WO2005122237A1 - 部品実装方法及び部品実装装置 - Google Patents
部品実装方法及び部品実装装置 Download PDFInfo
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- WO2005122237A1 WO2005122237A1 PCT/JP2005/010218 JP2005010218W WO2005122237A1 WO 2005122237 A1 WO2005122237 A1 WO 2005122237A1 JP 2005010218 W JP2005010218 W JP 2005010218W WO 2005122237 A1 WO2005122237 A1 WO 2005122237A1
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- heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/755—Cooling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/755—Cooling means
- H01L2224/75502—Cooling means in the upper part of the bonding apparatus, e.g. in the bonding head
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a mounting method and apparatus for mounting an electronic component on a substrate to be mounted by a flip chip mounting method, and particularly to a thin IC chip or an IC in which a large number of electrodes are formed at a narrow pitch.
- the present invention relates to a component mounting method and a component mounting apparatus capable of mounting electronic components such as chips on a substrate with high accuracy.
- high-density mounting technology As one of the technologies that support the remarkable progress of lightening, thinning, and high functionality of portable information devices such as notebook computers and mobile phones, high-density mounting technology can be cited.
- the IC chip is formed with fine array spacing as the number of electrodes used as external connection terminals increases with the progress of high-density integration, and this IC chip is short-circuited or poorly connected to the electrodes formed on the substrate.
- High-density mounting technology is indispensable for mounting without soldering, and the flip chip mounting method is known as a typical method, among which the solder bonding method is often used for IC chip bonding.
- a component mounting method for electronic components using this soldering method and a conventional technique for mounting an IC chip having electrodes arranged at a narrow pitch on a substrate by the apparatus are known (see Patent Document 1). ).
- the component mounting apparatus sucks and holds the IC chip 101 by the suction nozzle 111 provided at the tip of the mounting head 103 that moves up and down by the lift driving means 121.
- the mounting head 103 is lowered to mount the IC chip on the substrate, the IC chip 101 is heated by the ceramic heater 112 provided on the back surface of the suction nozzle 111, and the protruding electrode formed as a solder bump on the IC chip 101
- cooling air is blown from the blow nozzle 119 to solidify the bonded projecting electrode, and the suction by the suction nozzle 111 is released and the mounting head 103 is released.
- the IC chip is configured to be mounted on the substrate by raising the. 113 is a water jacket that blocks the heat from the ceramic heater 112 from being transferred to the main unit. It is.
- FIG. 9A to FIG. 9E sequentially show the procedure for mounting the IC chip 101 on the substrate 104 by the component mounting apparatus configured as described above.
- the IC chip 101 in which the solder bump 101b is formed on each of the plurality of electrodes 101a is sucked and held by the suction nozzle 111, the mounting head 103 is moved onto the substrate 104, and the IC chip 101 is moved onto the substrate 104. Position it so that it is in the specified position.
- the mounting head 103 is moved down so that each solder bump 101b formed on the IC chip 101 is preliminarily supplied onto each pad (substrate electrode) 104a formed on the substrate 104. Touch to solder 102.
- the IC chip 101 is heated by the ceramic heater 112 through the suction nozzle 111 to a temperature equal to or higher than the melting point of the solder forming the solder bump 101b and the preliminary solder 102, and the solder bump 101b. And the preliminary solder 102 is melted.
- heating by the ceramic heater 112 is stopped, and cooling air is blown from the blow nozzle 119 to the molten solder to forcibly cool the solder and solidify the solder, thereby causing the electrodes of the IC chip 101 to become solid.
- 101a and the pad 104a of the substrate 104 are joined.
- the suction of the IC chip 101 by the suction nozzle 111 is released, and the mounting head 103 is moved upward, so that the IC chip 101 is mounted on the substrate 104 as shown in FIG. 9E.
- the bonding position between the chip electrode and the substrate electrode is matched by positioning by the mounting head 103, and since the adsorption is released after the solder is solidified, not during the melting of the solder, the position is shifted to the bonding position by vacuum break blow. It is possible to stably mount the IC chip 101 with the electrodes arranged in a narrow pitch without causing a bonding failure such as a short circuit between the electrodes or poor connection, which is formed in a narrow pitch that does not generate it can.
- Patent Document 1 JP 2003-008196 A Disclosure of the invention
- IC chips tend to be thinner, and wafer distortion remains in the IC chip during the processing stage from wafer dicing until it is cast into the IC chip. It becomes easy to generate a state in which is damaged. Also, if the thinned IC chip is sucked and held by the suction nozzle, the negative pressure to be sucked and held concentrates on the center part of the IC chip, so that the center part is lifted and warpage tends to occur.
