TWI400349B - Magnetic loop device for magnetron sputtering - Google Patents

Magnetic loop device for magnetron sputtering Download PDF

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Publication number
TWI400349B
TWI400349B TW095103754A TW95103754A TWI400349B TW I400349 B TWI400349 B TW I400349B TW 095103754 A TW095103754 A TW 095103754A TW 95103754 A TW95103754 A TW 95103754A TW I400349 B TWI400349 B TW I400349B
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permanent magnet
side plate
plate portion
protective cover
cover member
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TW095103754A
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Chinese (zh)
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TW200641173A (en
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Hiroaki Yuasa
Yoshihiko Kuriyama
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Hitachi Metals Ltd
Neomax Kiko Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405Magnetron sputtering
    • H01J37/3408Planar magnetron sputtering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/345Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452Magnet distribution

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Description

磁控管濺鍍用磁回路裝置及其製造方法Magnetic circuit device for magnetron sputtering and manufacturing method thereof

本發明係關於一種搭載於在基板表面形成薄膜之磁控管濺鍍裝置之磁回路裝置及其製造方法。The present invention relates to a magnetic circuit device mounted on a magnetron sputtering apparatus for forming a thin film on a surface of a substrate, and a method of manufacturing the same.

磁控管濺鍍裝置在真空處理室內具有:與陽極側之基板相對而配置之標靶,配置於標靶背後之磁回路裝置,及以標靶成為陰極之方式而連接於標靶之高頻電源。在真空處理室內如導入10-1 ~10-3 Torr(13.33~0.13pa)之惰性氣體後,藉由在基板(陽極)與標靶(陰極)之間施加電壓,引起輝光放電,而將惰性氣體予以離子化,並且在自標靶放出之二次電子上直角地使磁場作用,而在標靶表面進行擺線運動,藉由與氣體分子撞擊而促進離子化,標靶材料之中性原子堆積(薄膜化)於基板上。磁控管濺鍍裝置由於成膜速度快,不引起電子撞擊基板,因此可低溫成膜,再者,由於具有可重現性佳地形成各種合金薄膜之優點,因此廣泛使用於半導體IC之製程等用途上。The magnetron sputtering apparatus has a target disposed opposite to the substrate on the anode side in the vacuum processing chamber, a magnetic circuit device disposed behind the target, and a high frequency connected to the target by the target being a cathode power supply. After introducing an inert gas of 10 -1 ~10 -3 Torr (13.33~0.13pa) in a vacuum processing chamber, a glow discharge is caused by applying a voltage between the substrate (anode) and the target (cathode), and the inert gas is generated. The gas is ionized, and the magnetic field is applied at a right angle to the secondary electron emitted from the target, and the cycloidal motion is performed on the surface of the target, and ionization is promoted by collision with the gas molecule, and the target material is a neutral atom. Stacked (thinned) on the substrate. Since the magnetron sputtering device has a high film formation speed and does not cause electrons to strike the substrate, it can be formed at a low temperature, and further, it is widely used in the process of semiconductor ICs because of its excellent reproducibility to form various alloy films. For other purposes.

磁控管濺鍍裝置中,放電集中在電場與磁場正交之標靶中央部,而顯著地濺鍍於該部分,因此長期間濺鍍後,標靶表面不均一化。因而,通常係使配置於標靶背面之磁回路裝置全體來回移動。In the magnetron sputtering apparatus, the discharge is concentrated in the central portion of the target orthogonal to the electric field and the magnetic field, and is significantly sputtered in this portion, so that the surface of the target is not uniform after sputtering for a long period of time. Therefore, the entire magnetic circuit device disposed on the back surface of the target is usually moved back and forth.

如日本特開平10-46334號揭示有一種濺鍍成膜裝置,其係具備:安裝有標靶之磁控管陰極,其係配置於搬運基板至內部之真空容器之壁部;磁控管磁回路裝置,其係以在標靶表面形成閉環狀磁場之方式而位於磁控管陰極之背面 側;第一機構,其係與標靶平行且在基板搬運方向上搖動磁回路裝置;及第二機構,其係與標靶平行且在與基板搬運方向垂直之方向上搖動磁回路裝置。記載於日本特開平10-46334號之磁控管磁回路裝置具有:桿狀之中央磁石;標靶側表面成為與中央磁石相反極性之方式而磁化之長方形狀之外周磁石;及支撐此等磁石之平坦之磁軛板。A sputtering film forming apparatus including a magnetron cathode to which a target is mounted, which is disposed on a wall portion of a vacuum container to which an internal substrate is transported, and a magnetron magnetic tube, is disclosed in Japanese Laid-Open Patent Publication No. Hei 10-46334. a loop device that is located on the back of the cathode of the magnetron in such a manner as to form a closed loop magnetic field on the surface of the target a first mechanism that is parallel to the target and that swings the magnetic circuit device in the substrate transport direction; and a second mechanism that is parallel to the target and that swings the magnetic circuit device in a direction perpendicular to the substrate transport direction. The magnetron magnetic circuit device disclosed in Japanese Patent Laid-Open No. Hei 10-46334 has a rod-shaped central magnet; a rectangular outer peripheral magnet that is magnetized in a manner opposite to the center magnet; and supports the magnets Flat yoke plate.

日本特開2000-248360號揭示有一種磁控管濺鍍裝置,其係具備:配置有基板以及與其相對之標靶之成膜室(第一真空室),設置有在標靶表面產生隧道狀直角方向(Poloidal)磁場之磁場產生機構之磁性室(第二真空室),及使磁場產生機構與標靶平行地來回移動之驅動裝置。在磁場產生機構近旁,依序配置有:背板及標靶,背板連接於施加負電位用之電源。磁場產生機構藉由背板及電源,而在標靶表面生成高密度之電漿。Japanese Laid-Open Patent Publication No. 2000-248360 discloses a magnetron sputtering apparatus comprising: a film forming chamber (first vacuum chamber) provided with a substrate and a target opposite thereto, and is provided with a tunnel shape on the surface of the target A magnetic chamber (second vacuum chamber) of a magnetic field generating mechanism of a Poloidal magnetic field, and a driving device that moves the magnetic field generating mechanism back and forth in parallel with the target. In the vicinity of the magnetic field generating mechanism, a backing plate and a target are arranged in sequence, and the backing plate is connected to a power source for applying a negative potential. The magnetic field generating mechanism generates a high-density plasma on the surface of the target by means of the backing plate and the power source.

為了加快對基板之成膜速度,需要縮短自磁回路裝置(永久磁石之表面)至標靶表面之距離,提高在標靶表面產生之磁場強度。但是,縮小磁回路裝置與標靶之間隔時,永久磁石與標靶背面之背板(或陰極)干擾而接觸時等,可能造成永久磁石脫落,其邊緣部破損。此外,磁回路裝置之組合作業中,以及磁回路裝置搬運或安裝於磁控管濺鍍裝置中,亦有因捆包狀況及處理上之錯誤等,永久磁石與其他構件碰撞,而造成永久磁石脫落或一部分破損之問題。In order to speed up the film formation speed of the substrate, it is necessary to shorten the distance from the surface of the self-magnetic circuit device (the surface of the permanent magnet) to the target surface to increase the strength of the magnetic field generated on the surface of the target. However, when the distance between the magnetic circuit device and the target is narrowed, when the permanent magnet interferes with the back plate (or cathode) on the back surface of the target, the permanent magnet may fall off and the edge portion may be damaged. In addition, in the combined operation of the magnetic circuit device, and the magnetic circuit device is transported or mounted in the magnetron sputtering device, the permanent magnet collides with other members due to the packing condition and the processing error, and the permanent magnet is caused. The problem of falling off or partially broken.

通常如記載於日本特開2000-248360號中之內容,磁場產生機構中之永久磁石係藉由接合劑而固定於軛鐵上。但 是,由於接合劑硬化時或硬化後產生放氣(Out gas)(分子量300程度以下),因此污染磁回路裝置之表面,而成為產生瑕疵品之原因。將脫落或破損之永久磁石更換成健全之永久磁石時,需要剝離接合劑,因而需要將磁回路裝置全體加熱至接合劑主要成分之樹脂之玻璃轉移溫度(如150~200℃)以上之溫度。因此,無法僅拆裝破損之永久磁石,而是拆裝全部之永久磁石。特別是由於大型之濺鍍裝置具備多數個(如100個以上)永久磁石之磁回路裝置,因此考慮作業工時,永久磁石之更換成本相當高。Generally, as described in Japanese Laid-Open Patent Publication No. 2000-248360, the permanent magnet in the magnetic field generating mechanism is fixed to the yoke by a bonding agent. but When the cement is hardened or hardened to generate an out gas (molecular weight of 300 or less), the surface of the magnetic circuit device is contaminated, which is a cause of defective products. When the permanent magnet that has fallen off or is damaged is replaced with a sound permanent magnet, it is necessary to peel off the bonding agent. Therefore, it is necessary to heat the entire magnetic circuit device to a temperature higher than the glass transition temperature (for example, 150 to 200 ° C) of the resin of the main component of the bonding agent. Therefore, it is not possible to disassemble only the damaged permanent magnet, but to disassemble all the permanent magnets. In particular, since a large-scale sputtering apparatus has a plurality of magnetic circuit devices of permanent magnets (for example, more than 100), the replacement cost of the permanent magnets is quite high in consideration of the working hours.

因此,如記載於日本特開平10-317137號及日本特開平11-36068號之內容,藉由螺栓等機械性手段固定永久磁石時,存在無法獲得充分之組合精確度之問題。Therefore, when the permanent magnet is fixed by mechanical means such as a bolt, there is a problem in that sufficient combination accuracy cannot be obtained as described in Japanese Patent Laid-Open No. Hei 10-317137 and No. Hei 11-36068.

因此,本發明之目的在提供一種可精確且可拆裝自如地搭載永久磁石,並且在使用中永久磁石不致脫落及破損之磁控管濺鍍用磁回路裝置及其製造方法。Accordingly, an object of the present invention is to provide a magnetic circuit device for magnetron sputtering which can accurately and detachably mount a permanent magnet and which does not fall off and break the permanent magnet during use, and a method of manufacturing the same.

鑑於上述目的之積極研究結果,發現至少將1個永久磁石安裝於保護蓋構件,並將其機械性地固定於磁控管濺鍍用磁回路裝置時,可將永久磁石精確且可拆裝自如地固定於磁回路裝置,並且在使用中永久磁石不致脫落及損傷,此外,由於不使用接合劑,因此亦不致發生放氣,因而想到本發明。In view of the positive research results of the above purposes, it is found that at least one permanent magnet can be mounted on the protective cover member and mechanically fixed to the magnetic circuit device for magnetron sputtering, and the permanent magnet can be accurately and detachably mounted. It is fixed to the magnetic circuit device, and the permanent magnet does not fall off and be damaged during use. Further, since the bonding agent is not used, deflation does not occur, and the present invention is conceivable.

因此,本發明第一磁控管濺鍍用磁回路裝置之特徵為具 備:內側永久磁石行,其係在上面具有指定極性之磁極之方式而連設成直線狀之數個直方體狀的永久磁石所形成;外側永久磁石行,其係包圍前述內側永久磁石行,在上面具有與前述內側永久磁石行之磁極相反極性的磁極之方式而連設的數個直方體狀的永久磁石所形成;磁軛板,其係可將前述內側永久磁石行及前述外側永久磁石行之永久磁石拆裝自如地保持;及剖面大致為字狀之非磁性保護蓋構件,其係至少逐一地覆蓋前述永久磁石;各保護蓋構件包含:第一側板部,其係覆蓋前述永久磁石之一方側面,並且機械性地固定於前述磁軛板;第二側板部,其係覆蓋前述永久磁石之另一方側面;及上板部,其係一體地連結兩側板部;並藉由各保護蓋構件之兩側板部而牢固地夾持前述永久磁石。Therefore, the magnetic circuit device for sputtering of the first magnetron of the present invention is characterized in that it has an inner permanent magnet row which is connected to a plurality of rectangular parallelepiped in a straight line shape with a magnetic pole of a predetermined polarity. Formed by a magnet; an outer permanent magnet row, which is formed by enclosing the inner permanent magnet row, and having a plurality of rectangular permanent magnets connected to the magnetic poles of opposite polarities of the inner permanent magnet rows; a yoke plate capable of detachably holding the inner permanent magnet row and the permanent magnet of the outer permanent magnet row; and the cross section is substantially a non-magnetic protective cover member that covers at least one of the permanent magnets one by one; each protective cover member includes: a first side plate portion covering one side of the permanent magnet and mechanically fixed to the yoke plate a second side plate portion covering the other side surface of the permanent magnet; and an upper plate portion integrally connecting the side plate portions; and firmly holding the permanent magnet by the plate portions on both sides of each protective cover member .

上述磁回路裝置中,前述磁軛板宜在上面具有承受長方體狀之前述永久磁石的凹部。承受構成前述內側永久磁石行之前述永久磁石的凹部係為中央溝,承受構成前述外側永久磁石行之前述永久磁石的凹部係為外周段差。In the above magnetic circuit device, it is preferable that the yoke plate has a concave portion that receives the rectangular magnet in a rectangular parallelepiped shape. The concave portion that receives the permanent magnet constituting the inner permanent magnet row is a central groove, and the concave portion that receives the permanent magnet constituting the outer permanent magnet row is an outer circumferential step.

上述磁回路裝置中,前述保護蓋構件之前述第一側板部宜具有至少具有1個開口部之外方凸緣部,在各永久磁石之下端部配置於前述磁軛板之前述凹部之狀態下,藉由咬合於前述開口部之螺栓,而將前述凸緣部固定於前述磁軛板。In the magnetic circuit device, it is preferable that the first side plate portion of the protective cover member has a flange portion having at least one opening portion, and the lower end portion of each permanent magnet is disposed in the recess portion of the yoke plate. The flange portion is fixed to the yoke plate by a bolt that is engaged with the opening.

