WO2006013915A1 - Méthode et appareil pour inspecter les panneaux d'affichage et méthode de fabrication de panneaux d'affichage - Google Patents

Méthode et appareil pour inspecter les panneaux d'affichage et méthode de fabrication de panneaux d'affichage Download PDF

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Publication number
WO2006013915A1
WO2006013915A1 PCT/JP2005/014275 JP2005014275W WO2006013915A1 WO 2006013915 A1 WO2006013915 A1 WO 2006013915A1 JP 2005014275 W JP2005014275 W JP 2005014275W WO 2006013915 A1 WO2006013915 A1 WO 2006013915A1
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WIPO (PCT)
Prior art keywords
substrate
height
display panel
liquid material
measurement
Prior art date
Application number
PCT/JP2005/014275
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English (en)
Japanese (ja)
Inventor
Osamu Kuramata
Hiromichi Sasamoto
Yasuki Shimizu
Original Assignee
Toray Industries, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to JP2006531530A priority Critical patent/JPWO2006013915A1/ja
Publication of WO2006013915A1 publication Critical patent/WO2006013915A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
    • H01J9/22—Applying luminescent coatings
    • H01J9/227—Applying luminescent coatings with luminescent material discontinuously arranged, e.g. in dots or lines
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/20—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring contours or curvatures, e.g. determining profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/34—Vessels, containers or parts thereof, e.g. substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/42—Measurement or testing during manufacture

Definitions

  • the present invention relates to a display panel inspection method, inspection apparatus, and manufacturing method, and in particular, in a display panel in which a plurality of liquid materials are applied on a substrate, the liquid material is applied and formed on the substrate with high accuracy.
  • the present invention relates to a state inspection method and inspection device such as means used for the purpose, and a display panel manufacturing method using the method and device.
  • a technique for inspecting the composition state of a phosphor layer is known in a method of applying a plurality of liquid materials on a substrate.
  • the composition state of the phosphor layer is inspected based on the difference between the substrate surface shape before the phosphor composition and the substrate surface shape on which the phosphor layer is constructed after the firing of the phosphor paste.
  • Technology is disclosed.
  • this method increases the manufacturing cost because two measurements are performed on one product.
  • the quality of the product cannot be judged until the second measurement is performed, if a continuous failure occurs in the phosphor paste applicator (and firing furnace), a large number of defective substrates are produced. Will occur
  • Patent Document 1 ultraviolet rays are irradiated to the substrate surface on which the phosphor layer is formed through a baking process after applying the phosphor-pased, and R (red), G (green), B (blue)
  • R red
  • G green
  • B blue
  • a technique for inspecting the configuration state of the phosphor layer by measuring the amount of excited luminescence from each phosphor layer is also disclosed.
  • the quality of the product cannot be determined until the measurement after firing is performed. Therefore, if a defect that causes a continuous defect occurs in the phosphor paste coating apparatus, the substrate that is also a defective product Will occur in large quantities.
  • Patent Document 1 JP-A-9 273913
  • An object of the present invention is to inspect the state of the coating process immediately after the phosphor paste coating process to quickly find defects that cause continuous defects in the coating process, resulting in a defective product and a lossy substrate. It is an object of the present invention to provide a display panel inspection method and inspection apparatus, and a manufacturing method using them, which can minimize the number and quickly restore the process. Another issue is to make it possible to obtain a desired measurement result in a single measurement and to keep the manufacturing cost of the substrate low. Another issue is to manage the surface condition data of the substrate so that it can be used as data for manufacturing products with higher accuracy and quality.
  • a display panel inspection method includes a height measuring unit, and in a direction intersecting with a plurality of liquid materials applied to the substrate at a predetermined interval.
  • the height shape signal obtained by discretely measuring the height of the substrate surface including the liquid material application part while moving the height measuring means, and obtaining an approximate curve of the obtained discrete height shape signal force
  • the height signal for each liquid material is extracted from the height signal and used as an inspection signal, and the coating amount for each liquid material is measured from the inspection signal.
  • the signal of the liquid phosphor coating part is specified from the discrete height shape signal obtained by the height measuring means, and the height shape is determined using the conic curve as an approximate curve from the specified signal.
  • the signal can be determined.
  • the signal of the liquid phosphor coating part is identified from the discrete height shape signal obtained by the height measuring means, and the height shape signal is determined using a circle as the identified signal force approximate curve.
  • the approximate circle diameter signal obtained by connecting the approximate circle diameters corresponding to a plurality of liquid materials can be used as an inspection signal, and the application amount for each liquid material can be measured based on the inspection signal. .
  • a plurality of first partition walls are formed at predetermined intervals in a direction parallel to the longitudinal direction of the liquid material applied at predetermined intervals on the substrate.
  • the present invention can be suitably applied to a substrate having a configuration in which a plurality of second partition walls are formed at predetermined intervals in the direction perpendicular to the longitudinal direction of the liquid material between adjacent first partition walls.
  • a height having a spot-like measurement region as a height measurement means.
  • the shape of the area within ⁇ 35% of the central part between the second partition walls formed in the direction perpendicular to the longitudinal direction of the liquid material is formed over the entire length of the substrate in the direction transverse to the longitudinal direction of the liquid material. Can be measured.
  • the substrate position regulating means for regulating the position of the substrate is further provided, and the shape of the region within ⁇ 35% of the central portion between the second partition walls is formed in a direction crossing the longitudinal direction of the liquid material.
  • the measurement can be performed over the entire length of the substrate.
  • the position of the substrate is regulated (conveyance guide in the case of substrate movement, pre-positioning mechanism in the case of sensor movement) to realize height measurement sensor scanning in the area within ⁇ 35% of the center between the second partition walls Is
  • the method further includes a substrate position recognizing unit for recognizing the position of the substrate and a scanning position correcting unit for correcting the position of the height measuring unit based on the substrate position information.
  • the shape of the region within ⁇ 35% of the central portion in between can be measured over the entire length of the substrate in a direction crossing the longitudinal direction of the liquid material.
  • the board edge position the board tilt and meandering information is obtained, the height measurement sensor position is corrected, and the height measurement sensor scan in the region within ⁇ 35% of the center between the second walls is corrected. Is realized.
  • the above method further comprises two or more height measuring means, position adjusting means, and switching means, and the shape of the region within ⁇ 35% of the central portion between the second partition walls is liquid.
  • the measurement can be performed over the entire length of the substrate in a direction transverse to the longitudinal direction of the material.
  • at least two height measurement sensors are used, and even if the substrate tilts and meandering occurs, at least one height measurement sensor captures data in the region within ⁇ 35% of the center between the second partition walls. It is to be acquired.
  • a height measurement sensor having a measurement region including a second partition wall space formed in a direction perpendicular to the longitudinal direction of the liquid material is used as the height measurement means, and the shape of the substrate surface is changed to the longitudinal direction of the liquid material. It is also possible to measure over the entire length of the substrate in a direction crossing the direction.
  • the above-described display panel inspection method includes substrate back surface height measuring means for measuring the height of the substrate back surface, and the measurement result by the height measuring means is displayed on the back surface of the substrate. It can also be corrected by the height measurement result. That is, measure the back side of the board A second height measuring sensor that measures the vertical movement of the substrate and eliminates the influence of the vertical movement of the substrate from the height measurement data.
  • the measurement position of the height measuring means can be rubbed so as to be arranged at a position where the substrate moving means and the substrate are in contact with each other.
  • the measurement position of the height measuring means is arranged at a position where the substrate transport means and the substrate are in contact with each other to suppress the vertical movement of the substrate.
  • the liquid material applied at a predetermined interval changes the surface shape between the first and second partition walls immediately after the application due to the flow action, and the predetermined time.
  • the height measurement of the substrate surface can be performed after a predetermined time. That is, the inspection is performed after the liquid material is leveled.
  • the liquid material applied at a predetermined interval changes its surface shape between the first and second partition walls immediately after the application due to the flow action, and reaches a steady state after a predetermined time.
  • the height shape signal is corrected using paste leveling characteristic data with respect to the preliminarily measured time.
  • the defect determination threshold for the inspection signal can be automatically adjusted from the moving average signal obtained by performing the moving average process on the inspection signal itself obtained from the inspection target substrate.
  • the height of the substrate surface is continuously measured for a plurality of substrates, and the substrate height and shape information measured before the measurement of the substrate to be inspected is used to determine the substrate to be inspected. It is also possible to automatically adjust the defect determination threshold. In other words, an individual judgment threshold value is automatically set for each liquid material from the measurement results of another substrate that was measured before the measurement of the target substrate.
