to be joined.

  In the third method of manufacturing a magnetic circuit device for magnetron sputtering, the first protective cover member has a notch for receiving the spacer at least on the first side plate, and the spacer is notched. Preferably, the first magnet assembly is fixed to the magnetic yoke plate so as to enter.

  In the magnetic circuit device for magnetron sputtering of the present invention, at least one permanent magnet is covered with a protective cover member, and the protective cover member is mechanically fixed to the magnetic yoke plate, so that it is necessary to use an adhesive. There is no risk of outgassing. In addition, it is easy to accurately fix the permanent magnet to the magnetic yoke plate in spite of the magnetic repulsion force caused by the adjacent magnetic poles of the same polarity. Even if a jig is used for accurate positioning, the jig contacts the protective cover member, so there is no possibility of damaging the permanent magnet itself. In addition, even if it collides with another member or the like during use, the permanent magnet is protected by the protective cover member so that it does not fall off or be damaged.

  If some permanent magnets fall off or be damaged during the assembly or operation due to the collision of other members, remove only the protective cover member that holds those permanent magnets, and grip new permanent magnets. After that, it may be attached to the magnetic yoke plate again. Even in this case, since no adhesive is used, it is not necessary to heat the entire magnetic circuit device, and the permanent magnet can be quickly attached and detached. Further, when the permanent magnet is fixed to the magnetic yoke plate without the protective cover member, if some permanent magnets are detached, the position of the permanent magnet on the magnetic yoke plate may be shifted due to the magnetic repulsive force. When the permanent magnets are fixed to each other through the protective cover member, the permanent magnets on the magnetic yoke plate are not displaced due to the attachment / detachment of some permanent magnets.

  The magnetic circuit device for magnetron sputtering according to the present invention can be manufactured by mechanically fixing a protective cover member on which a permanent magnet is mounted to a magnetic yoke plate, so that accurate positioning of the permanent magnet is only easy. Therefore, the assembly time can be greatly shortened. In addition, since it is not necessary to use an adhesive, the manufacturing environment can be maintained well.

It is a top view which shows an example of the magnetic circuit apparatus for magnetron sputtering of this invention. It is AA sectional drawing of FIG. FIG. 3 is an exploded view of FIG. 2 showing a state in which the first and second magnet assemblies are separated from the magnetic yoke plate. It is BB sectional drawing of FIG. It is sectional drawing which shows an example of a 1st protective cover member. It is a top view of the 1st protective cover member shown in FIG. It is sectional drawing which shows another example of the 2nd protective cover member for an outer side permanent magnet row | line | column. It is sectional drawing which shows another example of the 2nd protective cover member for an outer side permanent magnet row | line | column. It is sectional drawing which shows another example of the magnetic circuit apparatus for magnetron sputtering of this invention. FIG. 10 is a perspective view showing a first protective cover member for the inner permanent magnet row of FIG. 9. FIG. 10 is a perspective view showing a second protective cover member for the outer permanent magnet row of FIG. 9. It is a perspective view which shows a mode that a permanent magnet is inserted in the 2nd protective cover member for outer side permanent magnet rows shown in FIG. It is a perspective view which shows a mode that two permanent magnets are inserted in one protective cover member. It is sectional drawing which shows the manufacturing process of the magnetic circuit apparatus of FIG. It is sectional drawing which shows an example of the magnetron sputtering apparatus provided with the magnetic circuit apparatus of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Magnetic circuit apparatus 2 ... Magnetic yoke board
21 ... Central groove
22 ... Outer step
23 ... Horizontal groove 3 ... inner permanent magnet row 4 ... outer permanent magnet row
30, 40 ... Permanent magnet
31,331,431 ・ ・ ・ Protective cover member for inner permanent magnet row
31a, 331a, 431a ... first side plate
31b, 331b, 431b ... second side plate
31c, 331c, 431c ・ ・ ・ Upper plate
31d, 331d, 431d ・ ・ ・ Screw opening
31e, 331e, 431e ・ ・ ・ Outer flange
331f, 431f, 431g ・ ・ ・ Notch for receiving spacer
41, 141, 241, 341, 441 ... Protective cover member for outer permanent magnet array
141a, 241a, 341a, 441a ... first side plate
141b, 241b, 341b, 441b ... second side plate
141c, 241c, 341c, 441c ... Upper plate
141d, 241d, 341d, 441d ... Screw openings
141e, 241e ・ ・ ・ Outer flange
141f, 241g ... inward protrusion
441f ... Spacer receiving notches 5, 51, 52 ... Bolt 6 ... Spacer 8 ... Jig
100 ... Magnetron sputtering equipment
101: Vacuum chamber
102 ... Cathode
103 ・ ・ ・ Target
104 ... Substrate
105 ... Anode
106 ・ ・ ・ DC voltage source

  A magnetic circuit device for magnetron sputtering according to the present invention will be described below in detail with reference to the accompanying drawings. In each figure, members having the same functions are given the same reference numbers (or the same reference numbers in the last two digits).