本發明第二磁控管濺鍍用磁回路裝置之特徵為:前述磁軛板在上面具有:承受前述內側永久磁石行之中央溝,及承受前述外側永久磁石行之外周段差;並且在側面具有水 平溝,前述外側永久磁石行之各保護蓋構件之前述第一側板部,在與前述磁軛板之上面接觸之位置,具有至少具有1個開口部之外方凸緣部,前述第二側板部具有到達前述水平溝之長度,並且在前端具有內方突起部,據此,在前述內方突起部接合於前述水平溝,並且前述永久磁石配置於前述外周段差之狀態下,前述第一側板部之前述外方凸緣部藉由咬合於前述開口部之螺栓而固定於前述磁軛板上。The magnetic circuit device for sputtering a second magnetron of the present invention is characterized in that: the yoke plate has thereon: a central groove that receives the inner permanent magnet row, and a peripheral segment difference of the outer permanent magnet row; and has a side surface water a flat groove, wherein the first side plate portion of each of the protective cover members of the outer permanent magnet row has a flange portion having at least one opening portion at a position in contact with the upper surface of the yoke plate, and the second side plate portion has Arriving at the length of the horizontal groove, and having an inner protrusion at the front end, whereby the inner side protrusion is joined to the horizontal groove, and the permanent magnet is disposed in a state in which the outer circumference is in a difference, the first side plate portion The outer flange portion is fixed to the yoke plate by a bolt that is engaged with the opening.

在前述保護蓋構件之前述上板部之內面,亦可設置抵接於前述永久磁石之上面之突起部。The inner surface of the upper plate portion of the protective cover member may be provided with a protruding portion that abuts against the upper surface of the permanent magnet.

本發明第三磁控管濺鍍用磁回路裝置之特徵為具備:內側永久磁石行,其係在上面具有指定極性之磁極之方式而連設成直線狀之數個直方體狀的永久磁石所形成;外側永久磁石行,其係包圍前述內側永久磁石行,在上面具有與前述內側永久磁石行之磁極相反極性的磁極之方式而連設的直方體狀的數個永久磁石;磁軛板,其係可將前述內側永久磁石行及前述外側永久磁石行之永久磁石拆裝自如地保持;間隔物,其係設於前述內側永久磁石行與前述外側永久磁石行之間;及剖面大致為字狀之非磁性保護蓋構件,其係至少逐一地覆蓋前述永久磁石;前述內側永久磁石行之各保護蓋構件包含:第一側板部,其係覆蓋前述永久磁石之一方側面,並且機械性地固定於前述磁軛板;第二側板部,其係覆蓋前述永久磁石之另一方側面;及上板部,其係一體地連結兩側板部;前述外側永久磁石行之各保護蓋構件包含:第一側板部,其係具有覆蓋前述永久磁 石之一方側面及前述磁軛板之側面的至少一部分之長度,並且機械性地固定於前述磁軛板;第二側板部,其係覆蓋前述永久磁石之另一方側面;及上板部,其係一體地連結兩側板部;並藉由各保護蓋構件之兩側板部而牢固地夾持前述永久磁石。The magnetic circuit device for sputtering a third magnetron according to the present invention is characterized in that it has an inner permanent magnet row which is connected to a plurality of rectangular permanent magnets which are linearly arranged in a manner of a magnetic pole of a predetermined polarity. Forming; an outer permanent magnet row surrounding the inner permanent magnet row, having a plurality of rectangular parallelepiped magnets connected to the magnetic poles of opposite polarities of the inner permanent magnet rows; a yoke plate, The inner permanent magnet row and the outer permanent magnet row permanent magnet are detachably held; the spacer is disposed between the inner permanent magnet row and the outer permanent magnet row; and the cross section is substantially a non-magnetic protective cover member having a shape that covers at least one of the permanent magnets one by one; each of the protective cover members of the inner permanent magnet row includes: a first side plate portion covering one side of the permanent magnet, and mechanically Fixed to the yoke plate; the second side plate portion covers the other side surface of the permanent magnet; and the upper plate portion integrally connects the side plate portions; the protective cover members of the outer permanent magnet row include: a side plate portion having a length covering at least a portion of one side surface of the permanent magnet and a side surface of the yoke plate, and is mechanically fixed to the yoke plate; and a second side plate portion covering the permanent magnet The other side surface; and the upper plate portion integrally connect the side plate portions; and the permanent magnets are firmly held by the side plate portions of the respective cover members.

第三磁控管濺鍍用磁回路裝置中,前述磁軛板宜在上面具有承受前述內側永久磁石行之長方體狀之前述永久磁石之中央溝,並且具有承受前述外側永久磁石行之長方體狀之前述永久磁石之外周段差,前述內側永久磁石行之各保護蓋構件之前述第一側板部具有至少具有1個開口部之外方凸緣部,前述外側永久磁石行之各保護蓋構件之前述第一側板部,在與前述磁軛板之側面接觸之前端部分至少具有1個開口部,在各永久磁石之下端部配置於前述磁軛板之前述溝或段差之狀態下,前述第一側板部藉由咬合於前述開口部之螺栓而固定於前述磁軛板。前述內側永久磁石行之各保護蓋構件之前述第一側板部宜具有承受前述間隔物之缺口。In the magnetic circuit device for sputtering of the third magnetron, the yoke plate preferably has a central groove of the permanent magnet that receives the rectangular shape of the inner permanent magnet, and has a rectangular parallelepiped shape for receiving the outer permanent magnet. The first side plate portion of each of the protective cover members of the inner permanent magnet row has at least one outer flange portion, and the first side plate of each of the outer permanent magnet rows of the protective cover member is different from the outer circumference of the permanent magnet. The end portion has at least one opening portion before the contact with the side surface of the yoke plate, and the first side plate portion is disposed in a state where the lower end portion of each permanent magnet is disposed in the groove or the step of the yoke plate. The yoke plate is fixed to the yoke plate by a bolt that is engaged with the opening. Preferably, the first side plate portion of each of the protective cover members of the inner permanent magnet row has a notch that receives the spacer.

任何一種磁控管濺鍍用磁回路裝置中,前述保護蓋構件均宜以可彈性變形之非磁性金屬板而形成。此外,前述永久磁石之的磁極面之寬度WP ,與前述保護蓋構件之兩側板部之開口端之內壁寬度WO 及前述上板部之內壁寬度WD ,宜滿足WD >WP >WO 之關係。In any of the magnetic circuit devices for magnetron sputtering, the protective cover member is preferably formed of an elastically deformable non-magnetic metal plate. Further, the width W P of the magnetic pole surface of the permanent magnet and the inner wall width W O of the open end of the side plate portions of the protective cover member and the inner wall width W D of the upper plate portion are preferably W D >W P > W O relationship.

製造本發明之第一磁控管濺鍍用磁回路裝置之方法,係藉由在磁軛板上可拆裝自如地組合:內側永久磁石行,其係在上面具有指定極性之磁極之方式而連設成直線狀之數 個直方體狀的永久磁石所形成;及外側永久磁石行,其係包圍前述內側永久磁石行,在上面具有與前述內側永久磁石行之磁極相反極性的磁極之方式而連設的數個直方體狀的永久磁石所形成;其特徵為:(a)製作剖面大致為字狀之第一及第二非磁性保護蓋構件,其係由:具有與前述磁軛板之接合部的第一側板部,與前述第一側板部相對向之第二側板部、及一體地連結兩側板部之上板部來形成;(b)藉由以前述上板部側成為同極性之方式,在前述第一保護蓋構件中插入在高度方向磁化之至少1個永久磁石,而製作第一磁石組合體;(c)藉由以前述上板部側成為與前述第一磁石組合體相反極性之方式,在前述第二保護蓋構件中插入在高度方向磁化之至少1個永久磁石,而製作第二磁石組合體;(d)分別將前述第一及第二磁石組合體機械性地固定於前述磁軛板上。The method for manufacturing the first magnetic circuit device for magnetron sputtering of the present invention is detachably assembled on a yoke plate: an inner permanent magnet row having a magnetic pole of a specified polarity thereon a plurality of straight-shaped permanent magnets connected in a straight line; and an outer permanent magnet row surrounding the inner permanent magnet row and having a magnetic pole having a polarity opposite to that of the inner permanent magnet row Formed by a plurality of parallel-shaped permanent magnets; characterized in that: (a) the production profile is approximately a first and second non-magnetic protective cover member having a shape, a first side plate portion having a joint portion with the yoke plate, a second side plate portion facing the first side plate portion, and integrally (b) by inserting at least one permanent magnet magnetized in the height direction into the first protective cover member so that the upper plate portion side has the same polarity, and is formed. (c) inserting at least one permanent magnet magnetized in the height direction into the second protective cover member so that the upper plate portion side has a polarity opposite to that of the first magnet assembly; And forming a second magnet assembly; (d) mechanically fixing the first and second magnet assemblies to the yoke plate, respectively.

上述磁回路裝置之製造方法中,前述磁軛板宜在上面具有承受長方體狀之前述永久磁石的凹部。承受構成前述內側永久磁石行之前述永久磁石的凹部宜係中央溝,承受構成前述外側永久磁石行之前述永久磁石的凹部宜為外周段差。In the method of manufacturing a magnetic circuit device, it is preferable that the yoke plate has a concave portion that receives the rectangular magnet in a rectangular parallelepiped shape. The concave portion that receives the permanent magnet constituting the inner permanent magnet row is preferably a central groove, and the concave portion that receives the permanent magnet constituting the outer permanent magnet row is preferably a peripheral step.

上述磁回路裝置之製造方法中,前述保護蓋構件之前述第一側板部宜具有至少具有1個開口部之外方凸緣部,在將各永久磁石之下端部配置於前述磁軛板之前述凹部狀態下,藉由咬合於前述開口部之螺栓,而將前述凸緣部固定於前述磁軛板上。In the method of manufacturing the magnetic circuit device, it is preferable that the first side plate portion of the protective cover member has a flange portion having at least one opening portion, and the lower end portion of each permanent magnet is disposed in the concave portion of the yoke plate. Next, the flange portion is fixed to the yoke plate by a bolt that is engaged with the opening.

製造本發明之第二磁控管濺鍍用磁回路裝置之方法之 特徵為:前述磁軛板在上面具有中央溝及外周段差及在側面具有水平溝,前述第二非磁性保護蓋構件具有剖面大致為字狀,其係包含:具有外方凸緣部之第一側板部,該外方凸緣部具有與前述磁軛板之接合部;與前述第一側板部相對向之第二側板部(具有到達前述水平溝之長度,並且在前端具有內方突起部);及一體地連結兩側板部之上板部;在使前述第二磁石組合體之前述第二側板部之前述內方突起部接合於前述磁軛板之前述水平溝,並且將前述永久磁石配置於前述外周段差之狀態下,將前述第一側板部之前述外方凸緣部機械性地固定於前述磁軛板上。The method for manufacturing the second magnetic tube sputtering magnetic circuit device of the present invention is characterized in that the yoke plate has a central groove and an outer peripheral step on the upper surface and a horizontal groove on the side surface, and the second non-magnetic protective cover member has a cross section. Roughly a shape including: a first side plate portion having an outer flange portion having a joint portion with the yoke plate; and a second side plate portion facing the first side plate portion (having reaching the horizontal groove) a length, and an inner protruding portion at the front end; and integrally connecting the upper plate portion upper plate portion; and the inner protruding portion of the second side plate portion of the second magnet assembly is joined to the yoke The horizontal groove of the plate is disposed in a state in which the permanent magnet is disposed in the outer peripheral step, and the outer flange portion of the first side plate portion is mechanically fixed to the yoke plate.

製造本發明之第三磁控管濺鍍用磁回路裝置之方法,係藉由經由間隔物而在磁軛板上可拆裝自如地組合:內側永久磁石行,其係在上面具有指定極性之磁極之方式而連設成直線狀之數個直方體狀的永久磁石所形成;及外側永久磁石行,其係包圍前述內側永久磁石行,在上面具有與前述內側永久磁石行之磁極相反極性的磁極之方式而連設的數個直方體狀的永久磁石所形成;其特徵為:(a)製作剖面大致為字狀之第一非磁性保護蓋構件,其係由:具有與前述磁軛板之接合部的第一側板部,與前述第一側板部相對向之第二側板部、及一體地連結兩側板部之上板部;及製作剖面大致為字狀之第二非磁性保護蓋構件,其係包含:具有到達前述磁軛板之長度,並且前端部具有與至少一個前述磁軛板之接合部的第一側板部,與前述第一側板部相對向之第二側板部、及一體地連結兩側板部之上板部來形成;(b)藉由以前述上板部側成為同極性之方式,在前 述第一保護蓋構件中插入在高度方向磁化之至少1個永久磁石,而製作第一磁石組合體;(c)藉由以前述上板部側成為與前述第一磁石組合體相反極性之方式,在前述第二保護蓋構件中插入在高度方向磁化之至少1個永久磁石,而製作第二磁石組合體;(d)在前述磁軛板上機械性地固定間隔物;(e)經由前述第一側板部,將前述第一磁石組合體機械性地固定於前述磁軛板上;(f)經由前述第一側板部,將前述第二磁石組合體機械性地固定於前述磁軛板上。A method of manufacturing a magnetic circuit device for a third magnetron sputtering according to the present invention is detachably combined on a yoke plate via a spacer: an inner permanent magnet row having a specified polarity thereon a plurality of rectangular permanent magnets formed in a linear manner by a magnetic pole; and an outer permanent magnet row surrounding the inner permanent magnet row having an opposite polarity to the magnetic pole of the inner permanent magnet row a plurality of rectangular parallelepiped magnets connected in a magnetic pole manner; characterized in that: (a) the cross section is substantially a first non-magnetic protective cover member having a shape, a first side plate portion having a joint portion with the yoke plate, a second side plate portion facing the first side plate portion, and integrally connecting the side plates Upper part of the board; and the production section is roughly a second non-magnetic protective cover member comprising: a first side plate portion having a length reaching the yoke plate and having a front end portion having a joint portion with at least one of the yoke plates, and the first side plate portion The second side plate portion and the upper plate portion upper plate portion are integrally connected to each other; (b) the height is inserted into the first protective cover member at a height such that the upper plate portion side has the same polarity Inserting at least one permanent magnet magnetized in the direction to form a first magnet assembly; (c) inserting the second protective cover member in such a manner that the upper plate portion side has a polarity opposite to that of the first magnet assembly a second magnet assembly that is magnetized in the height direction to form a second magnet assembly; (d) mechanically fixing the spacer on the yoke plate; (e) the first magnet via the first side plate portion The assembly is mechanically fixed to the yoke plate; (f) the second magnet assembly is mechanically fixed to the yoke plate via the first side plate portion.