  • the height measurement is performed on all the substrates on which the liquid material is applied every time the liquid material is applied to the substrate, or a plurality of liquid materials are used.
  • Board It can be applied to all substrates coated with a liquid material after application to a selected representative substrate. For example, for multi-sided substrates, the timing of force inspection, such as the accuracy of inspection, manufacturing tact, and the number of lost substrates when NG (no good) occurs, and the target substrate are selected.
  • the display panel inspection apparatus obtains a height measuring means for discretely measuring the height of the substrate surface including the liquid material application portion, and an obtained discrete height shape signal force approximation curve. And a signal processing means for obtaining a height shape signal.
  • the substrate fixing means for fixing the substrate, and the substrate fixing means is provided with a position correcting function in the rotation direction with the axis perpendicular to the substrate surface as the central axis.
  • a laser displacement meter is used as the height measuring means
  • a linear motor guide having an air bearing is used as the moving means for moving the height measuring means
  • the substrate fixing means for fixing the substrate is perpendicular to the substrate surface. It is possible to adopt a configuration in which a high-precision stage having a position correction function in the rotational direction with a central axis as a central axis is used.
  • a high-precision stage as a substrate fixing means for fixing the substrate can be used in common with the coating apparatus as the substrate fixing means when applying the liquid material.
  • a high-precision stage can be used for general purposes.
  • the inspection apparatus may be configured to further include substrate position regulating means for regulating the position of the substrate.
  • a laser displacement meter can be used as the height measuring means
  • a roller transport machine can be used as the moving means for moving the substrate
  • a position regulation guide can be used as the substrate position regulating means.
  • a laser displacement meter is used as the height measuring means, and the height measuring means is moved. This is achieved by using a single-axis stage as the means and using a positioning mechanism as the substrate position restricting means.
  • the inspection apparatus may further include a position correcting unit for correcting the positions of the substrate edge position measuring unit and the height measuring unit.
  • a laser displacement meter is used as the height measuring means
  • a roller transporter is used as the moving means for moving the substrate
  • a laser position measuring sensor is used as the substrate edge position measuring means
  • a single-axis stage as the position correcting means Can be used.
  • the inspection apparatus may further include at least two or more height measuring units and an installation interval adjusting unit that adjusts an installation interval between the height measuring units.
  • two laser displacement meters can be used as the height measuring means
  • a roller transport machine can be used as the moving means for moving the substrate
  • a single-axis stage can be used as the installation interval adjusting means.
  • Such an inspection apparatus further includes a substrate back surface height measuring means, and a laser displacement meter can be used as a substrate back surface height measuring means.
  • the laser displacement meter as the height measuring means can be configured to measure the position where the substrate moving means and the substrate are in contact with each other.
  • a display panel manufacturing method comprises the above-described inspection method or a method characterized by manufacturing a display panel using the above-described inspection apparatus.
  • the substrate can be corrected using the liquid material correcting means based on the defect information of the substrate.
  • the NG substrate is corrected based on the defect information of the substrate.
  • a defect in the coating process (clogging of the coating nozzle, etc.) can be detected immediately after the occurrence of a defect from the surface shape of the substrate. Can be kept to a minimum.
  • the displacement meter since the displacement meter only needs to be scanned once, an increase in manufacturing costs can be minimized.
  • a high inspection sensitivity can be obtained by estimating the filling amount by the radius of the approximate circle including the surface of the liquid material (especially in the manufacturing specification in which the liquid material is filled in the partition wall).
  • the inspection accuracy Z reliability can be increased.
  • Scanning accuracy can be ensured by a travel guide in the case of substrate movement, and by a substrate positioning mechanism in the case of sensor movement.
  • the accuracy of the inspection can be improved by correcting the measurement data with the leveling characteristic of the paste with respect to time.
  • the individual difference of the coating apparatus and the fixed manufacturing unevenness of the substrate can be automatically eliminated by a spatial moving average process to perform the inspection. It is also possible to perform inspection by automatically eliminating individual differences of coating apparatuses and fixed manufacturing unevenness of the substrate by temporal moving average processing.
  • the inspection timing and the target substrate can be selected from the number of loss substrates when NG occurs, the manufacturing tact, the inspection accuracy, and the like.
  • the surface shape data of the substrate measured for the inspection of the state of the coating process can be managed as a trend and fed back to the control and operation of the coating process to enable stable substrate production.
  • an inspection apparatus can be configured by the height measuring means and the signal processing means.
  • a specific inspection apparatus can be actually configured by including a moving means for moving the height measuring means and an output means for outputting the inspection result.
  • a specific inspection apparatus can be actually configured by including a substrate fixing means having a function of correcting the rotation direction ( ⁇ direction) of the substrate.
  • a substrate moving type device configuration is possible, and a height measuring means moving type device configuration is also possible.
  • the above-described apparatus configuration can further include a substrate edge position measuring unit and a height measuring unit, whereby a practical inspection apparatus can be configured.
  • a substrate moving type device configuration is possible.
  • a substrate movement type apparatus configuration is possible.
  • a more specific inspection apparatus can actually be configured by providing a substrate back surface height measuring means in the apparatus configuration as described above.
  • the yield of the entire process can be increased.
  • FIG. 1 is a schematic configuration diagram showing a configuration of a PDP.
  • FIG. 2 is a process flow diagram showing a PDP back plate manufacturing process.
  • FIG. 3 is a schematic partial perspective view showing a PDP back plate having no phosphor.
  • FIG. 4 is a schematic partial perspective view showing an example of a PDP back plate immediately after applying a phosphor paste.
  • FIG. 5 is a schematic partial perspective view showing an example of a PDP back plate after the phosphor paste is leveled.
  • FIG. 6 is a schematic partial perspective view showing an example of a PDP back plate having a phosphor layer (only for one color).
  • FIG. 7 is a schematic perspective view showing the relationship between the PDP back plate and the height measuring means scanning.
  • FIG. 8 is a schematic diagram showing the relationship between the surface shape of the PDP back plate and the sampling of the height measuring means.
  • FIG. 9 is an explanatory diagram for explaining the definition of the signal approximation method and the height hZ approximate circle radius r.
  • FIG. 10 is an explanatory diagram for explaining a height shape signal, a Z height signal, a Z approximate circle radius signal, and a defect determination threshold value.
  • FIG. 11 is an explanatory diagram illustrating sensitivity characteristics of height signal inspection and approximate circle signal inspection.
  • FIG. 12 is a schematic view showing the surface shape of the PDP back plate application direction and the spot measurement position. ⁇ 13] It is a schematic diagram showing the surface shape of the PDP back plate application direction and the width measurement position.
  • Spot 14 is an explanatory diagram for explaining the relationship between the Z wide measurement position and the inspection sensitivity.
  • ⁇ 16 An explanatory diagram explaining the relationship between the elapsed time after applying the phosphor paste and the surface height.
  • ⁇ 17 An explanatory diagram explaining the fixed threshold and the individual threshold in the inspection signal.
  • FIG. 19 is an explanatory diagram for explaining a difference threshold in a difference processing waveform of an inspection signal.
  • FIG. 20 is a schematic configuration diagram showing an inspection device incorporated in the same body as the coating device.
  • ⁇ 21] It is a schematic plan view showing substrate transport and substrate stop by a roller transport machine.
  • FIG. 22 is a schematic plan view of a roller transporter showing a substrate movement type measuring apparatus provided with a substrate position regulating means.
  • ⁇ 23 It is a schematic plan view of a roller transporter showing a sensor moving type measuring device provided with a substrate position regulating means.
  • FIG. 24 is a schematic plan view of a roller transporter showing an inspection apparatus provided with substrate position recognition means and position correction means.
  • FIG. 25 is a schematic plan view of a roller transporter showing an inspection apparatus provided with two height measuring means and a distance adjusting means.
  • FIG. 26 is a schematic configuration diagram showing an inspection apparatus provided with a substrate back surface height measuring means.
  • FIG. 27 is a schematic configuration diagram showing a detection apparatus in which the measurement point of the height measurement means is installed at the contact point between the substrate and the substrate transfer means.
  • FIG. 28 is a schematic configuration diagram showing an inspection apparatus provided with two height measuring means and an interval adjusting means.
  • FIG. 29 is an explanatory diagram for explaining measurement errors of a discrete height signal and a height signal after correction using a conic curve.
