WO2006035606A1 - Icタグ付シート - Google Patents
Icタグ付シート Download PDFInfo
- Publication number
- WO2006035606A1 WO2006035606A1 PCT/JP2005/016957 JP2005016957W WO2006035606A1 WO 2006035606 A1 WO2006035606 A1 WO 2006035606A1 JP 2005016957 W JP2005016957 W JP 2005016957W WO 2006035606 A1 WO2006035606 A1 WO 2006035606A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- tag
- sheet
- release sheet
- longitudinal direction
- release
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
- G06K19/0776—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
Definitions
- the present invention relates to a sheet with an IC tag comprising a release sheet and a plurality of IC tags provided on the release sheet via an adhesive layer.
- an IC tag for exchanging data without contact with an external reader / writer
- an IC chip having a pair of electrodes also referred to as bumps
- a different electrode are electrically connected to each other.
- a pair of conductive materials hereinafter referred to as enlarged electrodes
- a pair of conductors extending in the longitudinal direction of the non-conductor sheet is provided on the non-conductor sheet, and then a pair of conductors
- a sheet-like sheet with an IC tag extending in a strip shape that can form a large number of IC tags by first mounting IC chips between the bodies and cutting them is produced. Then, the IC tag is obtained by cutting the sheet with the IC tag for each IC chip.
- the IC tag obtained from the sheet with the IC tag is sequentially mounted on the mounted body as it is, for example, a plastic sheet that is cut to form a card or a bull sheet that is cut to form a packaging bag. It is preferable in terms of production efficiency.
- a mounting method (arrangement method) of such an IC tag a mounting method using a knife edge having a tip portion protruding in an acute angle shape is known.
- the sheet with an IC tag used in this method is a release sheet and a plurality of rectangular IC tags arranged on the release sheet via an adhesive layer and extending in the width direction perpendicular to the longitudinal direction of the release sheet. It is equipped with.
- the IC tag sheet is fed to the tip of the knife edge, and the release sheet is folded back at the tip of the knife edge to peel off the IC tag along with the adhesive layer from the release sheet.
- the IC tag protrudes from the tip of the release sheet and the knife edge, and is transferred (mounted) onto the mounted body that is fed toward the tip of the knife edge, and the IC tag is mounted via the adhesive layer. Fixed on the body.
- the IC tags can be sequentially taken out from the sheet-like sheet with the IC tag, and the obtained IC tags can be sequentially mounted on the mounted body as they are.
- an IC tag (data carrier member) having a pair of enlarged electrodes and an IC chip is used as an interposer.
- This interposer functions as a contactless IC tag that exchanges data without contact with an external reader / writer by connecting a pair of enlarged electrodes to a separate antenna circuit.
- the interposer is sequentially mounted on an antenna-formed sheet in which multiple antenna circuits are formed on a non-conductive sheet, and then cut for each interposer. It is preferable in terms of production efficiency.
- a mounting method using a knife edge can be employed.
- IC tag data carrier member
- the mounted body includes an antenna-formed sheet.
- the tip of the knife edge is rounded (chamfered) for the purpose of protecting the IC chip. Therefore, when the length of the IC tag in the feeding direction is short, the IC tag cannot be peeled off from the release sheet. Even if it is peeled off, it cannot be transferred onto the mounted body because the protruding length from the tip end of the knife edge is short.
- the length of the IC tag in the feed direction must be a certain length (approximately 3 mm) or more.
- the present invention has been made in consideration of these points, and includes a release sheet and a plurality of IC tags provided on the release sheet via an adhesive layer, and the IC chip of the IC tag has a high density.
- the IC tag-attached sheet can be mounted on the mounted body more reliably and accurately by using a knife edge. is there.
- the first sheet with an IC tag is a sheet with an IC tag comprising a release sheet and a plurality of IC tags provided on the release sheet via an adhesive layer, the release sheet having Adjacent IC tag forces on the top of the release sheet are arranged overlapping each other in the longitudinal direction of the release sheet.
- the IC chips can be arranged on the IC-tagged sheet at a short pitch, and when the IC tag is peeled off from the release sheet using a knife edge, The tag can be protruded greatly from the release sheet. As a result, the IC tag-attached sheet force can be reliably and accurately mounted on the mounted body.