製造第三磁控管濺鍍用磁回路裝置之適切方法,係藉由經由間隔物而在上面具有延伸於指定方向之中央溝及外周段差之磁軛板上可拆裝自如地組合:內側永久磁石行,其係在上面具有指定極性之磁極之方式而連設成直線狀之數個直方體狀的永久磁石所形成;及外側永久磁石行,其係包圍前述內側永久磁石行,在上面具有與前述內側永久磁石行之磁極相反極性的磁極之方式而連設的數個直方體狀的永久磁石所形成;其特徵為:(a)製作剖面大致為字狀之第一非磁性保護蓋構件,其係包含:具有外方凸緣部之第一側板部,該外方凸緣部具有至少1個開口部;與前述第一側板部相對向之第二側板部;及一體地連結兩側板部之上板部;及製作剖面大致為字狀之第二非磁性保護蓋構件,其係包含:具有到達前述磁軛板之長度,並且前端部具有至少一個開口部之第一側板部,與前述第一側板部相對向之第二側板部、及一體地連結兩側板部之上板部來形成;(b)藉由以前述上板部側成為同極性之方式,在前述第一保護蓋構件中插入在高度方向磁化之至少1個永久磁 石,而製作第一磁石組合體;(c)藉由以前述上板部側成為與前述第一磁石組合體相反極性之方式,在前述第二保護蓋構件中插入在高度方向磁化之至少1個永久磁石,而製作第二磁石組合體;(d)在前述磁軛板上機械性地固定間隔物;(e)在將前述第一磁石組合體之永久磁石配置於前述中央溝之狀態下,藉由咬合於前述外方凸緣部之開口部之螺栓,而將前述第一磁石組合體固定於前述磁軛板上;(f)在將前述第二磁石組合體之永久磁石配置於前述外周段差之狀態下,藉由咬合於前述第一側板部之開口部之螺栓,而將前述第二磁石組合體固定於前述磁軛板上。A suitable method for manufacturing a magnetic circuit device for sputtering a third magnetron is detachably combined by a yoke plate having a central groove extending in a specified direction and a peripheral segment via a spacer: the inner permanent a row of magnets formed by a plurality of rectangular permanent magnets connected in a straight line with a magnetic pole of a specified polarity; and an outer permanent magnet row enclosing the inner permanent magnet row, having an upper permanent magnet row thereon a plurality of rectangular parallelepiped permanent magnets connected to the magnetic poles of opposite polarities of the inner permanent magnet rows; characterized in that: (a) the cross section is substantially a first non-magnetic protective cover member having a shape, comprising: a first side plate portion having an outer flange portion, the outer flange portion having at least one opening portion; and a second side plate portion facing the first side plate portion; And integrally connecting the upper plate portions of the upper plate portions; and the production profile is substantially a second non-magnetic protective cover member comprising: a first side plate portion having a length reaching the yoke plate and having at least one opening portion at a front end portion, and a second side plate opposite to the first side plate portion And (b) inserting at least one of the magnetization in the height direction in the first protective cover member so that the upper plate portion side has the same polarity. a permanent magnet to form a first magnet assembly; (c) inserting at least a magnetization in the height direction in the second protective cover member by the opposite polarity of the upper plate portion side from the first magnet assembly a permanent magnet to form a second magnet assembly; (d) mechanically fixing the spacer on the yoke plate; (e) a state in which the permanent magnet of the first magnet assembly is disposed in the central groove And fixing the first magnet assembly to the yoke plate by a bolt that is engaged with the opening of the outer flange portion; (f) arranging the permanent magnet of the second magnet assembly on the outer circumference segment Under the state, by the bolt engaging portion of the opening portion of the first side plate, whereas the second magnet assembly is fixed to the yoke plate.

第三磁控管濺鍍用磁回路裝置之製造方法中,前述第一保護蓋構件至少在前述第一側板部上宜具有承受前述間隔物之缺口,並以前述間隔物進入前述缺口之方式,將前述第一磁石組合體固定於前述磁軛板上。In the method of manufacturing a magnetic circuit device for sputtering a third magnetron, the first protective cover member preferably has a notch that receives the spacer at least in the first side plate portion, and the spacer enters the notch. The aforementioned first magnet assembly is fixed to the yoke plate.

參照附圖詳細說明本發明之磁控管濺鍍用磁回路裝置如下。另外各圖中,具有相同功能之構件上註記相同參照編號(或後二位數相同之參照編號)。The magnetic circuit device for magnetron sputtering according to the present invention will be described in detail below with reference to the accompanying drawings. In each of the drawings, members having the same function are denoted by the same reference number (or the same reference number as the last two digits).

[1]磁控管濺鍍用磁回路裝置[1] Magnetic circuit device for magnetron sputtering

(1)第一形態(1) First form

如第1圖所示,磁回路裝置1具備:長度方向兩端部大致半圓狀之平坦之磁軛板2,機械性地固定於磁軛板2上面之內側永久磁石行3及外側永久磁石行4。如第2~4圖所示,內側永久磁石行3以在上面具有指定極性之磁極(如S極)之方式,而直線狀地連設有在高度方向上預先磁化 之數個如長方體狀之永久磁石30。各永久磁石30之下端部在磁軛板2上,保持於形成於長度方向之中央溝21內。至少1個永久磁石30被非磁性保護蓋構件31覆蓋,各保護蓋構件31藉由旋入螺栓(下簡稱為「螺栓」)5等,而機械性地固定於磁軛板2之上面。As shown in Fig. 1, the magnetic circuit device 1 includes a flat yoke plate 2 having substantially semicircular ends at both ends in the longitudinal direction, and is mechanically fixed to the inner permanent magnet row 3 and the outer permanent magnet row on the upper surface of the yoke plate 2. 4. As shown in FIGS. 2 to 4, the inner permanent magnet row 3 is linearly connected to the magnetic pole (for example, the S pole) having a predetermined polarity thereon, and is linearly connected in advance in the height direction. A number of permanent magnets 30, such as a rectangular parallelepiped. The lower end portions of the permanent magnets 30 are held on the yoke plate 2 in the central groove 21 formed in the longitudinal direction. At least one permanent magnet 30 is covered by the non-magnetic protective cover member 31, and each protective cover member 31 is mechanically fixed to the upper surface of the yoke plate 2 by screwing a bolt (hereinafter simply referred to as "bolt") 5 or the like.

如第5圖所示,各保護蓋構件31包含:覆蓋永久磁石30之一方側面,並且機械性地固定於磁軛板2之第一側板部31a,覆蓋永久磁石30之另一方側面之第二側板部31b,及一體地連結兩側板部31a,31b之上板部31c,第一側板部31a具有至少具有1個開口部31d之外方凸緣部31e,外方凸緣部31e藉由咬合於開口部31d之螺栓5,而固定於磁軛板2。該開口部31d係可插通螺栓5之螺絲部大小之貫穿孔。As shown in FIG. 5, each of the protective cover members 31 includes: one side surface covering the permanent magnet 30, and is mechanically fixed to the first side plate portion 31a of the yoke plate 2, covering the second side of the other side of the permanent magnet 30 The side plate portion 31b and the upper plate portion 31a, 31b upper plate portion 31c are integrally connected, and the first side plate portion 31a has an outer flange portion 31e having at least one opening portion 31d, and the outer flange portion 31e is engaged with the opening portion 31d. The bolt 5 is fixed to the yoke plate 2. The opening portion 31d is a through hole that can be inserted into the screw portion of the bolt 5.

為了藉由各保護蓋構件31之兩側板部31a,31b牢固地夾持永久磁石30,宜使上板部31c之內壁寬WD 作成比保護蓋構件31之兩側板部31a,31b之開口端之內壁更寬WO ,具體而言,使寬度WD 比永久磁石30之寬度WP 稍大,如形成0<WD -WP ≦0.05mm,使寬度WO 比永久磁石30之寬度WP 稍小,如形成0<WP -WO ≦0.1mm。因此,係WD >WP >WO ,且WD -WO 最大為0.15mm。如此,藉由設定WD 及WO ,可無不良影響地牢固夾持永久磁石30。此外,插入永久磁石30時,為了防止在開口邊緣造成損傷,如第5(c)圖所示,亦可稍微擴大第二側板部31b之前端部31g。In order to cover both sides by respective protective member 31 of the plate portion 31a, 31b securely clamp the permanent magnets 30, should the upper plate portion 31c of the inner wall of both sides of the plate width W D creation portion 31a of the member 31 than the protective cap, 31b of the opening The inner wall of the end is wider W O , specifically, the width W D is slightly larger than the width W P of the permanent magnet 30, such as forming 0 < W D - W P ≦ 0.05 mm, so that the width W O is longer than the permanent magnet 30 The width W P is slightly smaller, such as forming 0 < W P - W O ≦ 0.1 mm. Therefore, the system W D > W P > W O , and W D - W O is at most 0.15 mm. Thus, by setting W D and W O , the permanent magnet 30 can be firmly held without adverse effects. Further, when the permanent magnet 30 is inserted, in order to prevent damage at the edge of the opening, as shown in Fig. 5(c), the front end portion 31g of the second side plate portion 31b may be slightly enlarged.

自外方凸緣部31e之底面至上板部31c內面之高度H,與永久磁石30之地上部(突出於比磁軛板2更上方之部分)之高度HP 相同,或比其稍大,如宜設定成H-HP = 0~0.1mm。此外,第二側板部31b如第2圖所示,將永久磁石30嵌入中央溝21時,宜為確實具有其下端在比磁軛板2之上面稍高位置之長度者。The height H from the bottom surface of the outer flange portion 31e to the inner surface of the upper plate portion 31c is the same as or slightly larger than the height H P of the ground portion of the permanent magnet 30 (exposed above the yoke plate 2). It should be set to HH P = 0~0.1mm. Further, as shown in Fig. 2, when the permanent magnet 30 is fitted into the center groove 21, it is preferable that the second side plate portion 31b has a length at which the lower end is slightly higher than the upper surface of the yoke plate 2.

保護蓋構件31之長度L(參照第6圖),於收容1個永久磁石30時,宜設定成與永久磁石30之長度LP 相同或稍短(參照第12圖),此外,收容兩個永久磁石30時,宜設定成2LP 或比其稍短(參照第13圖)。雖保護蓋構件31之角部為圓角化,不過為了擴大保護蓋構件31之內面與永久磁石30外面之接觸面積,保護蓋構件31之內周角部之曲率如宜形成0.5mm以下。The length L of the protective cover member 31 (see Fig. 6) is preferably set to be the same as or slightly shorter than the length L P of the permanent magnet 30 when the permanent magnet 30 is housed (see Fig. 12). When the permanent magnet is 30, it should be set to 2L P or slightly shorter (refer to Fig. 13). Although the corner portion of the protective cover member 31 is rounded, in order to enlarge the contact area between the inner surface of the protective cover member 31 and the outer surface of the permanent magnet 30, the curvature of the inner peripheral corner portion of the protective cover member 31 is preferably 0.5 mm or less.

如第2~4圖所示,外側永久磁石行4以包圍內側永久磁石行3之方式而連設有在與永久磁石30相反方向磁化(圖示之例中,上面側為N極)之數個永久磁石40,各永久磁石40之下端部保持於形成於磁軛板2之外周段差22。至少1個永久磁石40被非磁性保護蓋構件41牢固地夾持,各保護蓋構件41之外方凸緣部41e藉由螺栓5而機械性地固定於磁軛板2。夾持永久磁石40之保護蓋構件41之形狀,除因永久磁石40比永久磁石30厚,而內壁寬較大之外,與保護蓋構件31相同,因此省略其說明。不過如第1圖所示,安裝於磁軛板2之兩端部附近之保護蓋構件41宜具有覆蓋各永久磁石40之大致全部表面之形狀。當然,為了牢固地夾持永久磁石40,亦與保護蓋構件31相同,宜滿足WD 、WP 及WO 之關係。As shown in FIGS. 2 to 4, the outer permanent magnet row 4 is connected to the inner permanent magnet row 3 so as to be magnetized in the opposite direction to the permanent magnet 30 (in the example shown, the upper side is the N pole). The permanent magnets 40, the lower ends of the permanent magnets 40 are held at a circumferential difference 22 formed outside the yoke plate 2. At least one permanent magnet 40 is firmly held by the non-magnetic protective cover member 41, and the outer flange portion 41e of each protective cover member 41 is mechanically fixed to the yoke plate 2 by the bolt 5. The shape of the protective cover member 41 for holding the permanent magnet 40 is the same as that of the protective cover member 31 except that the permanent magnet 40 is thicker than the permanent magnet 30 and the inner wall is wide, and therefore the description thereof will be omitted. However, as shown in Fig. 1, the protective cover member 41 attached to the vicinity of both end portions of the yoke plate 2 preferably has a shape covering substantially the entire surface of each of the permanent magnets 40. Of course, in order to firmly hold the permanent magnet 40, it is also the same as the protective cover member 31, and it is preferable to satisfy the relationship of W D , W P and W O .

永久磁石30,40本身可為熟知者,於低價格之裝置時,宜使用鐵素體燒結磁石,此外,為在標靶表面產生強力磁 場之高價格裝置時,宜使用稀土類磁石,並宜為將R2 T14 B(R係包含Y之稀土類元素之一種以上,必須為選自由釹、鐠、鏑及鋱所組成之群之至少一種,T為鐵或鐵與鈷)作為主相之各向異性R-T-B系燒結磁石。由於成膜時基板之溫度上昇,設有磁回路裝置之真空室之溫度亦上昇,因此,特別宜使用具有1193kA‧m-1 以上之保磁力Hcj之耐熱型之各向異性R-T-B系燒結磁石。The permanent magnets 30, 40 themselves may be well-known. For low-cost devices, ferrite sintered magnets should be used. In addition, rare earth magnets should be used for high-priced devices that generate strong magnetic fields on the surface of the target. In order to use R 2 T 14 B (R or more of one or more rare earth elements containing Y, it must be at least one selected from the group consisting of ruthenium, osmium, iridium, and osmium, and T is iron or iron and cobalt) as a main phase. An anisotropic RTB based sintered magnet. Since the temperature of the substrate rises during film formation, the temperature of the vacuum chamber provided with the magnetic circuit device also rises. Therefore, it is particularly preferable to use a heat-resistant anisotropic RTB-based sintered magnet having a coercive force Hcj of 1193 kA·m -1 or more.