- heating by the heater transfers heat to the suction head and the mounting head to which the heater is attached, causing thermal expansion, which may change the contact pressure of the protruding electrode to the substrate electrode. Accordingly, control is performed to correct the thermal expansion by raising the mounting head.
- heating by the heater has a problem, considering that heat is transferred to the stage side holding the substrate via the suction nozzle and the IC chip and thermal expansion occurs on the stage side.
- the thermal expansion on the stage side and the thermal expansion force on the mounting head side are delayed, there was no control to compensate for this.
- An object of the present invention is to provide a component mounting method and a component mounting apparatus that can be mounted on a substrate with high accuracy.
- a first component mounting method of the present invention is configured to suck and hold an electronic component on which a plurality of protruding electrodes are formed by a suction nozzle provided in a mounting head that is controlled to move up and down.
- the substrate on which the plurality of substrate electrodes are formed is held on the mounting stage, the protruding electrode is brought into contact with the substrate electrode by the lowering operation of the mounting head, and the protruding electrode is melted by heating to join the two electrodes.
- the suction head is moved down to detect the load when the protruding electrode contacts the substrate electrode, and the suction nozzle is moved to the lowered position where a predetermined contact load value is detected.
- the bump electrode is melted by heating and bonded to the substrate electrode, heating is stopped and the melted part is solidified by cooling, and then the suction is released from the suction nozzle and the mounting head is lifted. Let It is intended.
- the mounting head is lowered to press the electronic component onto the board until a predetermined contact load value is detected. Even when warping deformation occurs and flatness is impaired, pressure is applied to the flat suction surface of the suction nozzle to correct the flatness to a predetermined level, thus preventing poor bonding due to deformation. can do.
- An IC chip which is an example of an electronic component, tends to be thinned, and a large number of electrodes are arranged at a narrow pitch due to high integration. Therefore, if the planarity is impaired, all electrodes are mounted on the substrate. However, even if the electronic component is thinned by this component mounting method and its flatness is easily impaired, it is possible to obtain a good bonded state.
- an electronic component on which a plurality of protruding electrodes are formed is sucked and held by a suction nozzle provided on a mounting head that is controlled to move up and down, and the plurality of substrate electrodes are provided.
- the formed substrate is held on the mounting stage, the protruding electrode is brought into contact with the substrate electrode by the lowering operation of the mounting head, the protruding electrode is melted by heating, and the two electrodes are connected to each other to place the electronic component on the substrate.
- the mounting head In the component mounting method to be mounted on the mounting head, the mounting head is moved down to bring the protruding electrode into contact with the substrate electrode, and the mounting head side and the mounting The mounting head is moved upward by an increase amount that corrects the known thermal expansion amount on the surface side, the protruding electrode is melted by heating at a predetermined temperature and bonded to the substrate electrode, the heating is stopped, and the molten part is cooled by cooling. After solidifying, the suction of the electronic parts by the suction nozzle is released and the mounting head is moved up.
- the mounting head lowering position is lowered by thermal expansion on the mounting head side and the mounting stage side due to heating, and the mounting head ascending operation control is corrected. Therefore, it is possible to prevent an excessive load from being applied to the melted protruding electrode and the melted portion to bulge in the lateral direction to cause a short circuit between adjacent electrodes.
- a short circuit is likely to occur due to the expansion of the melted part, but a short circuit due to the expansion of the melted part is prevented by controlling the lifting operation of the mounting head. be able to.
- an electronic component on which a plurality of protruding electrodes is formed is sucked and held by a suction nozzle provided on a mounting head that is controlled to move up and down, and the plurality of substrate electrodes are provided.
- the formed substrate is held on the mounting stage, the protruding electrode is brought into contact with the substrate electrode by the lowering operation of the mounting head, the protruding electrode is melted by heating, and the two electrodes are connected to each other to place the electronic component on the substrate.
- the mounting head is moved down to bring the protruding electrode into contact with the substrate electrode, the protruding electrode is melted by heating at a predetermined temperature and bonded to the substrate electrode, and the heating is stopped for cooling.
- the mounting head is moved downward by an amount that compensates for the accompanying shrinkage on the mounting head side and mounting stage side to solidify the melted part, and then the suction of the electronic components by the suction nozzle is released to raise the mounting head. Is shall.
- the heating is stopped and the cooling is performed, so that the mounting head side that has been thermally expanded is Since the mounting head is controlled to move downward in accordance with the shrinkage of the mounting stage side, a force acting in the peeling direction is not generated on the bonding surface along with the shrinkage, and the interface or It is possible to prevent a situation in which an open occurs and a junction resistance increases or a junction failure occurs.
