WO2006059553A1 - 電子部品ハンドリング装置および不良端子判断方法 - Google Patents
電子部品ハンドリング装置および不良端子判断方法 Download PDFInfo
- Publication number
- WO2006059553A1 WO2006059553A1 PCT/JP2005/021722 JP2005021722W WO2006059553A1 WO 2006059553 A1 WO2006059553 A1 WO 2006059553A1 JP 2005021722 W JP2005021722 W JP 2005021722W WO 2006059553 A1 WO2006059553 A1 WO 2006059553A1
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- Prior art keywords
- terminal
- electronic component
- test
- defective
- position information
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
Definitions
- the present invention relates to an electronic component handling apparatus and a defective terminal determination method capable of detecting a defect of a terminal of an electronic component, such as a missing or misplaced solder ball or lead pin of an IC device.
- an electronic component testing apparatus In the process of manufacturing electronic components such as IC devices, an electronic component testing apparatus is used to test the performance and function of the finally manufactured electronic component.
- An electronic component testing apparatus as an example of the prior art includes a test unit for testing an electronic component, a loader unit for sending an IC device before the test to the test unit, and taking out a tested IC device from the test unit. And an unloader section for classification.
- the loader unit includes a buffer stage that can reciprocate between the loader unit and the test unit, and an adsorption unit that can hold the IC device by suction.
- Customer tray card Heat plate area from the heat plate to the buffer stage
- a loader unit transporting device which can be moved at a distance.
- the test unit may be equipped with a contact arm that can hold the Ic device and hold it against the socket of the test head, and is equipped with a test unit transport device that can be moved in the test unit area.
- the loader unit transport device holds the IC device accommodated in the customer tray by the suction unit and places it on the heat plate, and then heats the IC device on the heat plate heated to a predetermined temperature.
- the IC device is again sucked and held by the suction section and placed on the buffer stage.
- the buffer stage on which the IC device is mounted moves from the loader unit to the test unit side.
- the test unit transfer device sucks and holds the IC device on the buffer stage with the contact arm and presses it against the socket of the test head, and then the external terminal
- an electronic component testing apparatus that measures the position of an IC device using an image processing technique and positions the test head with respect to the socket has been developed (for example, Patent Document 1).
- an IC device under test being transported by a transport device is shot with an optical imaging device such as a CCD (Charge Coupled Device) camera, and the IC device is based on the captured image. Calculate the amount of misalignment.
- the transport device corrects the posture of the IC device under test based on the calculated amount of displacement and transports the IC device under test to the socket.
- the calculation of the positional deviation amount of the IC device is performed, for example, by detecting a device terminal in the image using an image processing technique and measuring the center coordinates and the rotation angle of the entire array of device terminals.
- Patent Document 1 International Publication No. 03Z075025 Pamphlet
- mounting positions of some solder balls may be shifted due to a defect in a process of mounting solder balls.
- the contact between the device terminal and the socket terminal becomes insufficient, and the electrical resistance of the contact portion increases, which causes a problem that it cannot be accurately tested.
- the solder balls mounted in a shifted state may be detached from the knocker cage by a lateral force generated by contact with the socket terminal.
- the solder ball force that has been removed even if the device becomes defective s remains on the socket and hinders testing of IC devices that are transported later.
- the solder balls come off after the test in this way, defective products will be produced in the testing process, and there is a risk that the defective products will be shipped as they are.
- the present invention has been made in view of such a situation, and an object thereof is to provide an electronic component handling device and a defective terminal determination method capable of detecting a failure of a terminal of an electronic component. .
- the present invention transports the electronic component to a contact portion and electrically connects it to the contact portion.
- An electronic component handling device a storage device for storing reference position information of each terminal of a reference electronic component, an imaging device for imaging a terminal of an electronic device under test, and a device under test imaged by the imaging device.
- the terminal position information acquisition means for acquiring the position information of each terminal from the image data of the terminals of the electronic component, and the reference position information of each terminal of the electronic component serving as a reference are read from the storage device, and each of the read terminals is read.
- an electronic component handling device comprising a defective terminal determination means
- the electronic component handling device further includes a transport device capable of holding the electronic device under test and pressing it against the contact portion, and the imaging device includes the transport device. It is preferable to image the terminal of the electronic component held in the pre-test (Invention 2).
- the electronic component handling device includes reference position information of each terminal of an electronic component serving as a reference read from the storage device, and a device under test acquired by the terminal position information acquisition unit. It further comprises posture correction amount calculating means for obtaining a correction amount of the posture of the electronic component to be tested based on comparison with position information of each terminal of the electronic component, and the transport device is obtained by the posture correction amount calculating means. It is preferable to provide an attitude correction device that corrects the attitude of the electronic device under test held and / or held by the transfer apparatus based on the correction amount (Invention 3).
- the transfer device is capable of holding a plurality of electronic components to be tested.
- the electronic device under test that is determined to have no position failure, it is pressed against the contact part, and the electronic device under test that is determined to have a missing terminal or a poor placement position of the terminal.
