WO2006051693A1 - 金属張積層体およびその製造方法 - Google Patents

金属張積層体およびその製造方法 Download PDF

Info

Publication number
WO2006051693A1
WO2006051693A1 PCT/JP2005/019781 JP2005019781W WO2006051693A1 WO 2006051693 A1 WO2006051693 A1 WO 2006051693A1 JP 2005019781 W JP2005019781 W JP 2005019781W WO 2006051693 A1 WO2006051693 A1 WO 2006051693A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
film
liquid crystal
coefficient
clad laminate
Prior art date
Application number
PCT/JP2005/019781
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Minoru Onodera
Tadao Yoshikawa
Original Assignee
Kuraray Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuraray Co., Ltd. filed Critical Kuraray Co., Ltd.
Priority to CN2005800383953A priority Critical patent/CN101056758B/zh
Priority to US11/718,843 priority patent/US7811408B2/en
Priority to KR1020077012843A priority patent/KR101202233B1/ko
Publication of WO2006051693A1 publication Critical patent/WO2006051693A1/ja
Priority to US12/871,305 priority patent/US9096049B2/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/20Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/44Joining a heated non plastics element to a plastics element
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112Single lapped joints
    • B29C66/1122Single lap to lap joints, i.e. overlap joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/40General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45Joining of substantially the whole surface of the articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/80General aspects of machine operations or constructions and parts thereof
    • B29C66/83General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832Reciprocating joining or pressing tools
    • B29C66/8322Joining or pressing tools reciprocating along one axis
    • B29C66/83221Joining or pressing tools reciprocating along one axis cooperating reciprocating tools, each tool reciprocating along one axis
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/80General aspects of machine operations or constructions and parts thereof
    • B29C66/83General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/834General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools moving with the parts to be joined
    • B29C66/8341Roller, cylinder or drum types; Band or belt types; Ball types
    • B29C66/83411Roller, cylinder or drum types
    • B29C66/83413Roller, cylinder or drum types cooperating rollers, cylinders or drums
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/90Measuring or controlling the joining process
    • B29C66/91Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9141Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/90Measuring or controlling the joining process
    • B29C66/91Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9141Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
    • B29C66/91421Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the joining tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/90Measuring or controlling the joining process
    • B29C66/91Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9161Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux
    • B29C66/91641Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time
    • B29C66/91643Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time following a heat-time profile
    • B29C66/91645Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time following a heat-time profile by steps
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/90Measuring or controlling the joining process
    • B29C66/91Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B29C66/9192Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
    • B29C66/91921Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
    • B29C66/91931Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/90Measuring or controlling the joining process
    • B29C66/91Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B29C66/9192Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
    • B29C66/91921Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
    • B29C66/91931Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined
    • B29C66/91933Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined higher than said fusion temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/90Measuring or controlling the joining process
    • B29C66/91Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B29C66/9192Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
    • B29C66/91921Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
    • B29C66/91931Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined
    • B29C66/91935Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined lower than said fusion temperature
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/03After-treatments in the joint area
    • B29C66/034Thermal after-treatments
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
    • B29C66/7311Thermal properties
    • B29C66/73111Thermal expansion coefficient
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/735General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the extensive physical properties of the parts to be joined
    • B29C66/7352Thickness, e.g. very thin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74Joining plastics material to non-plastics material
    • B29C66/742Joining plastics material to non-plastics material to metals or their alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/90Measuring or controlling the joining process
    • B29C66/91Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00Use of unspecified macromolecular compounds as moulding material
    • B29K2101/12Thermoplastic materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0079Liquid crystals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2305/00Use of metals, their alloys or their compounds, as reinforcement
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00Layered products
    • B29L2009/003Layered products comprising a metal layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/34Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425Printed circuits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/55Liquid crystals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/732Dimensional properties
    • B32B2307/734Dimensional stability
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00Metals, their alloys or their compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0036Heat treatment
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/06Substrate layer characterised by chemical composition
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0141Liquid crystal polymer [LCP]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06Thermal details
    • H05K2201/068Thermal details wherein the coefficient of thermal expansion is important
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal

Definitions

  • the metal-clad laminate according to the present invention not only has excellent low moisture absorption, heat resistance, chemical resistance, and electrical properties derived from the thermoplastic liquid crystal polymer film, but also has excellent dimensional stability. They are useful as flexible wiring boards and circuit board materials for semiconductor mounting.
  • An object of the present invention is to provide a metal-clad laminate excellent in isotropy, appearance, adhesion to metal sheets and dimensional stability under high productivity by continuous production using a heating roll. It is to provide a manufacturing method thereof.
  • thermoplastic liquid crystal polymer film By using a thermoplastic liquid crystal polymer film, when a film is continuously stretched in the longitudinal direction of the film and pressed between heated rolls, the thermoplastic liquid crystal polymer film in which molecules are aligned in a direction perpendicular to the longitudinal direction of the film. It can be offset by the molecular orientation characteristics and the anisotropy of the thermal expansion coefficient of the thermoplastic polymer film is eliminated, so that a metal-clad laminate with excellent isotropy and appearance can be stably obtained. . Furthermore, by performing heat treatment under a specific temperature condition using this metal-clad laminate, a metal-clad laminate having excellent dimensional stability having a desired dimensional change rate with high adhesion to the metal sheet. Is obtained The In this way, a metal-clad laminate excellent in isotropy, appearance, adhesion to the metal sheet and dimensional stability can be obtained under high productivity by continuous production using a heating roll.
  • Y is a group such as 1 O—, 1 CH 2 —, 1 S—, etc.
  • thermoplastic liquid crystal polymer film used in the present invention is obtained by extruding the thermoplastic liquid crystal polymer.
  • any extrusion molding method can be used, but the well-known T-die film-forming stretching method, laminate stretching method, inflation method and the like are industrially advantageous.
  • the inflation method not only the machine axis direction of the film (longitudinal direction of the film described above) (hereinafter abbreviated as MD direction) but also the direction perpendicular to this (the lateral direction of the film described above) (hereinafter abbreviated as TD direction). ) Is also stressed to obtain a film with a balance of mechanical and thermal properties in the MD and TD directions.
  • the coefficient a is a ⁇ a ⁇ a + 2.
  • FIG. 2 is a configuration diagram showing an example of an apparatus for producing a thermoplastic liquid crystal polymer film used in a metal-clad laminate according to the present invention.
  • FIG. 2 is a thermoplastic liquid crystal polymer film used in the metal-clad laminate according to the present invention, and has a coefficient of thermal expansion a, a force in the longitudinal (longitudinal) direction and width (lateral) direction of the film described above.
  • thermoplastic liquid crystal polymer film A and copper foil (metal sheet) are laminated, the thickness of the finolem T is 25, 50, 100, 225 m, so 10 ⁇ Since T ⁇ 2503 ⁇ 4- and the thickness coefficient j8 is — 0.03, it satisfies ⁇ 0. 08 ⁇ ⁇ — 0.01 and the anisotropy coefficient ⁇ is 26, so the thermal expansion coefficient of the copper foil a force ⁇ 8 X 10 _6 cm / cm / ° C
  • thermoplastic liquid crystal polymer film ⁇ is included in the scope of the present invention.
  • p Hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid copolymer melt-extruded liquid crystal polymer with a melting point of 280 ° C, and film thicknesses of 25, 50, 100 and 225 m films were obtained, laminated with 30 ⁇ m-thick aluminum foil coated with a release agent, and thermocompression bonded at a temperature of 20 kgZcm 2 between a 260 ° C heating roll and a metathermic rubber roll, and each film thickness was The film was heat-treated for 30 seconds in a heat-treating furnace whose temperature was set so that the thermal expansion coefficient ⁇ in the MD direction was lowered to the predetermined value.
  • the coefficient of thermal expansion ⁇ in the D direction is 23.5, 23, 22 and 19.5 X 10 " 6 cm at each thickness.
  • thermoplastic liquid crystal polymer films are the key.
  • thermoplastic liquid crystal polymer film C and copper foil (metal sheet) were laminated in the same manner as in Reference Example 1 in Reference Example 3, the film thickness ⁇ was satisfied in the same manner, and the thickness coefficient j8 was 0. Therefore, it does not satisfy 0.0.08 ⁇ ⁇ ⁇ -0.01, and the anisotropy coefficient ⁇ is 18, so the thermal expansion coefficient of copper foil ⁇ force ⁇ 8 X 10 _6 cm / cm / ° C Therefore, do not satisfy ⁇ + 6 ⁇ y ⁇ a + 10
  • thermoplastic liquid crystal polymer film C does not include the thickness coefficient j8 and the anisotropy coefficient ⁇ within the scope of the present invention.
  • thermoplastic liquid crystal polymer film D and copper foil (metal sheet) were laminated in the same manner as in Reference Example 1 in Reference Example 4, the thickness T of the film was satisfied similarly, and the thickness coefficient j8 was -0. because. is 06, -0. 08 ⁇ ⁇ - meets 0.01, since the anisotropy coefficient ⁇ is a 18, the thermal expansion coefficient ⁇ force of the copper foil in Sl8 X 10 _6 cm / cm / ° C Since ⁇ + 6 ⁇ y ⁇ a + 10 Do not meet.
  • the coefficient of thermal expansion ⁇ is 19 X 10 _6 cm / cm / ° C for all thicknesses.
PCT/JP2005/019781 2004-11-10 2005-10-27 金属張積層体およびその製造方法 WO2006051693A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2005800383953A CN101056758B (zh) 2004-11-10 2005-10-27 覆金属箔层叠体及其制造方法
US11/718,843 US7811408B2 (en) 2004-11-10 2005-10-27 Metal-clad laminate and method for production thereof
KR1020077012843A KR101202233B1 (ko) 2004-11-10 2005-10-27 금속장 적층체 및 그 제조 방법
US12/871,305 US9096049B2 (en) 2004-11-10 2010-08-30 Metal-clad laminate and method for production thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004-326086 2004-11-10
JP2004326086A JP2006137011A (ja) 2004-11-10 2004-11-10 金属張積層体およびその製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US11/718,843 A-371-Of-International US7811408B2 (en) 2004-11-10 2005-10-27 Metal-clad laminate and method for production thereof
US12/871,305 Continuation US9096049B2 (en) 2004-11-10 2010-08-30 Metal-clad laminate and method for production thereof