  • FIG. 31 is an explanatory diagram for explaining a measurement error of a discrete height signal, a height signal value after correction by moving average processing, and a height signal after correction by a conic curve.
  • FIG. 32 is an explanatory diagram for explaining measurement results and measurement errors when performing correction using the moving average process and when performing correction using a conical curve.
  • FIG. 1 shows a basic configuration of a display panel, particularly a plasma display panel (hereinafter sometimes abbreviated as PDP), which is an object of the present invention.
  • PDP plasma display panel
  • a dielectric layer 14 having address electrodes 12 disposed thereon is provided on a back glass substrate 13, and a partition wall (vertical rib) 11 is provided on the dielectric layer 14, and an RGB phosphor layer 42r therebetween.
  • 42g, 42b, and a front plate 2 having a dielectric layer 22 on which a display electrode 23 is disposed and a protective film 24 interposed therebetween.
  • the discharge space 15 is filled with a mixed gas such as neon or xenon.
  • a mixed gas such as neon or xenon
  • the display electrode 23 when a voltage is applied between the display electrode 23 and a certain address electrode 12a, plasma 101 is generated in the discharge space 15, and the phosphor at the selected position emits light, and the display light is transmitted through the front plate 2. 102 is emitted.
  • the desired color display is performed by the combination of the light emission of each phosphor.
  • FIG. 2 shows a basic manufacturing flow of the PDP back plate.
  • 31 is a cleaning / drying process
  • 32 is a pattern electrode forming process
  • 33 is a dielectric layer forming process
  • 34 is a partition wall forming process
  • 35 is a phosphor coating process
  • 36 is a coating process state inspection process
  • 37 is The phosphor drying process and 38 are defect correction processes, respectively, and the present invention mainly relates to the coating process state inspection process.
  • FIG. 3 shows a PDP back plate in which no phosphor is configured.
  • Separate ribs (horizontal ribs) 16 are formed in the grooves separated by the barrier ribs (vertical ribs) 11 to form grooves 17 with horizontal ribs.
  • the phosphors are formed at intervals of two for one color along the lateral ribbed groove 17.
  • 18 shows one cell surrounded by the vertical rib 11 and the horizontal rib 16.
  • the groove width of each of the RGB phosphors is different, but the present invention is not limited to this. Further, the present invention can be applied to a PDP back plate in which the partition walls (lateral ribs) 16 are not formed.
  • FIG. 4 shows a state in which the groove 17 with the lateral ribs is filled with a liquid material (hereinafter also referred to as a phosphor paste).
  • a liquid material hereinafter also referred to as a phosphor paste.
  • it corresponds to the lateral rib groove 17 to be filled with the phosphor paste 40b.
  • the phosphor paste generally has a relatively high viscosity, and the shape of the surface changes immediately after filling the groove 17 with the lateral ribs. Finally, as shown in FIG. The bottom and the vicinity of the partition wall (both vertical ribs and horizontal ribs) reach a bowl shape with a high portion and become a steady state. This is called “repelling” and forms a bowl shape as described above unless the filling amount is lowered beyond a certain amount. When the filling amount becomes extremely small or becomes completely zero, the coating is lost 41b ".
  • FIG. 7 shows a method for measuring the shape of the substrate using the height measuring means.
  • the removal of coating due to nozzle clogging continues until the point where coating omission occurs on the substrate up to the point where the coating is completed, and continues to occur in the groove 17 with the lateral ribs on the next substrate.
  • a displacement gauge 50a with a spot-like measurement area (for example, Keyence Corporation, LT8000 series ( ⁇ 2 ⁇ m), Keyence Corporation, LC series (20 X 30 m), etc.), liquid material is applied. It is necessary to scan between adjacent partition walls (lateral ribs) 16 like dl over the entire length of the substrate in a direction crossing all the grooves 17 with transverse ribs. Details will be described later.
  • a spot-like measurement area for example, Keyence Corporation, LT8000 series ( ⁇ 2 ⁇ m), Keyence Corporation, LC series (20 X 30 m), etc.
  • Displacement meter 50b for example, Z300 series, manufactured by OMRON Corporation whose measurement area is one-dimensional wide (Field width lmm), manufactured by Keyence Corporation, LT9000 series (field width within 2mm variable), etc.) force to scan across the entire length of the substrate in the direction across all grooved ribs 17 coated with liquid material
  • LT9000 series field width within 2mm variable
  • cl is the cross-sectional line base point in the transverse rib direction
  • cl ' is the end point of the cross-sectional line in the transverse rib direction
  • c2 is the cross-sectional line in the longitudinal rib direction (normal application)
  • c2' is the cross-sectional line in the longitudinal rib direction (normal application) End point
  • c3 is the longitudinal rib cross-section line (abnormal application) base point
  • c3 ' is the longitudinal rib cross-section line (abnormal application) end point
  • dl is a straight scan example
  • d2 is an oblique scan example
  • swl is the sensor scan width Sw2 indicates the sensor field width.
  • a general displacement sensor operates at a constant response frequency.
  • data on the substrate shape is discretely acquired (sampled).
  • the sampling interval is determined by the sensor response frequency and the sensor scanning speed.
  • FIG. 9 shows the sampling timing and the obtained discrete height shape signal 61 when the portion where the coating amount is reduced due to nozzle clogging is measured.
  • the discrete height shape signal 61 is a signal obtained by connecting height measurement results of the substrate surface obtained by discrete height measurement. As can be seen from Fig. 9, if the lowest part of the liquid material, which is the control index, cannot be measured, it becomes a measurement error (difference from the true value).
  • the cl-cl 'cross-sectional shape of the liquid material filled here depends on the surface tension of the liquid material. It is known from past experiments that a smooth curve is drawn and becomes a part of a conical curve to reach a steady state.
  • the conic curve is a curve that becomes a boundary of a cross section when the cone is cut along an arbitrary plane.
  • a circle a plane that intersects all the generatrix lines and is parallel to the bottom surface).
  • the surface shape of a liquid material can be approximated by a circle, based on the sampling signal inside (approximate area dw) of the peak part (the top of the partition wall) of the two power points in the discrete height signal 61, these are converted into circular arcs.
  • the height shape signal 62 is obtained as shape data close to the actual liquid material surface.
  • the height shape signal 62 is a signal obtained by approximating between discrete height shape signals by an arc of an approximate circle.
  • dw is the approximate region
  • r is the approximate circle radius
  • PL is the paste surface level
  • KL is the reference surface level
  • h is the paste height (PL-KL)
  • 60a is outside the approximate region.
  • Discrete height shape signal 60b is the discrete height shape signal in the approximate region
  • 60c is the approximate circle
  • 60d is the height shape signal in the approximate region (approximated)
  • 61 is the discrete height shape signal (as above) 60a + 60b) and 62 indicate the height shape signals (60a + 60c) as described above.
  • Fig. 10 shows a height shape signal 62 and a height signal 63 (a signal obtained by extracting the bottom height of each liquid material from the height shape signal and connecting them to correspond to each liquid material) and an approximate circle radius signal.
  • 64 A signal obtained by obtaining an approximate circle with the signal portion of each liquid material as an arc from the height shape signal and connecting the diameter of the approximate circle so as to correspond to each liquid material
  • the defect judgment threshold inspection signal
  • a threshold value for determining the presence / absence of a defect is a cross-sectional view of FIG. 8 with a height shape signal 62 superimposed thereon
  • (b) is a waveform in which only the vertical axis is enlarged for easy viewing.
  • the lowest part of the liquid material and the reference surface are considered for each of the plurality of liquid materials applied. Is obtained, and as shown in (c), these are connected for each liquid material to obtain a height signal 63.
  • This height signal 63 is used as an inspection signal (a signal for determining the presence / absence of a defect with a predetermined threshold (including both a height signal and an approximate circle radius signal)), and a defect determination threshold thh is set to set a defect.
  • Part signal 63, 63b "is specified.
  • FIG. 29 and FIG. 30 The effect of approximating the discrete height shape signal by the conic curve will be described in detail using FIG. 29 and FIG. 30 as an example where the cl-cl ′ cross-sectional shape of the liquid material can be approximated by a circle.
  • the minimum part of the liquid material cannot be measured because the discrete measurement interval was widened to shorten the time required for the inspection, the distance between the discrete height measurement signal 60b and the actual minimum part of the liquid material is not measured. Measurement error Em occurs.