- the first IC tag-attached sheet may have a tapered portion at the end in the longitudinal direction of the IC tag force release sheet.
- a second sheet with an IC tag is a sheet with an IC tag comprising a release sheet and a plurality of IC tags provided on the release sheet via an adhesive layer, the IC tag It has a taper portion at the end in the longitudinal direction of the force peeling sheet.
- the IC tag can be easily peeled off from the IC-tagged sheet by using a knife edge. As a result, the IC tag can be reliably and accurately mounted on the mounted body from the sheet with the IC tag.
- an IC tag force-like force may be provided.
- the tapered portion is formed by a V-shaped apex portion, and the angle of the tapered portion is 90 ° to 170 °.
- the 1C tag extends along the width direction perpendicular to the longitudinal direction of the release sheet, and is further extended longitudinally at both ends thereof. It may be made of a shape that extends in the opposite direction along the direction.
- the IC tag may have a substantially parallelogram shape.
- the IC tag is disposed on the release sheet such that a pair of opposing sides are parallel to the longitudinal direction of the release sheet.
- the IC tag may have a substantially rectangular force, and the IC tag may be disposed obliquely with respect to the longitudinal direction of the release sheet.
- the material required for each IC tag and the IC tag without changing the arrangement pitch of the IC chip can be easily peeled off from the release sheet.
- the protruding length of the IC tag from the release sheet can be increased.
- the IC tag can be reliably and accurately mounted on the mounted body from the sheet with the IC tag without increasing the cost of the sheet with the IC tag.
- FIG. 1 is a plan view showing an embodiment of a sheet with an IC tag according to the present invention.
- FIG. 2 is a cross-sectional view taken along line II-II in FIG.
- FIG. 3 is a perspective view showing an antenna-formed sheet as an example of a mounted body on which an IC tag is mounted.
- FIG. 4 is a schematic view showing a method for producing a sheet with an IC tag.
- FIG. 5 is a perspective view showing a knife edge.
- FIG. 6 is a plan view showing a conventional sheet with an IC tag.
- FIG. 7 is a plan view showing a conventional sheet with an IC tag.
- FIG. 8 is a diagram showing a method of mounting an IC tag from a sheet with an IC tag to a mounted body using a knife edge.
- FIG. 9 is a view corresponding to FIG. 8 of the conventional sheet with an IC tag.
- FIG. 10 is a view corresponding to FIG. 8 for a conventional sheet with an IC tag.
- FIG. 11 is a plan view showing a modification of the IC tag-attached sheet.
- FIG. 12 is a plan view showing a modification of the sheet with IC tag.
- FIG. 13 is a plan view showing a modification of the IC tag-attached sheet.
- Figs. 1 to 13 are views for explaining an embodiment of a sheet with an IC tag according to the present invention.
- FIG. 1 is a plan view showing an embodiment of a sheet with an IC tag according to the present invention
- FIG. 2 is a cross-sectional view taken along the line II in FIG. 1
- FIG. FIG. 4 is a perspective view showing an antenna-formed sheet as an example of a mounted body on which a tag is mounted
- FIG. 4 is a schematic view showing a method of manufacturing a sheet with an IC tag
- FIGS. 5 to 10 are conventional IC tags.
- FIG. 11 is a view for explaining the operation of the sheet with an IC tag according to the present embodiment by comparison with the attached sheet
- FIGS. 11 to 13 are plan views showing modified examples of the sheet with the IC tag.
- the IC tag (data carrier member) 20 is not only a non-contact IC tag that exchanges data with an external reader / writer, but also the antenna circuit 44. Also includes an interposer that is used in connection.
- the IC tag-attached sheet 10 includes a release sheet 14 extending in a strip shape, and a plurality of IC tags 20 provided on the release sheet 14 via an adhesive layer 18.
- the release sheet 14 is also made of paper or PET, for example, and the surface facing the adhesive layer 18 is peeled. The peeling process is performed, for example, by applying silicon particles. Therefore, the adhesive layer 18 disposed on the release sheet 14 can be removed cleanly together with the IC tag 20 together with 14 release sheets. In this case, the IC tag 20 passes through the adhesive layer 18 to the mounted body 40 or the like. It can be affixed to a so-called seal.
- the adhesive layer 18 also has, for example, an acrylic adhesive and the like, and the IC tag 20 is detachably fixed on the release sheet 14.
