WO2006033380A1 - 封着材組成物、それを用いた気密容器および電子部品のオーバーコートならびにそれらの製造方法 - Google Patents
封着材組成物、それを用いた気密容器および電子部品のオーバーコートならびにそれらの製造方法 Download PDFInfo
- Publication number
- WO2006033380A1 WO2006033380A1 PCT/JP2005/017449 JP2005017449W WO2006033380A1 WO 2006033380 A1 WO2006033380 A1 WO 2006033380A1 JP 2005017449 W JP2005017449 W JP 2005017449W WO 2006033380 A1 WO2006033380 A1 WO 2006033380A1
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- WIPO (PCT)
- Prior art keywords
- sealing material
- silicone resin
- material composition
- getter agent
- refractory filler
- Prior art date
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- 229910052839 forsterite Inorganic materials 0.000 description 1
- 239000006232 furnace black Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 description 1
- 229910001412 inorganic anion Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-M isovalerate Chemical compound CC(C)CC([O-])=O GWYFCOCPABKNJV-UHFFFAOYSA-M 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 229910001425 magnesium ion Inorganic materials 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- 229930014626 natural product Natural products 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000002891 organic anions Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000005365 phosphate glass Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000004224 protection Effects 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- HUAUNKAZQWMVFY-UHFFFAOYSA-M sodium;oxocalcium;hydroxide Chemical compound [OH-].[Na+].[Ca]=O HUAUNKAZQWMVFY-UHFFFAOYSA-M 0.000 description 1
- 239000008247 solid mixture Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000006234 thermal black Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- DWAWYEUJUWLESO-UHFFFAOYSA-N trichloromethylsilane Chemical compound [SiH3]C(Cl)(Cl)Cl DWAWYEUJUWLESO-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
- 229910000500 β-quartz Inorganic materials 0.000 description 1
- 229910052644 β-spodumene Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
- C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
- B01J20/02—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
- B01J20/04—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising compounds of alkali metals, alkaline earth metals or magnesium
- B01J20/041—Oxides or hydroxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
- B01J20/02—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
- B01J20/06—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising oxides or hydroxides of metals not provided for in group B01J20/04
- B01J20/08—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising oxides or hydroxides of metals not provided for in group B01J20/04 comprising aluminium oxide or hydroxide; comprising bauxite
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
- B01J20/02—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
- B01J20/10—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising silica or silicate
- B01J20/103—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising silica or silicate comprising silica
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
- B01J20/28—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties
- B01J20/28002—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties characterised by their physical properties
- B01J20/28004—Sorbent size or size distribution, e.g. particle size
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
- B01J20/28—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties
- B01J20/28054—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties characterised by their surface properties or porosity
- B01J20/28057—Surface area, e.g. B.E.T specific surface area
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
- B01J20/30—Processes for preparing, regenerating, or reactivating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J17/00—Gas-filled discharge tubes with solid cathode
- H01J17/02—Details
- H01J17/18—Seals between parts of vessels; Seals for leading-in conductors; Leading-in conductors
- H01J17/183—Seals between parts of vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/86—Vessels; Containers; Vacuum locks
- H01J29/863—Vessels or containers characterised by the material thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/26—Sealing together parts of vessels
- H01J9/261—Sealing together parts of vessels the vessel being for a flat panel display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/26—Sealing together parts of vessels
- H01J9/265—Sealing together parts of vessels specially adapted for gas-discharge tubes or lamps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2217/00—Gas-filled discharge tubes
- H01J2217/38—Cold-cathode tubes
- H01J2217/49—Display panels, e.g. not making use of alternating current
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2329/00—Electron emission display panels, e.g. field emission display panels
Definitions
- the present invention relates to a sealing material composition having excellent characteristics as a sealing material for an airtight container or an overcoat material for an electronic component.
- a sealing material composition of the present invention water remaining as a reaction product during heat curing is removed, so that bubbles remaining in the sealing portion are greatly reduced. For this reason, the workability at the time of sealing is excellent, and the airtight reliability of the sealed portion and the reliability of the adhesive strength are excellent.
- the present invention also relates to an airtight container hermetically sealed using the sealing material composition and a method for producing the airtight container.
- the present invention also relates to an electronic component provided with an overcoat formed using the sealing material composition and a method for forming the overcoat.
- Plasma display panels PDPs
- cathode ray tubes CRTs
- fluorescent lamps are manufactured using airtight containers that are hermetically sealed between glass, ceramic, or metal members.
- Display tubes VFD
- field emission displays FED
- surface-conduction electron emission displays SED
- organic electroluminescence (EL) displays etc.
- flat fluorescent screens used as backlights or lighting for liquid crystal displays, Piezoelectric vibrators, laser diodes (LDs), light emitting diodes (LEDs), multilayer glass, micromachines (MEMS), etc. are known!
- sealing materials or adhesives used to hermetically seal the joint surfaces include low melting point glass frit, inorganic sealing materials such as low melting point metals, and organic materials such as epoxy. Sealing material is used.
- a lead type glass frit to which lead is added in the form of acid lead or the like in order to lower the melting point of the glass is most common. If such products sealed with lead-based glass frit are disposed of outdoors and exposed to wind and rain, Lead may dissolve and pollute the environment. For this reason, development of a sealing material that does not use lead that is harmful to the human body has been required.
- phosphate glass-based glass frit which is known as another low-melting-point glass frit, has a large deterioration in properties due to water absorption and has many problems in actual use.
- tempered glass when the hermetic container is a double-glazed glass, tempered glass may be used to increase the strength.
- the tempered glass has a residual stress layer formed near the glass surface by heat treatment or the like. In sealing using a conventional low melting point glass frit, the residual stress applied to the tempered glass may be reduced or lost due to the tempered glass being exposed to a high temperature.
- the low melting point metal does not contain harmful substances! /, And is superior to the low melting point glass frit in that it can be sealed at low temperatures, but it has sufficient adhesive strength to the sealed object. There are problems such as lack of price and higher price than other sealing materials.
- organic sealing materials such as epoxies are equivalent to low melting point glass frit and low melting point metal in that they do not contain harmful substances, can be sealed at low temperatures, and have high adhesive strength and cost. Power that is at a level, or superior to these other sealing materials Heat resistance and UV resistance are inferior to these, and there is a problem with long-term reliability. Furthermore, when high airtightness is required, the required airtightness cannot be fully satisfied.
- this silicone-based sealing material generates water as a reaction product during heat curing.
- chip resistors or overcoats formed on these electronic components may be used.
- a surface acoustic wave device is known.
- the overcoat is formed by melting an inorganic overcoat material such as a low-melting glass frit or a low-melting metal or an organic overcoat material such as an epoxy, or by dissolving it in a solvent as desired. It is formed by applying to the site and then curing. Here, if bubbles remain in the overcoat, the characteristics of the electronic component, such as electrical insulation, are adversely affected.
- the overcoat is required to have excellent electrical insulation, waterproofness, moisture proofing, heat resistance, etc.
- the formation of an overcoat on an electronic component is performed by mounting the electronic component on a substrate.
- the electronic components are used for devices containing heat-sensitive components such as displays, flat fluorescent screens, organic EL, FED, or SED. In this case, it is preferable that the overcoat is formed on the electronic component at a low temperature of 300 ° C or lower.
- Patent Document 1 Japanese Patent Laid-Open No. 2001-207152
- the present invention is a sealing material for hermetically sealing a joint surface between glass, ceramic or metal substrates, does not contain harmful components such as lead, and has a temperature of 300 ° C or lower. It can be sealed at temperature and has excellent adhesion strength to glass, ceramic and metal. Especially, the water generated as a reaction product during heat curing is removed, so that bubbles remaining in the sealed part are removed.
- An object of the present invention is to provide a sealing material composition that is greatly reduced, and has excellent workability at the time of sealing, as well as airtight reliability of the sealing portion and excellent reliability of adhesive strength.