- an electronic component on which a plurality of protruding electrodes are formed is provided.
- the suction nozzle provided in the mounting head that is controlled to move up and down is held by suction, the substrate on which a plurality of substrate electrodes are formed is held on the mounting stage, and the projection electrode is applied to the substrate electrode by the lowering operation of the mounting head.
- the load when the protruding electrode contacts the substrate electrode by lowering the mounting head The suction nozzle is lowered to a lowered position where a predetermined contact load value is detected, and the mounting head is lifted by an increase amount that corrects the known thermal expansion amount on the mounting head side and mounting stage side due to heating.
- the projection electrode is melted by heating at a predetermined temperature and bonded to the substrate electrode, the heating is stopped, the molten part is solidified by cooling, and the molten part is solidified. It is intended to increase operating the mounting head by releasing the adsorption of the goods.
- the fourth component mounting method since the mounting head is moved down to press the electronic component onto the board until a predetermined contact load value is detected, the electronic component is corrugated. Even if warping deformation due to deformation or suction occurs and flatness is impaired, the flat suction surface of the suction nozzle is pressurized and corrected to a state where a predetermined flatness is obtained.
- an electronic component on which a plurality of protruding electrodes are formed is sucked and held by a suction nozzle provided on a mounting head that is controlled to move up and down.
- the formed substrate is held on the mounting stage, the protruding electrode is brought into contact with the substrate electrode by the lowering operation of the mounting head, the protruding electrode is melted by heating, and the two electrodes are connected to each other to place the electronic component on the substrate.
- the loading head is moved down to detect the load when the protruding electrode contacts the substrate electrode, and the suction nozzle is moved down to the lowered position where the predetermined contact load value is detected.
- the projection electrode is melted by heating the temperature and bonded to the substrate electrode, and the mounting head is lowered by a lowering amount that corrects the shrinkage of the mounting head and the mounting stage due to cooling and melted.
- the solidified After that, the suction of the electronic component by the suction nozzle is released and the mounting head is moved up.
- the mounting head since the mounting head is moved down until the predetermined contact load value is detected and the electronic component is pressed onto the substrate, the electronic component is corrugated. Even if warping deformation due to deformation or suction occurs and flatness is impaired, the flat suction surface of the suction nozzle is pressurized and corrected to a state where a predetermined flatness is obtained.
- an electronic component on which a plurality of protruding electrodes are formed is sucked and held by a suction nozzle provided in a mounting head that is controlled to move up and down, and the plurality of substrate electrodes are provided.
- the formed substrate is held on the mounting stage, the protruding electrode is brought into contact with the substrate electrode by the lowering operation of the mounting head, the protruding electrode is melted by heating, and the two electrodes are connected to each other to place the electronic component on the substrate.
- the load is moved when the mounting head is lowered to detect the load when the protruding electrode contacts the substrate electrode, and the suction nozzle is lowered to a lowered position where a predetermined contact load value is detected.
- the mounting head is moved up by an amount that corrects the known thermal expansion on the mounting head and mounting stage, and the projection electrode is melted by heating at a predetermined temperature to be bonded to the substrate electrode. Then, the mounting head is moved downward by a lowering amount that corrects the shrinkage of the mounting head and mounting stage due to cooling to solidify the melted part, and then the suction of the electronic components by the suction nozzle is released to remove the mounting head. It is intended to move up.
- the sixth component mounting method since the mounting head is moved downward until the predetermined contact load value is detected and the electronic component is pressed onto the substrate, the electronic component is corrugated. Even if warping deformation due to deformation or suction occurs and flatness is impaired, the flat suction surface of the suction nozzle is pressurized and corrected to a state where a predetermined flatness is obtained. Therefore, it is possible to prevent the occurrence of poor bonding due to deformation. In addition, it is possible to correct the lowered position of the mounting head due to the thermal expansion of the mounting head and the mounting stage due to heating by lowering the mounting head. It is possible to prevent a short circuit from occurring between adjacent electrodes due to an excessive load being applied and the melted portion expanding laterally.
- the temperature below the freezing point is maintained for a predetermined time when the melted portion is solidified, and then control is performed to release the suction of the electronic component by the suction nozzle. Since the melted part between the electrode and the substrate electrode is completely solidified and the two electrodes are properly joined together, the suction by the suction nozzle is released and the electronic component is cut off. Is not generated.
- the load direction applied to the electronic component is detected, and control is performed to raise or lower the mounting head according to the load direction.
