KR101243068B1 - 마그네트론 스퍼터링용 자기 회로 장치 및 그 제조 방법 - Google Patents

마그네트론 스퍼터링용 자기 회로 장치 및 그 제조 방법 Download PDF

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Publication number
KR101243068B1
KR101243068B1 KR1020077014470A KR20077014470A KR101243068B1 KR 101243068 B1 KR101243068 B1 KR 101243068B1 KR 1020077014470 A KR1020077014470 A KR 1020077014470A KR 20077014470 A KR20077014470 A KR 20077014470A KR 101243068 B1 KR101243068 B1 KR 101243068B1
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KR
South Korea
Prior art keywords
permanent magnet
side plate
plate portion
protective cover
cover member
Prior art date
Application number
KR1020077014470A
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English (en)
Korean (ko)
Other versions
KR20070102497A (ko
Inventor
히로아키 유아사
요시히코 구리야마
Original Assignee
히타치 긴조쿠 가부시키가이샤
네오맥스 기코 가부시키가이샤
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Application filed by 히타치 긴조쿠 가부시키가이샤, 네오맥스 기코 가부시키가이샤 filed Critical 히타치 긴조쿠 가부시키가이샤
Publication of KR20070102497A publication Critical patent/KR20070102497A/ko
Application granted granted Critical
Publication of KR101243068B1 publication Critical patent/KR101243068B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
KR1020077014470A 2005-02-02 2006-02-01 마그네트론 스퍼터링용 자기 회로 장치 및 그 제조 방법 KR101243068B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005026389 2005-02-02
JPJP-P-2005-00026389 2005-02-02
PCT/JP2006/301694 WO2006082863A1 (ja) 2005-02-02 2006-02-01 マグネトロンスパッタリング用磁気回路装置及びその製造方法

Publications (2)

Publication Number Publication Date
KR20070102497A KR20070102497A (ko) 2007-10-18
KR101243068B1 true KR101243068B1 (ko) 2013-03-13

Family

ID=36777247

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077014470A KR101243068B1 (ko) 2005-02-02 2006-02-01 마그네트론 스퍼터링용 자기 회로 장치 및 그 제조 방법

Country Status (5)

Country Link
JP (1) JP4924835B2 (ja)
KR (1) KR101243068B1 (ja)
CN (1) CN101107381A (ja)
TW (1) TWI400349B (ja)
WO (1) WO2006082863A1 (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5012571B2 (ja) * 2008-02-29 2012-08-29 富士通株式会社 マグネトロンスパッタ装置用磁石ユニット
JP2009235497A (ja) * 2008-03-27 2009-10-15 Shinmaywa Industries Ltd スパッタリング装置
JP5461264B2 (ja) * 2010-03-25 2014-04-02 キヤノンアネルバ株式会社 マグネトロンスパッタリング装置、及び、スパッタリング方法
US20160133445A9 (en) * 2011-11-04 2016-05-12 Intevac, Inc. Sputtering system and method for highly magnetic materials
US10573500B2 (en) 2011-12-09 2020-02-25 Seagate Technology Llc Interchangeable magnet pack
US9347129B2 (en) * 2011-12-09 2016-05-24 Seagate Technology Llc Interchangeable magnet pack
CN102978725A (zh) * 2012-12-03 2013-03-20 吴江市东飞化纤有限公司 化纤干燥装置
CN105632855B (zh) * 2014-10-28 2018-05-25 北京北方华创微电子装备有限公司 一种磁控管及半导体加工设备
KR101694197B1 (ko) * 2015-03-25 2017-01-09 주식회사 에스에프에이 스퍼터 장치
JP2019030063A (ja) * 2017-07-26 2019-02-21 Tdk株式会社 磁石構造体及びモータ
CN111996505B (zh) * 2020-07-10 2023-07-14 包头稀土研究院 磁控溅射铁磁性靶材的装置
KR102412882B1 (ko) * 2020-10-30 2022-06-27 (주)울텍 스퍼터 건용 마그넷 모듈
KR102340351B1 (ko) * 2021-05-26 2021-12-16 고영효 마그네트론 스퍼터링 장치의 자기회로 및 그 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0569158U (ja) * 1992-02-27 1993-09-17 株式会社トーキン スパッタリング装置用磁気回路
KR950000906B1 (ko) * 1991-08-02 1995-02-03 니찌덴 아넬바 가부시기가이샤 스퍼터링장치
JPH1136068A (ja) * 1997-07-17 1999-02-09 Sony Corp スパッタリング用カソードマグネット取付け構造

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0726202B2 (ja) * 1985-12-17 1995-03-22 ローム株式会社 マグネトロンスパッタにおける膜厚調整方法
JPH0719982B2 (ja) * 1986-07-02 1995-03-06 松下電器産業株式会社 筐体取付装置
JP2555004B2 (ja) * 1993-12-30 1996-11-20 アネルバ株式会社 スパッタリング装置
JPH08325726A (ja) * 1995-05-29 1996-12-10 Hitachi Ltd カソード電極
KR970002891A (ko) * 1995-06-28 1997-01-28 배순훈 브이씨알 헤드의 박막 증착용 스퍼터링 장치
JPH1021978A (ja) * 1996-06-28 1998-01-23 Nippon Antenna Co Ltd 同軸ケーブル固着部品
JPH10317137A (ja) * 1997-05-13 1998-12-02 Fuji Elelctrochem Co Ltd マグネット取付装置
JPH11340165A (ja) * 1998-05-20 1999-12-10 Applied Materials Inc スパッタリング装置及びマグネトロンユニット
TW480553B (en) * 1999-07-02 2002-03-21 Applied Materials Inc Magnetron unit and sputtering device
JP2001299604A (ja) * 2000-04-20 2001-10-30 Toto Ltd 洗面化粧台
JP3965479B2 (ja) * 2003-07-28 2007-08-29 株式会社エフ・ティ・エスコーポレーション 箱型対向ターゲット式スパッタ装置及び化合物薄膜の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950000906B1 (ko) * 1991-08-02 1995-02-03 니찌덴 아넬바 가부시기가이샤 스퍼터링장치
JPH0569158U (ja) * 1992-02-27 1993-09-17 株式会社トーキン スパッタリング装置用磁気回路
JPH1136068A (ja) * 1997-07-17 1999-02-09 Sony Corp スパッタリング用カソードマグネット取付け構造

Also Published As

Publication number Publication date
JPWO2006082863A1 (ja) 2008-06-26
TWI400349B (zh) 2013-07-01
WO2006082863A1 (ja) 2006-08-10
CN101107381A (zh) 2008-01-16
JP4924835B2 (ja) 2012-04-25
TW200641173A (en) 2006-12-01
KR20070102497A (ko) 2007-10-18

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