- the imaging device may image the terminals of the electronic component before the test and the terminals of the electronic component after the test (Invention 6).
- this invention it is possible to detect missing or misplaced mounting positions of electronic components caused by the test from a comparison between the terminals of the electronic component before the test and the terminals of the electronic component after the test.
- the terminal may remain on the contact area. Can be prevented from being pressed against the remaining contact portion.
- the positional information of each terminal acquired from the image data of the terminal of the electronic component after the test imaged by the imaging device, and the reference read from the storage device may be further provided a second defective terminal judging means for judging terminal missing and Z or placement position defect in the electronic component after the test from comparison with the reference position information of each terminal of the electronic component.
- invention 7 positional information of each terminal acquired from the image data of the terminal of the electronic component after the test imaged by the imaging device, and each terminal of the electronic component before the test acquired by the terminal position information acquisition unit It is also possible to further include a second defective terminal determining means for determining a missing terminal and a Z or an arrangement position defect in the electronic component after the test based on the comparison with the position information (Invention 8). [0025] In the above inventions (Inventions 7 and 8), a terminal is missing by the second defective terminal judging means! It is preferable to classify electronic components under test that are determined to be defective or have poor terminal placement positions as defective electronic components (Invention 9).
- the electronic component handling device further includes a display device, and the second defective terminal determining means is missing a terminal or a terminal arrangement.
- the second defective terminal determining means is missing a terminal or a terminal arrangement.
- the present invention relates to a method for determining a terminal dropout and Z or an arrangement position defect of an electronic component under test in an electronic component handling apparatus, and a reference for each terminal of the electronic component as a reference
- From the comparison of the read reference position information of each terminal and the acquired position information of each terminal of the electronic device under test it is determined whether the terminal is missing and the Z or the placement position is bad in the electronic device under test.
- a defective terminal judging method characterized by comprising the steps of: (Invention 12).
- invention 12 it is possible to automatically detect a missing terminal and a Z or poor placement position in an electronic device under test without requiring visual inspection.
- an electronic device under test that is judged to have a missing terminal or a defective terminal placement position is excluded from the electrical test and Z or defective.
- the method may further include a step of performing classification processing as an electronic component (Invention 14).
- a step of imaging the terminal of the electronic component after the test, and position information of each terminal acquired from the image data of the imaged terminal of the electronic component after the test And a step of determining missing terminals and Z or poor placement position in the electronic component after the test based on comparison with reference position information of each terminal of the electronic component serving as the reference (invention).
- the step of imaging the terminals of the electronic components before the test the step of imaging the terminals of the electronic components after the test, Based on the comparison between the position information and the position information of each terminal acquired from the image data of the terminals of the electronic component after the test, it is determined whether the terminal is missing and Z or the placement position is poor in the electronic component after the test.
- the Tsu further a flop, even if good ⁇ (invention 16).
- the above inventions may further comprise a step of issuing an alarm when it is determined that the terminal is missing or the terminal arrangement position is defective (Invention 18). ).
- FIG. 1 is a plan view of a handler according to an embodiment of the present invention.
- FIG. 2 is a partial cross-sectional side view (II cross-sectional view in FIG. 1) of the handler according to the same embodiment.
- FIG. 3 is a side view of a contact arm and an imaging device used in the handler.
- FIG. 4 is a side view of a contact arm and a contact part used in the handler.
- FIG. 5A is a flowchart showing the operation of the handler.
- FIG. 5B is a flowchart showing the operation of the handler.
- FIG. 6 is a conceptual diagram of an image processing process in the handler (when there is no defective portion on the solder ball of the IC device).
- FIG. 7 is a conceptual diagram of an image processing process in the handler (when a solder ball of an IC device has a defective portion).
- FIG. 1 is a plan view of a handler according to an embodiment of the present invention
- FIG. 2 is a partial cross-sectional side view (cross-sectional view of II in FIG. 1) of the non-handler according to the embodiment
- FIG. 3 is a contact arm used in the handler 4 is a side view of a contact arm and a contact portion used in the handler
- FIG. 5 is a flowchart showing the operation of the handler
- FIGS. 6 and 7 are image processing steps in the handler. It is a conceptual diagram.
- the form of the IC device under test in this embodiment is, for example, a device terminal
- the present invention is not limited to this, for example, a QFP (Quad Flat Package) package having lead pins as device terminals, or the like. May be SOP (Small Outline Package) package! / ⁇ .
- the electronic component test apparatus 1 in this embodiment includes a handler 10, a test head 300, and a tester 20. Connected through. Then, the IC device before the test on the supply tray stored in the supply tray stock force 401 of the handler 10 is transported and pressed against the contact portion 301 of the test head 300, and the test head 300 and the cable 21 are passed through this test head 300. After the IC device test is executed, the IC device for which the test has been completed is mounted on the classification tray stored in the classification tray stock force 402 according to the test result.
- the noder 10 mainly includes a test unit 30, an IC device storage unit 40, a loader unit 50, and an unloader unit 60. Hereinafter, each part will be described.
