TW272237B - - Google Patents

Info

Publication number
TW272237B
TW272237B TW083103451A TW83103451A TW272237B TW 272237 B TW272237 B TW 272237B TW 083103451 A TW083103451 A TW 083103451A TW 83103451 A TW83103451 A TW 83103451A TW 272237 B TW272237 B TW 272237B
Authority
TW
Taiwan
Application number
TW083103451A
Other languages
Chinese (zh)
Original Assignee
Nidden Aneruba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidden Aneruba Kk filed Critical Nidden Aneruba Kk
Application granted granted Critical
Publication of TW272237B publication Critical patent/TW272237B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
TW083103451A 1993-12-30 1994-04-19 TW272237B (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5354024A JP2555004B2 (ja) 1993-12-30 1993-12-30 スパッタリング装置

Publications (1)

Publication Number Publication Date
TW272237B true TW272237B (ja) 1996-03-11

Family

ID=18434800

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083103451A TW272237B (ja) 1993-12-30 1994-04-19

Country Status (3)

Country Link
JP (1) JP2555004B2 (ja)
KR (1) KR960011245B1 (ja)
TW (1) TW272237B (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI391513B (zh) * 2007-11-28 2013-04-01 Ulvac Inc 濺鍍裝置及成膜方法
TWI393797B (zh) * 2005-08-18 2013-04-21 Ulvac Inc Sputtering electrodes and sputtering devices with sputtering electrodes
TWI400349B (zh) * 2005-02-02 2013-07-01 Hitachi Metals Ltd 磁控管濺鍍用磁回路裝置及其製造方法
TWI486469B (zh) * 2010-04-22 2015-06-01 Hon Hai Prec Ind Co Ltd 鍍膜系統

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3403550B2 (ja) 1995-06-29 2003-05-06 松下電器産業株式会社 スパッタリング装置とスパッタリング方法
JP2000239841A (ja) * 1999-02-24 2000-09-05 Ulvac Japan Ltd スパッタリング方法と装置
US20130220797A1 (en) * 2010-05-19 2013-08-29 General Plasma, Inc. High target utilization moving magnet planar magnetron scanning method
JP7390922B2 (ja) * 2020-02-18 2023-12-04 東京エレクトロン株式会社 カソードユニットおよび成膜装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400349B (zh) * 2005-02-02 2013-07-01 Hitachi Metals Ltd 磁控管濺鍍用磁回路裝置及其製造方法
TWI393797B (zh) * 2005-08-18 2013-04-21 Ulvac Inc Sputtering electrodes and sputtering devices with sputtering electrodes
TWI391513B (zh) * 2007-11-28 2013-04-01 Ulvac Inc 濺鍍裝置及成膜方法
TWI486469B (zh) * 2010-04-22 2015-06-01 Hon Hai Prec Ind Co Ltd 鍍膜系統

Also Published As

Publication number Publication date
JP2555004B2 (ja) 1996-11-20
JPH07197254A (ja) 1995-08-01
KR950018638A (ko) 1995-07-22
KR960011245B1 (ko) 1996-08-21

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