  • the discrete height shape signal is approximated by a circle that is a conic curve and the approximated height shape signal 60d is obtained, the height shape signal 60d after approximation is correct! Since the height of the part is obtained, measurement can be performed with little error.
  • Cell 18 composed of partition walls (vertical ribs) 11 with a height of 120 ⁇ m arranged so that the center position of each other is 350 ⁇ m is filled with liquid material, and four discrete times Taking the case of height measurement as an example, conical curve approximation was performed, and the measurement error when no conic curve approximation was performed was calculated theoretically. The results are shown in FIG.
  • the horizontal axis of Fig. 30 is the height m) of the lowest part of the liquid material, and the left vertical axis is the measured value ( ⁇ m) corresponding to the conic curve approximation (a) No Z approximation (b).
  • the right vertical axis represents the measurement error ( ⁇ m) corresponding to the measurement error (c) obtained by subtracting the height of the lowest part of the liquid material from the measured value of the conical curve approximation (b).
  • the surface shape of the liquid material changes depending on the filling rate of the liquid material with respect to the cell capacity. In other words, the higher the liquid material filling rate, that is, the closer the liquid material minimum height is to the partition wall height, the closer the surface shape of the liquid material is to the flat surface. The lower the filling rate, that is, the closer the bottom of the liquid material is to the bottom of the cell, the closer the surface shape of the liquid material is to a circle with a small curvature, so the measurement error Em without a conic curve approximation increases.
  • the cell is filled with the liquid material so that the minimum height of the liquid material is 80 to 100 ⁇ m. It should be noted that if there is a problem with the liquid material filling state in the cell, this will lead to display failure when the panel is commercialized, and the minimum value of the liquid material is the design value as the limit value for good products. On the other hand, it must be within ⁇ 10 m. In other words, the inspection apparatus according to the present invention needs to perform defect generation processing when a liquid material filled with a minimum height exceeding the design value ⁇ 10 m is found. However, as shown in Fig.
  • the noise generated in the measurement signal may include not only the vibration effect of the equipment but also the noise of the measuring equipment itself, such as the power supply of each device and the inverter of the neighboring equipment. In the following, vibration and electrical noise are collectively used as noise.
  • Moving average processing is a kind of frequency filter generally used in the field of signal processing, and signal power is also an effective technique for removing noise of a specific period.
  • the wavelength of the noise to be removed is used, the number of signals corresponding to the distance is selected for the Nth signal Y to be processed and the distance before and after Y is selected. Average the values and replace the obtained average value with the signal value of the Nth signal Y to be processed. Next, the same processing is performed for the (N + 1) th signal Y ' ⁇ , and thereafter, this processing is performed as necessary until the final end of the signal. Repeat the process.
  • the wavelength ⁇ of noise generated in the measurement signal is larger than the width near the lowest part of the liquid material to be measured. Information will also be lost.
  • the discrete height measurement signal 60b is obtained as the measurement signal. It is done.
  • the measurement signal considering that noise is generated in the measurement signal, it is preferable to obtain a height shape signal from the most appropriate approximate circle using as many signals as possible. Furthermore, the measurement signal causing the noise before approximation is discarded, and the approximate curve is made the height shape signal 60d. Since the minimum height of the normal liquid material is obtained from the approximated height shape signal 60d, the influence of noise can be eliminated as a result, and accurate measurement is possible.
  • a bulk material (vertical rib) 11 with a height of 120 ⁇ m is placed in a cell 18 configured so that the distance between the center positions is 350 ⁇ m.
  • m m the theoretical value was calculated for the measurement error when the conical curve approximation was performed and when the moving average correction was performed.
  • the results are shown in FIG.
  • the horizontal axis in Fig. 32 represents the noise wavelength as a multiple (multiple) of the center position interval between the bulkheads (vertical ribs) 11, and the left vertical axis represents when conic curve approximation is performed.
  • the actual minimum height for the design value is 10 m as the limit of quality assurance for filling with liquid material.
  • the noise generated at the actual manufacturing site varies, but if the noise has a wavelength ⁇ that is sufficiently short relative to the width of the lowest part of the liquid material to be measured, the moving average processing is performed by shortening the discrete measurement interval. There are few errors by doing! Measurements can be made. For example, from Fig. 32, if the noise wavelength ⁇ is about 0.15 times the interval between the ribs (longitudinal ribs) 11, the measurement error (f) can be suppressed to within 1 ⁇ m. Is fully practical.
  • Measurement error (f) is 9.5 / zm, which is not suitable for practical use.
  • the conic curve approximation is performed, no measurement error is theoretically generated, so that highly accurate measurement and inspection are possible.
  • the approximate circle radius r obtained when the approximate circle is obtained is calculated for each of the plurality of applied liquid materials, and the approximate circle radius signal 64 is obtained continuously.
  • the approximate circle radius signal basically tends to decrease as the filling amount decreases.
  • the bottom of the groove 17 with the lateral rib is flat. Because it is, it becomes extremely large.
  • FIG. 12 shows the cross section in the same direction (position).
  • FIG. 12 shows the spot measurement displacement sensor 50a, and the scanning direction of the displacement sensor 50a is the front side of the paper surface and the back side.
  • the surface shape of the liquid material becomes a bowl shape in the cell (space divided by the partition wall (vertical rib) 11 and the partition wall (horizontal rib) 16) by leveling.
  • cl-cl takes the shape of an arc of an approximate circle in the direction of the cross-section line, but c2-c2' (c3-c3 ') (Horizontal rib) It becomes a shape that becomes a slope in the vicinity of 16.
  • the height of the lowest part of the liquid material is accurately measured at the cell center ⁇ . Force that can be output A higher value than the actual value is output at the cell edge pi.
  • the cell center ⁇ can accurately measure the height of the lowest part of the liquid material. A higher value than the actual value (normal part height) is output at the end pl and on the side rib p2, which may cause a defect to be overlooked. Therefore, it is necessary that the scanning of the sensor be within the sensor scanning width swl, and it is experimentally shown that the accuracy is preferably within ⁇ 35% with respect to 16 intervals between the partition walls (lateral ribs).
  • a specific method for storing the sensor scan width in swl will be described.
  • a roller transport machine generally used in the process of manufacturing a glass substrate for a display as the substrate moving means 206 when holding the substrate for the main measurement or moving the substrate to realize sensor scanning.
  • the roller transporter is configured such that a plurality of cylindrical rollers 201 are arranged on a rotating shaft 200 at a predetermined pitch so that the cylindrical side faces a direction perpendicular to the longitudinal direction of the shaft.
  • a plurality of core shafts 202 are further installed at a predetermined pitch in a direction in which the substrate traveling direction 203 and the roller axis longitudinal direction are perpendicular to each other.
  • the scanning of the spot displacement sensor 50a is realized by moving the sensor by the sensor moving means 231 while the substrate is stopped on the substrate moving means 206, the sensor is not scanned. Applying force, apply the substrate position restricting means 230 to the four sides of the stopped substrate ⁇ , and restrict the relative position of the substrate to the sensor and the tilt in the rotation direction with the axis perpendicular to the substrate surface as the central axis.
  • the scanning locus 51a of the spot displacement sensor 50a can be stored in sw1.
  • the position regulating means 230 may remain applied to the substrate, or the substrate force may be separated.
  • the position of the height measuring means is determined based on the board position recognition means and the board position information.
  • a method using the scanning position correcting means for correcting will be described. First, as shown in FIG. 24, when the scanning of the spot displacement sensor 50a is realized by moving the substrate Id using the substrate moving means 206, the substrate position recognizing means 240 measures the edge position of the substrate as needed, and the time elapses.
  • Substrate edge position change force accompanying the calculation of the meandering of the substrate and the tilt in the rotation direction with the axis perpendicular to the substrate surface as the central axis, and the position of the swl, which is the measurement region, is determined from the obtained information as needed.
  • the spot displacement sensor 50a can be corrected and moved in the correction direction 203 "so that the scanning locus 51a of the spot displacement sensor 50a is within the swl by the scanning position correcting means 241.
  • the effect of the above-mentioned scanning position correction is that the substrate is stopped on the substrate moving means 206, and the scanning of the spot displacement sensor 50a is not shown!
  • the sensor moving means moves the sensor in the sensor moving direction 203 '. This can also be achieved by moving the substrate position recognizing means 240 by a substrate recognizing means moving means (not shown) in synchronization with the movement of the sensor.
  • a method using two or more height measuring means and a sensor interval adjusting means is used.