- Another object of the present invention is to provide an airtight container hermetically sealed using the sealing material composition and a method for producing the airtight container. Furthermore, an object of the present invention is to provide an electronic component having an overcoat formed using the composition, and a method for forming an overcoat on the electronic component.
- the present invention has been made to achieve the above object.
- the present invention contains a curable methylphenol silicone resin, a refractory filler, and a getter agent, and is based on the total of the curable methylphenyl silicone resin, refractory filler, and getter agent.
- the amount of the getter agent is 0.1 to 40% by mass, and the amount of the refractory filler is 10 to 80% by mass with respect to the total of the curable methylphenol silicone resin, the refractory filler and the getter agent.
- % Providing a sealing material composition characterized by
- the amount of the getter agent is 0.5 to 0.5 with respect to the total of the curable methylphenyl silicone resin, the refractory filler and the getter agent. 40% quality is preferred!
- the getter agent is a hydrated talcite compound, zeolite, porous silica, active It is preferable that the group power consisting of alumina, calcium oxide, magnesium oxide, silica gel and alumino silica gel is also selected. As the getter agent
- More preferred is a mixture of talcite and iodide.
- the getter agent preferably has a particle size of 0.05 ⁇ m to 20 ⁇ m and a BET specific surface area of 250 m 2 Zg or less.
- the methylphenol silicone resin preferably has a molar ratio of the phenyl group to the methyl group of 0.1 to 1.2.
- the refractory filler is preferably spherical silica or spherical alumina having an average particle diameter of 0.1 to 20 m.
- the sealing material composition of the present invention further comprises 3% by mass or less of the ultraviolet absorber based on the total of the curable methyl-fell silicone resin, the refractory filler, the getter agent, and the ultraviolet absorber. May be included.
- the present invention also provides an airtight container hermetically sealed using the sealing material composition of the present invention.
- the present invention provides an electronic component provided with an overcoat formed using the sealing material composition of the present invention.
- the sealing material composition is applied to at least one joint surface between the substrates constituting the hermetic container, the sealing material composition is heat-cured to form the joint surface.
- the sealing material composition contains a curable methylphenyl silicone resin, a refractory filler, and a getter agent.
- the amount of the getter agent with respect to the total of the curable methylphenyl silicone resin, the refractory filler and the getter agent is 0.1 to 45% by mass
- the amount of the refractory filler with respect to the total of the curable methylphenyl silicone resin, the refractory filler and the getter agent is 10 to 80% by mass
- the getter agent is at least one selected from the group force consisting of hydrated talcite compounds, zeolites, porous silica, activated alumina, calcium oxide, magnesium oxide, silica gel and alumino silica gel,
- the getter agent has a particle size of 0.05 ⁇ m to 20 ⁇ m and a BET specific surface area of 250 m 2 Zg or less,
- the methylphenol silicone resin has a molar ratio of the phenyl group to the methyl group of 0.1 to 1.2,
- the refractory filler is a spherical silica or spherical alumina having an average particle size of 0.1 to 20 / ⁇ ⁇ , and provides a method for producing an airtight container.
- the present invention is a method of forming an overcoat on the electronic component by applying the sealing material composition on the surface of the electronic component and then heat-curing the sealing material composition.
- the sealing material composition contains a curable methylphenyl silicone resin, a refractory filler, and a getter agent.
- the amount of the getter agent with respect to the total of the curable methylphenyl silicone resin, the refractory filler and the getter agent is 0.1 to 45% by mass
- the amount of the refractory filler with respect to the total of the curable methylphenyl silicone resin, the refractory filler and the getter agent is 10 to 80% by mass
- the getter agent is at least one selected from the group force consisting of hydrated talcite compounds, zeolites, porous silica, activated alumina, calcium oxide, magnesium oxide, silica gel and alumino silica gel,
- the getter agent has a particle size of 0.05 ⁇ m to 20 ⁇ m and a BET specific surface area of 250 m 2 Zg or less,
- the methylphenol silicone resin has a molar ratio of the phenyl group to the methyl group of 0.1 to 1.2,
- the refractory filler is a spherical silica or spherical alumina having an average particle size of 0.1 to 20 / ⁇ ⁇ , and provides a method for forming an overcoat on an electronic component.
- the invention's effect is a spherical silica or spherical alumina having an average particle size of 0.1 to 20 / ⁇ ⁇ , and provides a method for forming an overcoat on an electronic component.
- the sealing material composition of the present invention containing a curable methyl-fell silicone resin, a refractory filler and a getter agent uses a conventional lead-based glass frit (400 ° C to 550 ° C). Sealing is possible at a much lower temperature (130 ° C. to 300 ° C.) than in the case of the above. As a result, the components used in the hermetic container, such as a fluorescent lamp used in a display or a flat fluorescent screen The risk of thermal degradation of light emitters, organic EL devices, field emission devices used in FEDs and SEDs, etc. during sealing is reduced.
- the hermetic container is a double-glazed glass
- generation of cracks at the sealing portion is prevented.
- tempered glass is used for the double-glazed glass, the risk of reducing the strength of the glass due to reduction or loss of residual stress in the tempered glass due to heating during sealing is eliminated.
- the sealing material composition of the present invention is excellent in the adhesive strength of the sealing part and the airtightness of the sealing part, and is sealed with a conventional lead-based glass frit.
- the sealing material composition of the present invention which is not inferior even when compared, does not contain lead, which has been pointed out to be harmful, and therefore has excellent environmental properties.
- the sealing material composition of the present invention removes water generated as a reaction product during heat curing, the amount of bubbles remaining in the sealing part is greatly reduced. As a result, the workability at the time of sealing is excellent, and the appearance, hermetic reliability, and adhesive strength reliability of the sealed portion are excellent.
- the sealing material composition of the present invention containing an ultraviolet absorber is excellent in ultraviolet resistance, particularly vacuum ultraviolet resistance to ultraviolet light having a wavelength in the vacuum ultraviolet region, and has been exposed to ultraviolet irradiation for a long time.
- ultraviolet resistance particularly vacuum ultraviolet resistance to ultraviolet light having a wavelength in the vacuum ultraviolet region
- the adhesive strength, hermeticity, and moisture resistance of the sealing part will not deteriorate.
- An airtight container hermetically sealed using the sealing material composition of the present invention is excellent in the adhesive strength and airtightness of the sealing portion, and thus has excellent reliability.
- the sealing of the hermetic container means that the joint surface between the substrates constituting the hermetic container is hermetically sealed. Means that.
- an electronic component having an overcoat formed using the sealing material composition of the present invention is excellent in electrical insulation, waterproofness, moisture resistance, heat resistance, etc.
- the child component can exhibit desired performance over a long period of time.
- the amount of bubbles remaining in the overcoat is greatly reduced, there is no possibility of adversely affecting the properties such as electrical insulation.
- the airtight container can be manufactured stably.
- the sealing temperature of the hermetic container is greatly reduced, resulting in reduced energy consumption and work time, saving energy and reducing costs.
- FIGs. 1 (a) and 1 (b) are diagrams showing parts of a test sample used for leakage evaluation.
- FIG. 2 is a partial cross-sectional view of a test sample used for evaluating leakiness in an assembled state.
- FIG. 3 is a conceptual diagram of a test sample used for adhesion evaluation.
- the sealing material composition of the present invention contains a curable methylphenyl silicone resin, a refractory filler and a getter agent.
- the silanol groups of the curable methylphenyl silicone resin are compatible with the other components of the sealant composition, i.e. the surface of the refractory filler, the surface of the getter agent, and optionally the UV Because of its affinity with the absorbent surface, it is possible to control the mixing of curable methylphenol corn resin, refractory filler, getter agent, and optional UV absorber, uniformly and freely. As a result, a sealing material composition capable of fully exhibiting the characteristics of a curable methylphenol silicone resin, a refractory filler, a getter agent, and an optional UV absorber is obtained.
