JPS5432564A - Room temperature curing polyorganosiloxane composition - Google Patents

Room temperature curing polyorganosiloxane composition

Info

Publication number
JPS5432564A
JPS5432564A JP9884377A JP9884377A JPS5432564A JP S5432564 A JPS5432564 A JP S5432564A JP 9884377 A JP9884377 A JP 9884377A JP 9884377 A JP9884377 A JP 9884377A JP S5432564 A JPS5432564 A JP S5432564A
Authority
JP
Japan
Prior art keywords
room temperature
temperature curing
polyorganosiloxane composition
curing polyorganosiloxane
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9884377A
Other languages
Japanese (ja)
Inventor
Chiyuki Shimizu
Isao Endou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Momentive Performance Materials Japan LLC
Original Assignee
Toshiba Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Silicone Co Ltd filed Critical Toshiba Silicone Co Ltd
Priority to JP9884377A priority Critical patent/JPS5432564A/en
Publication of JPS5432564A publication Critical patent/JPS5432564A/en
Pending legal-status Critical Current

Links

Landscapes

  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP9884377A 1977-08-18 1977-08-18 Room temperature curing polyorganosiloxane composition Pending JPS5432564A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9884377A JPS5432564A (en) 1977-08-18 1977-08-18 Room temperature curing polyorganosiloxane composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9884377A JPS5432564A (en) 1977-08-18 1977-08-18 Room temperature curing polyorganosiloxane composition

Publications (1)

Publication Number Publication Date
JPS5432564A true JPS5432564A (en) 1979-03-09

Family

ID=14230526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9884377A Pending JPS5432564A (en) 1977-08-18 1977-08-18 Room temperature curing polyorganosiloxane composition

Country Status (1)

Country Link
JP (1) JPS5432564A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54116055A (en) * 1978-03-01 1979-09-10 Toray Silicone Co Ltd Thermally conductive silicone composition
JPS5686951A (en) * 1979-12-17 1981-07-15 Shin Etsu Chem Co Ltd Organopolysiloxane composition with its surface curable at room temperature
JPS5776055A (en) * 1980-10-29 1982-05-12 Toshiba Silicone Co Ltd Sealing method
WO2006033380A1 (en) * 2004-09-24 2006-03-30 Asahi Glass Company, Limited Sealing composition, airtight container and overcoat of electronic part using same, and method for producing those

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54116055A (en) * 1978-03-01 1979-09-10 Toray Silicone Co Ltd Thermally conductive silicone composition
JPS5623463B2 (en) * 1978-03-01 1981-05-30
JPS5686951A (en) * 1979-12-17 1981-07-15 Shin Etsu Chem Co Ltd Organopolysiloxane composition with its surface curable at room temperature
JPS5833257B2 (en) * 1979-12-17 1983-07-19 信越化学工業株式会社 Room temperature surface curable organopolysiloxane composition
JPS5776055A (en) * 1980-10-29 1982-05-12 Toshiba Silicone Co Ltd Sealing method
JPS6340222B2 (en) * 1980-10-29 1988-08-10 Toshiba Silicone
WO2006033380A1 (en) * 2004-09-24 2006-03-30 Asahi Glass Company, Limited Sealing composition, airtight container and overcoat of electronic part using same, and method for producing those
JPWO2006033380A1 (en) * 2004-09-24 2008-05-15 旭硝子株式会社 SEALING MATERIAL COMPOSITION, HERMETIC CONTAINER USING THE SAME, ELECTRONIC COMPONENT OVERCOAT AND METHOD FOR PRODUCING THEM

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