- the IC tag 20 includes a non-conductive sheet 22, a pair of expanded electrodes 24 and 24 provided on the non-conductive sheet 22 and functioning as a dipole antenna, and an expanded And an IC chip 26 fixed on the electrode 24 via an adhesive material 28.
- the IC chip 26 has a pair of electrodes 26a, 26a having a flat tip, and each electrode 26a is electrically connected to different enlarged electrodes 24, 24 (FIG. 2).
- the non-conductive sheet 22 is, for example, paper or PET, and the enlarged electrode 24 is, for example, copper or aluminum.
- the enlarged electrode 24 is used as a connection member for connecting the IC chip 26 and a separate antenna circuit, which is not an antenna. Function.
- the electrode 26a of the IC chip 26 is not limited to the flat electrode shown in FIG. In this case, the electrode 26a pierces the enlarged electrode 24, so that the electrode 26a of the IC chip 26 and the enlarged electrode 24 can be reliably electrically connected.
- FIG. 2 shows an example in which the IC chip 26 and the enlarged electrode 24 are fixed with an adhesive material.
- the force is not limited to this, and the IC chip 26 and the enlarged electrode 24 may be fixed using other means such as ultrasonic bonding. Good.
- such an IC tag 20 is formed in a substantially V shape in plan view, and the width direction of the release sheet 14 (the vertical direction of the paper surface in FIG. A line extending along the longitudinal direction (also referred to as the longitudinal direction of the IC-tagged sheet 10 in FIG. 1) that is the center of the center of the tagged sheet 10 (also referred to as the width direction) is perpendicular to the width direction. Arranged so that they are sandwiched and symmetrical.
- Each IC tag 20 has a tapered portion 7 formed at one end portion in the longitudinal direction of the release sheet 14 by a V-shaped apex portion and gradually narrowing toward the tip end. ing.
- the angle of the tapered portion 7 is preferably 10 ° force and 170 °, and more preferably 90 ° force and 170 °.
- the IC tags 20 adjacent on the release sheet 14 are arranged so as to overlap each other in the longitudinal direction of the release sheet 14.
- each IC tag 20 is arranged in close proximity so that the tapered portion 7 enters the V-shaped valley portion of the adjacent IC tag 20.
- the “arrangement overlapping each other in the longitudinal direction” as used herein means that the IC tags 20 adjacent to each other (both) exist when viewed from the width direction orthogonal to the longitudinal direction of the sheet 10 with IC tag.
- the IC tags 20 are arranged so as to have the portions 16, that is, the adjacent IC tags 20 have the overlapping portions 16 that exist (together) with each other along the width direction.
- the IC chips 26 can be arranged at a short pitch along the longitudinal direction of the release sheet 14, and the length of the IC tag 20 in the longitudinal direction (release sheet or IC) along the longitudinal direction of the release sheet 14.
- the feeding direction length When the tagged sheet 10 is fed along the longitudinal direction, it is called the feeding direction length).
- the length L in the longitudinal direction of the IC tag 20 means a separation distance along the longitudinal direction of the release sheet 14 between both ends of the IC tag 20 in the longitudinal direction of the release sheet 14.
- the configurations of the IC tag-attached sheet 10 and the IC tag 20 described above are merely examples of the present invention, and are not limited thereto. Therefore, there is a change in the stacking order of the non-conductive sheet 22, the enlarged electrode 24 and the IC chip 26 on the release sheet 14, or a change to provide another layer such as a protective layer for protecting the IC chip 26. Is possible.
- a non-conductive sheet 22 extending in a strip shape is supplied and sent to the roller 52, and a conductive material 23 extending in a strip shape along the non-conductive sheet 22 is supplied and the roller Sent to 52.
- a pressure bonding type adhesive material (not shown) is applied between the non-conductor sheet 22 and the conductor 23.
- the non-conductor sheet 22 and the conductor 23 are pressure-bonded by the roller 52, whereby the non-conductor sheet 22 and the conductor 23 are bonded and fixed to each other, and the conductor 23 is placed on the non-conductor sheet 22. Is laminated.
- the conductor 23 is cut by the cutter 54 at the center in the width direction along the feed direction.