- compositions including those containing partially polymerized methylphenyl silicone resin described below are widely used in airtight containers, sealing materials between ceramic and metal substrates, or ceramic or glass substrates. It is suitable as an overcoat material formed for the purpose of protection on electronic components such as resistors, conductors, and dielectric electrodes formed thereon.
- substrates here is glass-to-glass
- sealing between the same type of substrates such as ceramics and sealing between different types of substrates such as between glass ceramics, between ceramics and metals, and between glass metals.
- the sealing material composition of the present invention can perform sealing between these substrates at a low temperature, has high adhesive strength, excellent adhesive workability, and high mechanical heat resistance over a long period of time. It has many characteristics such as good airtightness, good heat resistance and dimensional stability, and water generated as a reaction product during heat curing is removed, so it remains in the sealed area. The remaining bubbles are greatly reduced. As a result, the appearance, hermetic reliability, and adhesive strength reliability of the sealed portion are excellent.
- curable silicone resin is excellent in heat resistance, weather resistance, moisture resistance, electrical properties, etc., and is therefore widely used as a material for electric, electronic, precision equipment, etc., and a reinforcing filler such as silica. It is also known to improve strength by blending one.
- a curable silicone resin modified with epoxy resin is excellent in strength, heat resistance, moisture resistance, and releasability.
- a composition having an improved mechanical strength of a molded product is known (see JP-A-7-316398).
- the curable silicone-based resin or its modified resin can reduce the stress applied to the glass member to be sealed, which has a relatively low elastic modulus, and can reduce the strain due to the difference in thermal expansion coefficient. it can.
- a curable silicone resin is composed of a bifunctional key monomer (R Si-X) and a trifunctional key.
- a tetrafunctional silicon monomer (Si-X) may be used in combination. Where R is carbon bond end
- R is preferably an alkyl group having 1 to 4 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms. More preferably, it is a methyl group, an ethyl group or a phenyl group.
- X is a hydroxyl group or a hydrolyzable group such as an alkoxy group or a chlorine atom. In the curable methylphenyl silicone resin of the present invention, X is preferably a hydroxyl group.
- the curable silicone resin is a copolymer obtained by partially hydrolyzing and co-condensing these monomers, and has a silanol group formed by hydrolysis of X.
- This curable silicone resin can be further condensed by the silanol group (can be hardened), and when cured, finally becomes a cured product having substantially no silanol group.
- the cured product consists of bifunctional silicon units (R SiO) and trifunctional silicon units (RSiO).
- Each key unit in the curable silicone resin is formed by hydrolysis of X together with each key unit of these cured products, and each unit containing silanol groups that contributes to the curability of the silicone resin. Also means.
- each key in curable silicone resin is formed by hydrolysis of X together with each key unit of these cured products, and each unit containing silanol groups that contributes to the curability of the silicone resin.
- a bifunctional unit having a silanol group is represented by (R Si (OH))
- each key in curable silicone resin is formed by hydrolysis of X together with each key unit of these cured products, and each unit containing si
- the molar ratio of the units is considered to be equal to the molar ratio of each raw material monomer.
- the curable methylphenol silicone resin preferably has a Si-OZSi-R value of 11.0 to 15.2 as determined from FT-IR. That is, the peak area of Si—O (peak appearing in the range of 1250 to 95 Ocm- 1 ) (a) is changed from the peak area derived from the methyl group (peak appearing in the range of 1330 to 1250 cm 1 ) (b) and And the peak area derived from the methyl group (b) and the number of moles of the phenyl group determined from H—N MR and the product of the value of the number of moles of the Z methyl group (c).
- Si-OZSi-R value 11.0 to 15.2 as determined from FT-IR. That is, the peak area of Si—O (peak appearing in the range of 1250 to 95 Ocm- 1 ) (a) is changed from the peak area derived from the methyl group (peak appearing in the range of 1330 to 1250 cm 1 ) (b) and And the peak area derived from the methyl group
- the heat resistance decreases.
- aromatic hydrocarbon groups typified by phenyl groups have mechanical heat resistance equal to or higher than that of methyl groups, which are the shortest alkyl groups.
- the resin film becomes harder. It becomes thermoplastic. Therefore, the mechanical strength such as heat resistance and bendability of the resin can be adjusted by the ratio of the number of the phenol groups to the total number of R in the resin.
- the number of moles of the phenol group obtained from H-NMR and the number of moles of the methyl group are 0.1 to 1.2.
- the ratio of the number of phenolic groups to the total number of R in the resin is 0.1 to 0.5, more preferably 0.2 to 0.5.
- Silicone resin is preferred. Peak height derived from FT-IR derived from a phenyl group (3074 cm- 1 ) Peak height derived from a Z methyl group (2996 cm- 1 ) Force SO. 1 to 1.2 methylphenol silicone resin Is also preferable.
- the curable methylphenol silicone resin has a molar ratio of difunctional silicon units to (total of bifunctional and trifunctional silicon units). (Also referred to as the molar ratio of bifunctional silicon units) is from 0.05 to 0.55.
- the curable methylphenyl silicone resin is a curable silicone resin containing both the methyl group and the phenyl group as the organic group R.
- the curable methylphenol silicone resin includes, for example, a method of hydrolytic cocondensation of dichlorodimethylsilane and trichlorophenylsilane, and a method of hydrolytic cocondensation of dichlorodiphenylsilane and trichloromethylsilane.
- the molar ratio of the bifunctional silicon units in the curable methylphenyl silicone resin is more preferably 0.2 to 0.4.
- the curable Mechirufue - Le silicone resin which becomes a force substantially only the bifunctional Kei-containing units and trifunctional Kei-containing units are preferred.
- Such a curable methylphenol silicone resin has excellent heat resistance that does not easily decompose or discolor even when kept at a high temperature of 250 ° C or higher for a long time.
- the above-mentioned molar ratio of the bifunctional silicon unit is obtained from Si-NMR.
- the curable methyl phenyl silicone resin includes curable dialkyl silicone resins such as dimethyl silicone resin, and curable alkyl resins other than methyl phenyl silicone resin such as ethyl silicone resin. It is possible to adjust the physical properties by blending a small amount of enyl silicone resin. Normally, it is preferable not to use these curable silicone resins other than methylphenol silicone resin. Further, curable methyl phenyl silicone resin can be modified with epoxy resin, phenol resin, alkyd resin, polyester resin, acrylic resin, and the like. The curable methylphenyl silicone resin, which has a small amount of force and denaturation, is preferred as a curable methylphenyl silicone resin, which is substantially modified and is preferably a curable methylphenyl silicone resin. ! /
- the refractory filler contained in the sealing material composition of the present invention is a heat-resistant inorganic powder, specifically, silica, alumina, mullite, zircon, cordierite, ⁇ -utari Ptite, ⁇ -spodumene, ⁇ -quartz solid solution, forsterite, bismuth titanate and barium titanate. Of course, these can also be used together. Of these, silica or alumina, particularly spherical silica or spherical alumina is preferred as the refractory filler.
- the average particle size of the refractory filler is preferably 0.1 to 130 ⁇ m, more preferably 0.1 to 90 ⁇ m, and 0.1 to 20 111. More preferably, it is 0.1-18 / ⁇ ⁇ .
- the average particle size of the refractory filler is 0.1 to 20 / ⁇ ⁇
- a sealing material composition with good coating workability can be obtained.
- the average particle size is less than 0. Lm, the particles are aggregated to reduce dispersibility, and a uniform composition can be obtained.
- thickening occurs, there is a problem that the amount of the refractory filler is limited. If the average particle size is more than 130 / zm, the particles will precipitate, resulting in poor dispersibility and a uniform composition. Is difficult to obtain.