磁軛板2為了形成磁路,包含鐵、鋼等強磁性金屬,不過,宜為一般構造用壓延鋼材(SS40等),或是馬丁體(Marteusite)系不銹鋼(SUS403等)。The yoke plate 2 contains a ferromagnetic metal such as iron or steel in order to form a magnetic circuit. However, it is preferably a rolled steel material (SS40 or the like) for general construction or a Marteusite stainless steel (SUS403 or the like).

保護蓋構件31,41須為非磁性體,來防止自永久磁石30,40產生之磁束短路。保護蓋構件31,41亦可藉由FRP等塑膠材料而形成,不過,仍宜藉由可彈性變形,高度耐用性之奧氏體(Austenite)系不銹鋼(如SUS304)或鋁合金(如A6063)等金屬板予以沖壓加工或擠壓加工而形成。保護蓋構件31,41之厚度宜依永久磁石30,40之材質及尺寸而適切設定。如以金屬製之保護蓋構件覆蓋各向異性R-T-B系燒結磁石時,為了彈性變形容易,板厚宜為3mm以下,特別宜為0.5~2mm。The protective cover members 31, 41 must be non-magnetic to prevent short-circuiting of the magnetic beams generated from the permanent magnets 30, 40. The protective cover members 31, 41 may also be formed of a plastic material such as FRP, but it is still preferable to use an elastically deformable, highly durable austenite stainless steel (such as SUS304) or an aluminum alloy (such as A6063). The metal plate is formed by press working or extrusion processing. The thickness of the protective cover members 31, 41 should be appropriately set depending on the material and size of the permanent magnets 30, 40. When the anisotropic R-T-B sintered magnet is covered with a protective cover member made of metal, the thickness is preferably 3 mm or less, and particularly preferably 0.5 to 2 mm, in order to facilitate elastic deformation.

(2)第二形態(2) The second form

保護蓋構件之形狀並不限定於上述者,亦可為第7圖所示之形狀。第7圖中,在與第1~6圖相同功能之部分註記相同(或後二位數相同)之參照符號。第7圖所示之例中,磁軛板2在上面具有承受內側永久磁石行30之中央溝21,及承受外側永久磁石行40之外周段差22,並且在側面,於 外周段差22之下方位置具有水平溝23,保護蓋構件141具有:具有外方凸緣部141e之第一側板部141a,該外方凸緣部141e在接觸於磁軛板2上面之位置,至少具有1個開口部141d;第二側板部141b,其係越過永久磁石40之下端而到達水平溝23,並且在前端具有內方突起部141f;及上板部141c,其係一體地連結兩側板部141a,141b。內方突起部141f可藉由將第二側板部141b之前端部向內側直角地彎曲而形成。在使內方突起部141f接合於水平溝23,而將永久磁石40配置於外周段差22之狀態下,藉由咬合於開口部141d之螺絲5,而將第一側板部141a之外方凸緣部141e固定於磁軛板2上。藉由形成內方突起部141f接合於水平溝23之形狀,可將永久磁石40更牢固地固定於磁軛板2,因此可減少保護蓋構件141之厚度。The shape of the protective cover member is not limited to the above, and may be the shape shown in Fig. 7. In Fig. 7, the same reference numerals are used for the same functions as those of the first to sixth figures (or the same two digits are the same). In the example shown in Fig. 7, the yoke plate 2 has a central groove 21 on the upper side of the permanent magnet row 30 and a peripheral portion 22 on the outer permanent magnet row 40, and on the side, The lower portion of the outer peripheral step 22 has a horizontal groove 23, and the protective cover member 141 has a first side plate portion 141a having an outer flange portion 141e having at least one opening at a position contacting the upper surface of the yoke plate 2 a second side plate portion 141b that passes over the lower end of the permanent magnet 40 and reaches the horizontal groove 23, and has an inner protrusion portion 141f at the front end; and an upper plate portion 141c that integrally connects the side plate portions 141a, 141b . The inner protruding portion 141f can be formed by bending the front end portion of the second side plate portion 141b at a right angle to the inner side. When the inner protruding portion 141f is joined to the horizontal groove 23 and the permanent magnet 40 is placed in the outer peripheral step 22, the outer side flange portion 141e of the first side plate portion 141a is engaged by the screw 5 that is engaged with the opening portion 141d. It is fixed to the yoke plate 2. By forming the shape in which the inner protruding portion 141f is joined to the horizontal groove 23, the permanent magnet 40 can be more firmly fixed to the yoke plate 2, so that the thickness of the protective cover member 141 can be reduced.

(3)第三形態(3) The third form

第8圖所示之例中,在保護蓋構件241之上板部241c之內面設有抵接於永久磁石40上面之突起部241g。如第8圖之(b)所示,突起部241g延伸於保護蓋構件241之長度方向。突起部241g可藉由模壓(emboss)等方法而形成。藉由該形狀,而將插入保護蓋構件241之永久磁石40安裝於磁軛板2之外周段差22,將保護蓋構件241螺合於磁軛板2時,由於永久磁石40以保護蓋構件241向下擠壓,因此可將永久磁石40更牢固地固定於磁軛板2上。In the example shown in Fig. 8, the inner surface of the upper plate portion 241c of the protective cover member 241 is provided with a projection 241g that abuts against the upper surface of the permanent magnet 40. As shown in FIG. 8(b), the protruding portion 241g extends in the longitudinal direction of the protective cover member 241. The protrusion 241g can be formed by a method such as embossing. By this shape, the permanent magnet 40 inserted into the protective cover member 241 is attached to the outer peripheral step 22 of the yoke plate 2, and when the protective cover member 241 is screwed to the yoke plate 2, the permanent magnet 40 is used to protect the cover member 241. The pressing is performed downward, so that the permanent magnet 40 can be more firmly fixed to the yoke plate 2.

(4)第四形態(4) The fourth form

於磁控管濺鍍裝置中,磁回路裝置之寬度設定為如170~200mm,不過,為了儘量均一地濺鍍標靶表面,而使標 靶之利用效率提高,宜形成排列多數個(如12個或14個)寬度較窄之如100~120mm程度之磁回路裝置之構造。該寬度窄之磁回路裝置中,因標靶之材質(如非磁性金屬),而需要在標靶表面產生高磁束密度,因此如第9圖所示,檢討將寬度大之永久磁石30,40固定於磁軛板2。In the magnetron sputtering device, the width of the magnetic circuit device is set to be 170 to 200 mm, however, in order to sputter the target surface as uniformly as possible, The utilization efficiency of the target is improved, and it is preferable to form a structure in which a plurality of (for example, 12 or 14) magnetic circuit devices having a narrow width such as 100 to 120 mm are arranged. In the narrow magnetic circuit device, since the target material (such as a non-magnetic metal) needs to have a high magnetic flux density on the surface of the target, as shown in Fig. 9, the permanent magnet having a large width is reviewed 30, 40. Fixed to the yoke plate 2.

第9圖所示之第四形態之磁控管濺鍍用磁回路裝置,具有以窄間隔設置較厚之永久磁石之構造,因此在永久磁石30與永久磁石40之間產生強磁性吸引力,而需要在內側永久磁石行3與外側永久磁石行4之間設置包含非磁性體之間隔物6。為了確保間隔物6之設置空間,而縮短保護蓋構件331,441之第二側板部,並將保護蓋構件331,441全體形成接近L字形之字狀。The magnetic circuit device for magnetron sputtering according to the fourth aspect shown in Fig. 9 has a structure in which a thick permanent magnet is provided at a narrow interval, so that a strong magnetic attraction force is generated between the permanent magnet 30 and the permanent magnet 40. It is necessary to provide a spacer 6 containing a non-magnetic material between the inner permanent magnet row 3 and the outer permanent magnet row 4. In order to secure the space for the spacers 6, the second side plate portions of the protective cover members 331, 441 are shortened, and the entire protective cover members 331, 441 are formed in an L-shape. Word shape.

如第9圖及第11(a)圖所示,內側永久磁石行3之保護蓋構件331包含:第一側板部331a,其係具有大致為字狀之剖面,而覆蓋永久磁石30之一方側面;覆蓋永久磁石30之另一方側面之第二側板部331b;及一體地連結兩側板部331a,331b之上板部331c。第一側板部331a在前端具有外方凸緣部331e,在第一側板部331a及外方凸緣部331e中設有承受間隔物6之缺口331f,此外,在外方凸緣部331e中設有螺栓用開口部331d。第二側板部331b縮短至承受間隔物6之高度。保護蓋構件331藉由缺口331f及短之第二側板部331b而防止與間隔物6之干擾,因此可以窄間隔設置內側永久磁石行3與外側永久磁石行4。As shown in FIG. 9 and FIG. 11(a), the protective cover member 331 of the inner permanent magnet row 3 includes: a first side plate portion 331a having a substantially The shape of the cross section covers one side of the permanent magnet 30, the second side plate portion 331b covering the other side of the permanent magnet 30, and the upper plate portion 331a, 331b upper plate portion 331c. The first side plate portion 331a has an outer flange portion 331e at its distal end, and a notch 331f for receiving the spacer 6 is provided in the first side plate portion 331a and the outer flange portion 331e, and a bolt opening portion 331d is provided in the outer flange portion 331e. The second side plate portion 331b is shortened to the height of the spacer 6. Since the protective cover member 331 prevents interference with the spacer 6 by the notch 331f and the short second side plate portion 331b, the inner permanent magnet row 3 and the outer permanent magnet row 4 can be provided at a narrow interval.

如第9圖及第11(a)圖所示,外側永久磁石行4之保護蓋構件341包含:第一側板部341a,其係具有接近L字形 之大致為字狀之剖面,而覆蓋永久磁石40之一方側面;覆蓋永久磁石40之另一方側面之第二側板部341b;及一體地連結兩側板部341a,341b之上板部341c。第一側板部341a具有覆蓋磁軛板2側面之至少一部分之長度,在前端部具有螺栓52用之開口部341d。第二側板部341b縮短至承受間隔物6之高度。保護蓋構件341由於第一側板部341a之下端部連結於磁軛板2之側面,因此可將永久磁石40牢固地固定於磁軛板2。As shown in FIG. 9 and FIG. 11(a), the protective cover member 341 of the outer permanent magnet row 4 includes a first side plate portion 341a having a shape close to an L shape. The shape of the cross section covers one side of the permanent magnet 40; the second side plate portion 341b covering the other side of the permanent magnet 40; and the upper plate portion 341a, 341b upper plate portion 341c. The first side plate portion 341a has a length covering at least a part of the side surface of the yoke plate 2, and has an opening portion 341d for the bolt 52 at the front end portion. The second side plate portion 341b is shortened to the height of the spacer 6. Since the protective cover member 341 is coupled to the side surface of the yoke plate 2 at the lower end portion of the first side plate portion 341a, the permanent magnet 40 can be firmly fixed to the yoke plate 2.

此外,由於第四形態以保護蓋構件331,341覆蓋永久磁石30,40之至少上部,因此可大幅減低因永久磁石30,40與其他構件之干擾(碰撞)而破損之機會,此外,將永久磁石30,40與磁軛板2之形成角度維持在直角,可防止永久磁石30,40傾斜。此外,由於安裝於磁軛板2外周側之保護蓋構件341不具外方凸緣部,因此可縮小永久磁石30與永久磁石40之間隔(如為5~15mm)。Further, since the fourth embodiment covers at least the upper portions of the permanent magnets 30, 40 with the protective cover members 331, 341, the chance of breakage due to interference (collision) of the permanent magnets 30, 40 and other members can be greatly reduced, and in addition, the permanent magnets 30 are provided. The angle between the 40 and the yoke plate 2 is maintained at a right angle to prevent the permanent magnets 30, 40 from tilting. Further, since the protective cover member 341 attached to the outer peripheral side of the yoke plate 2 does not have the outer flange portion, the distance between the permanent magnet 30 and the permanent magnet 40 (for example, 5 to 15 mm) can be reduced.

第10(b)圖顯示內側永久磁石行3之保護蓋構件之其他例。該保護蓋構件431除第一側板部431a之外,第二側板部431b上亦設有承受間隔物6,6之缺口431f,431g,第二側板部431b延伸至磁軛板2之上面附近。藉由該構造,永久磁石30之露出部分減低,因此可大幅減低永久磁石30之損傷。此外,藉由使間隔物6,6與缺口431f,431g接合,即使以1個螺栓51固定各間隔物6,6時,仍可確保各間隔物6,6與內側永久磁石行3之高平行度。Fig. 10(b) shows another example of the protective cover member of the inner permanent magnet row 3. In addition to the first side plate portion 431a, the second cover portion 431b is provided with cutouts 431f, 431g for receiving the spacers 6, 6, and the second side plate portion 431b extends to the vicinity of the upper surface of the yoke plate 2. With this configuration, the exposed portion of the permanent magnet 30 is reduced, so that the damage of the permanent magnet 30 can be greatly reduced. Further, by joining the spacers 6, 6 to the notches 431f, 431g, even when the spacers 6, 6 are fixed by one bolt 51, it is ensured that the spacers 6, 6 are parallel to the inner permanent magnet row 3 degree.

第11(b)圖顯示外側永久磁石行4之保護蓋構件之其他例。該保護蓋構件441之第二側板部441b具有承受間隔物 6之缺口441f,且延伸至磁軛板2之上面附近。藉由該構造,永久磁石40之露出部分減低,因此可大幅減低永久磁石40之損傷。此外,藉由使間隔物6與缺口441f接合,即使以1個螺栓51固定間隔物6時,仍可確保間隔物6與外側永久磁石行4之高平行度。Fig. 11(b) shows another example of the protective cover member of the outer permanent magnet row 4. The second side plate portion 441b of the protective cover member 441 has a spacer The notch 441f of 6 extends to the vicinity of the upper surface of the yoke plate 2. With this configuration, the exposed portion of the permanent magnet 40 is reduced, so that the damage of the permanent magnet 40 can be greatly reduced. Further, by joining the spacer 6 to the notch 441f, even when the spacer 6 is fixed by one bolt 51, the parallelism of the spacer 6 and the outer permanent magnet row 4 can be ensured.