- the slit 12 along the feed direction is provided in the conductor 23 at the center in the width direction, and the conductor 23 is divided into a pair.
- the conductor 23 is divided so that the width of the slit 12 is smaller than the distance between the electrodes 26a and 26a of the IC chip 26.
- the cutting by the cutter 54 is a so-called half-cut, and only the conductor 23 that does not cut the entire thickness of the conductor 23 and the non-conductor sheet 22 is divided, and the non-conductor sheet 22 is slightly cut but not divided.
- the adhesive material supply device 56 also configured with a dispenser or a screen printer or the like is used to bond an anisotropic conductive adhesive or a conductive adhesive.
- Material 28 is supplied.
- the IC chip 26 having a pair of electrodes 26a and 26a is sequentially mounted on the portion where the adhesive material 28 is applied. In this case, the IC chip 26 is positioned on the conductor 23 after the electrodes 26 a and 26 a are positioned so as to face different conductors 23.
- the fixing device 58 fixes the IC chip 26 disposed on the conductor 23 on the conductor 23, and the conductors separated into a pair with the electrodes 26a and 26a of the IC chip 26. 23 and 23 are electrically connected.
- the fixing device 58 includes a crimping machine, a thermocompression bonding machine, an ultrasonic bonding machine, or the like according to the type of the adhesive material 28 used.
- the release sheet 14 is fed to the side of the non-conductive sheet 22 that does not face the conductor 23. During this time, a pressure bonding type adhesive material (not shown) is applied between the release sheet 14 and the non-conductive sheet 22. Thereafter, the release sheet 14, the non-conductive sheet 22 and the conductor 23 are pressure-bonded by the roller 60, whereby the release sheet 14 and the non-conductive sheet 22 are bonded to each other, and the release sheet 14 is non-conductive. Laminated on the sheet 22.
- the roller 60 preferably has an annular recess 62 at a portion corresponding to the IC chip 26. By passing through the recess 62 when the IC chip 26 passes between the rollers 60, it is possible to prevent the IC chip 26 from being pressed by the roller 60 and being damaged.
- the adhesive layer 18 described above is formed of this adhesive material.
- the non-conductive sheet 22 and the conductive body 23 are sequentially half-cut for each IC chip 26 by the IC tag forming device 64 that also includes a punching machine and a cutter force. That is, a cut 11 is formed by the IC tag forming device 64. The cut 11 penetrates through the non-conductive sheet 22, the conductor 23, and the adhesive layer 18 and up to the release sheet 14 so as not to penetrate the release sheet 14. Enter ( Figure 2).
- the IC tag 20 having the non-conductive sheet 22, the pair of enlarged electrodes 24, 24 formed from the conductor 23, and the IC chip 26 connected to the enlarged electrode 24 is transformed into the shape of the IC tag 20.
- the layers are sequentially formed along the longitudinal direction on a single release sheet 14 extending in a band shape.
- the IC tag forming device 64 forms the V-shaped IC tag 20 described above.
- various shapes can be obtained by changing the shape of the punching blade.
- IC tag Can be formed on the release sheet 14.
- the non-conductive sheet 22 and the release sheet 14 extending in a belt shape are all processed while being fed in one direction, that is, the longitudinal direction thereof, and the IC tag-attached sheet 10 is manufactured. Therefore, if the IC chip 26 can be arranged at a short pitch along the longitudinal direction of the IC tag-attached sheet 10 (the feeding direction during manufacture), the IC tag 20 for mounting one IC tag 20 is attached. The amount of movement of the seat 10 is reduced. For this reason, the IC tag 20 can be manufactured in a shorter time, and the yield factor of the IC tag 20 (the yield of the IC tag 20) can be improved by reducing the cause of the positional deviation. As a result, it is possible to reduce the manufacturing cost of the IC tag 20 by dramatically improving the production efficiency as well as suppressing the material cost of the IC tag 20 per unit.
- a single conductor 23 extending in a strip shape is pressed and laminated on the non-conductor sheet 22 and then laminated, and then the conductor 23 is divided into a pair, whereby a pair of conductors 23 is formed on the non-conductor sheet 22.
- the force shown in the example of forming the conductors 23 and 23 is not limited to this, and the conductors 23 and 23 extending in a pair of bands separated in advance may be changed to be laminated on the non-conductor sheet 22.