- the IC device storage unit 40 is a means for storing the IC device before and after the test.
- the IC device storage unit 40 mainly includes the supply tray force 401, the classification tray stock force 402, the empty tray stock force 403, and the tray transport. Device 404.
- supply tray stock force 401 a plurality of supply trays loaded with a plurality of pre-test IC devices are loaded and stored.
- two supply tray stock forces 401 are provided.
- the classification tray stock force 402 includes a plurality of classification trays on which a plurality of IC devices after the test are mounted and is stored. In this embodiment, as shown in FIG. A tray stocking force 402 is provided. By providing these four classification tray stock forces 402, IC devices can be sorted and stored in up to four classifications according to the test results.
- the empty tray stock force 403 stores the empty tray after all the pre-test IC devices 20 mounted on the supply tray stock force 401 have been supplied to the test unit 30.
- the number of stock forces 401 to 403 can be appropriately set as necessary.
- the tray transfer device 404 is a transfer means that can move in the X-axis and Z-axis directions in FIG. 1, and is mainly composed of an X-axis direction lenore 404a, a movable head ⁇ 404b, and four suction nodes 404c
- the range including the supply tray force 401, the partial tray force 402, and the empty tray force 403 is defined as the operation range.
- the X-axis direction rail 404a fixed on the base 12 of the handler 10 supports the movable head 404b in a cantilevered manner so as to be movable in the X-axis direction.
- the portion 404b is provided with a Z-axis direction actuator (not shown) and four suction pads 404c at the tip.
- the tray transport device 404 sucks and holds the empty tray emptied by the supply tray stock force 401 by the suction pad 404c, moves up by the Z-axis direction actuator, and moves on the X-axis direction rail 404a.
- the head portion 404b is slid to be transferred to the empty tray stock force 401.
- the empty tray is attracted and held from the empty tray force 403 and lifted by the Z-axis direction actuator.
- the movable head portion 404b is slid on the X-axis direction rail 404a to be transferred to the sorting tray stock force 402.
- the operation range of the tray transport device 404 is provided so as not to overlap the operation range of a loader unit transport device 501 and an unloader unit transport device 601 described later in the Z-axis direction. Therefore, the operations of the tray transfer device 404, the loader unit transfer device 501, and the unloader unit transfer device 601 do not interfere with each other.
- the loader unit 50 is a means for supplying the IC device before the test to the test unit 30 from the supply tray stock force 401 of the IC device storage unit 40.
- the loader unit 50 mainly includes a loader unit transfer device 501 and two loader buffers. It comprises a part 502 (two in the negative direction of the X axis in FIG. 1) and a heat plate 503.
- the IC device before the test is moved from the supply tray stock force 401 to the heat plate 503 by the loader unit transport device 501, heated to a predetermined temperature by the heat plate 503, and then again loaded to the loader unit transport device 501.
- the loader buffer unit 502 moves to the loader buffer unit 502, and the loader buffer unit 502 introduces it to the test unit 30.
- the loader unit transport device 501 moves the IC device on the supply tray 401 of the supply tray of the IC device storage unit 40 onto the heat plate 503 and also transfers the IC device on the heat plate 503 to the loader buffer.
- This loader unit conveying device 501 has an operating range that includes a supply tray stock force 401, a heat plate 503, and two loader buffer units 502!
- the two Y-axis rails 501a of the loader unit transport device 501 are fixed on the base 12 of the handler 10, and the X-axis rail 502b is Y between them. It is slidably supported in the axial direction.
- the X-axis direction rail 502b supports a movable head portion 501c having a Z-axis direction actuator (not shown) so as to be slidable in the X-axis direction.
- the movable head portion 501c includes four suction portions 501d each having a suction pad 501e at the lower end, and the four suction portions 501d are each independently driven by driving the Z-axis direction actuator. Can be moved up and down in the Z-axis direction.
- Each suction part 501d is connected to a negative pressure source (not shown), and can suck and hold an IC device by sucking air from the suction pad 501e to generate a negative pressure. Also, the IC device can be released by stopping the suction of air from the suction pad 501e.
- the heat plate 503 is a heating source for applying a predetermined thermal stress to the IC device, and is, for example, a metal heat transfer plate having a heat source (not shown) in the lower part. On the upper surface side of the heat plate 503, a plurality of recesses 503a for dropping an IC device are formed. Note that a cooling source may be provided instead of a powerful heating source.
- the loader buffer unit 502 is a means for reciprocally moving the IC device between the operation range of the loader unit transport device 501 and the operation range of the test unit transport device 310, and mainly includes a buffer stage 502a, Consists of X-axis direction actuator 502b!
- a buffer stage 502a is supported at one end of an X-axis direction actuator 502b fixed on the base 12 of the handler 10, and as shown in FIGS. 3 and 4, the upper surface of the buffer stage 502a On the side, there is a rectangular recess 502c in plan view for dropping the IC device. Four are formed.