[1] magnetron sputtering magnetic circuit equipment
(1) First Mode As shown in FIG. 1, a magnetic circuit device 1 is mechanically fixed to a flat magnetic yoke plate 2 whose longitudinal ends are substantially semicircular, and an upper surface of the magnetic yoke plate 2. The inner permanent magnet row 3 and the outer permanent magnet row 4 are provided. As shown in FIGS. 2 to 4, in the inner permanent magnet row 3, a plurality of, for example, rectangular parallelepiped permanent magnets 30 pre-magnetized in the height direction have magnetic poles with a predetermined polarity (for example, S poles) on the upper surface. Are arranged in a straight line. The lower end portion of each permanent magnet 30 is held in a central groove 21 formed in the magnetic yoke plate 2 in the longitudinal direction. At least one permanent magnet 30 is covered with a nonmagnetic protective cover member 31, and each protective cover member 31 is mechanically fixed to the upper surface of the magnetic yoke plate 2 with a screw bolt (hereinafter simply referred to as “bolt”) 5 or the like. Yes.

  As shown in FIG. 5, each protective cover member 31 covers one side surface of the permanent magnet 30, and the first side plate portion 31 a mechanically fixed to the magnetic yoke plate 2 and the other side of the permanent magnet 30. The second side plate portion 31b covering the side surface and the upper plate portion 31c integrally connecting the both side plate portions 31a and 31b, and the first side plate portion 31a has an outer flange portion having at least one opening 31d. The flange 31e is fixed to the magnetic yoke plate 2 by a bolt 5 having 31e and engaging with the opening 31d. The opening 31d is a through hole having a size that allows the threaded portion of the bolt 5 to be inserted therethrough.

Side plate portions 31a of the protective cover member 31, in order to firmly grip the permanent magnet 30 by 31b, the inner wall of the upper plate portion 31c from the inner wall width W _O of the side plate portions 31a, the open end of 31b of the protective cover member 31 preferably larger at the width W _D. Specifically, the width W _D is slightly larger than the width W _P of the permanent magnet 30, for example, 0 <W _D −W _P ≦ 0.05 mm, and the width W _O is slightly smaller than the width W _P of the permanent magnet 30. For example, 0 <W _P −W _O ≦ 0.1 mm. Therefore, W _D > W _P > W _O and W _D −W _O is 0.15 mm at the maximum. By thus setting the W _D and W _O, it is possible to firmly grip the permanent magnet 30 without adverse effects. Further, in order to prevent the opening edge from being damaged when the permanent magnet 30 is inserted, the distal end portion 31g of the second side plate portion 31b may be slightly expanded as shown in FIG. 5 (c).

The height H from the bottom surface of the outer flange portion 31e to the inner surface of the upper plate portion 31c is equal to or slightly than the height H _P of the ground portion of the permanent magnet 30 (the portion which projects above the magnetic yoke plate 2) For example, it is preferable to set H−H _P = 0 to 0.1 mm. The second side plate portion 31b is a length that ensures that the lower end of the second side plate portion 31b is slightly higher than the upper surface of the magnetic yoke plate 2 when the permanent magnet 30 is fitted in the central groove 21 as shown in FIG. It is preferable to have a thickness.

The length L of the protective cover member 31 (see FIG. 6) is preferably set to be the same as or slightly shorter than the length L _P of the permanent magnet 30 when the single permanent magnet 30 is accommodated (see FIG. 12). ), also in case of accommodating the two permanent magnets 30 is preferably set 2L _P to or slightly shorter (see FIG. 13). Although the corner of the protective cover member 31 is rounded, in order to increase the contact area between the inner surface of the protective cover member 31 and the outer surface of the permanent magnet 30, the curvature of the inner peripheral corner of the protective cover member 31 is For example, it is preferably 0.5 mm or less.

As shown in FIGS. 2 to 4, the outer permanent magnet row 4 is magnetized in the direction opposite to that of the permanent magnet 30 (the upper surface side is N pole in the illustrated example) so as to surround the inner permanent magnet row 3. The lower end of each permanent magnet 40 is held by an outer circumferential step 22 formed on the magnetic yoke plate 2. At least one permanent magnet 40 is firmly held by the nonmagnetic protective cover member 41, and the outer flange portion 41 e of each protective cover member 41 is mechanically fixed to the magnetic yoke plate 2 by a bolt 5. Since the shape of the protective cover member 41 that holds the permanent magnet 40 is the same as that of the protective cover member 31 except that the inner wall width is large because the permanent magnet 40 is thicker than the permanent magnet 30, the description thereof is omitted. However, as shown in FIG. 1, the protective cover member 41 mounted near both ends of the magnetic yoke plate 2 preferably has a shape that covers almost the entire surface of each permanent magnet 40. Of course, in order to firmly hold the permanent magnet 40, it is preferable to satisfy the same relationship of W _D , W _P and W _O as the protective cover member 31.