- the conductor 23 may be provided on the non-conductor sheet 22 by etching, conductive ink printing, foil transfer or punching.
- a plurality of pairs of conductors 23 provided on the non-conductive sheet 22 and spaced apart in the width direction and arranged along the longitudinal direction of the non-conductive sheet 22 are non-conductive sheet 22.
- the enlarged electrode 24 of the IC tag 10 may be formed from such a conductor 23.
- release sheet 14 is a non-conductor.
- a protective layer for protecting the IC chip 26 may be further provided.
- the notch 11 formed by the IC tag forming device 64 penetrates the protective layer, and the protective layer from which the portion corresponding to the IC tag 20 is extracted is recovered as the residue 38.
- the release sheet 14 may be laminated on the side facing the conductor 23 on the non-conductor sheet 22. In this case, the half cut by the IC tag forming device 64 is also performed on the non-conductive sheet 22 side, that is, the lower side of the paper surface in FIG.
- FIGS. 5 to 10 the operation when the IC tag 20 is mounted (arranged) from the IC tag sheet 10 shown in FIG. 1 to the mounted body 40 using the knife edge 70 will be described.
- the IC tag 20 on the mounted body 40 from the conventional sheet 30a, 30b with the IC tag in which the IC tags 31a, 31b having a rectangular force extending along the width direction of the release sheet 14 are arranged This will be explained in comparison with.
- FIG. 6 and FIG. 7 are plan views showing a conventional sheet with an IC tag
- FIG. 6 shows an arrangement of IC chips 26 at the same arrangement pitch as the IC tag-attached sheet 10 shown in FIG.
- Fig. 7 shows the IC tag sheet 30a.
- Fig. 7 shows the IC tag 20 of the IC tag sheet 10 shown in Fig. 1 and the longitudinal length (feed direction length) along the longitudinal direction (feed direction to the knife edge 70).
- FIG. 5 is a perspective view showing the knife edge 70
- FIGS. 8 to 10 show the IC tag-attached sheets 10, 30a, 30b shown in FIGS. 1, 6, and 7 on the knife edge 70, respectively. It is a side view which shows the case where it sends in.
- the mounted body 40 on which the IC tags 20, 31a, 3 lb are mounted is, for example, a plastic sheet that is cut to form a force sheet, a vinyl sheet that is cut to form a packaging bag, or the like. It is.
- the IC tags 20, 31a, 31b may be used as an interposer.
- the second non-conductive sheet 42 and the second non-conductive sheet 42 are arranged on the different non-conductive electrodes 24 and 24, respectively.
- an antenna-formed sheet 41 comprising a plurality of antenna circuits 44 having a pair of contacts 44a, 44a connected to each other.
- the knife edge 70 has a tip 72 projecting at an acute angle, and the tip 72 And side surfaces 74 for guiding the C-tagged sheets 10, 30a, 30b.
- Such a knife edge 70 folds the release sheet 14 at the front end portion 72, whereby the IC tags 20, 31a, 31b together with the adhesive layer 18 from the release sheet 14, that is, a so-called sealed IC tag. Peel 20, 31a, 3 lb.
- the sealed IC tag 20, 31a, 3 lb protrudes from the tip 72 of the knife edge 70 and is mounted on the mounting body 40 fed toward the tip 72 of the knife edge 70 via the adhesive layer 18. (Reprinted).
- Such a mounting method is simple and easy, has good mounting efficiency, and has the advantage that the manufacturing cost and maintenance cost of the mounting apparatus can be kept low.
- the tip 72 of the knife edge 70 is provided with a local roundness in order to prevent the IC chip 26 from being broken by being broken. Therefore, in the IC tag sheet 30a having the rectangular IC tag 3 la that is elongated along the width direction of the release sheet 14, the IC tag 31a is fed in the feed direction length (longitudinal length) L1 to the IC chip 26. The IC tag 31a fed to the tip 72 of the knife edge 70 does not peel from the release sheet 14 or even protrudes greatly from the tip 72 of the knife edge 70. I can't. As a result, as shown in FIG. 9, it is sent around the tip 72 of the knife edge 70 while being adhered to the release sheet 14 that is mounted (reprinted) on the mounted body 40.