- the recess 502c is provided with a suction means (not shown) that can suck the IC device placed in the recess 502c.
- the loader unit transport device 501 and the test unit transport device 310 can operate simultaneously without interfering with each other. Further, by providing the two loader buffer units 502 as in the present embodiment, it is possible to efficiently supply an IC device to the test head 300 and increase the operating rate of the test head 300. Note that the number of loader buffer units 502 is not limited to two, and it is possible to set the time power required for the IC device test as appropriate.
- the test unit 30 detects a defect in the external terminal (solder ball) 2a of the IC device 2 to be tested and corrects the attitude of the IC device 2 to be tested, and then attaches the solder ball 2a of the IC device 2 to be tested to the contact portion.
- This is a means for performing a test by making electrical contact with the contact pin 301b of the socket 301a of 301, and mainly comprises a test section transport device 310 and an imaging device 320.
- the four pre-test IC devices placed on the loader buffer unit 502 are transported onto the imaging device 320 by the test unit transport device 310 and the posture is corrected, and then the contact portions of the test head 300 are contacted.
- the test piece is transferred to the unloader buffer unit 602 by the test unit transporting device 310 and discharged to the unloader unit 60 by the unloader buffer unit 602 again.
- two imaging devices 320 are installed on both sides of the contact portion 301 of the test head 300 in the Y-axis direction.
- the image pickup device 320 for example, a CCD camera can be used, but the image pickup device 320 is not limited to this, and is a device capable of photographing a target object by arranging a number of image pickup devices such as a MOS (Metal Oxide Semiconductor) sensor array. If there is ⁇
- each imaging device 320 is installed in a recess formed in the base 12 of the handler 10, and an IC device positioned above the imaging device 320 is located at the upper end of the recess.
- An illumination device 321 that can brightly illuminate 2 is provided.
- Each imaging device 320 is connected to an image processing device (not shown).
- the contact portion 301 of the test head 300 includes four sockets 301a in the present embodiment, and the four sockets 301a are movable head portions of the test unit transport device 310. They are arranged in an arrangement that substantially matches the arrangement of 312 contact arms 315. Further, each socket 301a is provided with a plurality of contact pins 301b arranged so as to substantially match the arrangement of the solder balls 2a of the IC device 2.
- an opening 11 is formed in the base 12 of the handler 10, and the contact portion 301 of the test head 300 protrudes from the opening 11 and the IC The device comes to be pressed!
- the test unit transport apparatus 310 is a means for moving the IC device between the loader buffer unit 502 and the unloader buffer unit 602 and the test head 300.
- the test section transport device 310 has two X-axis direction support members 31la slidable in the Y-axis direction on the two Y-axis direction rails 311 fixed on the base 12 of the handler 10. Support. A movable head 312 is supported at the center of each X-axis direction support member 311a, and the movable head 312 includes a loader buffer 502, an unloader buffer 602, and a test head 300. Is the operating range. It should be noted that the movable head portion 312 supported by each of the two X-axis direction supporting members 311a operating simultaneously on the pair of Y-axis direction rails 311 is controlled so that their operations do not interfere with each other. It has been.
- each movable head 312 includes a first Z-axis direction actuator 313a whose upper end is fixed to the X-axis direction support member 31la, and a first Z-axis direction actuator.
- Two contact arms 315 are provided corresponding to the arrangement of the sockets 301a, and a suction portion 317 is provided at the lower end of each contact arm 315.
- Each suction unit 317 is connected to a negative pressure source (not shown). By sucking air from the suction unit 317 and generating a negative pressure, the IC device can be sucked and held. In addition, the IC device can be released by stopping the suction of air from the suction part 317. According to the movable head portion 312, the four IC devices 2 held by the contact arm 315 can be moved in the Y-axis direction and the Z-axis direction and pressed against the contact portion 301 of the test head 300. It has become.
- the contact arm 315 in this embodiment includes an attitude correction mechanism capable of correcting the attitude of the IC device attracted and held by the attracting section 317, and the base 3 positioned on the upper side.
- a movable portion 315b that is located on the lower side and is movable with respect to the base portion 315a in the X-axis direction, the Y-axis direction, and the planar view rotation direction (the ⁇ direction).
- the contact arm 315 is based on the posture correction amount of the IC device 2 held by the contact arm 315 based on the posture correction amount of the IC device calculated by the image processing device from the image data acquired by the imaging device 320. After correcting the above, the IC device 2 can be pressed against the socket 301a, and the solder ball 2a of the IC device 2 and the contact pin 301b of the socket 301a can be reliably contacted.
- the unloader unit 60 is a means for discharging the IC device after the test from the test unit 30 to the IC device storage unit 40.
- the unloader unit 60 mainly includes an unloader unit transfer device 601 and two unloader buffer units 602 (see FIG. 1). ! /, 2 in the positive direction of the X axis).
- the IC device after the test placed on the unloader buffer unit 602 is discharged from the test unit 30 to the unloader unit 60, and is then unloaded from the unloader unit 602 by the unloader unit transfer device 601. Mounted on a sorting tray with a force of 402.