[2]製造方法[2] Manufacturing method

(1)第一及第三形態(1) First and third forms

第1~6及8圖所示之形態,在各保護蓋構件31,41,231,241中插入永久磁石30,40之操作基本上相同,因此,參照第12(a)~(c)圖說明在各保護蓋構件41中插入永久磁石40之情況。由於兩側板部41a,41b之開口端之內壁寬WO 及上板部41c之內壁寬WD 對永久磁石40之寬度WP 滿足WD >WP >WO 之關係,因此在藉由夾具8擴大第二側板部41b之狀態下,將永久磁石40插入保護蓋構件41內。如第12(c)所示,插入永久磁石40後,取下夾具8。In the form shown in Figs. 1 to 6 and 8, the operations of inserting the permanent magnets 30, 40 into the respective protective cover members 31, 41, 231, and 241 are substantially the same, and therefore, the protection is described with reference to Figs. 12(a) to (c). The case where the permanent magnet 40 is inserted into the cover member 41. Since the inner wall width W O of the open ends of the side plate portions 41a, 41b and the inner wall width W D of the upper plate portion 41c satisfy the relationship W D > W P > W O with respect to the width W P of the permanent magnet 40, The permanent magnet 40 is inserted into the protective cover member 41 in a state where the second side plate portion 41b is enlarged by the jig 8. As shown in Fig. 12(c), after the permanent magnet 40 is inserted, the jig 8 is removed.

藉由插入永久磁石40,兩側板部41a,41b稍微擴大而彈性變形,因此藉由彈性復原力而壓接於永久磁石40之外面。因此,永久磁石40無須使用接合劑而牢固地固定於保護蓋構件41。且藉由使用保護蓋構件亦可獲得下述之優點。亦即,使各同極鄰接而配置磁化之永久磁石時,因磁性排斥力而不易精確地定位,即使使用夾具,仍須增加夾持永久磁石之力,因此可能損傷永久磁石本身。但是,將各永久磁石插入各保護蓋構件很容易,且即使以夾具緊緊地夾持保護蓋構件,仍不致損傷永久磁石,因此,藉由使用保護蓋構件,非常容易將永久磁石安裝於磁軛板上。如 此,藉由使用保護蓋構件,很容易將永久磁石精確地(直角且直線性地)安裝於磁軛板上,因此,可達成磁回路裝置之精確度提高及製造成本之降低。By inserting the permanent magnet 40, the side plate portions 41a, 41b are slightly enlarged and elastically deformed, and thus are pressed against the outer surface of the permanent magnet 40 by the elastic restoring force. Therefore, the permanent magnet 40 is firmly fixed to the protective cover member 41 without using a bonding agent. And the following advantages can also be obtained by using the protective cover member. That is, when the permanent magnets in which the magnetizations are arranged adjacent to each other are not easily positioned accurately due to the magnetic repulsive force, even if a jig is used, the force for holding the permanent magnets must be increased, and thus the permanent magnet itself may be damaged. However, it is easy to insert each permanent magnet into each of the protective cover members, and even if the protective cover member is tightly held by the jig, the permanent magnet is not damaged, and therefore, it is very easy to mount the permanent magnet to the magnetic body by using the protective cover member. Yoke plate. Such as Thus, by using the protective cover member, the permanent magnet can be easily mounted on the yoke plate accurately (right angle and linearly), so that the accuracy of the magnetic circuit device can be improved and the manufacturing cost can be reduced.

第13圖顯示在1個保護蓋構件41中插入兩個永久磁石40,40之情況。此時,保護蓋構件41之長度L宜設定成永久磁石40之長度LP之兩倍以上。在1個保護蓋構件41中插入兩個以上之永久磁石40,40時,具有可縮短將保護蓋構件安裝於磁軛板2之作業的優點。鄰接之永久磁石40,40雖相互排斥,但是薄形之永久磁石之排斥力較小,因此,比較容易在保護蓋構件41中插入兩個永久磁石40,40。但是,永久磁石變厚時,於插入時除須使用適當之夾具(圖上未顯示)外,還須使WD 及WO 對WP 之大小予以最佳化,使兩側板部41a,41b對永久磁石40具有充分之夾持力。Fig. 13 shows the case where two permanent magnets 40, 40 are inserted into one protective cover member 41. At this time, the length L of the protective cover member 41 is preferably set to be twice or more the length LP of the permanent magnet 40. When two or more permanent magnets 40, 40 are inserted into one protective cover member 41, there is an advantage that the operation of attaching the protective cover member to the yoke plate 2 can be shortened. The adjacent permanent magnets 40, 40 are mutually exclusive, but the repulsive force of the thin permanent magnet is small, so that it is relatively easy to insert the two permanent magnets 40, 40 into the protective cover member 41. However, when the permanent magnet becomes thick, it is necessary to optimize the size of W P for W D and W O at the time of insertion, in addition to using appropriate jigs (not shown), so that the side plates 41a, 41b The permanent magnet 40 has sufficient clamping force.

第一磁回路裝置中,內側永久磁石行3與外側永久磁石行4較隔離,因此哪一個先安裝於磁軛板2上均可。如首先在保護蓋構件31中插入永久磁石30,以製作第一磁石組合體,並且在保護蓋構件41中插入永久磁石40而製作第二磁石組合體。使各永久磁石30之下端磁性吸附於磁軛板2之中央溝21,並沿著中央溝21排列第一磁石組合體。藉由螺栓將全部之保護蓋構件31固定於磁軛板2上,而組合內側永久磁石行3。同樣地,使永久磁石40磁性吸附於磁軛板2之外周段差22,並沿著外周段差22排列第二磁石組合體。藉由螺栓將全部之保護蓋構件41固定於磁軛板2上,而組合外側永久磁石行4。當然亦可先組合外側永久磁石行4。In the first magnetic circuit device, the inner permanent magnet row 3 is relatively isolated from the outer permanent magnet row 4, so that either one can be attached to the yoke plate 2 first. The second magnet assembly is fabricated by first inserting the permanent magnet 30 into the protective cover member 31 to fabricate the first magnet assembly and inserting the permanent magnet 40 into the protective cover member 41. The lower ends of the permanent magnets 30 are magnetically attracted to the central groove 21 of the yoke plate 2, and the first magnet assembly is arranged along the central groove 21. The inner permanent magnet row 3 is combined by fixing all of the protective cover members 31 to the yoke plate 2 by bolts. Similarly, the permanent magnets 40 are magnetically attracted to the outer peripheral step 22 of the yoke plate 2, and the second magnet assembly is arranged along the outer peripheral step 22. The entire outer permanent magnet row 4 is combined by fixing all of the protective cover members 41 to the yoke plate 2 by bolts. Of course, it is also possible to combine the outer permanent magnet row 4 first.

(2)第二形態(2) The second form

第7圖所示之第二形態,除第二磁石組合體對磁軛板之固定方法之外,與第一形態相同,因此,參照第7(b)圖僅說明第二磁石組合體對磁軛板之固定方法。使內方突起部141f接合於水平溝23,並且將永久磁石40配置於外周段差22。在該狀態下,由於外方凸緣部141e之開口部141d與磁軛板2之螺絲孔25對準,因此藉由螺絲5而將保護蓋構件141之外方凸緣部141e機械性地固定於磁軛板2上。The second embodiment shown in Fig. 7 is the same as the first embodiment except for the method of fixing the second magnet assembly to the yoke plate. Therefore, only the second magnet assembly is described with reference to Fig. 7(b). The method of fixing the yoke plate. The inner protrusion 141f is joined to the horizontal groove 23, and the permanent magnet 40 is placed on the outer circumference difference 22. In this state, since the opening portion 141d of the outer flange portion 141e is aligned with the screw hole 25 of the yoke plate 2, the outer flange portion 141e of the protective cover member 141 is mechanically fixed to the yoke plate by the screw 5. 2 on.

(3)第四形態(3) The fourth form

第14圖顯示第9圖所示之第四形態之磁回路裝置之製造方法一種範例。首先,藉由使螺栓51螺合於螺絲孔26,而在磁軛板2上固定各間隔物6,6[步驟(a)]。在兩間隔物6,6間之中央溝21中,設置將永久磁石30插入保護蓋構件31而形成之第一磁石組合體,並藉由螺栓5將保護蓋構件31之外方凸緣部31e固定於磁軛板2上[步驟(b)]。將永久磁石40插入保護蓋構件41而形成之第二磁石組合體設置於外周段差22上,藉由螺栓52將第一側板部41b固定於磁軛板2之側面[步驟(c)]。最後將其餘之第二磁石組合體設置於另一方之外周段差22上,藉由螺栓52將第一側板部41b固定於磁軛板2之側面[步驟(d)]。藉由形成各間隔物6,6與永久磁石30,40及/或保護蓋構件31,41接觸之構造,可精確地將各永久磁石30,40予以定位。Fig. 14 is a view showing an example of a method of manufacturing the magnetic circuit device of the fourth aspect shown in Fig. 9. First, the spacers 6, 6 are fixed to the yoke plate 2 by screwing the bolts 51 to the screw holes 26 [step (a)]. In the central groove 21 between the two spacers 6, 6, a first magnet assembly in which the permanent magnet 30 is inserted into the protective cover member 31 is provided, and the outer flange portion 31e of the protective cover member 31 is fixed by the bolt 5. On the yoke plate 2 [step (b)]. The second magnet assembly formed by inserting the permanent magnet 40 into the protective cover member 41 is disposed on the outer peripheral step 22, and the first side plate portion 41b is fixed to the side surface of the yoke plate 2 by the bolt 52 [step (c)]. Finally, the remaining second magnet assembly is placed on the other outer circumferential step 22, and the first side plate portion 41b is fixed to the side surface of the yoke plate 2 by the bolt 52 [step (d)]. By forming the spacers 6, 6 in contact with the permanent magnets 30, 40 and/or the protective cover members 31, 41, the permanent magnets 30, 40 can be accurately positioned.

[3]磁控管濺鍍裝置[3] Magnetron sputtering device

第15圖顯示具備第1圖所示之磁回路裝置1之磁控管濺鍍裝置100。磁回路裝置1在與紙面垂直之方向上設置數 個(如6個),不過圖上並未顯示。濺鍍裝置100在真空處理室101內具有:磁回路裝置1,配置於接近磁回路裝置1之位置之陰極102,與陰極102接觸之標靶103,夾著基板104而配置於與標靶103相對之位置之陽極105。真空處理室101具有:連接於工作氣體供給手段(圖上未顯示)之工作氣體流入口101a,及連接於真空泵(圖上未顯示)之排氣口101b。真空處理室101形成接地電位,磁回路裝置1與陰極102形成相同電位。陰極102與陽極105分別連接於直流電壓源106。並在標靶103與陽極105之間搬運基板104。Fig. 15 shows a magnetron sputtering apparatus 100 including the magnetic circuit device 1 shown in Fig. 1. The magnetic circuit device 1 is arranged in a direction perpendicular to the paper surface (such as 6), but not shown on the map. The sputtering apparatus 100 includes a magnetic circuit device 1 in the vacuum processing chamber 101, a cathode 102 disposed at a position close to the magnetic circuit device 1, and a target 103 that is in contact with the cathode 102, and is disposed on the target 103 with the substrate 104 interposed therebetween. The anode 105 is in a relative position. The vacuum processing chamber 101 has a working gas inlet 101a connected to a working gas supply means (not shown), and an exhaust port 101b connected to a vacuum pump (not shown). The vacuum processing chamber 101 forms a ground potential, and the magnetic circuit device 1 and the cathode 102 form the same potential. The cathode 102 and the anode 105 are connected to a DC voltage source 106, respectively. The substrate 104 is transported between the target 103 and the anode 105.

自磁回路裝置1之表面至標靶103之表面之距離過長時,呈現於標靶103表面之磁場之水平成分過小。此外,該距離過短時,不易在真空處理室101中設置磁回路裝置1,因此,兩者之距離宜依基板104之大小等而適切設定。如為第七~八代之基板時,該距離通常設定在50~60mm之範圍。此外,磁回路裝置1之上面與陰極102之底面之間隔即使狹窄至數mm,由於永久磁石被保護蓋構件覆蓋,因此於組合時仍可防止永久磁石破損。When the distance from the surface of the magnetic circuit device 1 to the surface of the target 103 is too long, the horizontal component of the magnetic field appearing on the surface of the target 103 is too small. Further, when the distance is too short, it is difficult to provide the magnetic circuit device 1 in the vacuum processing chamber 101. Therefore, the distance between the two should be appropriately set depending on the size of the substrate 104 or the like. For the seventh to eighth generation of substrates, the distance is usually set in the range of 50 to 60 mm. Further, even if the interval between the upper surface of the magnetic circuit device 1 and the bottom surface of the cathode 102 is narrow to several mm, since the permanent magnet is covered by the protective cover member, the permanent magnet can be prevented from being broken at the time of combination.

磁控管濺鍍裝置100如以下所述,可在基板104表面成膜。在真空處理室101內進行真空排氣,並且導入包含惰性氣體之工作氣體(如氬、氬+氮或氬+氧),並保持在10-1 ~10-3 Torr之壓力。其次,在陰極102上施加負電壓(如-300V~-800V),形成朝向標靶103表面之電場而輝光放電。藉此,電漿中之離子撞擊標靶103之表面,此時放出之二次電子被磁場捕捉,而形成沿著磁場細長環狀之高密 度電漿。高密度電漿中之離子撞擊標靶103,其中之物質飛散,藉由其粒子附著於基板104之表面而形成薄膜。The magnetron sputtering apparatus 100 can form a film on the surface of the substrate 104 as described below. Vacuum evacuation is performed in the vacuum processing chamber 101, and a working gas containing an inert gas (e.g., argon, argon + nitrogen or argon + oxygen) is introduced and maintained at a pressure of 10 -1 to 10 -3 Torr. Next, a negative voltage (e.g., -300 V to -800 V) is applied to the cathode 102 to form an electric field toward the surface of the target 103 to cause glow discharge. Thereby, the ions in the plasma strike the surface of the target 103, and the secondary electrons emitted at this time are captured by the magnetic field to form a high-density plasma which is elongated along the magnetic field. The ions in the high-density plasma strike the target 103, in which the substance scatters, and a film is formed by adhering particles to the surface of the substrate 104.