The permanent magnets 30 and 40 themselves may be known ones. For low-priced devices, sintered ferrite magnets are used, and for high-priced devices that generate a strong magnetic field on the target surface, rare earth magnets are preferable. Is R ₂ T ₁₄ B (R is one or more of rare earth elements including Y, and at least one selected from the group consisting of Nd, Pr, Dy and Tb is essential, and T is Fe or Fe and Co.) It is preferable to use an anisotropic RTB-based sintered magnet whose main phase is. During film formation, the temperature of the substrate rises and the temperature of the vacuum chamber in which the magnetic circuit device is installed also rises. Therefore, a heat-resistant anisotropic RTB sintered magnet having a coercive force Hcj of 1193 kA · m ⁻¹ or more It is particularly preferred to use

  The magnetic yoke plate 2 is made of a ferromagnetic metal such as iron or steel in order to form a magnetic path. For example, a general structural rolled steel (SS40 or the like) or martensitic stainless steel (SUS403 or the like) is preferable.

  The protective cover members 31 and 41 need to be non-magnetic in order to prevent a short circuit of magnetic flux generated from the permanent magnets 30 and 40. The protective cover members 31 and 41 may be formed of a plastic material such as FRP, but a metal plate such as austenitic stainless steel (for example, SUS304) or aluminum alloy (for example, A6063) that is elastically deformable and has high durability. It is preferable to form by pressing or extruding. The thicknesses of the protective cover members 31 and 41 can be appropriately set depending on the material and size of the permanent magnets 30 and 40. For example, when an anisotropic R-T-B sintered magnet is covered with a metal protective cover member, the plate thickness is preferably 3 mm or less, particularly 0.5 to 2 mm in order to facilitate elastic deformation.

(2) Second Aspect The shape of the protective cover member is not limited to the above, and may be the shape shown in FIG. 7, parts having the same functions as those in FIGS. 1 to 6 are denoted by the same reference numerals (or the same last two digits). In the example shown in FIG. 7, the magnetic yoke plate 2 has a central groove 21 for receiving the inner permanent magnet row 30 and an outer circumferential step 22 for receiving the outer permanent magnet row 40 on the upper surface, and an outer circumferential step 22 on the side surface. A first side plate portion 141a having an outer flange portion 141e having at least one opening portion 141d at a position in contact with the upper surface of the magnetic yoke plate 2. The second side plate portion 141b having the inner protrusion 141f at the tip and reaching the horizontal groove 23 beyond the lower end of the permanent magnet 40, and the upper plate portion 141c integrally connecting the both side plate portions 141a and 141b Have. The inward protruding portion 141f can be formed by bending the distal end portion of the second side plate portion 141b at a right angle inside. With the inner protrusion 141f engaged with the horizontal groove 23 and the permanent magnet 40 disposed at the outer circumferential step 22, the outer flange 141e of the first side plate portion 141a is secured by the screw 5 engaged with the opening 141d. Is fixed to the magnetic yoke plate 2. By forming the inward protruding portion 141f into a shape that engages with the horizontal groove 23, the permanent magnet 40 can be more firmly fixed to the magnetic yoke plate 2, so that the protective cover member 141 can be made thinner.

(3) Third Aspect In the example shown in FIG. 8, a protrusion 241g that contacts the upper surface of the permanent magnet 40 is provided on the inner surface of the upper plate portion 241c of the protective cover member 241. As shown in FIG. 8B, the protrusion 241g extends in the longitudinal direction of the protective cover member 241. The protrusion 241g can be formed by a technique such as embossing. According to this shape, when the permanent magnet 40 inserted into the protective cover member 241 is mounted on the outer circumferential step 22 of the magnetic yoke plate 2 and the protective cover member 241 is screwed onto the magnetic yoke plate 2, the permanent magnet 40 is protected. Since the cover member 4 can be pressed downward, the permanent magnet 40 can be more firmly fixed to the magnetic yoke plate 2.

(4) Fourth aspect In the magnetron sputtering apparatus, the width of the magnetic circuit device is set to 170 to 200 mm, for example, but in order to improve the utilization efficiency of the target by sputtering the target surface as uniformly as possible, It is preferable to have a structure in which a large number (for example, 12 or 14) of magnetic circuit devices having a width as narrow as about 100 to 120 mm are arranged. In this narrow magnetic circuit device, depending on the material of the target (for example, nonmagnetic metal), it is necessary to generate a high magnetic flux density on the surface of the target. Therefore, a wide permanent magnet as shown in FIG. It has been studied to fix 30 and 40 to the magnetic yoke plate 2.