- the sheet 10 with an IC tag according to the present embodiment shown in FIG. 1 is adjusted so that the tapered portion 7 of the IC tag 20 is on the front side, that is, the left side in FIG.
- the case of feeding to the tip 72 of the die 70 will be described.
- the IC tag 20 on the IC tag-attached sheet 10 also has a V-shaped force.
- the IC tag 20 is arranged on the release sheet 14 so that the V-shaped apex portion enters the V-shaped valley portion of the adjacent IC tag 20. Therefore, while arranging the IC chips 26 on the sheet 10 with the IC tag at a short pitch, each IC tag 20 along the longitudinal direction of the release sheet 14, that is, the feeding direction to the knife edge 70 of the sheet 10 with the IC tag. Length in feed direction (length in longitudinal direction) L can be increased.
- the IC chip 26 on the IC tag-attached sheet 10 according to the present embodiment shown in FIG. 1 is arranged at the same pitch as the arrangement pitch of the IC chips 26 in the IC tag-attached sheet 30a shown in FIG.
- the area of the IC tag shown in FIG. 1 in plan view can be made the same as the area of the IC tag 31a shown in FIG.
- the feed direction length L of the IC tag 20 shown in FIG. 1 is almost twice the feed direction length L1 of the IC tag 31a shown in FIG. 6, and can be made longer. It is. Therefore, when the IC tag 20 shown in FIG.
- the IC tag 20 is more reliably peeled off from the release sheet 14 and greatly protrudes from the tip end portion 72. As a result, as shown in FIG. 8, the IC tag 20 can be mounted (reprinted) reliably and accurately by the mounted body 40.
- the protruding length of the IC tag 20 from the tip 72 of the knife edge 70 is the same in the feed direction length L2 and the area twice as shown in FIG.
- the sheet 30b with the IC tag on which is placed is fed to the tip 72 of the knife edge 70 (Fig. 10), it can be brought close to the protruding length of the 3 lb IC tag.
- the IC tag 20 of the IC tag-attached sheet 10 has the tapered portion 7 at the end in the longitudinal direction.
- the tapered portion 7 can be a base point when the IC tag 20 is peeled off by the release sheet 14.
- the IC tag 20 is easily peeled from the release sheet 14 when the release sheet 14 is folded at the tip 72 of the knife edge 70. be able to. Therefore, the IC tag 20 is not peeled from the release sheet 14 and can be prevented from being sent around the tip 72 while being adhered to the release sheet 14.
- the angle of the tapered portion 7 of the IC tag 20 is very preferably in the range of 90 ° to 170 °. In this range, the tapered portion 7 has a certain rigidity and is more easily peeled off from the release sheet 14.
- the force that has been shown so far to send the IC tag sheet 10 to the knife edge 70 so that the tapered portion 7 of the IC tag 20 of the IC tag sheet 10 is on the front side is not limited to this.
- the tapered portion 7 of the tag 70 may be on the rear side, that is, the sheet 10 with the IC tag 10 may be fed into the knife edge 70 with the right side of the paper in FIG. 1 as the front side. in this case
- the protrusion length when the IC tag 20 is peeled off from the release sheet 14 is not changed.
- the leading end of the IC tag 20 in the feed direction is formed of a pair of tapered portions 8, 8 that gradually taper. For this reason, as in the case where the left side in FIG. 1 is sent as the front side, the IC tag 20 is peeled off from the release sheet 14 or immediately, and the peeled IC tag 20 protrudes greatly from the release sheet 14.
- the IC tag 20 since the IC tag 20 has the tapered portion 7, the IC tag 20 can be easily peeled from the release sheet 14. . Further, adjacent IC tags 20 are arranged so as to have an overlapping portion 16 in the longitudinal direction, and the longitudinal length L of the IC tag 20 along the longitudinal direction of the release sheet 14 is increased. Therefore, when the IC tag 20 is peeled off from the release sheet 14, the IC tag 20 can be protruded greatly from the release sheet 14.
- the IC chips 26 of the IC tag 20 are arranged at a high density on the sheet 10 with the IC tag, and the IC tag 20 on the sheet 10 with the IC tag is mounted by using the knife edge 70. More reliable and accurate mounting is possible.
- the mounting method using the knife edge 70 can be applied to the sheet 10 with the IC tag in which the small IC tag 20 is arranged with a short pitch.