Publications (1)

Publication Number Publication Date
WO2006051693A1 true WO2006051693A1 (ja) 2006-05-18

Family

ID=36336376

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2005/019781 WO2006051693A1 (ja) 2004-11-10 2005-10-27 金属張積層体およびその製造方法

Country Status (6)

Country Link
US (2) US7811408B2 (US20100323210A1-20101223-C00004.png)
JP (1) JP2006137011A (US20100323210A1-20101223-C00004.png)
KR (1) KR101202233B1 (US20100323210A1-20101223-C00004.png)
CN (1) CN101056758B (US20100323210A1-20101223-C00004.png)
TW (1) TWI359076B (US20100323210A1-20101223-C00004.png)
WO (1) WO2006051693A1 (US20100323210A1-20101223-C00004.png)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090183829A1 (en) * 2008-01-17 2009-07-23 Harris Corporation Method for making three-dimensional liquid crystal polymer multilayer circuit boards
US9117602B2 (en) 2008-01-17 2015-08-25 Harris Corporation Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods
WO2017154811A1 (ja) * 2016-03-08 2017-09-14 株式会社クラレ 金属張積層板の製造方法および金属張積層板

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3968068B2 (ja) * 2003-09-30 2007-08-29 株式会社クラレ 液晶ポリマーフィルムの製造方法
JP4383487B2 (ja) 2007-03-19 2009-12-16 古河電気工業株式会社 金属張積層体及び金属張積層体の製造方法
CA2741742C (en) 2008-10-29 2017-02-28 Kci Licensing, Inc. Modular, reduced-pressure, wound-closure systems and methods
JP5962298B2 (ja) * 2012-07-27 2016-08-03 住友ベークライト株式会社 硬化体の製造方法
JP6306369B2 (ja) * 2014-02-25 2018-04-04 住友化学株式会社 フィルムの製造方法
JP6632541B2 (ja) * 2014-11-07 2020-01-22 株式会社クラレ 回路基板およびその製造方法
JP2016107507A (ja) * 2014-12-05 2016-06-20 株式会社クラレ 金属張積層板およびその製造方法
WO2016170779A1 (ja) * 2015-04-20 2016-10-27 株式会社クラレ 金属張積層板の製造方法およびこれを用いた金属張積層板
KR102304510B1 (ko) 2016-03-03 2021-09-23 주식회사 쿠라레 금속 클래드 적층판 및 그 제조방법
JP6880723B2 (ja) 2016-12-27 2021-06-02 住友金属鉱山株式会社 両面金属積層板、両面金属積層板の製造方法、及びパターンの画像転写方法
KR102635625B1 (ko) * 2017-04-07 2024-02-13 주식회사 쿠라레 금속 피복 적층판 및 그 제조 방법
CN111328424B (zh) * 2017-11-15 2022-01-11 株式会社村田制作所 薄膜电容器以及金属化薄膜
JP6764049B1 (ja) * 2018-11-08 2020-09-30 株式会社クラレ 熱可塑性液晶ポリマーフィルムおよびそれを用いた回路基板
CN111196050B (zh) * 2018-11-16 2021-09-14 佳胜科技股份有限公司 液晶聚合物薄膜的加工方法及其装置
TWI705995B (zh) * 2018-11-16 2020-10-01 佳勝科技股份有限公司 液晶聚合物薄膜的加工方法及其裝置
CN113329871B (zh) * 2019-01-25 2023-07-04 电化株式会社 两面覆金属层叠体和其制造方法、绝缘膜及电子电路基板
KR102323921B1 (ko) * 2021-06-09 2021-11-08 에스케이넥실리스 주식회사 동박 제조장치
CN114361463A (zh) * 2021-12-17 2022-04-15 合肥国轩高科动力能源有限公司 一种复合集流体的制备方法