上述磁控管濺鍍裝置100宜形成如下之構造。亦即,進行成膜時,由於高密度電漿在垂直於標靶103表面之磁場成分為零之位置的密度提高,因此,在標靶103之表面形成沿著高密度電漿形狀之侵蝕區域。因此,藉由在磁回路裝置1背面側設置驅動裝置(圖上未顯示),使磁回路裝置1在與標靶103平行之面內平行移動,且其移動間距與高密度電漿相同或為其以下之間距,使標靶103之利用效率提高。藉由該構造,使標靶103表面暴露於高密度電漿之時間被平均化,因此在標靶103表面形成均一之侵蝕區域。The magnetron sputtering apparatus 100 described above preferably has the following configuration. That is, when the film formation is performed, since the density of the high-density plasma at a position perpendicular to the surface of the target 103 is zero, an erosion region along the shape of the high-density plasma is formed on the surface of the target 103. . Therefore, by providing a driving device (not shown) on the back side of the magnetic circuit device 1, the magnetic circuit device 1 is moved in parallel in a plane parallel to the target 103, and the moving pitch is the same as that of the high-density plasma. The following distances increase the utilization efficiency of the target 103. With this configuration, the time at which the surface of the target 103 is exposed to the high-density plasma is averaged, thereby forming a uniform erosion region on the surface of the target 103.

(發明之效果)(Effect of the invention)

由於本發明之磁控管濺鍍用磁回路裝置中,至少1個永久磁石被保護蓋構件所覆蓋,且保護蓋構件機械性地固定於磁軛板上,因此無須使用接合劑,絕不致發生放氣。此外,儘管鄰接之同極性磁極產生磁性排斥力,仍容易將永久磁石精確地固定於磁軛板上。此外,即使為了精確定位而使用夾具,由於夾具接觸於保護蓋構件,因此不致在永久磁石本身造成損傷。此外,於使用中即使與其他構件等碰撞,由於永久磁石藉由保護蓋構件而保護,因此不致脫落或損傷。In the magnetic circuit device for magnetron sputtering according to the present invention, at least one permanent magnet is covered by the protective cover member, and the protective cover member is mechanically fixed to the yoke plate, so that no bonding agent is required, and never occurs. Deflation. Further, although the adjacent magnetic poles of the same polarity generate magnetic repulsive force, it is easy to accurately fix the permanent magnet to the yoke plate. Further, even if the jig is used for precise positioning, since the jig is in contact with the protective cover member, damage is not caused to the permanent magnet itself. Further, even if it collides with other members or the like during use, since the permanent magnet is protected by the protective cover member, it does not fall off or be damaged.

組合時或操作中,由於與其他構件碰撞等造成數個永久磁石脫落或損傷時,只須拆裝夾持此等永久磁石之保護蓋構件,夾持新的永久磁石後,再度安裝於磁軛板上即可。 此時亦不使用接合劑,因此無須將磁回路裝置全體加熱,而可迅速進行永久磁石之拆裝。此外,不設置保護蓋構件而將永久磁石固定於磁軛板上時,於拆裝數個永久磁石時,可能因磁性排斥力而造成磁軛板上之永久磁石之位置偏差,不過如本發明,經由保護蓋構件而固定永久磁石時,不致因數個永久磁石之拆裝而造成永久磁石在磁軛板上之位置偏差。When combining or operating, when several permanent magnets fall off or are damaged due to collision with other components, only the protective cover member holding these permanent magnets must be disassembled, and the new permanent magnet is clamped and then mounted on the yoke. Just on the board. Since the bonding agent is not used at this time, it is not necessary to heat the entire magnetic circuit device, and the permanent magnet can be quickly attached and detached. In addition, when the permanent magnet is fixed to the yoke plate without providing the protective cover member, when a plurality of permanent magnets are detached, the position of the permanent magnet on the yoke plate may be deviated due to the magnetic repulsive force, but the present invention When the permanent magnet is fixed by the protective cover member, the position of the permanent magnet on the yoke plate is not caused by the disassembly and assembly of the permanent magnet.

由於本發明之磁控管濺鍍用磁回路裝置係藉由將安裝有永久磁石之保護蓋構件機械性地固定於磁軛板上而製造,因此,不但永久磁石之精確定位容易,且可大幅縮短組合時間。此外,由於無須使用接合劑,因此可維持良好之製造環境。Since the magnetic circuit device for magnetron sputtering of the present invention is manufactured by mechanically fixing a protective cover member to which a permanent magnet is attached to a yoke plate, not only the permanent magnet is accurately positioned, but also can be greatly Reduce the combination time. In addition, since a bonding agent is not required, a good manufacturing environment can be maintained.

1‧‧‧磁回路裝置1‧‧‧magnetic circuit device

2‧‧‧磁軛板2‧‧‧Magnetic yoke plate

3‧‧‧內側永久磁石行3‧‧‧ Inside permanent magnet row

4‧‧‧外側永久磁石行4‧‧‧Outer permanent magnet row

5‧‧‧螺栓5‧‧‧ bolt

6‧‧‧間隔物6‧‧‧ spacers

8‧‧‧夾具8‧‧‧Clamp

21‧‧‧中央溝21‧‧‧Central Ditch

22‧‧‧外周段差22‧‧‧peripheral difference

23‧‧‧水平溝23‧‧‧ horizontal ditch

25‧‧‧螺絲孔25‧‧‧ screw holes

26‧‧‧螺絲孔26‧‧‧ screw holes

30‧‧‧永久磁石30‧‧‧ permanent magnet

31‧‧‧內側永久磁石行用保護蓋構件31‧‧‧Protective cover member for inner permanent magnet row

31a‧‧‧第一側板部31a‧‧‧First side panel

31b‧‧‧第二側板部31b‧‧‧Second side panel

31c‧‧‧上板部31c‧‧‧Upper Board

31d‧‧‧螺絲用開口部31d‧‧‧Openings for screws

31e‧‧‧外方凸緣部31e‧‧‧Outer flange

31g‧‧‧前端部31g‧‧‧ front end

40‧‧‧永久磁石40‧‧‧ permanent magnet

41‧‧‧外側永久磁石行用保護蓋構件41‧‧‧ Protective cover members for outer permanent magnets

41e‧‧‧外方凸緣部41e‧‧‧Outer flange

51‧‧‧螺栓51‧‧‧ bolt

52‧‧‧螺栓52‧‧‧Bolts

100‧‧‧磁控管濺鍍裝置100‧‧‧Magnetron tube sputtering device

101‧‧‧真空處理室101‧‧‧vacuum processing room

101a‧‧‧流入口101a‧‧‧flow entrance

101b‧‧‧排氣口101b‧‧‧Exhaust port

102‧‧‧陰極102‧‧‧ cathode

103‧‧‧標靶103‧‧‧ Target

104‧‧‧基板104‧‧‧Substrate

105‧‧‧陽極105‧‧‧Anode

106‧‧‧直流電壓源106‧‧‧DC voltage source

141‧‧‧外側永久磁石行用保護蓋構件141‧‧‧ Protective cover members for outer permanent magnets

141a‧‧‧第一側板部141a‧‧‧First side panel

141b‧‧‧第二側板部141b‧‧‧Second side panel

141c‧‧‧上板部141c‧‧‧Upper Board

141d‧‧‧螺絲用開口部141d‧‧‧Openings for screws

141e‧‧‧外方凸緣部141e‧‧‧Outer flange

141f‧‧‧內方突起部141f‧‧‧Inside protrusion

241‧‧‧外側永久磁石行用保護蓋構件241‧‧‧ Protective cover members for outer permanent magnets

241a‧‧‧第一側板部241a‧‧‧First side panel

241b‧‧‧第二側板部241b‧‧‧Second side panel

241c‧‧‧上板部241c‧‧‧Upper Board

241d‧‧‧螺絲用開口部241d‧‧‧Openings for screws

241e‧‧‧外方凸緣部241e‧‧‧Outer flange

241g‧‧‧內方突起部241g‧‧‧Inside protrusion

331‧‧‧內側永久磁石行用保護蓋構件331‧‧‧The inner permanent magnet row protective cover member

331a‧‧‧第一側板部331a‧‧‧First side panel

331b‧‧‧第二側板部331b‧‧‧Second side panel

331c‧‧‧上板部331c‧‧‧Upper Board

331d‧‧‧螺絲用開口部331d‧‧‧Openings for screws

331e‧‧‧外方凸緣部331e‧‧‧Outer flange

331f‧‧‧間隔物承受用缺口331f‧‧‧ gaps for spacers

341‧‧‧外側永久磁石行用保護蓋構件341‧‧‧Side cover for outer permanent magnets

341a‧‧‧第一側板部341a‧‧‧First side panel

341b‧‧‧第二側板部341b‧‧‧Second side panel

341c‧‧‧上板部341c‧‧‧Upper Board

341d‧‧‧螺絲用開口部341d‧‧‧Openings for screws

431‧‧‧內側永久磁石行用保護蓋構件431‧‧‧Protective cover member for inner permanent magnet

431a‧‧‧第一側板部431a‧‧‧First side panel

431b‧‧‧第二側板部431b‧‧‧Second side panel

431c‧‧‧上板部431c‧‧‧Upper Board

431d‧‧‧螺絲用開口部431d‧‧‧Openings for screws

431e‧‧‧外方凸緣部431e‧‧‧Outer flange

431f‧‧‧間隔物承受用缺口431f‧‧‧ gaps for spacers

431g‧‧‧間隔物承受用缺口431g‧‧‧ spacer tolerance

441‧‧‧外側永久磁石行用保護蓋構件441‧‧‧ Protective cover for outer permanent magnets

441a‧‧‧第一側板部441a‧‧‧First side panel

441b‧‧‧第二側板部441b‧‧‧Second side panel

441c‧‧‧上板部441c‧‧‧Upper Board

441d‧‧‧螺絲用開口部441d‧‧‧Openings for screws

441f‧‧‧間隔物承受用缺口441f‧‧‧ spacers withstand gaps

第1圖係顯示本發明之磁控管濺鍍用磁回路裝置一種範例之平面圖。Fig. 1 is a plan view showing an example of a magnetic circuit device for magnetron sputtering of the present invention.

第2圖係第1圖之A-A剖面圖。Fig. 2 is a cross-sectional view taken along line A-A of Fig. 1.

第3圖係顯示第一及第二磁石組合體自磁軛板隔離之狀態之第2圖之分解圖。Fig. 3 is an exploded view showing a second diagram of the state in which the first and second magnet assemblies are separated from the yoke plate.

第4圖係第1圖之B-B剖面圖。Figure 4 is a cross-sectional view taken along line B-B of Figure 1.

第5(a)~(c)圖係顯示第一保護蓋構件一種範例之剖面圖。Sections 5(a) to (c) show a cross-sectional view of an example of the first protective cover member.

第6圖係第3圖所示之第一保護蓋構件之平面圖。Fig. 6 is a plan view showing the first protective cover member shown in Fig. 3.

第7(a)、(b)圖係顯示外側永久磁石行用之第二保護蓋構件之其他範例之剖面圖。Sections 7(a) and (b) are cross-sectional views showing other examples of the second protective cover member for the outer permanent magnet row.

第8(a)、(b)圖係顯示外側永久磁石行用之第二保護蓋構 件之另外範例之剖面圖。Figure 8(a) and (b) show the second protective cover for the outer permanent magnet row. A cross-sectional view of another example of the piece.

第9圖係顯示本發明之磁控管濺鍍用磁回路裝置其他範例之剖面圖。Fig. 9 is a cross-sectional view showing another example of the magnetic circuit device for magnetron sputtering of the present invention.

第10(a)、(b)圖係顯示第9圖之內側永久磁石行第一保護蓋構件之斜視圖。Fig. 10(a) and (b) are perspective views showing the first protective cover member of the inner permanent magnet row of Fig. 9.

第11(a)、(b)圖係顯示第9圖之外側永久磁石行第二保護蓋構件之斜視圖。Fig. 11(a) and (b) are perspective views showing the second protective cover member on the outer side of the permanent magnet row in Fig. 9.

第12(a)~(c)圖係顯示在第2圖所示之外側永久磁石行用之第二保護蓋構件中插入永久磁石狀態之斜視圖。Fig. 12(a) to (c) are perspective views showing the state in which the permanent magnet is inserted into the second protective cover member for the outer permanent magnet row shown in Fig. 2.

第13圖係顯示在1個保護蓋構件中插入2個永久磁石狀態之斜視圖。Fig. 13 is a perspective view showing the state in which two permanent magnets are inserted into one protective cover member.

第14(a)~(d)圖係顯示第9圖之磁回路裝置之製造步驟之剖面圖。Figures 14(a) to (d) are cross-sectional views showing the manufacturing steps of the magnetic circuit device of Fig. 9.

第15圖係顯示具備本發明之磁回路裝置之磁控管濺鍍裝置一種範例之剖面圖。Fig. 15 is a cross-sectional view showing an example of a magnetron sputtering apparatus having the magnetic circuit device of the present invention.

