TWI400349B - 磁控管濺鍍用磁回路裝置及其製造方法 - Google Patents
磁控管濺鍍用磁回路裝置及其製造方法 Download PDFInfo
- Publication number
- TWI400349B TWI400349B TW095103754A TW95103754A TWI400349B TW I400349 B TWI400349 B TW I400349B TW 095103754 A TW095103754 A TW 095103754A TW 95103754 A TW95103754 A TW 95103754A TW I400349 B TWI400349 B TW I400349B
- Authority
- TW
- Taiwan
- Prior art keywords
- permanent magnet
- side plate
- plate portion
- protective cover
- cover member
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3452—Magnet distribution
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005026389 | 2005-02-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200641173A TW200641173A (en) | 2006-12-01 |
TWI400349B true TWI400349B (zh) | 2013-07-01 |
Family
ID=36777247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095103754A TWI400349B (zh) | 2005-02-02 | 2006-02-03 | 磁控管濺鍍用磁回路裝置及其製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4924835B2 (ja) |
KR (1) | KR101243068B1 (ja) |
CN (1) | CN101107381A (ja) |
TW (1) | TWI400349B (ja) |
WO (1) | WO2006082863A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5012571B2 (ja) | 2008-02-29 | 2012-08-29 | 富士通株式会社 | マグネトロンスパッタ装置用磁石ユニット |
JP2009235497A (ja) * | 2008-03-27 | 2009-10-15 | Shinmaywa Industries Ltd | スパッタリング装置 |
JP5461264B2 (ja) * | 2010-03-25 | 2014-04-02 | キヤノンアネルバ株式会社 | マグネトロンスパッタリング装置、及び、スパッタリング方法 |
US20160133445A9 (en) * | 2011-11-04 | 2016-05-12 | Intevac, Inc. | Sputtering system and method for highly magnetic materials |
US10573500B2 (en) | 2011-12-09 | 2020-02-25 | Seagate Technology Llc | Interchangeable magnet pack |
US9347129B2 (en) * | 2011-12-09 | 2016-05-24 | Seagate Technology Llc | Interchangeable magnet pack |
CN102978725A (zh) * | 2012-12-03 | 2013-03-20 | 吴江市东飞化纤有限公司 | 化纤干燥装置 |
CN105632855B (zh) * | 2014-10-28 | 2018-05-25 | 北京北方华创微电子装备有限公司 | 一种磁控管及半导体加工设备 |
KR101694197B1 (ko) * | 2015-03-25 | 2017-01-09 | 주식회사 에스에프에이 | 스퍼터 장치 |
JP2019030063A (ja) * | 2017-07-26 | 2019-02-21 | Tdk株式会社 | 磁石構造体及びモータ |
CN111996505B (zh) * | 2020-07-10 | 2023-07-14 | 包头稀土研究院 | 磁控溅射铁磁性靶材的装置 |
KR102412882B1 (ko) * | 2020-10-30 | 2022-06-27 | (주)울텍 | 스퍼터 건용 마그넷 모듈 |
KR102340351B1 (ko) * | 2021-05-26 | 2021-12-16 | 고영효 | 마그네트론 스퍼터링 장치의 자기회로 및 그 제조 방법 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62142765A (ja) * | 1985-12-17 | 1987-06-26 | Rohm Co Ltd | マグネトロンスパツタにおける膜厚調整方法 |
JPH05239640A (ja) * | 1991-08-02 | 1993-09-17 | Anelva Corp | スパッタリング装置 |
TW272237B (ja) * | 1993-12-30 | 1996-03-11 | Nidden Aneruba Kk | |
JPH0925573A (ja) * | 1995-06-28 | 1997-01-28 | Daewoo Electron Co Ltd | スパッタリング装置 |
JPH10317137A (ja) * | 1997-05-13 | 1998-12-02 | Fuji Elelctrochem Co Ltd | マグネット取付装置 |
JPH1136068A (ja) * | 1997-07-17 | 1999-02-09 | Sony Corp | スパッタリング用カソードマグネット取付け構造 |
TW417143B (en) * | 1998-05-20 | 2001-01-01 | Applied Materials Inc | Sputtering device and magnetron unit |
TW480553B (en) * | 1999-07-02 | 2002-03-21 | Applied Materials Inc | Magnetron unit and sputtering device |
TW200504238A (en) * | 2003-07-28 | 2005-02-01 | Fts Corp | Box-shaped facing-targets sputtering apparatus and method for producing compound thin film |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0719982B2 (ja) * | 1986-07-02 | 1995-03-06 | 松下電器産業株式会社 | 筐体取付装置 |
JP2571817Y2 (ja) * | 1992-02-27 | 1998-05-20 | 株式会社トーキン | スパッタリング装置用磁気回路 |
JPH08325726A (ja) * | 1995-05-29 | 1996-12-10 | Hitachi Ltd | カソード電極 |
JPH1021978A (ja) * | 1996-06-28 | 1998-01-23 | Nippon Antenna Co Ltd | 同軸ケーブル固着部品 |
JP2001299604A (ja) * | 2000-04-20 | 2001-10-30 | Toto Ltd | 洗面化粧台 |
-
2006
- 2006-02-01 WO PCT/JP2006/301694 patent/WO2006082863A1/ja not_active Application Discontinuation
- 2006-02-01 KR KR1020077014470A patent/KR101243068B1/ko not_active IP Right Cessation
- 2006-02-01 CN CNA2006800026734A patent/CN101107381A/zh active Pending
- 2006-02-01 JP JP2007501599A patent/JP4924835B2/ja not_active Expired - Fee Related
- 2006-02-03 TW TW095103754A patent/TWI400349B/zh not_active IP Right Cessation
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62142765A (ja) * | 1985-12-17 | 1987-06-26 | Rohm Co Ltd | マグネトロンスパツタにおける膜厚調整方法 |
JPH05239640A (ja) * | 1991-08-02 | 1993-09-17 | Anelva Corp | スパッタリング装置 |
TW272237B (ja) * | 1993-12-30 | 1996-03-11 | Nidden Aneruba Kk | |
JPH0925573A (ja) * | 1995-06-28 | 1997-01-28 | Daewoo Electron Co Ltd | スパッタリング装置 |
JPH10317137A (ja) * | 1997-05-13 | 1998-12-02 | Fuji Elelctrochem Co Ltd | マグネット取付装置 |
JPH1136068A (ja) * | 1997-07-17 | 1999-02-09 | Sony Corp | スパッタリング用カソードマグネット取付け構造 |
TW417143B (en) * | 1998-05-20 | 2001-01-01 | Applied Materials Inc | Sputtering device and magnetron unit |
TW480553B (en) * | 1999-07-02 | 2002-03-21 | Applied Materials Inc | Magnetron unit and sputtering device |
TW200504238A (en) * | 2003-07-28 | 2005-02-01 | Fts Corp | Box-shaped facing-targets sputtering apparatus and method for producing compound thin film |
Also Published As
Publication number | Publication date |
---|---|
TW200641173A (en) | 2006-12-01 |
JPWO2006082863A1 (ja) | 2008-06-26 |
KR101243068B1 (ko) | 2013-03-13 |
KR20070102497A (ko) | 2007-10-18 |
JP4924835B2 (ja) | 2012-04-25 |
CN101107381A (zh) | 2008-01-16 |
WO2006082863A1 (ja) | 2006-08-10 |
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Legal Events
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MM4A | Annulment or lapse of patent due to non-payment of fees |