  • two height measuring means are used, and scanning of the first spot displacement sensor 50a and the second spot displacement sensor 50a 'is realized by moving the substrate Id using the substrate moving means 206.
  • the interval adjustment means 250 the measurement points of the first spot displacement sensor 50a and the second spot displacement sensor 50a 'are added to the integral multiple of the transverse rib interval and half the transverse rib interval. Adjust in the direction of the distance adjustment direction 203 "'so that it is separated by the distance.
  • the sensors For inspection, it is preferable to install the sensors as close to each other as possible so that the sensor head housings do not interfere with each other. If the sensor position is adjusted as shown in Fig. 2, either one of the sensors must be positioned between the horizontal ribs even if the board meanders geometrically or tilts in the direction of rotation about the axis perpendicular to the board surface. Measure within ⁇ 25% of the center of And thus that can. That given the example of FIG.
  • the region 251a first spot displacement sensor 5 0a scan trajectory 51a is contained within the scanning width swl, region 251b in the second spot displacement sensor
  • the scan trajectory 51a 'of the sensor 50a' is included in the scan width swl '
  • the scan trajectory 51a of the first spot displacement sensor 50a is included in the scan width wl "'.
  • the effect of using the above two sensors is illustrated by the first spot displacement sensor 50a and the second spot displacement sensor 50a while the substrate is stopped on the substrate moving means 206.
  • the same effect can be obtained by moving the sensor and the distance adjusting means 250 in the moving direction 203 ′ with the moving means that does not.
  • the number of sensors is not limited to two.
  • Fig. 13 shows a wide displacement sensor 50b instead of the spot measurement displacement sensor 50a.
  • the scanning direction of the displacement sensor 50b is from the front side to the back side.
  • the wide displacement sensor 50b outputs an average value of the height within the sensor visual field width sw2.
  • the sensor visual field width sw2 is set to one partition (horizontal rib) 16 intervals (adjacent horizontal). (Distance between rib centers), the sensor field of view sw2 is always one cell 18 and one cell even if the sensor measurement position is cell center p0, cell edge pl, and horizontal rib p2.
  • the partition wall (lateral rib) 16 is included. Therefore, there is a difference between the average height of the normal part and the average value of the abnormal part, so that these can be distinguished.
  • the wide sensor 50b outputs a height profile within the sensor visual field width sw2, and the sensor visual field width sw2 is divided into one partition (lateral rib) 16 width + partition (lateral rib) 16 in the same manner as described above.
  • the sensor field of view sw2 always has one cell 18 and one partition wall (horizontal rib) even if the sensor measurement position is cell center p0, cell edge pl, and horizontal rib top p2. ) 1 6 will be included. Therefore, the profile shape force can also specify the cell center and output the measurement result of the cell center. In other words, the cell center ⁇ data can always be acquired, In theory, the cell edge pi and lateral rib p2 data are not used for measurement.
  • FIG. 14 shows a result image when the displacement sensor 50 is scanned with coarse accuracy as shown in FIGS. 12 and 13 (oblique scanning d2).
  • the spot measuring sensor 50a When the spot measuring sensor 50a is used, the normal part can be normally judged.
  • the cell edge part pl and the horizontal rib p2 are overlooked.
  • high-sensitivity measurement can be expected, which is more preferable.
  • a substrate back surface measuring means 50c capable of measuring the height of the substrate back surface as shown in FIG. Fig. 26 (a) shows the measurement system of the lateral force relative to the relative movement directions 203 and 203 'of the substrate Id and the height measuring means 50, and Fig. 26 (b) shows the substrate Id and the height measuring means 50. Relative moving directions 203 and 203 ′ forces are also observed in the measurement system.
  • the fixed height measuring means 50 is the surface information of the substrate.
  • the surface information includes the vertical movement information of the substrate.
  • the back surface height measuring means 50c obtained acquires the back surface information of the substrate, and this back surface information includes only the vertical movement information of the substrate. Therefore, the base obtained by the height measuring means 50 When the substrate back surface information obtained by the back surface height measuring means 50c is subtracted from the plate surface information, only the substrate vertical movement information is removed from the substrate surface shape with high accuracy.
  • the measurement point of the height measuring means 50 and the measurement point of the back surface height measuring means 50c are preferably positioned at the same point on the substrate plane! /.
  • the above effect is obtained by using the height measuring means moving means 260a and the back surface height measuring means moving means 260b to move the substrate Id and the height measuring means 50 relative to each other. This can also be obtained when the measuring means 50c is moved in synchronization with the sensor moving direction 203 '.
  • the vertical movement information of the substrate included in the measurement information of the height measuring means 50 and the back surface height measuring means 50c is mainly due to the deflection of the substrate Id that does not actually vibrate up and down. Become.
  • a space 261 may be provided so that there is no obstacle at the scanning position of the back surface height measuring means 50c.
  • the measurement point of the height measurement sensor 50 is an area where the substrate moving means 206 and the substrate Id are in contact with each other. It is also preferable to install at 262.
  • Fig. 27 (a) is a view of the measurement system observed from the side with respect to the relative movement directions 203 and 203 'of the substrate Id and the height measuring means 50
  • Fig. 27 (b) is the substrate Id and the height measuring means 50. It is the figure which observed the measuring system from relative movement direction 203 and 203 'of the.
  • the relative movement between the substrate Id and the height measuring means 50 is realized by moving the substrate Id in the substrate moving direction 203 using the substrate moving means 206, the fixed height measuring means 50 becomes the substrate moving means.
  • the substrate moving means By performing measurement in the area 262 where the substrate 206 and the substrate Id are in contact, surface information can be acquired in a state in which vertical vibration due to substrate deflection is suppressed.
  • the above effect is obtained by using the height measuring means moving means 260a to move the height measuring means 50 in synchronization with the sensor moving direction 203 'using the relative movement between the substrate Id and the height measuring means 50. It can also be obtained if realized. In this case, it is necessary that the substrate back surface corresponding to the substrate surface scanned by the height measuring means is in contact with the substrate moving means 206 over the entire scanning area. Specifically, the measurement is performed by placing the substrate in contact with a high-precision table. Just do it.
  • roller transport machine As a substrate table when holding the substrate for the main measurement or moving the substrate to realize sensor scanning.
  • scope of application of this technology is not limited to roller transporters.
  • Fig. 15 shows the leveling behavior of the paste.
  • the figure shows the substrate cross-sectional shape (in the same direction as c2-c2 'and c3-c3') immediately after filling with the liquid material and after leveling.
  • the liquid material immediately after filling the liquid material is filled not only in the cells 18 but also on the partition walls (lateral ribs) 16.
  • the liquid material on the partition wall (lateral rib) 16 flows into the cell 18 according to the paste flow 43.
  • the surface height of the liquid material increases immediately after application at the cell central portion ⁇ , which is the measurement portion, and the surface height decreases at p2 on the lateral rib.
  • Figure 16 shows the relationship between time and leveling. As shown in Fig. 16, the surface height of the liquid material increases immediately after application at the cell center ⁇ , which is the measurement part, and the surface height decreases at p2 on the lateral rib, and this leveling phenomenon is completed. The time required to reach steady state is about 5 seconds experimental force. However, if the viscosity of the liquid material is changed or the design of the substrate is changed, it is necessary to re-evaluate the leveling behavior.
  • the variation in cell capacity due to the variation in the width of the partition wall (vertical rib) 11 and the partition wall (lateral rib) 16 due to variations in manufacturing conditions and manufacturing equipment capacity can be considered. Even if the filling amount of the liquid material is filled, the height of the liquid material varies depending on the cell capacity. This characteristic is due to individual differences in the substrate due to the manufacturing process (under certain manufacturing conditions, the partition wall width at the edge of the substrate is always narrower and the partition wall width at the center of the substrate is larger).
  • liquid material height variation due to individual differences in coating nozzles and substrates is not a defect (abnormal coating process) unlike the height variation due to nozzle clogging. .
  • FIG. 17 shows an inspection signal and a fixed threshold value a and a variation threshold value ⁇ for defect determination.
  • s is, for example, M + 3rd paste height (OK), t is M + 6th paste height (OK), t "is M + 6th paste height (NG), u is M + 9th paste height (OK), u "is M + 9th paste height (NG) Yes.
  • This automatic variation threshold y is used as a threshold by calculating a moving average signal of the inspection signal itself (a signal obtained by moving average processing of the inspection signal itself).
  • the difference value between the N + 2 measurement result and the N + 1 measurement result shown in Fig. (E) changes greatly, and if the difference threshold ⁇ is set! / The defect can be detected normally.