WO2023162662A1 (ja) * 2022-02-28 2023-08-31 富士フイルム株式会社 メタマテリアル用基材、メタマテリアル、積層体及びメタマテリアルの製造方法
CN117183347B (zh) * 2023-11-06 2024-02-20 紫晶电子材料(杭州)有限公司 液晶聚合物薄膜及其制造方法及柔性电路板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0542603A (ja) * 1991-04-05 1993-02-23 Kuraray Co Ltd 積層体の製造方法
JPH0890570A (ja) * 1994-09-16 1996-04-09 Hoechst Celanese Corp 液晶ポリマーフイルムの処理方法
JP2000343610A (ja) * 1999-03-29 2000-12-12 Kuraray Co Ltd 回路基板用金属張積層板とその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000044797A (ja) * 1998-04-06 2000-02-15 Kuraray Co Ltd 液晶ポリマ―フィルムと積層体及びそれらの製造方法並びに多層実装回路基板
CN1116164C (zh) * 1998-04-09 2003-07-30 可乐丽股份有限公司 使用聚合物薄膜的涂层方法和由此得到的涂层体
US6574075B2 (en) * 1998-10-22 2003-06-03 World Properties, Inc. Liquid crystal polymer disk drive suspension assembly and method of manufacture thereof
CN1181139C (zh) * 1999-11-30 2004-12-22 大塚化学株式会社 树脂组合物和挠性印刷电路板
AU2001292823A1 (en) * 2000-09-20 2002-04-02 World Properties Inc. Electrostatic deposition of high temperature, high performance thermoplastics
JP3968068B2 (ja) 2003-09-30 2007-08-29 株式会社クラレ 液晶ポリマーフィルムの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0542603A (ja) * 1991-04-05 1993-02-23 Kuraray Co Ltd 積層体の製造方法
JPH0890570A (ja) * 1994-09-16 1996-04-09 Hoechst Celanese Corp 液晶ポリマーフイルムの処理方法
JP2000343610A (ja) * 1999-03-29 2000-12-12 Kuraray Co Ltd 回路基板用金属張積層板とその製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090183829A1 (en) * 2008-01-17 2009-07-23 Harris Corporation Method for making three-dimensional liquid crystal polymer multilayer circuit boards
US8778124B2 (en) * 2008-01-17 2014-07-15 Harris Corporation Method for making three-dimensional liquid crystal polymer multilayer circuit boards
US9117602B2 (en) 2008-01-17 2015-08-25 Harris Corporation Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods
US9922783B2 (en) 2008-01-17 2018-03-20 Harris Corporation Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch
US10818448B2 (en) 2008-01-17 2020-10-27 Harris Corporation Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch including air
US11657989B2 (en) 2008-01-17 2023-05-23 Harris Corporation Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch including air
WO2017154811A1 (ja) * 2016-03-08 2017-09-14 株式会社クラレ 金属張積層板の製造方法および金属張積層板
US10807352B2 (en) 2016-03-08 2020-10-20 Kuraray Co., Ltd. Method for producing metal-clad laminate, and metal-clad laminate

