KR970002891A - 브이씨알 헤드의 박막 증착용 스퍼터링 장치 - Google Patents
브이씨알 헤드의 박막 증착용 스퍼터링 장치 Download PDFInfo
- Publication number
- KR970002891A KR970002891A KR1019950017788A KR19950017788A KR970002891A KR 970002891 A KR970002891 A KR 970002891A KR 1019950017788 A KR1019950017788 A KR 1019950017788A KR 19950017788 A KR19950017788 A KR 19950017788A KR 970002891 A KR970002891 A KR 970002891A
- Authority
- KR
- South Korea
- Prior art keywords
- top plate
- thin film
- sputtering device
- film deposition
- head
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/18—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates by cathode sputtering
- H01F41/183—Sputtering targets therefor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Magnetic Heads (AREA)
Abstract
본 발명은 브이씨알 헤드의 박막 증착용 스퍼터링 장치에 관한 것으로서, 전자를 방출시키는 빽판(40)과, 빽판(40)에 자기장을 형성시키는 자석(30)으로 구성된 스퍼터링 장치에 있어서, 상기 빽판(40)의 저면에 부착된 타켓(50)에 균일하게 아르곤 이온(110)을 충돌시켜 많은 량의 규소를 박리시키기 위해 빽판(40)의 배면에 회전축(61)을 고정시킨 회전모터(60)를 설치하여 빽판(40)을 일정 속도로 회전시키도록 구성된 것을 특징으로 하는 브이씨알 헤드의 박막 증착용 스퍼터링 장치인 바 페라이트 상에 고른 균일도와 두께를 쉽게 조절시킨 규소 박막을 증착시킴으로써 양질의 자기헤드를 제조하도록 해주는 것이다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 종래의 박막 증착용 스퍼터링 장치의 구성도, 제2도는 본 발명에 따른 박막 증착용 스퍼터링 장치의 구성도.
Claims (1)
- 전자를 방출시키는 빽판(40)과, 빽판(40)에 자기장을 형성시키는 자석(30)으로 구성된 스퍼터링 장치에 있어서, 상기 빽판(40)의 저면에 부착된 타켓(50)에 균일하게 아르곤 이온(110)을 충돌시켜 많은 량의 규소를 박리시키기 위해 빽판(40)의 배면에 회전축(61)을 고정시킨 회전모터(60)를 설치하여 빽판(40)을 일정 속도로 회전시키도록 구성된 것을 특징으로 하는 브이씨알 헤드의 박막 증착용 스퍼터링 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950017788A KR970002891A (ko) | 1995-06-28 | 1995-06-28 | 브이씨알 헤드의 박막 증착용 스퍼터링 장치 |
JP8163925A JPH0925573A (ja) | 1995-06-28 | 1996-06-04 | スパッタリング装置 |
CN96105322A CN1141353A (zh) | 1995-06-28 | 1996-06-04 | 在基底上喷镀材料用的溅射装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950017788A KR970002891A (ko) | 1995-06-28 | 1995-06-28 | 브이씨알 헤드의 박막 증착용 스퍼터링 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970002891A true KR970002891A (ko) | 1997-01-28 |
Family
ID=19418503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950017788A KR970002891A (ko) | 1995-06-28 | 1995-06-28 | 브이씨알 헤드의 박막 증착용 스퍼터링 장치 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPH0925573A (ko) |
KR (1) | KR970002891A (ko) |
CN (1) | CN1141353A (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200108651A (ko) * | 2019-03-11 | 2020-09-21 | 한국원자력연구원 | 광물 탄산화 방법 및 장치 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10047430B2 (en) | 1999-10-08 | 2018-08-14 | Applied Materials, Inc. | Self-ionized and inductively-coupled plasma for sputtering and resputtering |
US6610184B2 (en) * | 2001-11-14 | 2003-08-26 | Applied Materials, Inc. | Magnet array in conjunction with rotating magnetron for plasma sputtering |
KR100993046B1 (ko) * | 2001-11-14 | 2010-11-08 | 어플라이드 머티어리얼스, 인코포레이티드 | 스퍼터링 및 재스퍼터링을 위한 자기-이온화 및 유도 결합플라즈마 |
US7504006B2 (en) | 2002-08-01 | 2009-03-17 | Applied Materials, Inc. | Self-ionized and capacitively-coupled plasma for sputtering and resputtering |
JP4924835B2 (ja) * | 2005-02-02 | 2012-04-25 | 日立金属株式会社 | マグネトロンスパッタリング用磁気回路装置及びその製造方法 |
US20120048723A1 (en) * | 2010-08-24 | 2012-03-01 | Varian Semiconductor Equipment Associates, Inc. | Sputter target feed system |
CN102437004A (zh) * | 2010-09-29 | 2012-05-02 | Snu精密股份有限公司 | 溅射装置 |
JP5081315B2 (ja) * | 2011-02-23 | 2012-11-28 | 株式会社神戸製鋼所 | アーク式蒸発源 |
JP5081320B2 (ja) * | 2011-02-23 | 2012-11-28 | 株式会社神戸製鋼所 | アーク式蒸発源 |
CA2824749C (en) * | 2011-02-23 | 2016-04-26 | Kabushiki Kaisha Kobe Seiko Sho(Kobe Steel, Ltd.) | Arc evaporation source |
JP5081327B1 (ja) * | 2011-04-25 | 2012-11-28 | 株式会社神戸製鋼所 | アーク式蒸発源 |
JP6580113B2 (ja) * | 2017-12-05 | 2019-09-25 | キヤノントッキ株式会社 | スパッタ装置及びその制御方法 |
WO2021052497A1 (zh) * | 2019-09-20 | 2021-03-25 | 深圳市晶相技术有限公司 | 一种半导体设备 |
-
1995
- 1995-06-28 KR KR1019950017788A patent/KR970002891A/ko not_active Application Discontinuation
-
1996
- 1996-06-04 JP JP8163925A patent/JPH0925573A/ja active Pending
- 1996-06-04 CN CN96105322A patent/CN1141353A/zh active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200108651A (ko) * | 2019-03-11 | 2020-09-21 | 한국원자력연구원 | 광물 탄산화 방법 및 장치 |
Also Published As
Publication number | Publication date |
---|---|
JPH0925573A (ja) | 1997-01-28 |
CN1141353A (zh) | 1997-01-29 |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
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