  • the reference data that takes the difference from the data to be measured it is also preferable to use the average of the data for multiple sheets rather than the data for only the previous board as described above.
  • the above Z-inspection techniques can be used as they are. Loss when NG occurs. Inspection timing and target substrate can be selected based on the number of substrates, manufacturing tact, and inspection accuracy. In other words, if it is important to reduce the number of lost substrates when NG occurs, the above inspection should be performed on all PDP backplates every time liquid material is applied. If tact-up is aimed at, after applying the liquid material to all the PDP back plates on the mother glass substrate lb, the above-mentioned inspection may be performed only on the representative substrate, or the mother glass substrate lb. After applying the liquid material to all of the upper PDP backplates, multiple displacement sensors are All the substrates may be inspected simultaneously using a sensor. If the inspection accuracy is important, after applying the liquid material to all the PDP back plates on the mother glass substrate lb, the height measurement means 50 is applied to the representative substrate only at high speed at low speed. It is preferable to perform measurement by scanning with low vibration.
  • the surface shape of the substrate is measured for this purpose. Therefore, trend measurement is performed on the surface shape data of all the measured substrates, and the coating process is performed. It is also preferable to use it for nozzle operation. Specifically, for example, if the surface shape of the liquid material changes as a whole, a substrate with better quality can be manufactured by adjusting the coating pressure of the coating apparatus. Also, if the surface height of the liquid material, which cannot be said to be abnormal in the coating process, is decreasing, prepare an alternative nozzle early, and if a defect actually occurs, manufacture an NG substrate. Replace the nozzle before it ends.
  • FIG. 20 is a schematic diagram of an inspection apparatus for realizing the inspection method of the present invention.
  • FIG. 20 shows an example in which six PDP rear plates are manufactured from one mother glass substrate la (lb, lc).
  • the liquid material is sequentially applied by the two application means 74 to the mother glass substrate lb carried in by the substrate carry-in means 75L and fixed on the substrate fixing means 70.
  • the application means fixing means 73 with the application means 74 fixed can be applied while being moved by the moving means 71.
  • the application of one mother glass substrate lb is completed by two application operations three times each. To do. After coating is completed, the mother glass substrate lb is unloaded by the substrate unloading means 75UL.
  • the board fixing means 70 in addition to the XY axis position correction function, corrects the ⁇ direction (rotation direction) with the axis perpendicular to the board surface as the central axis. I also prefer to have more functions.
  • the inspection is performed on the target substrate at the timing described above after coating. That is, for example, the height measuring means moving means 72 is moved onto the substrate to be inspected by the moving means 71, and the height measuring means moving means 72 is used to scan two height measuring means 50 to form the shape of the substrate. Perform the measurement. As a result of inspection, if it is determined that there is an abnormality in the application process, the application process is stopped. , Perform recovery work. If the height measuring means fixing means 76 is provided with three height measuring means 50, the liquid material is applied to all the PDP back plates on the mother glass substrate lb, and then all the substrates are inspected. It can also be performed simultaneously.
  • the sensor scanning mechanism is preferably configured with a mechanism that suppresses vertical movement to the limit.
  • an LM guide with an air bearing and a moving mechanism composed of a linear motor can be considered.
  • FIG. 28 is a schematic view of another example of an inspection apparatus for realizing the inspection method of the present invention, and shows an example in the case of manufacturing one PDP back plate.
  • a fixing means 280 is provided in a transport section that transports the substrate from the previous process to the next process by the substrate moving means 206.
  • the fixing means 280 includes two height measuring means 50a and a height adjusting means 50a held by the interval adjusting means 250. 50a 'is provided.
  • the distance between the height measuring means 50a and 50a ' is the shortest distance at which the sensor housing does not interfere with the distance adjustment means 250, which is an integral multiple of the horizontal rib interval of the substrate to be manufactured plus half the horizontal rib interval. The distance is adjusted with the distance adjustment direction 203 "'.
  • the substrate Id is subjected to the application of the liquid material to the surface in the previous step, and is transferred in the substrate transfer direction 203 to the equipment for the next step by the substrate moving means 206.
  • a part of the surface shape of at least all of the grooves is measured by the height measuring means 50a and 50a ′ over the entire length in the longitudinal direction of the substrate.
  • the vertical vibration during substrate scanning becomes a direct measurement error and becomes a surface for high-accuracy measurement.
  • the vertical vibration effect at the time of substrate scanning is measured.
  • the thickness measuring means 50c and 50c ′ shows an example of sensor installation for the inspection equipment in this case in dotted lines. That is, if the substrate back surface information obtained by the back surface height measuring means 50c and 50c ′ is subtracted from the substrate surface information obtained by the height measuring means 50a and 50a ′, the substrate vertical movement information is accurately obtained from the substrate surface shape. Only will be removed.
  • the measurement points of the height measuring means 50 and 50a ′ and the corresponding measurement points of the back surface height measuring means 50c and 50c ′ should be positioned at the same point with respect to the substrate plane. Is preferred! /.
  • a substrate that has become NG due to a defect in the coating process can be restored as a non-defective product by correcting it with a dispenser that can be manually filled with a liquid material.
  • the PDP back plate to be measured consists of the partition walls (vertical ribs) 11 shown in Fig. 3 divided by the partition walls (lateral ribs) 16 to form cells 18, and each RGB cell with a different groove width is one.
  • One pixel of PDP is formed as a set.
  • the width of the cell 18 divided by the partition walls (lateral ribs) 16 is 950 ⁇ m, and the width of the partition walls (lateral ribs) 16 is 50 ⁇ m (the distance between the partition walls (lateral ribs 16) is 1000 ⁇ m).
  • six PDP rear plates lbl to lb6 are positioned on the mother glass substrate lb with two height measurement scanning directions x three phosphor coating directions.
  • the liquid material to be filled in the groove 17 with the lateral rib is a phosphor paste in which a phosphor material that promotes the color development of each RGB is dissolved in a solvent. In this example 1, no RG phosphor is formed.
  • B phosphor base 40b is applied to the substrate with a filling amount of 75% of the cell capacity.
  • the apparatus shown in Fig. 20 is used as an apparatus for applying the phosphor paste and an apparatus for inspecting the state of the applying apparatus.
  • First, regarding the phosphor-pased coating function Uses two coating nozzles in which a plurality of nozzle holes are arranged one-dimensionally at positions corresponding to the plurality of grooves 17 with lateral ribs to be coated with phosphors.
  • the coating means fixing means 73 for fixing the coating nozzle and the moving means 71 for moving the coating means fixing means 73 in the coating direction 19 a gantry stage having a positioning / correcting function on the XYZ axes is used.
  • the inspection function two triangulation laser displacement meters LC-2430 (manufactured by Keyence Corporation) having a spot measurement field are used as the height measuring means 50.
  • the moving means 71 for positioning the height measuring means moving means 72 and the height measuring means 72 on the substrate to be measured each has a positioning 'correction function on the XYZ axes.
  • the inspection function is configured as described above, the three height measuring means 50 and the height measuring means fixing means 76 shown above the substrate carry-out means 75UL are not necessarily required.
  • a general-purpose high-precision stage was used as the substrate fixing means 70 for positioning the mother glass substrate lb with high accuracy and correcting the positions of the XY and ⁇ axes.
  • a general-purpose co-feed transport mechanism was used as the substrate loading means 75L and the substrate unloading means 75UL for carrying the mother glass substrate la (lb, lc) into and out of the apparatus.
  • the operation of the coating function and the loading and unloading of the mother glass substrate la (lb, lc) into the equipment, the movement of the inspection function, and the scanning are performed centrally in the coating equipment operation section 78, and the height measurement is performed.
  • the processing of the electrical signal obtained by the means is carried out by the inspection device operation unit 77, and the application device operation unit 78 and the inspection device operation unit 77 are not shown in the figure so that they can communicate with each other. It is electrically controlled by PLC.
  • the inspection device operation unit 77 is not shown to perform signal processing !, a general-purpose personal computer as a signal processing means, a keyboard serving as an interface with an operator, a mouse, a monitor for outputting measurement results and inspection results, and the like.
  • An output device is provided.
  • the mother glass substrate lb carried on the high precision stage 70 by the roller transport mechanism 75L is fixed on the high precision stage 70 by vacuum suction, etc., and then the XY and ⁇ axes are finely adjusted. It is adjusted and positioned at a predetermined position.