- the unloader buffer unit 602 is a means for reciprocally moving the IC device between the operation range of the test unit transport apparatus 310 and the operation range of the unloader unit transport apparatus 601, and mainly includes the buffer stage 602 a and X Consists of an axial actuator 602b!
- a buffer stage 602a is supported on one end of an X-axis direction actuator 602b fixed on the base 12 of the handler 10, and a recess for dropping an IC device is provided on the upper surface side of the buffer stage 602a.
- Four 602c are formed.
- the unloader unit transport device 601 and the test unit transport device 310 can operate simultaneously without interfering with each other. Also, by providing two unloader buffers 602, the test head 30 It is possible to efficiently discharge IC devices from 0 and increase the operating rate of the test head 300. Note that the number of unloader buffer units 602 is not limited to two, and can be set as appropriate, such as the time required for testing the IC device.
- the unloader unit transport device 601 is a means for moving and mounting the IC device on the unloader buffer unit 602 onto the classification tray having the sorting tray force 402, and mainly includes a Y-axis direction rail 601a, It is composed of an X-axis direction rail 601b, a movable head portion 601c, and a suction portion 601d.
- the unloader unit transport device 601 has a range including two unloader buffer units 602 and a classification tray stock force 402 as an operation range.
- the two Y-axis direction rails 601a of the unloader section transfer device 601 are fixed on the base 12 of the node 10, and the X-axis direction rail 602b is Y between them. It is supported so as to be slidable in the axial direction.
- the X-axis direction rail 602b supports a movable head portion 601c having a Z-axis direction actuator (not shown) so as to be slidable in the X-axis direction.
- the movable head portion 601c includes four suction portions 601d each having a suction pad at the lower end portion.
- each of the four suction portions 601d is independently Z It can be raised and lowered in the axial direction.
- the handler 10 includes a storage device that stores model data of various IC devices, a display device that can display images of the IC devices, and alarms such as speakers, buzzers, and warning lights.
- Equipment one shown.
- the IC device model data includes an array of coordinate data for each solder ball of the reference IC device.
- the solder ball coordinate data may be force center position coordinates or specific position coordinate data, which is data of the gravity center position coordinates of the solder ball.
- the loader unit transport device 501 is operated by the suction pads 501e of the four suction units 501d.
- Adsorb and hold four IC devices Adsorb and hold four IC devices.
- the loader unit transport device 501 holds the four IC devices, lifts the four IC devices by the Z-axis direction actuator of the movable head unit 501c, and moves them on the Y-axis direction rail 501a.
- the X-axis direction rail 501b is slid, and the movable head unit 501c is slid on the X-axis direction rail 501b to move to the loader unit 50.
- the loader unit transport device 501 performs positioning above the recess 503a of the heat plate 503, extends the Z-axis direction actuator of the movable head unit 501c, releases the suction pad 501e, and the IC device Into the recess 503a of the heat plate 503.
- the loader unit transfer device 501 holds the four heated IC devices again, and the upper part of the waiting loader buffer unit 502 is Move to.
- the loader unit transport device 501 performs positioning above the buffer stage 502a of one of the waiting loader buffer units 502, expands the Z-axis direction actuator of the movable head unit 501c, and extracts the suction unit 501d.
- the IC device 2 held by the suction pad 501e is released, and the IC device 2 is placed in the recess 502c of the buffer stage 502a.
- the suction means provided in the recess 502c sucks and holds the IC device 2 placed in the recess 502c.
- the loader buffer unit 502 extends the X-axis direction actuator 502b while adsorbing and holding the four IC devices 2 in the recesses 502 2c of the buffer stage 502a, and the loader unit 50 includes the header unit transport device 501. As for the operating range force, the four IC devices 2 are moved to the operating range of the test unit transport device 310 of the test unit 30.
- test unit 30 The following operation in the test unit 30 will be described with reference to the flowchart of FIG.
- the movable head unit 312 of the test unit transport apparatus 310 is mounted in the recess 502c of the buffer stage 502a.
- the IC device 2 (STEP 01).
- the first Z-axis direction actuator 313a of the movable head portion 312 extends, and is positioned in the concave portion 502c of the buffer stage 502a of the loader buffer portion 502 by the suction portions 317 of the four contact arms 315 of the movable head portion 312.
- Adsorb and hold the four IC devices 2 (STEP02). At this time, it is desirable that the adsorption in the recess 502c of the buffer stage 502a is released.
- the movable head unit 312 holding the four IC devices is raised by the first Z-axis direction actuator 313a of the movable head unit 312.
- the test unit transport apparatus 310 slides the X-axis direction support member 3 11 a that supports the movable head unit 312 on the Y-axis direction rail 311 and holds it by the contact arm 315 of the movable head unit 312.
- the four IC devices are conveyed above the imaging device 320 (STEP03; see FIG. 3).