Also Published As

Publication number Publication date
TW200621480A (en) 2006-07-01
US9096049B2 (en) 2015-08-04
TWI359076B (en) 2012-03-01
US20100323210A1 (en) 2010-12-23
US7811408B2 (en) 2010-10-12
KR20070085861A (ko) 2007-08-27
JP2006137011A (ja) 2006-06-01
KR101202233B1 (ko) 2012-11-16
CN101056758A (zh) 2007-10-17
US20080107833A1 (en) 2008-05-08
CN101056758B (zh) 2012-07-04

Similar Documents

Publication Publication Date Title
WO2006051693A1 (ja) 金属張積層体およびその製造方法
JP4216433B2 (ja) 回路基板用金属張積層板の製造方法
TWI616328B (zh) 熱塑性液晶聚合物薄膜及使用其之積層體及電路基板、積層體之製造方法、以及熱塑性液晶聚合物薄膜之製造方法
US8771458B2 (en) Method of making wiring boards covered by thermotropic liquid crystal polymer film
JP2000044797A (ja) 液晶ポリマ―フィルムと積層体及びそれらの製造方法並びに多層実装回路基板
EP0507332A2 (en) Laminate
JPH0890570A (ja) 液晶ポリマーフイルムの処理方法
JP5254901B2 (ja) 液晶ポリマーフィルムと積層体及びそれらの製造方法並びに多層実装回路基板
JP2016107507A (ja) 金属張積層板およびその製造方法
EP2832525A1 (en) Thermoplasitc liquid crystal polymer film and method for producing same
JP2001244630A (ja) 多層配線回路基板およびその製造方法
JP2008229995A (ja) 積層体の製造方法
JP3534405B1 (ja) 耐熱性フレキシブル積層板の製造方法およびこれにより製造される耐熱性フレキシブル積層板
JP2001079946A (ja) 片面金属張積層板の製造方法
EP1238800B1 (en) Method for producing metal laminate
WO2009157143A1 (ja) 離型フィルム
WO2020153391A1 (ja) 両面金属張積層体とその製造方法、絶縁フィルムおよび電子回路基板
JP2004358677A (ja) 積層体の製造方法
JPH11302417A (ja) ポリマーフィルムおよびその製造方法
JPH0453739A (ja) 積層板
JP2001239585A (ja) 金属張積層体およびその製造方法。
JP7182030B2 (ja) 金属張積層体の製造方法
JP2002331589A (ja) 金属張積層板の製造方法
JP2805882B2 (ja) 積層体
WO2020255871A1 (ja) 金属張積層体の製造方法

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KM KN KP KR KZ LC LK LR LS LT LU LV LY MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU LV MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 11718843

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 200580038395.3

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 1020077012843

Country of ref document: KR

122 Ep: pct application non-entry in european phase

Ref document number: 05799104

Country of ref document: EP

Kind code of ref document: A1

WWP Wipo information: published in national office

Ref document number: 11718843

Country of ref document: US