  • the phosphor coating nozzle 74 is positioned by the gantry 73 and the gantry stage 71 at the coating start position (for example, the end of the PDP rear plate lbl and lb2 in the X axis origin direction direction) and finely adjusted in the XYZ axis direction.
  • the phosphor paste is applied to a predetermined position over the entire length of the substrate by moving continuously toward the application completion position (for example, the opposite end of the PDP back plate lbl and lb2 in the X-axis origin direction).
  • the mother glass substrate lb in FIG. 20 is coated with the phosphor paste on the PDP back plate lbl and lb2 by the coating operation, and the PDP back plates Ib3 to lb6 are in the stage where the phosphor paste is not applied.
  • Example 1 in order to minimize the number of NG substrates that are manufactured when clogging occurs in the coating nozzle, all substrates should be measured and inspected each time. To do.
  • the outline of the operation is as follows: loading of the mother glass substrate lb ⁇ application of PDP rear panel lbl and lb2 ⁇ inspection of PDP rear panel lbl and lb2 ⁇ application of PDP rear panel lb3 and lb4 ⁇ application of PDP rear panel lb3 and lb4 Inspection ⁇ PDP rear plate lb5, lb6 application ⁇ PDP rear plate lb5, lb6 inspection ⁇ Mother glass substrate lb unloading.
  • the substrate manufacturing conditions are set such that the B phosphor paste is applied at a filling amount of 75% of the cell capacity. Therefore, the discrete height shape signal is used as the inspection signal.
  • the height signal obtained from the height shape signal approximated by an approximation method using a parabola that is one of the conic curves is used, and the defect judgment threshold thh is taken into account the variation in the hole diameter of the coating nozzle. , Individual threshold manually adjusted) 8) was applied.
  • the phosphor paste has been smoothly applied to the substrate since the start of production.
  • coating on the substrate carry-out side
  • the Mlth hole of the cloth nozzle was clogged with dust mixed in the nozzle during nozzle assembly, resulting in a decrease in the coating amount.
  • the filling amount of the phosphor paste in the Ml-th lateral rib groove 17 corresponding to the Ml-th hole decreases from about 75% to about 70%, and the surface height h of the lowest part of the paste h Decreased from around 75 ⁇ m to around 65 ⁇ m.
  • the M2 hole of the coating nozzle on the substrate carry-in side is completely coated with dust mixed in the phosphor paste during phosphor paste manufacturing. It became impossible. As a result, the phosphor paste was missed in the M2th groove with lateral ribs 17 corresponding to the M2th hole.
  • the inspection device detected these normally, and once the coating device was stopped and the coating nozzle was replaced quickly, the process could be quickly restored to normal with a minimum number of NG substrate losses. While the coating was being performed smoothly, false detection / overdetection by the inspection device did not occur.
  • Example 1 the manufacturing conditions of the substrate were reset so that the phosphor paste B was applied at a filling amount of 90% with respect to the cell capacity.
  • an approximate circle radius signal obtained using a circle that is one of conic curves is used as an inspection signal to approximate the discrete height shape signal, and the defect determination thresholds thrl and thr2 are determined from both ends of the substrate.
  • the moving average signal of the inspection signal itself is automatically obtained and adjusted based on this
  • the variation threshold ⁇ applied was applied.
  • the relationship of Fig. 16 is used to prevent a drop in inspection accuracy due to the measured force paste leveling operation by starting scanning with a laser displacement meter from the part 2 seconds after application.
  • the height shape signal was corrected by holding and the inspection was carried out.
  • the phosphor paste has been successfully applied to the substrate since the start of production.
  • the third hole of the coating nozzle on the substrate carry-in side is clogged with dust mixed in the phosphor paste during phosphor paste manufacturing, resulting in a decrease in the coating amount. did.
  • the filling amount of the phosphor paste in the third groove 17 with the horizontal rib corresponding to the third hole is reduced to about 90% force 85%, and the approximate circle radius r of the paste surface shape is about 400 m.
  • Inspection device Detected this normally, and stopped the coating device and quickly cleaned the coating nozzle, so that the process could be quickly restored to normal with the minimum number of NG substrate losses. While the coating was performed smoothly, there was no false detection by the inspection device.
  • Substrate unloading means Install a frame with sufficiently high rigidity as height measuring means fixing means 76 on the upper part of 75UL, and as height measuring means 50, the same width as cell 18 and one partition (lateral rib) 16 width 1000
  • Three wide laser displacement meters 50b with m measurement area and set to output the average height in the measurement area were installed.
  • this wide laser displacement meter for example, a triangulation laser shape measurement sensor Z300-S10 (OMRON) having a measurement field of view can be used.
  • the inspection function is configured as described above, the two laser displacement meters and the gantry stage 72 having a spot field as the height measuring means 50 used in the second embodiment are not necessarily required.
  • Example 3 as described above, for the substrate manufacturing tact-up, the mother glass substrate lb is unloaded after all the PDP rear plates lbl to lb6 have been applied on the mother glass substrate lb.
  • the substrate surface of all substrates is measured by a laser displacement meter fixed above and inspection is performed.
  • the outline of the operation is as follows: import of the mother glass substrate lb ⁇ application of the PDP rear panel lbl and lb2 ⁇ application of the PDP rear panel lb3 and lb4 ⁇ application of the PDP rear panel lb5 and lb6 ⁇ export of the mother glass substrate lb ⁇ PDP back plate lbl ⁇ lb6 inspection.
  • Example 3 phosphor paste can be applied to all PDP backplates without waiting for the inspection time, and precise positioning of the sensor scanning trajectory by the gantry stage is not necessary. In addition, all board inspections can be performed together at the same time, making it possible to significantly reduce the board manufacturing tact.
  • the defect determination thresholds thrl and thr2 are measured taking into account the manufacturing condition of the substrate due to the characteristics of the drying furnace, where the partition walls (vertical ribs) 11 tend to gradually increase from both ends of the substrate to the vicinity of the center. Obtain the average value of the inspection signals of the 10 substrates before the measurement of the target substrate, and calculate the difference between the average value of the inspection signal and the inspection signal obtained from the target substrate. The difference threshold ⁇ was applied and the test was carried out.
  • the phosphor paste has been smoothly applied to the substrate since the start of production.
  • the fourth hole of the coating nozzle on the substrate carry-out side was clogged with aggregates generated in the phosphor paste itself, and the coating amount decreased.
  • the filling amount of the phosphor paste in the fourth groove 17 with the lateral rib corresponding to the fourth hole decreased from about 90% to about 80%, and the approximate circular radius r of the paste surface shape was 400 m. It decreased from around to 210 m.
  • the inspection device detected this normally, and the coating device was stopped and the coating nozzle was quickly washed to quickly restore the process to normal. While the coating was being performed smoothly, false detection / overdetection by the inspection device did not occur.
  • Example 1 the surface shape data of the substrate was temporally managed and compared in the order of measurement and inspection. As a result, the entire surface of the substrate was changed at the timing of switching the phosphor paste lot. It was found that the height h of the lowest part of the phosphor paste was increased. It was judged that this was caused by a decrease in paste viscosity due to phosphor paste manufacturing variations, and when the application pressure of the applicator was adjusted, the state before the lot change was restored. Of the two coating nozzles, the surface height h of the lowest part of the paste decreases in the M5th groove 17 with the lateral rib corresponding to the M5th hole of the coating nozzle on the substrate carry-in side. I was strong. On the other hand, clogging of the coating nozzle could be prevented beforehand by cleaning the nozzle hole as soon as possible.
  • Example 6 While applying the phosphor paste to the PDP back plate lb2 on a certain mother glass substrate lb in the form of Example 3 above, the phosphor is applied to the M6th hole of the coating nozzle on the substrate carry-out side.
  • the body paste was manufactured, dust mixed in the phosphor paste was clogged and the coating amount was reduced.
  • the inspection equipment detected this normally, but the PDP back plates lb2, lb4, and lb6 on the substrate carry-out side on the mother glass substrate lb became NG substrates. However, this NG substrate was extracted from the process, fixed on a table for correction, and corrected with a dispenser that can be manually filled with liquid material.
  • the PDP back plate to be measured consists of the partition walls (vertical ribs) 11 shown in Fig. 3 divided by the partition walls (lateral ribs) 16 to form cells 18, and each RGB cell with a different groove width is one.
  • One pixel of PDP is formed as a set.