- the imaging device 320 captures an image on the side where the solder ball 2a of the IC device 2 is present (STEP 04). At this time, the lighting device 321 illuminates the IC device 2 brightly.
- the image processing apparatus uses the coordinate data of each solder ball 2a that can be compared with the model data (array of coordinate data of each solder ball of the reference IC device) from the image data of the IC device 2 photographed by the imaging device 320. Create the first element list of the IC device under test, including the array (STEP 05).
- the creation of the first element list can be performed as follows, for example. First, the image data of the captured IC device is digitized using a threshold value to detect a solder ball candidate area. Then, the coordinates of the center of gravity of each solder ball candidate area are calculated, and the array (the array of actually measured solder ball coordinate data) is created. Next, while the model data is moved in the X and y directions and rotated in the Z or ⁇ direction, the number of elements in which the coordinate data of the model data and the coordinate data of the measured solder balls substantially match is counted. , Move and Z or rotate the model data so that the number of elements is maximized.
- a first element list including an array of solder ball coordinate data (an array of solder ball coordinate data that can be compared with model data) corresponding to the coordinate data of the model data based on the information thus obtained Create
- the image processing apparatus compares the first element list created as described above with the model data, and inspects the absence of the solder ball 2a in the IC device 2 (STEP06). Specifically, if the first element list does not include coordinate data corresponding to the model data, it is determined that a solder ball is missing.
- the image processing device will inform the IC device 2 that there is a defect (solder ball missing). (STEP08) and skip to STEP13 which will be described later.
- the image processing apparatus compares the first element list with the model data to determine whether the solder ball in IC device 2 The amount of mounting position deviation of 2a is calculated (STEP09).
- FIG. 6 and FIG. 7 are diagrams conceptually showing the above-mentioned STEP 04, STEP 05, STEP 06, and STEP 09, and FIG. 6 shows the IC device solder ball held by the contact arm 315.
- FIG. 7 is a conceptual diagram in the case where there is no defective portion, and FIG. 7 is a conceptual diagram in the case where there is a defective (missing “mounting position deviation”) portion on the solder ball of the IC device held by the contact arm 315.
- the amount of mounting position deviation calculated above and an allowable amount are compared, and the amount of mounting position deviation is larger than the allowable capacity.
- the image processing apparatus notifies the control unit of the nodler 10 of information indicating that the IC device 2 has a defect (solder ball mounting position defect) (STEP 08). Skip to.
- the image processing apparatus next calculates the attitude correction amount ( ⁇ ⁇ , ⁇ ⁇ , ⁇ ⁇ ) of the IC device 2 (STEP11).
- the position information of the socket 301a is also taken into account for calculating the posture correction amount.
- the contact arm 315 of the movable head portion 312 moves the movable portion 315b based on the calculated amount of correction ( ⁇ X, ⁇ y, ⁇ ⁇ ) of the posture of the IC device 2 to change the posture of the IC device 2. Correct (STEP 12).
- test unit transport apparatus 310 slides the X-axis direction support member 3 11 a that supports the movable head unit 312 on the Y-axis direction rail 311 to attract the contact arm 315 of the movable head unit 312.
- the four IC devices 2 held by the part 317 are conveyed above the four sockets 301a in the contact part 301 of the test head 300 (STEP 13).
- the control unit of the handler 10 determines whether there is a terminal failure in each IC device 2 currently held, and if it is determined that there is a terminal failure (STEP 14—Yes), it is movable.
- the head unit 312 holds the IC device 2 and does not extend the second Z-axis direction actuator 313b and does not subject the IC device 2 to the test.
- This IC device 2 will be Classification tray (defective device tray) will be transported.
- the movable head unit 312 includes the first Z-axis direction actuator 313a and the IC device concerned.
- the second Z-axis direction actuator 313b holding 2 is extended (see FIG. 4), and the solder ball 2a of each IC device 2 is brought into contact with the contact pin 301b of the socket 301a (STEP 15). During this contact, an electrical signal is transmitted / received via the contact pin 301b, whereby the test of the IC device 2 is performed.
- the test unit transporting device 310 causes the IC device after the test by contraction of the first Z-axis direction actuator 313a and the second Z-axis direction actuator 313b of the movable head unit 312. 2 is raised and the X-axis direction supporting member 311 a supporting the movable head portion 312 is slid on the Y-axis direction rail 311 and held by the contact arm 315 of the movable head portion 312.
- the IC device 2 is conveyed again above the imaging device 320 (STEP 16).
- the imaging device 320 takes a second image of the side of the IC device 2 where the solder ball 2a is present (STEP 17).
- the image processing apparatus creates a second element list including an array of coordinate data of each solder ball 2a from the image data of the IC device 2 photographed by the imaging apparatus 320 (STEP 18).
- the second element list can be created by the same procedure as the first element list described above.
- the image processing apparatus compares the second element list with the first element list, and inspects the absence of the solder ball 2a in the IC device 2 after the test (STEP 19). Specifically, if the second element list does not include the coordinate data corresponding to the first element list, it is determined that the solder ball is missing. In the present embodiment, the second element list and the first element list are compared. However, the second element list and the model data may be compared.