2‧‧‧磁軛板2‧‧‧Magnetic yoke plate

3‧‧‧內側永久磁石行3‧‧‧ Inside permanent magnet row

4‧‧‧外側永久磁石行4‧‧‧Outer permanent magnet row

5‧‧‧螺栓5‧‧‧ bolt

30‧‧‧永久磁石30‧‧‧ permanent magnet

31‧‧‧內側永久磁石行用保護蓋構件31‧‧‧Protective cover member for inner permanent magnet row

40‧‧‧永久磁石40‧‧‧ permanent magnet

41‧‧‧外側永久磁石行用保護蓋構件41‧‧‧ Protective cover members for outer permanent magnets

Claims (18)

一種磁控管濺鍍用磁回路裝置,其特徵包含:具備:內側永久磁石行,其係由以上面具有指定極性之磁極之方式呈直線狀連續設置之複數個直方體狀永久磁石所形成;外側永久磁石行,其係由以包圍前述內側永久磁石行且在上面具有與前述內側永久磁石行之磁極相反極性的磁極之方式連續設置的複數個直方體狀的永久磁石所形成;磁軛板,其係可將前述內側永久磁石行及前述外側永久磁石行之永久磁石拆裝自如地保持;及剖面大致為字狀之非磁性保護蓋構件,其係至少逐一地覆蓋前述永久磁石;每一保護蓋構件包含:第一側板部,其係覆蓋前述永久磁石之一側面,並且以機械方式固定於前述磁軛板;第二側板部,其係覆蓋前述永久磁石之另一側面;及上板部,其係將兩側板部連結成一體;又,藉由每一保護蓋構件之兩側板部而牢固地夾持前述永久磁石。A magnetic circuit device for magnetron sputtering, comprising: an inner permanent magnet row formed by a plurality of rectangular permanent magnets arranged in a straight line in a manner of a magnetic pole having a predetermined polarity; a row of outer permanent magnets formed by a plurality of rectangular permanent magnets continuously surrounding the inner permanent magnet row and having magnetic poles having opposite polarities to the magnetic poles of the inner permanent magnet row; yoke plate The detachable permanent magnet of the inner permanent magnet row and the outer permanent magnet row can be detachably held; and the cross section is substantially a non-magnetic protective cover member of a shape, which covers at least one of the permanent magnets one by one; each protective cover member includes: a first side plate portion covering one side of the permanent magnet and mechanically fixed to the yoke a second side plate portion covering the other side of the permanent magnet; and an upper plate portion that integrally joins the side plate portions; and, by the side plates of each of the protective cover members, is firmly clamped Hold the aforementioned permanent magnet. 如申請專利範圍第1項之磁控管濺鍍用磁回路裝置,其 中前述磁軛板係上面具有承受直方體狀之前述永久磁石的凹部。 A magnetic circuit device for magnetron sputtering according to item 1 of the patent application scope, The yoke plate has a concave portion on the upper surface of the permanent magnet that receives the rectangular parallelepiped shape. 如申請專利範圍第2項之磁控管濺鍍用磁回路裝置,其中承受構成前述內側永久磁石行之前述永久磁石的凹部係為中央溝,承受構成前述外側永久磁石行之前述永久磁石的凹部係為外周段差。 The magnetic circuit device for magnetron sputtering according to claim 2, wherein the concave portion that receives the permanent magnet constituting the inner permanent magnet row is a central groove, and receives a concave portion of the permanent magnet constituting the outer permanent magnet row. It is the difference of the peripheral segment. 如申請專利範圍第2項之磁控管濺鍍用磁回路裝置,其中前述保護蓋構件之前述第一側板部係具有至少具有1個開口部之外方凸緣部,在每一永久磁石之下端部配置於前述磁軛板之前述凹部之狀態下,藉由卡合於前述開口部之螺栓,而將前述凸緣部固定於前述磁軛板。 The magnetic circuit device for magnetron sputtering according to the second aspect of the invention, wherein the first side plate portion of the protective cover member has a flange portion having at least one opening portion, and an end portion under each permanent magnet. The flange portion is fixed to the yoke plate by a bolt that is engaged with the opening portion in a state of being disposed in the recessed portion of the yoke plate. 如申請專利範圍第1項之磁控管濺鍍用磁回路裝置,其中前述磁軛板在上面具有承受前述內側永久磁石行之中央溝、及承受前述外側永久磁石行之外周段差,且在側面具有水平溝,前述外側永久磁石行之每一保護蓋構件之前述第一側板部,在與前述磁軛板之上面接觸之位置,具有至少具有1個開口部之外方凸緣部,前述第二側板部具有到達前述水平溝之長度,並且在前端具有內方突起部,據此,在前述內方突起部卡合於前述水平溝且前述永久磁石配置於前述外周段差之狀態下,前述第一側板部之前述外方凸緣部係藉由卡合於前述開口部之螺栓而固定於前述磁軛板上。 The magnetic circuit device for magnetron sputtering according to claim 1, wherein the yoke plate has a central groove on the upper side of the inner permanent magnet row and a circumferential difference from the outer permanent magnet row, and is laterally a horizontal groove, wherein the first side plate portion of each of the outer permanent magnet rows has a flange portion having at least one opening portion at a position in contact with the upper surface of the yoke plate, and the second side plate The portion has a length reaching the horizontal groove, and has an inner protruding portion at the front end, whereby the first side plate is in a state where the inner protruding portion is engaged with the horizontal groove and the permanent magnet is disposed in the outer peripheral step. The outer flange portion of the portion is fixed to the yoke plate by a bolt that is engaged with the opening. 如申請專利範圍第1項之磁控管濺鍍用磁回路裝置,其 中在前述保護蓋構件之前述上板部之內面,具有抵接於前述永久磁石之上面之突起部。 A magnetic circuit device for magnetron sputtering according to item 1 of the patent application scope, The inner surface of the upper plate portion of the protective cover member has a protruding portion that abuts against the upper surface of the permanent magnet. 一種磁控管濺鍍用磁回路裝置,其特徵包含具備:內側永久磁石行,其係由以上面具有指定極性之磁極之方式呈直線狀連續設置之複數個直方體狀的永久磁石所形成;外側永久磁石行,其係由以包圍前述內側永久磁石行且在上面具有與前述內側永久磁石行之磁極相反極性的磁極之方式連續設置的複數個直方體狀的永久磁石所形成;磁軛板,其係可將前述內側永久磁石行及前述外側永久磁石行之永久磁石拆裝自如地保持;間隔物,其係設於前述內側永久磁石行與前述外側永久磁石行之間;及剖面大致為字狀之非磁性保護蓋構件,其係至少逐一地覆蓋前述永久磁石;前述內側永久磁石行之每一保護蓋構件包含:第一側板部,其係覆蓋前述永久磁石之一側面,並且以機械方式固定於前述磁軛板;第二側板部,其係覆蓋前述永久磁石之另一側面;及上板部,其係將兩側板部連結成一體;前述外側永久磁石行之每一保護蓋構件包含:第一 側板部,其係具有覆蓋前述永久磁石之一側面及前述磁軛板之側面的至少一部分之長度,並且以機械方式固定於前述磁軛板;第二側板部,其係覆蓋前述永久磁石之另一側面;及上板部,其係將兩側板部連結成一體;又,藉由每一保護蓋構件之兩側板部而牢固地夾持前述永久磁石。A magnetic circuit device for magnetron sputtering, characterized in that it comprises: an inner permanent magnet row formed by a plurality of rectangular permanent magnets arranged in a straight line in a manner of a magnetic pole having a predetermined polarity; a row of outer permanent magnets formed by a plurality of rectangular permanent magnets continuously surrounding the inner permanent magnet row and having magnetic poles having opposite polarities to the magnetic poles of the inner permanent magnet row; yoke plate The permanent magnet of the inner permanent magnet row and the permanent magnet of the outer permanent magnet row are detachably held; the spacer is disposed between the inner permanent magnet row and the outer permanent magnet row; and the cross section is substantially a non-magnetic protective cover member of the shape, which covers at least one of the permanent magnets one by one; each of the protective cover members of the inner permanent magnet row comprises: a first side plate portion covering one side of the permanent magnet, and is mechanically The method is fixed to the yoke plate; the second side plate portion covers the other side surface of the permanent magnet; and the upper plate portion connects the two side plate portions into one body; each of the outer permanent magnet rows of the protective cover member The first side plate portion includes a length covering at least a portion of one side surface of the permanent magnet and a side surface of the yoke plate, and is mechanically fixed to the yoke plate; the second side plate portion covers the foregoing The other side of the permanent magnet; and the upper plate portion are integrally joined to the side plate portions; and the permanent magnets are firmly held by the side plate portions of each of the protective cover members. 如申請專利範圍第7項之磁控管濺鍍用磁回路裝置,其中前述磁軛板在上面具有承受前述內側永久磁石行之直方體狀之前述永久磁石之中央溝,並且具有承受前述外側永久磁石行之直方體狀之前述永久磁石之外周段差,前述內側永久磁石行之每一保護蓋構件之前述第一側板部具有至少具有1個開口部之外方凸緣部,前述外側永久磁石行之每一保護蓋構件之前述第一側板部,在與前述磁軛板之側面接觸之前端部分至少具有1個開口部,在每一永久磁石之下端部配置於前述磁軛板之前述溝或段差之狀態下,前述第一側板部藉由卡合於前述開口部之螺栓而固定於前述磁軛板。 The magnetic circuit device for magnetron sputtering according to claim 7, wherein the yoke plate has a central groove on the upper surface of the permanent magnet that receives the rectangular shape of the inner permanent magnet, and has a permanent outer surface The first side plate portion of each of the protective cover members of the inner permanent magnet row has a flange portion having at least one opening portion, and each of the outer permanent magnet rows is inferior to the outer circumference of the permanent magnet in the shape of a straight body of the magnet row. The first side plate portion of the protective cover member has at least one opening portion before the contact with the side surface of the yoke plate, and the end portion of each of the permanent magnets is disposed on the groove or the step of the yoke plate. In the state, the first side plate portion is fixed to the yoke plate by a bolt that is engaged with the opening portion. 如申請專利範圍第7項之磁控管濺鍍用磁回路裝置,其中前述內側永久磁石行之每一保護蓋構件之前述第一側板部具有承受前述間隔物之缺口。 The magnetic circuit device for magnetron sputtering according to claim 7, wherein the first side plate portion of each of the inner permanent magnet rows has a notch that receives the spacer. 如申請專利範圍第1至9項中任一項之磁控管濺鍍用磁回路裝置,其中前述保護蓋構件由可彈性變形之非磁性 金屬板所形成。 The magnetic circuit device for magnetron sputtering according to any one of claims 1 to 9, wherein the protective cover member is made of an elastically deformable non-magnetic material Formed by a metal plate. 如申請專利範圍第10項之磁控管濺鍍用磁回路裝置,其中前述永久磁石的磁極面之寬度WP ,與前述保護蓋構件之兩側板部之開口端之內壁寬度WO 及前述上板部之內壁寬度WD ,滿足WD >WP >WO 之關係。The magnetic circuit device for magnetron sputtering according to claim 10, wherein a width W P of the magnetic pole surface of the permanent magnet and an inner wall width W O of the open end of the side plate portions of the protective cover member and the foregoing The inner wall width W D of the upper plate portion satisfies the relationship of W D > W P > W O . 一種製造磁控管濺鍍用磁回路裝置的方法,係以可在磁軛板上拆裝自如地組合內側永久磁石行及外側永久磁石行之方式製造磁控管濺鍍用磁回路裝置,其中內側永久磁石行係由以上面具有指定極性之磁極之方式呈直線狀連續設置之複數個直方體狀的永久磁石所形成,而外側永久磁石行係由以包圍前述內側永久磁石行且上面具有與前述內側永久磁石行之磁極相反極性的磁極之方式連續設置的複數個直方體狀的永久磁石所形成,該製造磁控管濺鍍用磁回路裝置的方法之特徵為:(a)製作剖面大致為字狀之第一及第二非磁性保護蓋構件,其等係由具有與前述磁軛板接合的接合部之第一側板部、和前述第一側板部對向之第二側板部、以及將兩側板部連結成一體的上板部所形成;(b)以前述上板部側可成為同極性之方式,在前述第一保護蓋構件中插入高度方向被磁化的至少1個永久磁石,而製作第一磁石組合體;(c)以前述上板部側可成為與前述第一磁石組合體相反極性之方式,在前述第二保護蓋構件中插入高度方 向被磁化的至少1個永久磁石,而製作第二磁石組合體;(d)透過前述第一側板部,分別將前述第一及第二磁石組合體以機械方式固定於前述磁軛板上。A method for manufacturing a magnetic circuit device for magnetron sputtering, wherein a magnetic circuit device for magnetron sputtering is manufactured by disassembling a combination of an inner permanent magnet row and an outer permanent magnet row on a yoke plate, wherein The inner permanent magnet row is formed by a plurality of rectangular permanent magnets which are linearly arranged in a manner of a magnetic pole having a specified polarity thereon, and the outer permanent magnet row is surrounded by the inner permanent magnet row and has an upper surface The method of manufacturing a magnetic circuit device for magnetron sputtering is characterized in that: (a) a cross section is substantially formed by a plurality of rectangular permanent magnets in which the magnetic poles of the opposite polarity of the inner permanent magnet row are continuously disposed. for a first and second non-magnetic protective cover member having a shape, the first side plate portion having a joint portion joined to the yoke plate, and the second side plate portion facing the first side plate portion, and (b) at least one permanent magnet that is magnetized in the height direction is inserted into the first protective cover member so that the upper plate portion side can be of the same polarity. a first magnet assembly is produced; (c) at least one permanent magnet that is magnetized in the height direction is inserted into the second protective cover member so that the upper plate portion side has a polarity opposite to that of the first magnet assembly; And forming a second magnet assembly; (d) mechanically fixing the first and second magnet assemblies to the yoke plate through the first side plate portions. 如申請專利範圍第12項之製造磁控管濺鍍用磁回路裝置的方法,其中在前述磁軛板上面具有延伸於指定方向之凹部,而在前述凹部中配置前述第一及第二磁石組合體之永久磁石。 The method of manufacturing a magnetic circuit device for magnetron sputtering according to claim 12, wherein the yoke plate has a concave portion extending in a predetermined direction, and the first and second magnet combinations are disposed in the concave portion. The permanent magnet of the body. 如申請專利範圍第12或13項之製造磁控管濺鍍用磁回路裝置的方法,其中前述第一及第二保護蓋構件在前述第一側板部之前端具有外方凸緣部,隔著前述外方凸緣部而將前述第一及第二保護蓋構件以機械方式固定於前述磁軛板上。 The method of manufacturing a magnetic circuit device for magnetron sputtering according to claim 12, wherein the first and second protective cover members have outer flange portions at a front end of the first side plate portion, which are separated from each other The first and second protective cover members are mechanically fixed to the yoke plate by the square flange portion. 如申請專利範圍第12項之製造磁控管濺鍍用磁回路裝置的方法,其中在前述磁軛板上面具有中央溝及外周段差,在側面具有水平溝,前述第二非磁性保護蓋構件具有由第一側板部、第二側板部及上板部所構成之大致字狀剖面,前述第一側板部具有外方凸緣部,該外方凸緣部具有與前述磁軛板接合之接合部,前述第二側板部與前述第一側板部相對向且具有到達前述水平溝之長度,並且在前端具有內方突起部,前述上板部將兩側板部連結成一體;在使前述第二磁石組合體之前述第二側板部之前述 內方突起部卡合於前述磁軛板之前述水平溝,並且將前述永久磁石配置於前述外周段差之狀態下,將前述第一側板部之前述外方凸緣部以機械方式固定於前述磁軛板上。The method of manufacturing a magnetic circuit device for magnetron sputtering according to claim 12, wherein the yoke plate has a central groove and an outer peripheral step on the yoke plate, and has a horizontal groove on a side surface, and the second non-magnetic protective cover member has The first side plate portion, the second side plate portion, and the upper plate portion are substantially In the cross section, the first side plate portion has an outer flange portion having a joint portion joined to the yoke plate, and the second side plate portion faces the first side plate portion and has a length reaching the horizontal groove And having an inner protruding portion at the front end, wherein the upper plate portion integrally connects the side plate portions; and the inner protruding portion of the second side plate portion of the second magnet assembly is engaged with the yoke plate In the horizontal groove, the outer peripheral portion of the first side plate portion is mechanically fixed to the yoke plate in a state in which the permanent magnet is disposed in the outer peripheral step. 一種製造磁控管濺鍍用磁回路裝置的方法,係以隔著間隔物而可在磁軛板上將內側永久磁石行及外側永久磁石行拆裝自如地組合之方式製造磁控管濺鍍用磁回路裝置,其中內側永久磁石行係由以上面具有指定極性之磁極之方式呈直線狀連續設置之複數個直方體狀的永久磁石所形成,而外側永久磁石行係由以包圍前述內側永久磁石行且上面具有與前述內側永久磁石行之磁極相反極性的磁極之方式連續設置的複數個直方體狀的永久磁石所形成,該製造磁控管濺鍍用磁回路裝置的方法之特徵為:(a)製作剖面大致為字狀之第一及第二非磁性保護蓋構件,其中第一非磁性保護蓋構件包含:具有與前述磁軛板接合之接合部的第一側板部;與前述第一側板部相對向之第二側板部;將兩側板部連結成一體之上板部;而第二非磁性保護蓋構件包含:具有到達前述磁軛板之長度且前端部具有與至少一個前述磁軛板接合之接合部的第一側板部;與前述第一側板部相對向之第二側板部;將兩側板部連結成一體之上板部;(b)以前述上板部側可成為同極性之方式在前述第 一保護蓋構件中插入高度方向被磁化之至少1個永久磁石,而製作第一磁石組合體;(c)以前述上板部側可成為與前述第一磁石組合體相反極性之方式在前述第二保護蓋構件中插入高度方向被磁化之至少1個永久磁石,而製作第二磁石組合體;(d)將間隔物以機械方式固定在前述磁軛板上;(e)隔著前述第一側板部,將前述第一磁石組合體以機械方式固定於前述磁軛板上;(f)隔著前述第一側板部,將前述第二磁石組合體以機械方式固定於前述磁軛板上。A method for manufacturing a magnetic circuit device for magnetron sputtering, which is capable of manufacturing a magnetron sputtering by disassembling an inner permanent magnet row and an outer permanent magnet row on a yoke plate via a spacer. A magnetic circuit device in which an inner permanent magnet row is formed by a plurality of rectangular permanent magnets which are linearly arranged in a manner of a magnetic pole having a specified polarity thereon, and the outer permanent magnet row is formed to surround the aforementioned inner permanent The magnet row is formed by a plurality of rectangular permanent magnets continuously provided with magnetic poles of opposite polarities to the magnetic poles of the inner permanent magnet rows. The method for manufacturing a magnetic circuit device for magnetron sputtering is characterized by: (a) The production profile is roughly a first and second non-magnetic protective cover member, wherein the first non-magnetic protective cover member includes: a first side plate portion having a joint portion joined to the yoke plate; and a first side plate portion opposite to the first side plate portion a two side plate portion; the side plate portions are joined to form an integral upper plate portion; and the second non-magnetic protective cover member includes: a joint portion having a length reaching the yoke plate and having a front end portion engaged with at least one of the yoke plates a first side plate portion; a second side plate portion facing the first side plate portion; the both side plate portions being coupled to the integral upper plate portion; and (b) the first plate portion side being of the same polarity Inserting at least one permanent magnet magnetized in the height direction in the protective cover member to form the first magnet assembly; (c) in the second layer so that the upper plate portion side may be opposite in polarity to the first magnet assembly Inserting at least one permanent magnet magnetized in the height direction into the protective cover member to form a second magnet assembly; (d) mechanically fixing the spacer to the yoke plate; (e) interposing the first side plate Ministry The first magnet assembly is mechanically fixed to the plate yoke; (f) through the first side plate portion, the said second magnet assembly is mechanically fixed to the yoke plate. 一種製造磁控管濺鍍用磁回路裝置的方法,係以隔著間隔物而可在上面是具有延伸於指定方向之中央溝及外周段差之磁軛板上拆裝自如地組合內側永久磁石行及外側永久磁石行之方式製造磁控管濺鍍用磁回路裝置,其中內側永久磁石行係由在上面具有指定極性之磁極之方式呈直線狀連續設置之複數個直方體狀的永久磁石所形成,外側永久磁石行係由以包圍前述內側永久磁石行且在上面具有與前述內側永久磁石行之磁極相反極性的磁極之方式連續設置的複數個直方體狀的永久磁石所形成,該製造磁控管濺鍍用磁回路裝置的方法之特徵為:(a)製作剖面大致為字狀之第一及第二非磁性保護蓋構件,其中第一非磁性保護蓋構件包含:具有外方凸緣部之第一側板部,該外方凸緣部具有至少1個開口 部;與前述第一側板部相對向之第二側板部;將兩側板部連結成一體之上板部;第二非磁性保護蓋構件包含:具有到達前述之長度,並且前端部具有至少一個開口部之第一側板部,與前述第一側板部相對向之第二側板部、及將兩側板部連結成一體之上板部;(b)以前述上板部側可成為同極性之方式在前述第一保護蓋構件中插入高度方向被磁化之至少1個永久磁石,而製作第一磁石組合體;(c)以前述上板部側可成為與前述第一磁石組合體相反極性之方式在前述第二保護蓋構件中插入高度方向被磁化之至少1個永久磁石,而製作第二磁石組合體;(d)將間隔物以機械方式固定在前述磁軛板上;(e)在將前述第一磁石組合體之永久磁石配置於前述中央溝之狀態下,藉由卡合於前述外方凸緣部之開口部之螺栓,而將前述第一磁石組合體固定於前述磁軛板上;(f)在將前述第二磁石組合體之永久磁石配置於前述外周段差之狀態下,藉由卡合於前述第一側板部之開口部之螺栓,而將前述第二磁石組合體固定於前述磁軛板上。A method for manufacturing a magnetic circuit device for magnetron sputtering, which is capable of detachably assembling an inner permanent magnet row on a yoke plate having a central groove and a peripheral segment extending in a predetermined direction with a spacer interposed therebetween And a magnetic circuit device for magnetron sputtering in which the outer permanent magnet is formed, wherein the inner permanent magnet row is formed by a plurality of rectangular permanent magnets which are linearly arranged in a manner of a magnetic pole having a specified polarity thereon. The outer permanent magnet row is formed by a plurality of rectangular permanent magnets that are continuously disposed in a manner that surrounds the inner permanent magnet row and has a magnetic pole opposite to the magnetic pole of the inner permanent magnet row. The method of the magnetic circuit device for pipe sputtering is characterized in that: (a) the cross section is approximately a first and second non-magnetic protective cover member, wherein the first non-magnetic protective cover member comprises: a first side plate portion having an outer flange portion, the outer flange portion having at least one opening portion; and the first side plate a second side plate portion opposite to the second side plate portion; the two side plate portions are integrally joined to the upper plate portion; the second non-magnetic protective cover member includes: a first side plate portion having a length reaching the aforementioned length and having at least one opening portion at the front end portion, a second side plate portion facing the first side plate portion and an upper plate portion being integrally joined to the upper plate portion; (b) the first plate member side being of the same polarity in the first protective cover member Inserting at least one permanent magnet magnetized in the height direction to form a first magnet assembly; (c) in the second protective cover member in such a manner that the upper plate portion side can be opposite in polarity to the first magnet assembly Inserting at least one permanent magnet magnetized in the height direction to form a second magnet assembly; (d) mechanically fixing the spacer to the yoke plate; (e) permanently splicing the first magnet assembly The stone is disposed in the center groove, and the first magnet assembly is fixed to the yoke plate by a bolt that is engaged with the opening of the outer flange portion; (f) the second magnet is The permanent magnet of the assembly is disposed in a state in which the outer peripheral step is different, and the second magnet assembly is fixed to the yoke plate by a bolt that is engaged with the opening of the first side plate portion. 如申請專利範圍第16或17項之製造磁控管濺鍍用磁回路裝置的方法,其中前述第一保護蓋構件係以至少在前述第一側板部上具有承受前述間隔物之缺口,且供前述 間隔物進入前述缺口之方式將前述第一磁石組合體固定於前述磁軛板上。 The method of manufacturing a magnetic circuit device for magnetron sputtering according to claim 16 or 17, wherein the first protective cover member has a notch at least on the first side plate portion to receive the spacer, and The foregoing The first magnet assembly is fixed to the yoke plate in such a manner that the spacer enters the gap.
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Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5012571B2 (en) * 2008-02-29 2012-08-29 富士通株式会社 Magnet unit for magnetron sputtering equipment
JP2009235497A (en) * 2008-03-27 2009-10-15 Shinmaywa Industries Ltd Sputtering system
JP5461264B2 (en) * 2010-03-25 2014-04-02 キヤノンアネルバ株式会社 Magnetron sputtering apparatus and sputtering method
US20160133445A9 (en) * 2011-11-04 2016-05-12 Intevac, Inc. Sputtering system and method for highly magnetic materials
US10573500B2 (en) 2011-12-09 2020-02-25 Seagate Technology Llc Interchangeable magnet pack
US9347129B2 (en) * 2011-12-09 2016-05-24 Seagate Technology Llc Interchangeable magnet pack
CN102978725A (en) * 2012-12-03 2013-03-20 吴江市东飞化纤有限公司 Chemical fiber drying device
CN105632855B (en) * 2014-10-28 2018-05-25 北京北方华创微电子装备有限公司 A kind of magnetron and semiconductor processing equipment
KR101694197B1 (en) * 2015-03-25 2017-01-09 주식회사 에스에프에이 Apparatus to sputter
JP2019030063A (en) * 2017-07-26 2019-02-21 Tdk株式会社 Magnet structure and motor
CN111996505B (en) * 2020-07-10 2023-07-14 包头稀土研究院 Device for magnetron sputtering ferromagnetic target
KR102412882B1 (en) * 2020-10-30 2022-06-27 (주)울텍 The margnet module for sputter gun
KR102340351B1 (en) * 2021-05-26 2021-12-16 고영효 Magnetic Circuit of Magnetron Sputtering Apparatus and Method of Manufacture Thereof