- the refractory filler spherical silica or spherical alumina, which is preferable for silica or alumina, is preferable, but silica or alumina referred to here is porous such as porous silica or activated alumina. Preferably it is not quality. In other words, it is preferable that the refractory filler has a relatively small specific surface area. Specifically, the BET specific surface area is preferably less than 50 m 2 / g, more preferably less than 30 m 2 / g, and even more preferably less than 10 m 2 / g. In particular, the BET specific surface area of the most preferable refractory filler having a BET specific surface area of 0.1 to 8 m 2 / g is preferably 0.5 to 5 m / g.
- the amount of the refractory filler in the sealing material composition of the present invention is 10 to 80% by mass with respect to the total amount of the curable methylphenol silicone resin, the refractory filler and the getter agent. It is.
- the blending amount of the refractory filler is that of the curable methyl-fell silicone resin, the refractory filler, the getter agent, and the ultraviolet absorber. It is preferable that it is 10-80 mass% with respect to the total amount. When the amount is less than 10% by mass, sufficient heat resistance cannot be exhibited.
- the amount of refractory filler is 30-75% by weight.
- the sealing material composition of the present invention contains spherical particles having a larger particle size (over 130 m) and a narrow particle size distribution. A small amount can be blended as a pacer material.
- high refractive index glass such as spherical silica or barium titanate glass with a particle size of 150 to 600 ⁇ m, soda lime glass, zircoure, alumina, Preferred are silicon nitride, ceramics such as SiC, or carbon.
- the blending amount is 0.1 to 15% by mass with respect to the total of curable methylphenol silicone resin, refractory filler and getter agent (however, 50% by mass or less with respect to the total refractory filler) 1-5 mass% is particularly preferred.
- a spacer material is not blended in the sealing material composition of the present invention.
- the spacer material coated with the sealing material composition of the present invention around the spacer material is used in an airtight container. Spacer material may be fixed by placing it at a desired site such as a sealing surface and then heat-curing it.
- the getter agent contained in the sealing material composition removes water generated as a reaction product when the sealing material composition is heat-cured, and has a known strength as a hygroscopic agent or an adsorbent. Can be widely selected. However, since the sealing material composition is heat-cured at a temperature of 130 ° C to 300 ° C, the hygroscopic agent or adsorbent used as the getter agent has excellent heat resistance and the sealing material composition. A powdery inorganic moisture absorbent or adsorbent that can be uniformly dispersed in the product is preferred.
- hygroscopic agent or adsorbent examples include hydrated talcite compounds, zeolites (molecular sieves), porous silica, activated alumina, calcium oxide, magnesium oxide, silica gel, alumino silica gel and the like. . Depending on the purpose, these may be used alone or in combination of two or more.
- the particle diameter of the getter agent should be 0.05 ⁇ m to 20 ⁇ m from the viewpoint of removing water generated as a reaction product during heat curing and dispersibility in the sealing material composition. Preferably, it is more preferably 0.1 m to 15 m, and further preferably 0.1 to 10 ⁇ m.
- the getter agent preferably has a BET specific surface area of 250 m 2 / g or less.
- the getter agent preferably has a BET specific surface area of 10 m 2 Zg or more.
- the getter agent is relatively inexpensive, excellent in dispersibility in the sealing material composition, and as a reaction product during heat curing.
- Hyde mouth talcite-like compounds are preferred because of their excellent water removal characteristics.
- Ido-oral talcite-like compounds are substances having many uses such as adsorbents, antacids as pharmaceuticals, anti-pepsin agents, catalyst carriers, and noinders.
- Hyde used in the present invention Mouth talcite is a representative compound of the hyde mouth talcite represented by the following formula (1), a compound group having the same shape, and a dehydrated compound group obtained by subjecting them to heat dehydration. It is included.
- the nodular talcite is hydrated magnesium hydroxide Mg (OH)
- 2+ 2+ represents a divalent metal ion, and examples thereof include Mg 2+ , Mn 2+ , Co 2+ , Fe 2+ , Ni 2+ , Zn + , and Cu 2+ .
- M 3+ represents a trivalent metal ion, and examples thereof include Al 3+ , Cr 3+ , Mn Fe ln + , and Co 3+ .
- the above divalent metal and trivalent metal are not limited to one type, but may be a mixture of a plurality of types.
- X is a number in the range 0.009 ⁇ X ⁇ 0.33.
- a n — represents an anion, inorganic anion such as CO 2 —, SO 2 , organic anion,
- Z is a number of about 0 to 8, and changes depending on the ratio of divalent and trivalent metal cations and the dry state.
- M 2+ represents a divalent metal ion, and examples thereof include Mg 2+ , Mn 2+ , Co 2+ , Fe 2+ , Ni 2+ , Zn +, and Cu 2+ .
- M 3+ represents a trivalent metal ion, and examples thereof include Al 3+ , Cr 3+ , Mn Fe ln + , and Co 3+ .
- the above divalent metal and trivalent metal are not limited to one type, but may be a mixture of a plurality of types.
- X is a number in the range 0.009 ⁇ X ⁇ 0.33.
- Hyde mouth talcite-like compounds corresponding to the above may be either natural products or synthetic products, and commercially available products may also be used. Specific examples of commercially available products include Kyowa Chemical Industry Co., Ltd. trade name Kiyo Ward 300, Kiyo Ward 1000, Kiyo Ward 2000, Kiyo Ward 2100, Kiyo Ward 2200, DHT-4A, DHT-4A— 2, DHT-4C etc. It is done.
- the hyaled talcite compound in the sealing material composition of the present invention there is no particular limitation on the hyaled talcite compound in the sealing material composition of the present invention, and any of the above types may be used.
- the hydrated talcite compound preferably has a low water content. From this point, among the examples given above, decrystallized water grade DHT-4A-2 and DHT-4C, or decrystallized water grade of Kiyoward 2000, Kiyoword 2100 and Kiyo word 2 200 is preferred.
- the above-mentioned hydrated talcite compound preferably has a low content of alkali metal or alkaline earth metal.
- DHT-4C has an alkali metal and alkaline earth metal content of about 20 ppm.
- An alkali metal additive is preferable because it may cause variations in the properties of the sealing material composition, particularly the curing properties.
- the particle size is preferably 0.05 to 20 ⁇ m, and particularly preferably 0.1 to LO m. Its BET specific surface area, it is not preferable to be 10 ⁇ 250m 2 / g is preferred instrument particularly 12 ⁇ 220m 2 / g.
- Zeolite, porous silica, activated alumina, etc. are preferred as the getter agent other than the anodic and talcite compounds, and the particle size is preferably 0.05 to 20 m. 0.1 to 20 / ⁇ ⁇ is preferable.
- the BET specific surface area is preferably 10 to 250 m 2 / g, particularly preferably 30 to 200 m 2 Zg.
- the amount of the getter agent is 0.1 to 0.1% of the total amount of the curable methylphenol silicone resin, the refractory filler and the getter agent. 45% by mass.
- the blending amount of the getter agent is the total amount of curable methylphenol silicone resin, refractory filler, getter agent, and ultraviolet absorber. It is preferable that it is 0.1-45 mass% with respect to. When the amount is less than 0.1% by mass, the removal characteristics of water generated as a reaction product during heat curing cannot be sufficiently exhibited.
- Adhesiveness with the members constituting the object to be sealed is deteriorated and sufficient adhesive strength cannot be obtained.
- the blending amount of is more preferably 0.5 to 40% by mass.
- the sealing material composition of the present invention may further contain an ultraviolet absorber, if necessary.
- the ultraviolet absorber to be contained in the sealing material composition is not particularly limited, and may be an organic ultraviolet absorber such as salicylic acid type, benzophenone type, benzotriazole type, or cyanoacrylate type. However, since the sealing material composition is heated and cured at a temperature of 130 ° C to 300 ° C, the ultraviolet absorber is excellent in heat resistance and can be uniformly dispersed in the sealing material composition.