- the material cost per IC tag 20 can be reduced, and the manufacturing cost of the IC tag sheet 10 can be reduced by improving the production efficiency of the IC tag sheet 10. Can be reduced. Further, in response to the miniaturization of the IC chip 26, the IC tag 20 of the IC tag-attached sheet 10 can be further miniaturized, and the IC tag-added sheet 10 having the miniaturized IC tag 20 can be reduced. The mounting method using a knife edge can be applied.
- the IC chips 26 are arranged at a short pitch on the sheet 10 with an IC tag, even when the IC tag 20 is mounted from the sheet 10 with the IC tag using the knife edge 70. In order to mount one IC tag 20, the amount of sheet 10 with IC tag fed is small Disappear. For this reason, the IC tag 20 can be mounted in a shorter time, and the cause of the positional deviation can be reduced and the mounting yield can be improved. As a result, when the IC tag-attached sheet 10 according to the present embodiment is used, the mounting cost of the IC tag 20 can be reduced.
- IC tag-attached sheets 10a, 10b, and 10c shown in FIGS. 11 to 13 are different from the above-described IC tag-attached sheet 10 only in the shape of the IC tag, and the other configurations are substantially the same. is there. 11 to 13, the same parts as those of the IC tag-attached sheet 10 described above are denoted by the same reference numerals and detailed description thereof is omitted.
- the IC tag 20a of the IC tag-attached sheet 10a shown in FIG. 11 has a substantially parallelogram shape in plan view, and a pair of sides (one set of opposite sides) forming the outer edge of the IC tag 20a is the length of the release sheet 14. It is disposed on the release sheet 14 so as to be substantially parallel to the hand direction.
- the IC tag 20b of the IC tag-attached sheet 10b shown in FIG. 12 has a substantially rectangular shape in a plan view, and forms the outer edge of the IC tag 20b!
- the side of the shift is parallel to the longitudinal direction of the release sheet 14. In other words, it is arranged obliquely with respect to the release sheet 14.
- the IC tags 20a and 20b both have tapered portions 7a and 7b at end portions in the longitudinal direction of the release sheet 14, and are adjacent to each other.
- the IC tags 20a, 20b in contact with each other have overlapping portions 16a, 16b in the longitudinal direction of the release sheet 14, and are arranged so as to overlap each other.
- the IC tag-attached sheet 10 (FIG. 1) in which the V-shaped IC tag 20 described above is arranged. ) Can be obtained in the same manner as when the knife edge 70 is fed.
- the IC tag 20c of the IC tag-attached sheet 10c shown in FIG. 13 extends along the width direction of the release sheet 14, and further extends in opposite directions along the longitudinal direction at both ends thereof. Yes.
- the adjacent IC tags 20c on the release sheet 14 are arranged in the longitudinal direction of the release sheet 14 so as to overlap each other with an overlapping portion 16c. This Therefore, the IC chips 26 can be arranged at a high density on the IC tag-attached sheet 10c, and the material cost required for each IC tag 20c can be reduced.
- IC tag 20c extends along the longitudinal direction of release sheet 14. That is, the IC tag 20c is arranged so that the longitudinal direction of the IC tag 20c itself coincides with the longitudinal direction of the release sheet. Therefore, the IC tag 20c that has been fed to the front end portion 72 of the knife edge 70 and peeled off from the release sheet 14 projects extremely greatly from the front end portion 72 of the knife edge 70. As a result, the size of each IC tag 20c can be further reduced as much as possible so that the IC tag 20c can be more reliably and accurately mounted from the IC tag sheet 10 to the mounted body 40.
- the arrangement pitch of the IC chips 26 along the longitudinal direction on the IC tag-attached sheet 10c can be shortened. Since the IC tag 20c extends along the longitudinal direction of the release sheet 14, the width direction length of the release sheet 14 is short. For these reasons, the IC chips 26 can be arranged with a short pitch and a high density on the sheet 1 Oc with an IC tag. As a result, the material cost required for each IC tag 20c can be greatly reduced, and the IC tag can be manufactured at a lower cost by improving the production efficiency of the sheet with the IC tag. .
- a taper portion that gradually tapers may be provided at the tip in the feed direction to the knife edge 70. Is possible.
- the IC tag 20c can be easily peeled from the release sheet 14.