  The magnetron sputtering magnetic circuit device of the fourth embodiment shown in FIG. 9 has a structure in which thick permanent magnets are installed at a narrow interval, so that a strong magnetic attractive force is generated between the permanent magnet 30 and the permanent magnet 40. It is necessary to install a spacer 6 made of a nonmagnetic material between the inner permanent magnet row 3 and the outer permanent magnet row 4. In order to secure an installation space for the spacer 6, the second side plate portions of the protective cover members 331 and 441 are shortened, and the protective cover members 331 and 341 as a whole have a U-shape close to an L shape.

  As shown in FIG. 9 and FIG. 10 (a), the protective cover member 331 of the inner permanent magnet row 3 has a substantially U-shaped cross section, and a first side plate portion 331a covering one side surface of the permanent magnet 30 and The second side plate portion 331b that covers the other side surface of the permanent magnet 30 and the upper plate portion 331c that integrally connects the side plate portions 331a and 331b. The first side plate portion 331a has an outer flange portion 331e at the tip, and the first side plate portion 331a and the outer flange portion 331e are provided with a notch 331f for receiving the spacer 6, and the outer side. The flange portion 331e is provided with a bolt opening 331d. The second side plate portion 331b is shortened to a height at which the spacer 6 is received. Since the protective cover member 331 prevents interference with the spacer 6 by the notch 331f and the short second side plate portion 331b, the inner permanent magnet row 3 and the outer permanent magnet row 4 can be installed at a narrow interval. enable.

  As shown in FIGS. 9 and 10 (a), the protective cover member 341 of the outer permanent magnet row 4 has a substantially U-shaped cross section close to an L shape, and covers the first side surface of the permanent magnet 40. The side plate portion 341a includes a second side plate portion 341b that covers the other side surface of the permanent magnet 40, and an upper plate portion 341c that integrally connects the side plate portions 341a and 341b. The first side plate portion 341a has a length that covers at least a part of the side surface of the magnetic yoke plate 2, and has an opening 341d for the bolt 52 at the tip. The second side plate portion 341b is shortened to a height at which the spacer 6 is received. Since the lower end portion of the first side plate portion 341a is fastened to the side surface of the magnetic yoke plate 2, the protective cover member 341 can firmly fix the permanent magnet 40 to the magnetic yoke plate 2.

  In the fourth embodiment, since at least the upper parts of the permanent magnets 30 and 40 are covered with the protective cover members 331 and 341, the chances of the permanent magnets 30 and 40 being damaged due to interference (collision) with other members are greatly increased. Further, the angle between the permanent magnets 30 and 40 and the magnetic yoke plate 2 is maintained at a right angle, so that the permanent magnets 30 and 40 can be prevented from falling down. Further, since the protective cover member 341 attached to the outer peripheral side of the magnetic yoke plate 2 does not have an outer flange portion, the interval between the permanent magnet 30 and the permanent magnet 40 can be narrowed (for example, 5 to 15 mm).

  FIG. 10B shows another example of the protective cover member of the inner permanent magnet row 3. In this protective cover member 431, not only the first side plate portion 431a but also the second side plate portion 431b are provided with notches 431f and 431g for receiving the spacers 6 and 6, and the second side plate portion 431b. Extends to the vicinity of the upper surface of the magnetic yoke plate 2. With this structure, the exposed portion of the permanent magnet 30 is reduced, so that damage to the permanent magnet 30 can be greatly reduced. Further, by engaging the spacers 6 and 6 with the notches 431f and 431g, even when the spacers 6 and 6 are fixed with one bolt 51, the parallelism between the spacers 6 and 6 and the inner permanent magnet row 3 is high. Can be secured.

  FIG. 11 (b) shows another example of the protective cover member of the outer permanent magnet row 4. In this protective cover member 441, the second side plate portion 441b has a notch 441f for receiving the spacer 6, and extends to the vicinity of the upper surface of the magnetic yoke plate 2. With this structure, the exposed portion of the permanent magnet 40 is reduced, so that damage to the permanent magnet 40 can be greatly reduced. Further, by engaging the spacer 6 with the notch 441f, high parallelism between the spacer 6 and the outer permanent magnet row 4 can be ensured even when the spacer 6 is fixed with one bolt 51.

[2] Manufacturing method
(1) First and third modes In the modes shown in FIGS. 1 to 6 and 8, the operation of inserting the permanent magnets 30 and 40 into the protective cover members 31, 41, 231, and 241 is basically the same. The case where the permanent magnet 40 is inserted into each protective cover member 41 will be described with reference to FIGS. 12 (a) to 12 (c). Since the inner wall width W _O at the open ends of the side plate portions 41a and 41b and the inner wall width W _{D at the} upper plate portion 41c satisfy the relationship of W _D > W _P > W _O with respect to the width W _P of the permanent magnet 40, The permanent magnet 40 is inserted into the protective cover member 41 in a state where the second side plate portion 41 b is expanded by the jig 8. As shown in FIG. 12 (c), the jig 8 is removed after the permanent magnet 40 is inserted.