- These powdery inorganic ultraviolet absorbers have an average particle size of 0.01 to 5 111. It is particularly preferable that the ratio is 0.01 to 2 / ⁇ ⁇ .
- the ultraviolet absorber is preferably carbon black because it is inexpensive among the exemplified inorganic absorbers. Carbon black is roughly classified into channel type, furnace type, thermal type, and acetylene type, depending on the manufacturing method.
- the channel method is a method in which natural gas is incompletely burned in an iron combustion chamber and a flame is made to collide with the surface of a steel channel.
- the furnace method is a method in which gas, oil, or a mixture thereof is fed into a specially designed combustion furnace with a certain amount of air and incompletely combusted.
- the thermal method is a method in which natural gas is thermally decomposed in a combustion furnace.
- the acetylene type is a method that is manufactured by sending acetylene bricks into a heated furnace and causing thermal decomposition. The products produced by these are generally called channel black, furnace black, thermal black, and acetylene black.
- the carbon black in the sealing material yarn and composite of the present invention is not particularly limited, and any of the above-mentioned types may be used.
- the particle size of carbon black is preferably 15 to 70 nm, more preferably 15 to 60 nm, from the viewpoint of ultraviolet absorption characteristics and dispersibility in the sealing material composition.
- the carbon black in the present invention has a dibutyl phthalate (DBP) absorption (JIS)
- It force S is force S50 ⁇ 300cm 3 / 100g, further preferably 80 ⁇ 250cm 3 / 100g. If the DBP absorption is too high, the thickening will be so high that the amount of carbon black will be limited. Moreover, the adhesive strength of the sealing material is lowered. If the DBP content is too low, the dispersibility in the sealing material composition deteriorates.
- alkaline metals such as potassium are generally added to carbon black.
- the addition of alkali metal is not preferred because it may cause variations in the properties of the sealing material composition, particularly the curing properties.
- the blending amount of the ultraviolet absorber in the sealing material composition of the present invention is 3 mass with respect to the total amount of the curable methylphenol silicone resin, the refractory filler, the getter agent, and the ultraviolet absorber. % Or less.
- the lower limit of the amount is preferably 0.05% by mass.
- the amount is less than 0.05% by mass, sufficient UV resistance cannot be exhibited. If it exceeds 3% by mass, the viscosity is too high and the dispersibility and affinity with the sealing material composition deteriorate.
- the blending amount of the ultraviolet absorber exceeds 3% by mass, it is not preferable in the following points.
- the amount of the absorbent is from 0.1 to 3% by mass, more preferably from 0.2 to 3% by mass.
- the sealing composition is excellent in vacuum ultraviolet resistance, and even when exposed to ultraviolet rays having a wavelength in the vacuum ultraviolet region, Properties such as adhesive strength, air tightness, and moisture resistance are not degraded.
- the sealing material composition of the present invention may contain components other than the curable methylphenyl silicone resin, the refractory filler, the getter agent, and the ultraviolet absorber.
- examples of such other components include, for example, components other than the components that finally function as a sealing material such as a solvent to be described later, or components remaining in the sealing material, such as a silicone resin curing catalyst and sealing. It is a material coloring pigment.
- the content of these components in the sealing material composition is not particularly limited, but the amount of the sealing material composition of the present invention or the molded product of the sealing material composition obtained therefrom is not impaired.
- the former component is preferably 20% by mass or less based on the total amount of the constituent components of the sealing material composition, excluding the solvent.
- the amount of the solvent is arbitrary depending on the method of use, such as using the sealing composition in liquid form, using it in paste form, using it in solid form, etc. It is preferably 50% by mass or less based on the total amount of the constituent components.
- specific examples of the latter component and preferred amounts thereof include, for example, the following. 5% by mass or less of an amine-based curing agent for accelerating the curing of the methylphenol silicone resin, improving pot life of the sealing material composition, methylphenol silicone resin, refractory filler, adsorbent or
- tackifiers such as rosin, rosin derivatives, etc. are used at 5% by mass or less, or the coloring pigment of the sealing material is 5% by mass or less. Can be blended.
- the sealing material composition of the present invention is formed by mixing a curable methylphenyl silicone resin, a refractory filler, a getter agent, and, if necessary, an ultraviolet absorber, into a uniform composition. And obtained.
- Curable methylphenyl silicone resin is usually handled by transportation, storage, etc. in a solution (varnish) dissolved in a solvent.
- the sealing material composition of the present invention can be produced by using this varnish and mixing it with a refractory filler, a getter agent, and, if necessary, an ultraviolet absorber.
- the product thus produced becomes a paste-like sealing material composition having fluidity.
- a solid is obtained by mixing a curable methylvinyl silicone resin free of solvent, a refractory filler, a getter agent, and, if necessary, an ultraviolet absorber. It is also possible to obtain a sealing material composition in the form of a seal.
- the temperature at which the solvent is volatilized and removed depends on the type of solvent used.
- the solvent can be removed to obtain a solid sealing material composition. Furthermore, it is possible to obtain a paste-like sealing material composition by mixing a solvent with a solid sealing material composition.
- the curable methylphenyl silicone resin is dissolved in the desired solvent and mixed with a refractory filler, a getter agent and, if necessary, an ultraviolet absorber. It is good also as a paste-form sealing material composition.
- the sealing material composition of the present invention is excellent in handleability, it is preferably used in a paste state containing a solvent, preferably containing 10 to 40% by mass of a solvent.
- a solvent preferably containing 10 to 40% by mass of a solvent.
- the shape is not particularly limited, and it may be formed into a sheet shape, a wire shape, a stick shape or the like.
- the solvent used for varnishing the curable methylphenyl silicone resin is not particularly limited, and any solvent that dissolves the curable methylphenyl silicone resin! / Can be used.
- Aromatic hydrocarbon solvents xylene, toluene, benzene, 1, 3, 5-trimethylbenzene, solvents with boiling point of 100 ° C or lower, methyl ethyl ketone, ethyl acetate, isopropyl acetate, n-propyl acetate, acetic acid Butyl, jetyl ether, dipropyl ether, tetrahydrofuran, acetonitrile, propionitryl, 1 propanol, 2-propanol, allylic alcohol, and the like can be used.
- the amount of solvent used in the varnish is preferably 5 to 50% by mass. If it is less than 5% by mass, the dissolving action of the curable methylphenyl silicone resin is insufficient, and it is difficult to uniformly mix with the refractory filler, the getter agent, and the optional UV absorber. When it exceeds 50% by weight, when mixed with a refractory filler, a getter agent, and an optional UV absorber, the solvent is combined with the refractory filler, getter agent, and an optional UV absorber. A great deal of energy is required to remove the solvent immediately after separation and after mixing with a refractory filler, a getter agent, and an optional UV absorber.
- the curable methylphenyl silicone resin is present as a partially polymerized methylphenol silicone resin (also simply referred to as partially polymerized methylphenol silicone resin) in the sealing material composition.
- partially polymerized methylphenyl silicone resin the dehydration condensation reaction of the curable methylphenylsilicone resin of the raw material has progressed to some extent.
- the amount of water generated during sealing is small, and therefore a sealing material composition containing partially polymerized methylphenyl silicone resin is used to seal the material to be sealed when it is cured. Compared with fat, there is less risk of bubble generation, and airtightness can be improved.
- the partially polymerized methylphenol silicone resin is a high-viscosity liquid or a solid having a high melt viscosity as compared with the raw material methylphenol silicone resin, and the sealing material composition of the present invention is used as a molded product. It has properties suitable for the case. For example, when a molded article of a sealing material composition placed at a predetermined part of an object to be sealed is sealed and cured, the methylphenol silicone resin may flow and protrude from the predetermined part. Less.
- the partially polymerized methylphenol silicone resin is a curable methylphenol silicone resin in which the curing of the curable methylphenylsilicone resin that is the raw material is partially advanced.