  • the width of the cell 18 divided by the partition wall (lateral rib) 16 is 900 ⁇ m, and the width of the partition wall (lateral rib) 16 is 50 m.
  • one PDP back plate Id is produced on one glass substrate.
  • the liquid material 40b filled in the groove 17 with the lateral rib is a phosphor paste in which a phosphor material that promotes the color development of each RGB is dissolved in a solvent, and in this Example 6, an RG phosphor is constructed, and the substrate In contrast, consider the case where B phosphor paste is applied at a filling amount of 75% of the cell capacity.
  • a coating device (not shown) is used as a device for applying the phosphor paste, and a device shown in Fig. 28 is used as a device for inspecting the state of the coating device.
  • the height measuring means 50 for the inspection apparatus two triangulation type laser displacement meters LK-G10 (Keyence) having a spot measurement field are used (spot displacement sensors 50a and 50a,). Further, a general-purpose automatic single-axis stage is used as the distance adjusting means 250 for adjusting the distance between the spot displacement sensors 50a and 50a ', and is attached to the sensor frame as the fixing means 280. Further, the field of view of the spot displacement sensors 50a and 50a 'is set on a roller 201 which is a part of a roller transfer machine as the substrate transfer means 206, and the measurement point interval of both sensors is set in advance before the inspection. It is set to 63450 m by adjusting means 250.
  • the electrical signal obtained by the height measuring means 50 is processed by the inspection device operation unit 281.
  • the inspection device operation unit 281 further includes an input / output device such as a general-purpose personal computer (not shown) that performs signal processing, a keyboard that serves as an interface with an operator, a mouse, and a monitor that outputs measurement results and inspection results. Prepare.
  • the phosphor is applied to the substrate surface by a coating machine.
  • a coating machine the potential of a nozzle coating type coating machine with the mechanism described in Example 1 is considered.
  • Example 6 it is assumed that a single substrate is used. It is designed for single-sheet application corresponding to. Specifically, it has only one application nozzle and one sheet Each time a minute application operation is completed, the substrate is discharged and a new substrate is carried in.
  • the substrate Id is transported to the subsequent process by the roller transporting machine 206, which captures the surface shape of the substrate being transported.
  • a height measuring means 50 is installed on the conveyor.
  • the manufacturing condition of the substrate is set so that the phosphor paste B is applied at a filling amount of 75% with respect to the cell capacity. Therefore, the discrete height shape signal is used as the inspection signal.
  • Height shape signal force obtained by approximating method using a parabola that is one of the conic curves The height signal obtained is used, and the defect judgment threshold value thh is manually and individually considered in consideration of the hole diameter variation of the coating nozzle. An adjusted individual threshold of
  • the signal obtained when scanning on the partition wall (lateral rib) 16 is excluded from the signals obtained from the two spot displacement sensors 50a and 50a ', and either of the spot displacement sensors 50a and 50a' is within the scanning width. Implemented signal processing that extracts the signals when scanning and connects them.
  • the phosphor paste has been applied to the substrate smoothly since the start of production.
  • the M7th hole of the application nozzle was clogged with dust mixed in the nozzle during nozzle assembly, resulting in a decrease in coating amount.
  • the filling amount of the phosphor paste in the M7th laterally ribbed groove 17 corresponding to the M7th hole decreased by about 75% force and 60% before and after, and the surface height h of the lowest part of the paste was 75 ⁇ m. It decreased from around 30 to around 32 ⁇ m.
  • the inspection device detected these normally, and stopped the coating device and quickly replaced the coating nozzle, so that the process could be quickly restored to normal with the minimum number of NG substrate losses.
  • no false detection / overdetection by the inspection machine occurred.
  • Example 6 the measurement field of view of the spot displacement sensors 50a and 50a ′ is transferred to the substrate.
  • the force on the roller 201 which is a part of the roller transport machine as the feeding means 206, was also removed, and the configuration was changed so that the substrate could be measured by sandwiching the substrate between the two substrate back surface height measuring means 50c and 50c ′.
  • signal processing that eliminates the substrate vertical motion signal contained in the measurement signal by subtracting the measurement signal obtained by the back surface height measurement means 50c (50c ') from the measurement signal of the spot displacement sensor 50a (50a') was added.
  • force S is considered to apply the B phosphor paste to the substrate on which the RG phosphor is not configured.
  • This is not limited to the B phosphor paste.
  • a phosphor layer of a color other than the phosphor paste to be measured may be formed in another laterally ribbed groove 17.
  • the height h may be calculated on the basis of the height outside the region where the lateral rib groove 17 serving as the measurement region exists, for example, the height of the raw glass surface.
  • the height of the partition wall (vertical rib) 11 is also known as the board design value, it is possible to calculate the height h on the basis of the height of the partition wall (vertical rib) 11.

Abstract

L'invention décrit une méthode et un appareil pour inspecter un panneau d'affichage qui sont caractérisés en ce qu'ils comprennent un moyen de mesure de la hauteur, la hauteur d'un plan de tablette incluant une pièce recouverte de matériel liquide est discrètement mesurée, alors qu'une tablette ou le moyen de mesurer la hauteur est décalé dans une direction qui croise le matériel liquide, qui est appliqué en une pluralité de bandes à des intervalles donnés sur la tablette, la hauteur multipliée par la bande de matériel liquide est soustraite d'un signal de forme haute obtenu en rendant immédiate les signaux de forme de hauteur discrète, une série de signaux de hauteur sont permis d'être des signaux d'inspection, et une quantité d'application pour chaque bande de matériel liquide est mesurée par chaque signal d'inspection. Une méthode de fabrication utilisant la méthode d'inspection et l'appareil d'inspection sont aussi décrits. Un problème qui a provoqué des défauts continus générés dans un processus d'application est rapidement détecté en inspectant le statut du processus d'application immédiatement après le procédé d'application de la pâte fluorescente pour supprimer le nombre de tablettes comme étant des produits non conformes qui provoque au minimum une perte, et le procédé peut être immédiatement récupéré.
PCT/JP2005/014275 2004-08-05 2005-08-04 Méthode et appareil pour inspecter les panneaux d'affichage et méthode de fabrication de panneaux d'affichage WO2006013915A1 (fr)

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JP2006531530A JPWO2006013915A1 (ja) 2004-08-05 2005-08-04 ディスプレイパネルの検査方法、検査装置および製造方法

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JP2007258140A (ja) * 2006-02-22 2007-10-04 Toray Ind Inc ディスプレイパネルの検査方法および検査装置ならびに製造方法

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CN104588270A (zh) * 2014-12-30 2015-05-06 广东旭业光电科技股份有限公司 可实现快速检测镜头漏点胶的方法
KR101777290B1 (ko) * 2016-01-12 2017-09-14 에스엔유 프리시젼 주식회사 광학측정장치의 데이터 평가장치 및 데이터 평가방법
JP6822864B2 (ja) * 2017-01-31 2021-01-27 アルファーデザイン株式会社 情報処理装置、情報処理方法、プログラム、
JP2019168315A (ja) * 2018-03-23 2019-10-03 三菱電機株式会社 測定装置、回路基板、表示装置、および測定方法

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JPH07311025A (ja) * 1994-05-17 1995-11-28 Komatsu Ltd ３次元形状検査装置
JPH1027543A (ja) * 1996-05-09 1998-01-27 Fujitsu Ltd プラズマディスプレイパネルの蛍光体層形成装置および形成方法
JP2003331727A (ja) * 2002-05-13 2003-11-21 Hitachi Kokusai Electric Inc リブ内蛍光体埋込量検査方法およびその検査装置
JP2003344038A (ja) * 2002-05-31 2003-12-03 Toray Ind Inc 塗膜の厚さ測定方法および測定装置と塗膜形成部材の製造方法

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JPH07311025A (ja) * 1994-05-17 1995-11-28 Komatsu Ltd ３次元形状検査装置
JPH1027543A (ja) * 1996-05-09 1998-01-27 Fujitsu Ltd プラズマディスプレイパネルの蛍光体層形成装置および形成方法
JP2003331727A (ja) * 2002-05-13 2003-11-21 Hitachi Kokusai Electric Inc リブ内蛍光体埋込量検査方法およびその検査装置
JP2003344038A (ja) * 2002-05-31 2003-12-03 Toray Ind Inc 塗膜の厚さ測定方法および測定装置と塗膜形成部材の製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007258140A (ja) * 2006-02-22 2007-10-04 Toray Ind Inc ディスプレイパネルの検査方法および検査装置ならびに製造方法

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