  By inserting the permanent magnet 40, the side plate portions 41a and 41b are elastically deformed so as to expand slightly, so that they are pressed against the outer surface of the permanent magnet 40 by an elastic restoring force. Therefore, the permanent magnet 40 is firmly fixed to the protective cover member 41 without using an adhesive. In addition, the use of the protective cover member also provides the following advantages. That is, when magnetized permanent magnets are arranged with the same poles adjacent to each other, accurate positioning is not easy due to the magnetic repulsive force, and the force to grip the permanent magnets must be increased even if a jig is used. The permanent magnet itself may be damaged. However, it is easy to insert each permanent magnet into each protective cover member, and even if the protective cover member is firmly held with a jig, the permanent magnet will not be damaged. The attachment to the magnetic yoke plate becomes extremely easy. Thus, by using the protective cover member, it becomes easy to attach the permanent magnet to the magnetic yoke plate accurately (at right angles and in a straight line), so that the accuracy of the magnetic circuit device is improved and the manufacturing cost is reduced. Can be achieved.

FIG. 13 shows a case where two permanent magnets 40 are inserted into one protective cover member 41. In this case, the length L of the protective cover member 41 is preferably set to be twice or more the length LP of the permanent magnet 40. Inserting two or more permanent magnets 40, 40 into one protective cover member 41 has the advantage that the work of attaching the protective cover member to the magnetic yoke plate 2 is shortened. Adjacent permanent magnets 40 and 40 repel each other, but the repulsive force of a thin permanent magnet is relatively small, so it is possible to insert the two permanent magnets 40 and 40 into the protective cover member 41 relatively easily. It is. However, when the permanent magnet is thick, not only a suitable jig (not shown) needs to be used for insertion, but also the side plates 41a and 41b have sufficient gripping force for the permanent magnet 40. , The size of W _D and W _{O with} respect to W _P must be optimized.

  In the first magnetic circuit device, since the inner permanent magnet row 3 and the outer permanent magnet row 4 are relatively separated from each other, any of them may be attached to the magnetic yoke plate 2 first. For example, the permanent magnet 30 is first inserted into the protective cover member 31 to produce a first magnet assembly, and the permanent magnet 40 is inserted into the protective cover member 41 to produce a second magnet assembly. The lower end of each permanent magnet 30 is magnetically attracted to the central groove 21 of the magnetic yoke plate 2, and the first magnet assembly is aligned along the central groove 21. The inner permanent magnet row 3 is assembled by fixing all the protective cover members 31 to the magnetic yoke plate 2 with bolts. Similarly, the permanent magnet 40 is magnetically attracted to the outer circumferential step 22 of the magnetic yoke plate 2, and the second magnet assembly is aligned along the outer circumferential step 22. The outer permanent magnet row 4 is assembled by fixing all the protective cover members 41 to the magnetic yoke plate 2 with bolts. Of course, the outer permanent magnet row 4 may be assembled first.

(2) Second Aspect The second aspect shown in FIG. 7 is the same as the first aspect except for the method of fixing the second magnet assembly to the magnetic yoke plate. Only the fixing method to the magnetic yoke plate will be described with reference to FIG. The inward protrusion 141f is engaged with the horizontal groove 23, and the permanent magnet 40 is disposed on the outer peripheral step 22. In this state, since the opening 141d of the outer flange portion 141e is aligned with the screw hole 25 of the magnetic yoke plate 2, the outer flange portion 141e of the protective cover member 141 is machined to the magnetic yoke plate 2 by the screw 5. Fixed.

(3) Fourth Embodiment FIG. 14 shows an example of a method for manufacturing the magnetic circuit device of the fourth embodiment shown in FIG. First, the spacers 6 and 6 are fixed to the magnetic yoke plate 2 by screwing the bolts 51 into the screw holes 26 [step (a)]. A first magnet assembly formed by inserting the permanent magnet 30 into the protective cover member 31 is placed in the central groove 21 between the spacers 6 and 6, and the outer flange portion 31e of the protective cover member 31 is bolt 5 To fix to the magnetic yoke plate 2 [step (b)]. A second magnet assembly formed by inserting the permanent magnet 40 into the protective cover member 41 is placed on the outer circumferential step 22, and the second side plate portion 41 b is fixed to the side surface of the magnetic yoke plate 2 with a bolt 52 [step ( c)]. Finally, the remaining second magnet assembly is placed on the other outer peripheral step 22 and the second side plate portion 41b is fixed to the side surface of the magnetic yoke plate 2 by the bolt 52 [step (d)]. With the structure in which the spacers 6 and 6 are in contact with the permanent magnets 30 and 40 and / or the protective cover members 31 and 41, the positioning of the permanent magnets 30 and 40 can be made accurate.