- the curable methyl phenyl silicone resin in the present invention means a curable methyl phenyl silicone resin which is a raw material for partially polymerized methyl phenyl silicone resin, and also includes this partially polymerized methyl phenyl silicone resin. Intention Taste.
- a product obtained by partial polymerization of a curable methylphenol silicone resin will be referred to as a partially polymerized methylphenol silicone resin.
- the partial polymerization of the curable methylphenyl silicone resin is usually carried out by stopping the curing reaction by heating the raw material methylphenyl silicone resin to the extent that it is not completely completed. For example, it can be obtained by partially curing the raw material methyl phenyl silicone resin by a method such as heating at a lower temperature than in a normal curing reaction or heating for a shorter time than the time required for normal curing. .
- polymerization is performed at a temperature of 120 ° C to 180 ° C, and the crosslinking reaction does not proceed, that is, gelling does not occur. Stop the reaction.
- the partial polymerization of the curable methylphenyl silicone resin is carried out at the resin-only stage prior to mixing the refractory filler, the getter agent, and the optional UV absorber. Alternatively, it may be carried out in a composition after mixing a refractory filler, a getter agent, and an optional UV absorber, or may be carried out during the production of the composition.
- the partial polymerization of the curable methylphenol silicone resin stops the reaction before the crosslinking reaction proceeds, so the composition containing the curable methylphenol silicone resin dissolves in the viscosity and solvent. Carry out at a temperature of 120 to 180 ° C, taking the characteristics into consideration.
- the partial polymerization is preferably carried out at a temperature of 120 to 140 ° C. because it is easy to stop the reaction based on a viscosity at which the curing reaction is relatively slow.
- the sealing material composition of the present invention containing a partially polymerized methylphenol silicone resin may be used as a molded product formed into a sheet shape, a wire shape, a stick shape or the like.
- a sealing composition obtained by heating as described above into a partially polymerized methylphenol silicone resin becomes a composition having thermoplastic properties, and has this thermoplastic property in a heated state.
- the composition can be molded into a mold.
- fluorine resin Can be formed into molded products of various desired shapes such as sheet shape, wire shape, stick shape, etc. .
- the obtained molded body of the sealing material composition having a sheet shape, a wire shape, a stick shape, or the like can be applied to seal the bonding surface between the substrates constituting the airtight container in the shape.
- the sealing material composition of the present invention containing partially polymerized methylfur silicone resin is excellent in handleability even if used in a paste state dissolved in the above-mentioned suitable solvent, preferable.
- the amount of the solvent is as described above.
- Curing of curable methylphenyl silicone resin by dehydration condensation usually proceeds only by heating, and a dehydration condensation reaction between silanol groups of the resin, silanol groups of the resin and a refractory filler.
- a cured product insoluble in the solvent is formed by the dehydration condensation reaction of the silanol group on one surface.
- a sealing material composition applied to an object to be sealed can be cured and insolubilized only by heating for 1 to 120 minutes at a temperature of 140 ° C or higher, preferably from 180 ° C to 300 ° C. And it becomes a sealing material.
- a solvent when included in the sealing material composition, it is removed by volatilization at the beginning of heating, and when non-heat-resistant substances such as organic substances are present, they are removed by volatilization or decomposition during curing. .
- the solvent is removed by volatilization at a lower temperature before the sealing material composition is cured. Such solvent volatilization is performed for 30 to 60 minutes at a temperature of 100 to 140 ° C, for example, depending on the type of solvent.
- a curing catalyst may be used as an organic metal salt such as zinc, cobalt, tin, iron, zirconium, or the like.
- Examples include quaternary ammonium salts, chelates such as aluminum and titanium, various amines or salts thereof.
- the sealing material composition of the present invention can be preferably used as a sealing material for an airtight container and an overcoat material for an electronic component as described later.
- the sealing material composition of the present invention can also be used as a heat-resistant sealing agent that does not form an airtight container. Examples of such applications include heat dissipation boards such as aluminum and copper. When a large current circuit board is produced by laminating these electrodes, it can be used as a heat resistant sealant having excellent heat resistance, voltage resistance and thermal conductivity.
- the hermetic container of the present invention is hermetically sealed using the above-described sealing material composition of the present invention. More specifically, it is hermetically sealed with a cured product obtained from the above-described sealing material composition of the present invention or a molded product of the sealing material composition.
- the shape and configuration of the hermetic container are not particularly limited, and include a wide variety of known hermetic containers made of glass, ceramics, and metal bases, which are formed by hermetically sealing the joint surfaces between the bases. Therefore, products with airtight containers such as display products such as PDP, CRT, VFD, FED, SED, and organic EL, light emitting device products such as liquid crystal knock lights and flat fluorescent plates used for lighting, piezoelectric vibrators, A wide range of known materials such as LD, LED, double-glazed glass, and MEMS can be selected.
- the substrate constituting the hermetic container is made of glass
- usable materials include glass such as soda ash glass, borosilicate glass, silica glass, alkali-free glass, and Pyrex (registered trademark) glass. be able to.
- the substrate constituting the hermetic vessel is made of ceramic
- usable materials include aluminum oxide sintered body, mullite sintered body, aluminum nitride sintered body, silicon nitride sintered body ' Ceramics such as a silicon carbide sintered body can be used.
- the substrate constituting the hermetic container is made of metal
- examples of usable materials include metal materials such as iron-nickel cobalt alloy (Kovar), iron-nickel alloy, stainless steel, and copper. It can also be used in composites with metal and ceramic forces, such as Al-SiC composites.
- the bonding surface between the substrates constituting the airtight container is sealed using the above-described sealing material composition of the present invention.
- the sealing material composition of the present invention is disposed along a portion corresponding to the joint surface on the surface of the substrate constituting the airtight container.
- a paste-like sealing material composition containing a solvent a composition containing a partially polymerized methylphenol silicone resin is also included.
- a molded article of a sealing material composition such as a sheet (including a molded article containing partially polymerized methylphenol silicone resin)
- the shape was heated to 150 to 200 ° C.
- the molded body is disposed at a portion corresponding to the bonding surface of the substrate surface.
- the arrangement of the sealing material composition of the present invention may be performed using other methods, for example, a spray method, a screen printing method, a spin coating method, or the like.
- the layer thickness of the sealing material composition of the present invention at the joint surface between the substrates constituting the hermetic container is preferably 500 m or less, more preferably 400 ⁇ m. m or less.
- the solvent is heated by heating at 70 ° C to 120 ° C for 1 to 60 minutes. Volatilize and remove. Thereafter, in either case of the paste-like sealing material composition or the molded body of the sealing material composition, it is dried at 170 to 200 ° C. for several minutes to soften the sealing material composition, and then 170 to 200 The substrates are bonded together while heated to ° C.
- the sealing material composition is heated and cured by heating at a predetermined temperature condition, for example, 140 ° C or higher, preferably 180 ° C to 300 ° C for 1 to 120 minutes. At this time, the substrates constituting the hermetic container are pressurized as necessary.
- tempered glass can be used to increase the strength.
- Tempered glass has a residual stress layer formed near the glass surface by heat treatment or the like.
- conventional sealing using a low-melting glass frit there is a possibility that the residual stress applied to the tempered glass is reduced or lost when the tempered glass is exposed to a high temperature.
- the sealing composition of the present invention since the sealing temperature is greatly lowered, even when tempered glass is used for the multilayer glass, the risk that the strength of the tempered glass is impaired is reduced. Has been.
- a hole for evacuating the airtight container is provided, and the inside of the airtight container is evacuated by connecting a vacuum pump to the hole. Then, the airtight container interior Nozomu Tokoro degree of vacuum (e.g., 1 degree 3 X 10- 2 Pa) may be sealed hole hermetically with sealing material at the time point when.