- the IC tag-attached sheets 10a, 10b, and 10c shown in FIGS. 11 to 13 are the IC tags described with reference to FIG. 4 by changing the shape of the blade of the IC tag forming device 64 described above.
- the attachment sheet 10 can be manufactured by the same method.
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004284116A JP4743583B2 (ja) | 2004-09-29 | 2004-09-29 | Icタグ付シート |
JP2004-284116 | 2004-09-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006035606A1 true WO2006035606A1 (ja) | 2006-04-06 |
Family
ID=36118758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/016957 WO2006035606A1 (ja) | 2004-09-29 | 2005-09-14 | Icタグ付シート |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4743583B2 (ja) |
TW (1) | TW200634649A (ja) |
WO (1) | WO2006035606A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007121114A2 (en) * | 2006-04-10 | 2007-10-25 | Checkpoint Systems, Inc. | Transfer tape strap process |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5200557B2 (ja) * | 2008-01-25 | 2013-06-05 | 株式会社村田製作所 | 無線icデバイスの製造方法 |
JP2013168577A (ja) * | 2012-02-16 | 2013-08-29 | Elpida Memory Inc | 半導体装置の製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07271938A (ja) * | 1994-03-29 | 1995-10-20 | Sony Corp | 情報カード |
JP2003022426A (ja) * | 2001-07-06 | 2003-01-24 | Oji Paper Co Ltd | 情報記憶媒体 |
JP2005063201A (ja) * | 2003-08-14 | 2005-03-10 | Dainippon Printing Co Ltd | 非接触icタグ付シートの製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04311443A (ja) * | 1991-03-29 | 1992-11-04 | Kawasaki Steel Corp | 粘着シート片付きテープと粘着シート片の剥離方法 |
JP3595159B2 (ja) * | 1998-03-19 | 2004-12-02 | 株式会社東芝 | Icカードの製造方法 |
JP2000200328A (ja) * | 1998-10-01 | 2000-07-18 | Hitachi Maxell Ltd | 半導体装置 |
JP2002187223A (ja) * | 2000-12-22 | 2002-07-02 | Sato Corp | Icインレット仮着帯の製造方法およびic内蔵表示札の製造方法 |
US6951596B2 (en) * | 2002-01-18 | 2005-10-04 | Avery Dennison Corporation | RFID label technique |
JP4882167B2 (ja) * | 2001-06-18 | 2012-02-22 | 大日本印刷株式会社 | 非接触icチップ付きカード一体型フォーム |
JP2003030615A (ja) * | 2001-07-16 | 2003-01-31 | Oji Paper Co Ltd | タ グ |
JP2004231274A (ja) * | 2003-01-31 | 2004-08-19 | Sato Corp | 剥離装置 |
-
2004
- 2004-09-29 JP JP2004284116A patent/JP4743583B2/ja not_active Expired - Fee Related
-
2005
- 2005-09-14 WO PCT/JP2005/016957 patent/WO2006035606A1/ja active Application Filing
- 2005-09-22 TW TW094132894A patent/TW200634649A/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07271938A (ja) * | 1994-03-29 | 1995-10-20 | Sony Corp | 情報カード |
JP2003022426A (ja) * | 2001-07-06 | 2003-01-24 | Oji Paper Co Ltd | 情報記憶媒体 |
JP2005063201A (ja) * | 2003-08-14 | 2005-03-10 | Dainippon Printing Co Ltd | 非接触icタグ付シートの製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007121114A2 (en) * | 2006-04-10 | 2007-10-25 | Checkpoint Systems, Inc. | Transfer tape strap process |
WO2007121114A3 (en) * | 2006-04-10 | 2007-12-13 | Checkpoint Systems Inc | Transfer tape strap process |
US7646304B2 (en) | 2006-04-10 | 2010-01-12 | Checkpoint Systems, Inc. | Transfer tape strap process |
US7884726B2 (en) | 2006-04-10 | 2011-02-08 | Checkpoint Systems, Inc. | Transfer tape strap process |
Also Published As
Publication number | Publication date |
---|---|
JP4743583B2 (ja) | 2011-08-10 |
TW200634649A (en) | 2006-10-01 |
TWI360079B (ja) | 2012-03-11 |
JP2006099375A (ja) | 2006-04-13 |
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