[3] Magnetron Sputtering Device FIG. 15 shows a magnetron sputtering device 100 including the magnetic circuit device 1 shown in FIG. Although not shown, a plurality (for example, six) of magnetic circuit devices 1 are installed in a direction perpendicular to the paper surface. In the vacuum chamber 101, the sputtering apparatus 100 faces the target 103 with the magnetic circuit device 1, the cathode 102 disposed at a position close to the magnetic circuit device 1, the target 103 in contact with the cathode 102, and the substrate 104 interposed therebetween. And an anode 105 arranged at a position to be. The vacuum chamber 101 has a working gas inlet 101a connected to a working gas supply means (not shown) and an exhaust port 101b connected to a vacuum pump (not shown). The vacuum chamber 101 is set to the ground potential, and the magnetic circuit device 1 and the cathode 102 are set to the same potential. The cathode 102 and the anode 105 are each connected to a DC voltage source 106. The substrate 104 is transported between the target 103 and the anode 105.

  If the distance from the surface of the magnetic circuit device 1 to the surface of the target 103 is too long, the horizontal component of the magnetic field appearing on the surface of the target 103 will be too small. If this distance is too short, it is difficult to install the magnetic circuit device 1 in the vacuum chamber 101. Therefore, the distance between the two is appropriately set according to the size of the substrate 104 and the like. For example, in the case of seventh to eighth generation substrates, this distance is generally set in the range of 50 to 60 mm. Even if the distance between the top surface of the magnetic circuit device 1 and the bottom surface of the cathode 102 is as narrow as several millimeters, the permanent magnet is covered with the protective cover member, so that the permanent magnet can be prevented from being damaged during assembly. .

In the magnetron sputtering apparatus 100, a film can be formed on the surface of the substrate 104 as follows, for example. The inside of the vacuum chamber 101 is evacuated and a working gas containing an inert gas (for example, Ar, Ar + N ₂ or Ar + O ₂ ) is introduced and maintained at a pressure of 10 ⁻¹ to 10 ⁻³ Torr. Next, a negative voltage (for example, −300 V to −800 V) is applied to the cathode 102 to form an electric field toward the surface of the target 103, and glow discharge is performed. Thereby, ions in the plasma collide with the surface of the target 103, secondary electrons emitted at that time are captured by the magnetic field, and an elongated annular high-density plasma along the magnetic field is formed. The ions in the high-density plasma collide with the target 103, the substances therein are scattered, and the particles adhere to the surface of the substrate 104, whereby a thin film is formed.

  The magnetron sputtering apparatus 100 is preferably configured as follows. That is, when the film is formed, the density of the high-density plasma becomes high at a position where the magnetic field component perpendicular to the surface of the target 103 is zero. Is done. Therefore, a drive device (not shown) is provided on the back side of the magnetic circuit device 1, the magnetic circuit device 1 is translated in a plane parallel to the target 103, and the movement pitch is equal to or less than that of the high-density plasma. By using this pitch, the utilization efficiency of the target 103 is improved. With this configuration, the time during which the surface of the target 103 can be exposed to high-density plasma is averaged, so that a uniform erosion region is formed on the surface of the target 103.

Claims (18)