- Nozomu Tokoro degree of vacuum e.g., 1 degree 3 X 10- 2 Pa
- the sealing material used here is not particularly limited, and can be appropriately selected according to the material of the substrate constituting the hermetic container. It may be melt sealed using a lead-free metal material such as Au / Su, silver braze, or AuZGe, or a conventional lead glass frit. However, it is preferable to use the sealing material composition of the present invention because it can be sealed at a low temperature and does not contain lead and is excellent in environmental friendliness.
- an exhaust pipe is provided so as to penetrate the wall surface of the hermetic container, and a vacuum pump is connected to the exhaust pipe to connect the inside of the hermetic container. It is also possible to evacuate.
- the airtight container interior desired vacuum degree e.g., 1 degree 3 X 10- 2 Pa
- the exhaust pipe may be cut and the opening of the exhaust pipe may be hermetically sealed using a sealing material.
- the means for evacuating the inside of the hermetic container is not limited to the above-described form, and the hermetic container having a desired degree of vacuum is obtained by sealing the substrates constituting the hermetic container in the vacuum chamber. May be formed.
- This sealing material composition is suitable for producing an airtight container using such a sealing method because the amount of gas generated during heat curing is greatly reduced.
- the sealing material composition of the present invention can also be used as an overcoat material for electronic components such as resistors, dielectrics, and conductor electrodes. These electronic components are properly protected from dust and water by forming an overcoat.
- the electronic components are not limited to those described above, and can be widely selected from known electronic components that require an overcoat to protect them from dust and water.
- the sealing material composition of this invention is arrange
- the specific arrangement procedure may be carried out in the same procedure as described above for the sealing procedure of the airtight container.
- the electronic component may be mounted on a glass or ceramic substrate, or it may be a single electronic component before mounting on the substrate.
- a predetermined temperature condition for example, 140 ° C or higher, preferably 180 ° C to 300 ° C, 1 to The overcoat is formed by heating for 120 minutes to heat cure the sealing material composition.
- the obtained solid sealing material composition and a solvent (ethyl acetate) were mixed according to the ratio shown in Table 1 to obtain a pasty sealing material composition.
- the molar ratio of the phenol groups was measured by 1 H-NMR and FT-IR.
- the following evaluation was carried out on the obtained sealing material composition.
- the results are shown in Table 1.
- a plurality of samples (2 to 10) were prepared using the same sealing material composition. When the evaluation results shown in the table are shown as ranges, the measurement results vary between these multiple samples.
- the sealing material composition has good fluidity and can be applied uniformly and with good flatness.
- the fluidity of the sealing material composition is inferior, and it cannot be applied uniformly and with good flatness.
- the airtightness evaluation was performed according to the following procedure.
- Figure 1 shows the components of the test sample used for the airtightness evaluation.
- A is a flat substrate 100 (70 ⁇ 70 ⁇ 3 mm) having a hole 101 having a diameter of 6 mm in the center.
- (b) is a flat substrate 200 (80 ⁇ 80 ⁇ 3 mm). Glass material (soda lime glass) was used as the test sample material.
- Figure 2 is a side cross-sectional view of the assembled test sample.
- a paste-like sealing material composition 1 was applied along the peripheral edge of the substrate 100 shown in FIG. 1 using a dispenser. After sprinkling glass beads of ⁇ 100 m uniformly on the sealant composition for spacers, the solvent is volatilized by heating at 70 ° C for 30 minutes and at 120 ° C for 20 minutes. Removed and further dried at 200 ° C. for 10 minutes.
- the substrate 100 was placed on the substrate 200, and the substrate 100 was pressed from above while being pressed at 200 ° C. for 1 hour, 250 A test sample for airtightness evaluation was prepared by heat curing at ° C for 1 hour. Thereafter, the presence or absence of leakage was measured.
- the thickness of the sealing material composition 1 is 100 ⁇ m.
- the presence or absence of a leak was measured by a hood method using a UL VAC helium leak detector HELIOT.
- a vacuum pump is connected to hole 101, the test sample is evacuated until the knock ground value reaches 1 to 9 X 10— U Pa'm 3 / s, helium gas is introduced into the hood, and 5 Helium gas leak rate was measured for a minute, and the maximum value of helium gas leak rate was recorded to check for leaks.
- Table 1 the case where no leak was found was marked as ⁇ , and the case where leak was found was marked as X.
- the vacuum sealability evaluation was performed according to the following procedure.
- Two flat substrates (made of soda lime) were prepared, and a paste-like sealing composition was applied along the peripheral edge of one substrate (300 X 300 X 3 mm) using a dispenser.
- the solvent was evaporated and removed by heating at 70 ° C for 30 minutes and at 120 ° C for 20 minutes.
- a Kapton tape with a thickness of about 40-50 ⁇ m was affixed on the 5 X 5 surface so as to be a spacer.
- the substrate coated with the sealing material composition was set on the lower plate of the hot plate placed in the vacuum chamber, and the substrate with the Kapton tape attached was set on the upper plate.
- the inside of the vacuum chamber was evacuated below 0. OlTorr, and the hot plate was heated to 180 ° C.
- the two substrates were bonded together in a vacuum. After bonding the substrates together, the hot plate temperature was raised to 200 ° C. When the hot plate reaches 200 ° C, nitrogen is introduced and the vacuum is The sealing composition was heated and cured at normal pressure and 200 ° C. for 15 minutes while the pressure was restored and the substrates were bonded together. At this point, the hot plate was turned off, and the substrate was attached to the substrates, and the plate was cooled down over 2 to 3 hours until the hot plate temperature reached about 90 ° C to 50 ° C. Thereafter, the two substrates that were vacuum-sealed were removed from the hot plate.
- FIG. 3 is a conceptual diagram showing a test sample used for adhesiveness evaluation.
- the end portions (10 mm ⁇ 3 mm) of the plate-like test samples 300 and 301 were bonded together using the sealing material composition 1 to prepare a test sample for adhesion evaluation.
- a glass material silica glass
- the size of the test sample Nop 300, 301 was lOmm ⁇ lOOmm ⁇ 6 mm.
- the sealing material composition was applied, dried and heat-cured in the same procedure as described above.
- a tensile test was performed using Tensilon (manufactured by Orientec Co., Ltd.) in the same procedure as JIS K6850, and the adhesive strength of the sealed portion was measured.
- the pulling speed was 5 mm Zmin.
- Bubbles that can be used as a route to connect the inside of the substrate and the outside under atmospheric pressure by observing the sealed part of the sample used for the evaluation of the vacuum sealing property with a stereomicroscope and penetrating the vacuum-sealed sealing part. The presence or absence was confirmed.
- ⁇ indicates that there are no air bubbles penetrating the sealing part
- ⁇ indicates that there are no air bubbles penetrating the sealing part, but there are conspicuous air bubbles
- X indicates that there are air bubbles penetrating the sealing part. did.
- a hyde mouth talcite (trade name DHT-4C, manufactured by Kyowa Chemical Industry Co., Ltd.) with a particle size of 0.5 i um (catalog value) and a BET specific surface area of 15 m 2 / g (catalog value) or particle size Hyde mouth talcite (trade name Kiyo Ward 2200, manufactured by Kyowa Chemical Industry Co., Ltd.) with 0.5 m (catalog value) and BET specific surface area of 150 m 2 Zg (catalog value) is blended in the amounts shown in Table 2. Then, the same procedure as in Example 1 was conducted except that the sealing material composition was prepared by changing the blending amount of the spherical silica to the amount shown in Table 2.
- Example 9 the evaluation of thermal decomposability and airtightness was not performed.
- the thermal degradability evaluation was not carried out.
- the force that could not be vacuum-sealed was strong, so the evaluation of the residual amount of bubbles in the sealed part was too strong to be performed.