- the control unit of the handler 10 issues an alarm by the alarm device (STEP 21), and the IC device solder ball is missing from the display device.
- the site is displayed (STEP 22).
- the display device displays, for example, an image of the IC device and a graphic such as a cursor indicating the position of the missing solder ball. Overlay can be displayed on the device image.
- the image processing device next compares the second element list with the model data, and after the test.
- the amount of misalignment of the solder ball 2a in the IC device 2 is calculated (STEP 23).
- the control unit of the handler 10 issues an alarm with the alarm device.
- the position of the solder ball mounting position of the IC device is displayed on the display device (STEP 22).
- the display device can display an image of the IC device and display a graphic such as a cursor indicating the position of the solder ball whose mounting position is shifted on the image of the IC device.
- test unit transport apparatus 310 slides the X-axis direction support member 3 11 a that supports the movable head unit 312 on the Y-axis direction rail 311, and the four IC devices that are held are The tester is transported above the buffer stage 602a of the unloader buffer unit 602 that is waiting within the operation range of the test unit transporting device 310.
- the movable head unit 312 extends the first Z-axis direction actuator 313a and releases the suction pad 317c, thereby dropping the four IC devices into the recess 602c of the buffer stage 602a.
- the unloader buffer unit 602 drives the X-axis actuator 602b with the four IC devices after the test mounted, and from the operating range of the test unit transport device 310 of the test unit 30, the unloader of the unloader unit 60 Move the IC device to the operation range of the part transport device 601.
- the Z-axis direction actuator of the movable head unit 601c of the unloader unit transfer device 601 located above the unloader buffer unit 602 is extended, and the four suction units 601d of the movable head unit 601c are used for unloading.
- the four IC devices after the test located in the recess 6 02c of the buffer stage 602a of the buffer unit 602 are sucked and held.
- the unloader unit transport device 601 is a movable head while holding the four IC devices after the test.
- the four IC devices are lifted by the Z-axis direction actuator of the 601c section, the X-axis direction rail 601b is slid on the Y-axis direction rail 601a, and the movable head section 601c is moved on the X-axis direction rail 601b. Slide it to move it onto the sorting tray force 402 of the IC device housing 40. Then, according to the test result of each IC device, each IC device is mounted on the classification tray positioned at the top of the stock force 402 for each classification tray.
- Sarakuko can also detect missing solder balls 2a and mounting position shifts in the IC device 2 after the test. It can be prevented that the IC device 2 in which a defect has occurred is shipped as it is. In addition, if a missing solder ball 2a is detected after the test, the solder ball 2a may remain on the socket 301a. It is possible to prevent the ball 2a from being pressed against the remaining socket 301a.
- the electronic component handling apparatus and defective terminal determination method of the present invention are useful for automatically detecting a defective terminal of an electronic component without requiring visual inspection.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006547872A JPWO2006059553A1 (ja) | 2004-11-30 | 2005-11-25 | 電子部品ハンドリング装置および不良端子判断方法 |
DE112005002693T DE112005002693T5 (de) | 2004-11-30 | 2005-11-25 | Prüfgerät für elektronische Bauelemente und Verfahren zur Erkennung schadhafter Klemmen |
US11/791,272 US20080059095A1 (en) | 2004-11-30 | 2005-11-25 | Electronic Device Handling Apparatus and Defective Terminal Determination Method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2004/017749 WO2006059360A1 (ja) | 2004-11-30 | 2004-11-30 | 電子部品ハンドリング装置 |
JPPCT/JP2004/017749 | 2004-11-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006059553A1 true WO2006059553A1 (ja) | 2006-06-08 |
Family
ID=36564805
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/017749 WO2006059360A1 (ja) | 2004-11-30 | 2004-11-30 | 電子部品ハンドリング装置 |