An inner permanent magnet array composed of a plurality of permanent magnets arranged in series so as to have a magnetic pole of a predetermined polarity on the upper surface, and the inner permanent magnet array are surrounded, and a magnetic pole having a polarity opposite to that of the inner permanent magnet array is provided on the upper surface. An outer permanent magnet array comprising a plurality of permanent magnets arranged in series, a magnetic yoke plate for detachably holding the inner permanent magnet array and the outer permanent magnet array, and at least one permanent magnet. A non-magnetic protective cover member having a substantially U-shaped cross-section covering each one, each protective cover member covering one side surface of the permanent magnet and mechanically fixed to the magnetic yoke plate Side plate portions, a second side plate portion covering the other side surface of the permanent magnet, and an upper plate portion integrally connecting the both side plate portions, and the permanent magnets are formed by the side plate portions of each protective cover member. Be firmly gripped The magnetic circuit device for magnetron sputtering, characterized in. 2. The magnetic circuit device for magnetron sputtering according to claim 1, wherein the magnetic yoke plate has a concave portion for receiving the rectangular parallelepiped permanent magnet on an upper surface. 3. The magnetic circuit device for magnetron sputtering according to claim 2, wherein the recess for receiving the permanent magnet that constitutes the inner permanent magnet row is a central groove, and the permanent magnet that constitutes the outer permanent magnet row is received. A magnetic circuit device for magnetron sputtering, wherein the concave portion is a step on the outer periphery. The magnetic circuit device for magnetron sputtering according to claim 2 or 3, wherein the first side plate portion of the protective cover member has an outer flange portion having at least one opening, and a lower end portion of each permanent magnet is provided. A magnetic circuit device for magnetron sputtering, wherein the flange portion is fixed to the magnetic yoke plate by a bolt engaging with the opening in a state where the magnetic yoke plate is disposed in the concave portion. 2. The magnetic circuit device for magnetron sputtering according to claim 1, wherein the magnetic yoke plate has a central groove for receiving the inner permanent magnet row and an outer peripheral step for receiving the outer permanent magnet row on an upper surface, The first side plate portion of each protective cover member in the outer permanent magnet row has an outer flange portion having at least one opening at a position in contact with the upper surface of the magnetic yoke plate. The second side plate portion has a length reaching the horizontal groove and has an inward projection at the tip, so that the inward projection engages with the horizontal groove and the permanent magnet is in the outer periphery. The magnetron sputtering, wherein the outer flange portion of the first side plate portion is fixed to the magnetic yoke plate by a bolt engaged with the opening portion in a state where the step is disposed. Ring magnetic circuit device. 6. The magnetron sputtering magnetic circuit device according to claim 1, further comprising: a protrusion that abuts on the upper surface of the permanent magnet on the inner surface of the upper plate portion of the protective cover member. Magnetic circuit device. An inner permanent magnet array composed of a plurality of permanent magnets arranged in series so as to have a magnetic pole of a predetermined polarity on the upper surface, and the inner permanent magnet array are surrounded, and a magnetic pole having a polarity opposite to that of the inner permanent magnet array is provided on the upper surface. An outer permanent magnet array composed of a plurality of permanent magnets arranged in series, a magnetic yoke plate that detachably holds the inner permanent magnet array and the permanent magnets of the outer permanent magnet array, and the inner permanent magnet array; Each of the protective covers in the inner permanent magnet row includes a spacer provided between the outer permanent magnet row and a non-magnetic protective cover member having a substantially U-shaped cross-section covering at least one of the permanent magnets. The member covers one side of the permanent magnet and is mechanically fixed to the magnetic yoke plate, a second side plate covering the other side of the permanent magnet, and both side plates Integrate the parts Each protective cover member in the outer permanent magnet row has a length that covers at least a part of one side surface of the permanent magnet and the side surface of the magnetic yoke plate. Each protective cover includes a first side plate portion mechanically fixed to the plate, a second side plate portion covering the other side surface of the permanent magnet, and an upper plate portion integrally connecting the both side plate portions. A magnetic circuit device for magnetron sputtering, wherein the permanent magnet is firmly held by both side plates of the member. 8. The magnetic circuit device for magnetron sputtering according to claim 7, wherein the magnetic yoke plate has a central groove for receiving the rectangular parallelepiped permanent magnet in the inner permanent magnet row on the upper surface, and a rectangular parallelepiped in the outer permanent magnet row. The first side plate portion of each protective cover member in the inner permanent magnet row has an outer flange portion having at least one opening, The first side plate portion of each protective cover member in the permanent magnet row has at least one opening at a tip portion contacting the side surface of the magnetic yoke plate, and a lower end portion of each permanent magnet is the groove of the magnetic yoke plate. Alternatively, the first side plate portion is fixed to the magnetic yoke plate by a bolt that engages with the opening in a state where the first side plate portion is arranged at a step. For Tron sputtering magnetic circuit device. The magnetic circuit device for magnetron sputtering according to claim 7 or 8, wherein the first side plate portion of each protective cover member in the inner permanent magnet row has a notch for receiving the spacer. Magnetic circuit device for magnetron sputtering. 