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62142765A (en) * 1985-12-17 1987-06-26 Rohm Co Ltd Method for regulating film thickness during magnetron sputtering
JPH05239640A (en) * 1991-08-02 1993-09-17 Anelva Corp Sputtering device
TW272237B (en) * 1993-12-30 1996-03-11 Nidden Aneruba Kk
JPH0925573A (en) * 1995-06-28 1997-01-28 Daewoo Electron Co Ltd Sputtering apparatus
JPH10317137A (en) * 1997-05-13 1998-12-02 Fuji Elelctrochem Co Ltd Magnet attaching device
JPH1136068A (en) * 1997-07-17 1999-02-09 Sony Corp Cathode magnet mounting structure for sputtering
TW417143B (en) * 1998-05-20 2001-01-01 Applied Materials Inc Sputtering device and magnetron unit
TW480553B (en) * 1999-07-02 2002-03-21 Applied Materials Inc Magnetron unit and sputtering device
TW200504238A (en) * 2003-07-28 2005-02-01 Fts Corp Box-shaped facing-targets sputtering apparatus and method for producing compound thin film

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0719982B2 (en) * 1986-07-02 1995-03-06 松下電器産業株式会社 Case mounting device
JP2571817Y2 (en) * 1992-02-27 1998-05-20 株式会社トーキン Magnetic circuit for sputtering equipment
JPH08325726A (en) * 1995-05-29 1996-12-10 Hitachi Ltd Cathode
JPH1021978A (en) * 1996-06-28 1998-01-23 Nippon Antenna Co Ltd Coaxial cable fixing part
JP2001299604A (en) * 2000-04-20 2001-10-30 Toto Ltd Washstand dressing table

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62142765A (en) * 1985-12-17 1987-06-26 Rohm Co Ltd Method for regulating film thickness during magnetron sputtering
JPH05239640A (en) * 1991-08-02 1993-09-17 Anelva Corp Sputtering device
TW272237B (en) * 1993-12-30 1996-03-11 Nidden Aneruba Kk
JPH0925573A (en) * 1995-06-28 1997-01-28 Daewoo Electron Co Ltd Sputtering apparatus
JPH10317137A (en) * 1997-05-13 1998-12-02 Fuji Elelctrochem Co Ltd Magnet attaching device
JPH1136068A (en) * 1997-07-17 1999-02-09 Sony Corp Cathode magnet mounting structure for sputtering
TW417143B (en) * 1998-05-20 2001-01-01 Applied Materials Inc Sputtering device and magnetron unit
TW480553B (en) * 1999-07-02 2002-03-21 Applied Materials Inc Magnetron unit and sputtering device
TW200504238A (en) * 2003-07-28 2005-02-01 Fts Corp Box-shaped facing-targets sputtering apparatus and method for producing compound thin film

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