PCT/JP2005/021722 WO2006059553A1 (ja) | 2004-11-30 | 2005-11-25 | 電子部品ハンドリング装置および不良端子判断方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/017749 WO2006059360A1 (ja) | 2004-11-30 | 2004-11-30 | 電子部品ハンドリング装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080059095A1 (ja) |
JP (1) | JPWO2006059553A1 (ja) |
KR (1) | KR20070086747A (ja) |
CN (1) | CN101069100A (ja) |
DE (1) | DE112005002693T5 (ja) |
TW (1) | TWI276813B (ja) |
WO (2) | WO2006059360A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009046882A3 (de) * | 2007-10-05 | 2009-06-18 | Multitest Elektronische Syst | Handhabungsvorrichtung für elektronische bauelemente, insbesondere ic's, mit pneumatikzylinderbewegungseinrichtung zum verschieben von plungern |
TWI402517B (zh) * | 2010-02-24 | 2013-07-21 | Fugu Tech Entpr Co Ltd | 檢測系統及檢測方法 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5621313B2 (ja) * | 2010-05-14 | 2014-11-12 | セイコーエプソン株式会社 | 電子部品検査装置及び電子部品搬送方法 |
JP2013170917A (ja) * | 2012-02-21 | 2013-09-02 | Nidec-Read Corp | 基板内蔵電子部品の端子判別方法及び端子判別装置 |
CN107407552B (zh) * | 2015-03-06 | 2019-11-12 | 株式会社富士 | 识别装置及识别方法 |
US20170285102A1 (en) * | 2016-03-29 | 2017-10-05 | Delta Design, Inc. | Ic test site vision alignment system |
US10297043B2 (en) * | 2017-04-07 | 2019-05-21 | Advantest Corporation | Detector for detecting position of IC device and method for the same |
EP3385726B1 (en) * | 2017-04-07 | 2024-01-10 | Melexis Technologies NV | Kelvin connection with positional accuracy |
JP2020046326A (ja) * | 2018-09-20 | 2020-03-26 | 株式会社Screenホールディングス | 三次元形状計測装置、三次元形状計測方法 |
CN110930390B (zh) * | 2019-11-22 | 2020-09-22 | 深圳市海芯微迅半导体有限公司 | 基于半监督深度学习的芯片管脚缺失检测方法 |
CN110953989B (zh) * | 2019-12-09 | 2021-07-30 | 青岛歌尔微电子研究院有限公司 | 产品标记位置偏移的测量方法、装置、设备及介质 |
JP3227434U (ja) * | 2020-03-12 | 2020-08-27 | 株式会社アドバンテスト | 電子部品ハンドリング装置及び電子部品試験装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05166897A (ja) * | 1991-12-19 | 1993-07-02 | Tokyo Electron Yamanashi Kk | デバイスプローバ |
JP2769199B2 (ja) * | 1989-08-07 | 1998-06-25 | 富士通株式会社 | 半導体装置の製造方法 |
JP3105837B2 (ja) * | 1997-08-25 | 2000-11-06 | 九州日本電気株式会社 | 外観検査機能付きicハンドラ |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4969199A (en) * | 1986-02-28 | 1990-11-06 | Kabushiki Kaisha Toshiba | Apparatus for inspecting the molded case of an IC device |
US5828449A (en) * | 1997-02-26 | 1998-10-27 | Acuity Imaging, Llc | Ring illumination reflective elements on a generally planar surface |
US5956134A (en) * | 1997-07-11 | 1999-09-21 | Semiconductor Technologies & Instruments, Inc. | Inspection system and method for leads of semiconductor devices |
WO2003075025A1 (fr) * | 2002-03-07 | 2003-09-12 | Advantest Corporation | Dispositif d'essai de composants electroniques |
-
2004
- 2004-11-30 WO PCT/JP2004/017749 patent/WO2006059360A1/ja not_active Application Discontinuation
-
2005
- 2005-11-21 TW TW094140776A patent/TWI276813B/zh not_active IP Right Cessation
- 2005-11-25 DE DE112005002693T patent/DE112005002693T5/de not_active Ceased
- 2005-11-25 WO PCT/JP2005/021722 patent/WO2006059553A1/ja active Application Filing
- 2005-11-25 US US11/791,272 patent/US20080059095A1/en not_active Abandoned
- 2005-11-25 KR KR1020077014737A patent/KR20070086747A/ko not_active Application Discontinuation
- 2005-11-25 CN CNA2005800411084A patent/CN101069100A/zh active Pending
- 2005-11-25 JP JP2006547872A patent/JPWO2006059553A1/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2769199B2 (ja) * | 1989-08-07 | 1998-06-25 | 富士通株式会社 | 半導体装置の製造方法 |
JPH05166897A (ja) * | 1991-12-19 | 1993-07-02 | Tokyo Electron Yamanashi Kk | デバイスプローバ |
JP3105837B2 (ja) * | 1997-08-25 | 2000-11-06 | 九州日本電気株式会社 | 外観検査機能付きicハンドラ |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009046882A3 (de) * | 2007-10-05 | 2009-06-18 | Multitest Elektronische Syst | Handhabungsvorrichtung für elektronische bauelemente, insbesondere ic's, mit pneumatikzylinderbewegungseinrichtung zum verschieben von plungern |
US8684168B2 (en) | 2007-10-05 | 2014-04-01 | Multitest Elektronische Systeme Gmbh | Handler for electronic components, in particular IC'S, comprising a pneumatic cylinder displacement unit for moving plungers |
TWI402517B (zh) * | 2010-02-24 | 2013-07-21 | Fugu Tech Entpr Co Ltd | 檢測系統及檢測方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20070086747A (ko) | 2007-08-27 |
TW200622263A (en) | 2006-07-01 |
JPWO2006059553A1 (ja) | 2008-06-05 |
TWI276813B (en) | 2007-03-21 |
WO2006059360A1 (ja) | 2006-06-08 |
US20080059095A1 (en) | 2008-03-06 |
DE112005002693T5 (de) | 2007-10-31 |
CN101069100A (zh) | 2007-11-07 |
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