10. The magnetic circuit device for magnetron sputtering according to claim 1, wherein the protective cover member is formed of a nonmagnetic metal plate that can be elastically deformed. In the magnetic circuit unit for a magnetron sputtering of claim 10, the width W _P of the permanent magnet, the inner wall width W _D of the inner wall width W _O, and the top plate portion at the open end of the side plate portions of said protective cover member , W _D > W _P > W _O The magnetic circuit device for magnetron sputtering characterized by satisfy | filling the relationship. An inner permanent magnet array composed of a plurality of permanent magnets arranged in series so as to have a magnetic pole of a predetermined polarity on the upper surface, and the inner permanent magnet array are surrounded, and a magnetic pole having a polarity opposite to that of the inner permanent magnet array is provided on the upper surface. A method of manufacturing a magnetic circuit device for magnetron sputtering by removably assembling a magnetic yoke plate with an outer permanent magnet array composed of a plurality of permanent magnets arranged in series so as to have (a) the magnetic yoke A first side plate portion having an engagement portion with the plate, a second side plate portion facing the first side plate portion, and an upper plate portion integrally connecting the both side plate portions. A first non-magnetic protective cover member having a letter shape, and (b) at least one permanent magnet magnetized in a height direction on the first protective cover member, the upper plate portion side having the same polarity By inserting so that the first (C) At least one permanent magnet magnetized in the height direction is provided on the second protective cover member, and the upper plate portion side has a polarity opposite to that of the first magnet assembly. (D) mechanically fixing the first and second magnet assemblies to the magnetic yoke plate through the first side plate portion, respectively. A method characterized by: 13. The method of manufacturing a magnetic circuit device for magnetron sputtering according to claim 12, wherein the magnetic yoke plate has a concave portion extending in a predetermined direction on an upper surface, and the permanent magnets of the first and second magnet assemblies are formed in the concave portion. A method characterized by arranging. 14. The method of manufacturing a magnetic circuit device for magnetron sputtering according to claim 12 or 13, wherein the first and second protective cover members have an outer flange portion at a tip of the first side plate portion, and the outer A method of mechanically fixing the first and second protective cover members to the magnetic yoke plate via a flange portion. 13. The method of manufacturing a magnetic circuit device for magnetron sputtering according to claim 12, wherein the magnetic yoke plate has a central groove and an outer peripheral step on the upper surface and a horizontal groove on a side surface, and the second nonmagnetic protective cover member is A first side plate portion having an outer flange portion having an engagement portion with the magnetic yoke plate, and a second side plate portion (having a length to reach the horizontal groove, and a tip) facing the first side plate portion And the second side plate portion of the second magnet assembly. The second side plate portion of the second magnet assembly has a substantially U-shaped cross section. The outer projection of the first side plate is moved to the magnetic yoke in a state where the inner protrusion is engaged with the horizontal groove of the magnetic yoke plate and the permanent magnet is disposed at the outer circumferential step. One characterized by being mechanically fixed to the plate . An inner permanent magnet array composed of a plurality of permanent magnets arranged in series so as to have a magnetic pole of a predetermined polarity on the upper surface, and the inner permanent magnet array are surrounded, and a magnetic pole having a polarity opposite to that of the inner permanent magnet array is provided on the upper surface. A method of manufacturing a magnetic circuit device for magnetron sputtering by removably assembling a magnetic yoke plate through a spacer with an outer permanent magnet array composed of a plurality of permanent magnets arranged in series. a) from a first side plate portion having an engaging portion with the magnetic yoke plate, a second side plate portion facing the first side plate portion, and an upper plate portion integrally connecting both side plate portions. A first non-magnetic protective cover member having a substantially U-shaped cross section, and a first side plate portion having a length reaching the horizontal groove and having at least one engaging portion with the magnetic yoke plate at a tip portion And on the first side plate Producing a second nonmagnetic protective cover member having a substantially U-shaped cross section comprising a second side plate portion facing each other and an upper plate portion integrally connecting the both side plate portions, and (b) the first A first magnet assembly is manufactured by inserting at least one permanent magnet magnetized in the height direction into the protective cover member so that the upper plate side has the same polarity, and (c) the first By inserting at least one permanent magnet magnetized in the height direction into the second protective cover member so that the upper plate portion side has the opposite polarity to the first magnet assembly, the second magnet assembly (D) mechanically fixing the spacer to the magnetic yoke plate, and (e) mechanically fixing the first magnet assembly to the magnetic yoke plate via the first side plate portion. And (f) mechanically fixing the second magnet assembly to the magnetic yoke plate via the first side plate portion. Wherein the. An inner permanent magnet array composed of a plurality of permanent magnets arranged in series so as to have a magnetic pole of a predetermined polarity on the upper surface, and the inner permanent magnet array are surrounded, and a magnetic pole having a polarity opposite to that of the inner permanent magnet array is provided on the upper surface. A magnetron is assembled by detachably assembling an outer permanent magnet array composed of a plurality of permanent magnets connected in series to a magnetic yoke plate having a central groove extending in a predetermined direction on the upper surface and an outer circumferential step through a spacer. A method of manufacturing a magnetic circuit device for sputtering, comprising: (a) a first side plate portion having an outer flange portion having at least one opening, and a second side plate portion facing the first side plate portion A first non-magnetic protective cover member having a substantially U-shaped cross section comprising an upper plate portion integrally connecting both side plate portions, and a length reaching the horizontal groove and at least one at the tip portion The first side plate portion having an opening, the second side plate portion facing the first side plate portion, and the upper plate portion integrally connecting the both side plate portions are substantially U-shaped in cross section. And (b) inserting at least one permanent magnet magnetized in the height direction into the first protective cover member so that the upper plate portion side has the same polarity. (C) at least one permanent magnet magnetized in the height direction on the second protective cover member, and the first magnet assembly on the upper plate side. A second magnet assembly is produced by inserting the three-dimensionally-opposite polarities, and (d) a spacer is mechanically fixed to the magnetic yoke plate, and (e) the first magnet assembly is With the permanent magnet disposed in the central groove, the bolt is engaged with the opening of the outer flange portion. One magnet assembly is fixed to the magnetic yoke plate, and (f) is engaged with the opening of the first side plate portion in a state where the permanent magnet of the second magnet assembly is disposed at the outer circumferential step. A method of fixing the second magnet assembly to the magnetic yoke plate with a bolt. 18. The method of manufacturing a magnetic circuit device for magnetron sputtering according to claim 16 or 17, wherein the first protective cover member has a notch for receiving the spacer at least on the first side plate portion. Fixing the first magnet assembly to the magnetic yoke plate such that the first magnet assembly enters the notch.

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