- Hyde mouth talcite (trade name Kiyo Ward 2200, manufactured by Kyowa Chemical Industry Co., Ltd.) with a particle size of 0.5 i um (catalog value) and a BET specific surface area of 150 m 2 Zg (catalog value) is shown in Table 3.
- Example 1 except that a paste-like sealing material composition was prepared by changing the ratio of the solid sealing material composition to the solvent as shown in Table 3 It was carried out in the same way. The results are shown in Table 3.
- thermal decomposability and airtightness were not evaluated.
- Example 16 was not evaluated for thermal degradability.
- the strength that could not be vacuum-sealed was strong, so the evaluation of the residual amount of bubbles in the sealed portion was too strong to be performed.
- spherical silica instead of spherical silica as a filler, spherical alumina with an average particle size of 0.7 ⁇ m (BET ratio table area 2m 2 / g) is blended in the amount shown in Table 4, and the getter agent has a particle size of 0.5 m (catalog Value), BET specific surface area of 15m 2 Zg (catalog value), id mouth talcite (trade name DHT-4C, manufactured by Kyowa Chemical Industry Co., Ltd.) or particle size 0.
- Example 22 is not evaluated for thermal decomposability and airtightness.
- a getter agent As a getter agent, a hyde mouth talcite (trade name DHT-4C, manufactured by Kyowa Chemical Industry Co., Ltd.) with a particle size of 0.5 i um (catalog value) and a BET specific surface area of 15 m 2 / g (catalog value) or particle size Hyde mouth talcite (trade name Kiyo Ward 2200, manufactured by Kyowa Chemical Industry Co., Ltd.) with 0.5 m (catalog value), BET specific surface area of 150 m 2 Zg (catalog value), particle size 48 nm as a UV absorber, DBP Paste sealant composition with 140cm 3 Zl00g of carbon black absorbed in the amounts shown in Table 5 and changing the ratio of solid sealant composition and solvent as shown in Table 5
- DBP Paste sealant composition with 140cm 3 Zl00g of carbon black absorbed in the amounts shown in Table 5 and changing the ratio of solid sealant composition and solvent as shown in Table 5
- Example 28 is not evaluated
- a getter agent As a getter agent, a hyde mouth talcite (trade name DHT-4C, manufactured by Kyowa Chemical Industry Co., Ltd.) with a particle size of 0.5 i um (catalog value) and a BET specific surface area of 15 m 2 / g (catalog value) or particle size Hyde mouth talcite (trade name Kiyo Ward 2200, manufactured by Kyowa Chemical Industry Co., Ltd.) with 0.5 m (catalog value), BET specific surface area of 150 m 2 Zg (catalog value), particle size 48 nm as a UV absorber, DBP Paste sealant composition with 140cm 3 Zl00g of carbon black absorbed in the amount shown in Table 6 and changing the ratio of solid sealant composition and solvent as shown in Table 6
- the procedure is the same as in Example 1 except that is created. The results are shown in Table 6.
- Example 34 is not evaluated for thermal decomposability and airtightness.
- a getter agent As a getter agent, a hyde mouth talcite (trade name DHT-4C, manufactured by Kyowa Chemical Industry Co., Ltd.) with a particle size of 0.5 i um (catalog value) and a BET specific surface area of 15 m 2 / g (catalog value) or particle size Hyde mouth talcite (trade name Kiyo Ward 2200, manufactured by Kyowa Chemical Industry Co., Ltd.) with 0.5 m (catalog value) and BET specific surface area of 150 m 2 Zg (catalog value), granules as UV absorber Carbon black with a core diameter of 35 nm and DBP absorption of 175 cm 3 Zl00 g was blended in the amounts shown in Table 7, and the ratio of the solid sealing material composition and the solvent was changed as shown in Table 7 to change the paste shape.
- Example 40 is not evaluated for thermal decomposability and airtightness.
- Form Sealant composition Solvent 9: 1 87:13 87: 13 87:13 85:15
- Example 17 Example 18 Example 19 Example 20
- Example 21 Example 22 Methylphenyl silicone
- Material Filler content [parts by mass] 55.0 50.0 35.0 55.0 50.0 35.0 Filler particle size [jum] 0.7 07 0.7 0.7
- Form Sealant composition Solvent 9: 1 9: 1 87:13 9: 1 9: 1 87:13
- Example 23 Example 24 Example 25 Example 26 Example 27 Example 28 Methylphenyl silicone
- Filler content [parts by mass] 54.5 49.5 34.5 54.5 49.5 34.5 Filler particle size [m] 1 1 1 1 1 1 Getter agent content
- Material Getter agent particle size [nm] 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5
- Form Sealant composition Solvent 9: 1 9: 1 87: 13 9: 1 1 9: 1 87: 13
- the sealing material composition of the present invention is a sealing material for hermetically sealing a joint surface between glass, ceramic or metal substrates, does not contain harmful components such as lead, and is 300 ° C or less. It can be sealed at any temperature and has excellent adhesion strength to glass, ceramics and metals. In particular, it remains in the sealed part by removing water generated as a reaction product during heat curing. Air bubbles are greatly reduced, and this makes the workability at the time of sealing excellent, and the airtight reliability of the sealed portion and the reliability of adhesive strength are excellent. Further, an airtight container hermetically sealed using the sealing material composition of the present invention, and the airtight container can be manufactured, and the yarn and the composition are used to overload the electronic component and the electronic component. A coat can be formed.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Analytical Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims
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JP2006536405A JPWO2006033380A1 (ja) | 2004-09-24 | 2005-09-22 | 封着材組成物、それを用いた気密容器および電子部品のオーバーコートならびにそれらの製造方法 |
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Cited By (8)
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JP2007070603A (ja) * | 2005-08-09 | 2007-03-22 | Sony Corp | ナノ粒子−樹脂複合材料及びその製造方法、並びに、発光素子組立体、発光素子組立体用の充填材料、及び、光学材料 |
EP2009667A1 (en) * | 2006-04-10 | 2008-12-31 | Ulvac, Inc | Method for manufacturing sealing panel and plasma display panel |
JP2013124315A (ja) * | 2011-12-15 | 2013-06-24 | Konishi Co Ltd | 硬化性樹脂組成物 |
WO2013120584A3 (de) * | 2012-02-16 | 2014-01-30 | Karlsruher Institut für Technologie | Dichtung einer fuge |
WO2016175271A1 (ja) * | 2015-04-28 | 2016-11-03 | 味の素株式会社 | 封止用樹脂組成物および封止用シート |
CN106573835A (zh) * | 2014-07-30 | 2017-04-19 | 旭硝子株式会社 | 真空复层玻璃的制造方法、以及真空复层玻璃 |
CN108192560A (zh) * | 2017-12-06 | 2018-06-22 | 常州市绿意管道有限公司 | 一种阻燃高强度建筑密封胶的制备方法 |
WO2021225083A1 (ja) * | 2020-05-08 | 2021-11-11 | パナソニックIpマネジメント株式会社 | ガラスパネルユニット、ゲッタ材、ゲッタ材組成物、ガラスパネルユニットの製造方法 |
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CN104167394A (zh) * | 2014-07-14 | 2014-11-26 | 京东方科技集团股份有限公司 | 一种电子器件封装用组合物及封装方法和oled显示装置 |
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CN106573835A (zh) * | 2014-07-30 | 2017-04-19 | 旭硝子株式会社 | 真空复层玻璃的制造方法、以及真空复层玻璃 |
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CN108192560A (zh) * | 2017-12-06 | 2018-06-22 | 常州市绿意管道有限公司 | 一种阻燃高强度建筑密封胶的制备方法 |
WO2021225083A1 (ja) * | 2020-05-08 | 2021-11-11 | パナソニックIpマネジメント株式会社 | ガラスパネルユニット、ゲッタ材、ゲッタ材組成物、ガラスパネルユニットの製造方法 |
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JPWO2006033380A1 (ja) | 2008-05-15 |
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