- the thermal expansion of the mounting stage force that holds the substrate causes thermal expansion again on the suction nozzle side, and the facing distance between the electronic component and the substrate is shortened, so that the melted part in the solidification swells and a short circuit occurs. It can be prevented that the opposing distance between the electronic component and the substrate is increased due to the deformation recovery force of the electronic component, and the peeling action is exerted on the melted portion during solidification.
- the component mounting apparatus of the present invention sucks and holds an electronic component in which a plurality of protruding electrodes are formed by a suction nozzle provided in a mounting head, and the substrate on which the plurality of substrate electrodes are formed is mounted on a mounting stage. Mounting the electronic head on the board by controlling the mounting head to move up and down, bringing the protruding electrode into contact with the substrate electrode by its lowering operation, melting the protruding electrode by heating, and joining the electrodes together
- load detecting means for detecting a contact load when the mounting electrode is lowered to contact the substrate electrode, and the contact load detected by the load detecting means is set to a predetermined value. It is provided with a control unit that controls the lifting operation of the head.
- the control unit performs control to lower the mounting head and press the electronic component onto the board until a predetermined contact load value is detected. Even when warping deformation due to suction occurs and flatness is impaired, pressure is applied to the flat suction surface of the suction nozzle to correct the flatness to a predetermined level, preventing the occurrence of poor bonding due to deformation. be able to.
- An IC chip which is an example of an electronic component, tends to be thinned, and a large number of electrodes are arranged at a narrow pitch due to high integration, so that all electrodes are in a state where flatness is impaired. Although it is in a state where it is not evenly bonded to the substrate, it is possible to obtain a good bonded state even for electronic components that are thinned by the above control operation and whose flatness is likely to be impaired.
- an electronic component on which a plurality of protruding electrodes is formed is sucked and held by a suction nozzle provided on a mounting head, and a substrate on which a plurality of substrate electrodes are formed is provided.
- the mounting head Holding on the mounting stage, the mounting head is controlled to move up and down, and the projecting electrode is brought into contact with the substrate electrode by its lowering operation.
- the mounting head in the lowered position is moved and controlled in the upward direction according to the amount of thermal expansion generated on the mounting head side and the mounting stage side with heating, and the heating is stopped and accompanied by cooling.
- a control unit is provided for controlling the movement of the mounting head in the downward direction by the downward amount that corrects the shrinkage on the mounting head side and the mounting stage side.
- the thermal expansion of the mounting head side and the mounting stage side accompanying heating is performed. Because the control operation to correct the mounting head's descending stop position by tension is corrected by the mounting head's ascending motion control, an excessive load is applied to the molten protruding electrode, causing the molten part to move laterally. It is possible to prevent a short circuit from occurring between adjacent electrodes. In particular, in an IC chip in which a large number of electrodes are arranged at a narrow pitch, a short circuit is likely to occur due to the bulging of the melted part, but a short circuit due to the bulging of the melted part can be prevented by controlling the lifting operation of the mounting head Can do.
- a plurality of substrate electrodes are formed by sucking and holding an electronic component on which a plurality of protruding electrodes are formed by a suction nozzle provided on a mounting head.
- the substrate is held on the mounting stage, the mounting head is controlled to move up and down, and the protruding electrode is brought into contact with the substrate electrode by its lowering operation, and the protruding electrode is melted by heating to join the two electrodes to attach the electronic component to the substrate.
- load detection means for detecting the contact load when the protruding electrode contacts the substrate electrode by lowering the mounting head, and the contact load detected by the load detection means is a predetermined value.
- the mounting head is controlled to move up and down according to the amount of thermal expansion that occurs on the mounting head side and mounting stage side with heating.
- the control unit for movement control in the lowering direction the mounting head descent amount for correcting the shrinkage of the pressurized heat the side mounting head accompanies to the cooling stop and implementation stage side is provided.
- the control unit performs control to lower the mounting head and press the electronic component onto the board until a predetermined contact load value is detected. Even when warping deformation due to suction occurs and flatness is impaired, pressure is applied to the flat suction surface of the suction nozzle to correct the flatness to a predetermined level, preventing the occurrence of poor bonding due to deformation. be able to.
- the mounting head side and mounting stage side thermal expansion accompanying heating may cause the mounting head to move down. Can be compensated by controlling the ascending operation of the mounting head, so that an excessive load is applied to the melted protruding electrode, preventing the melted portion from expanding laterally and causing a short circuit between adjacent electrodes. it can.
- the electronic component is sucked into the suction nozzle. Since it is adsorbed not only by the mouth but also by the intake air from the intake groove, it is evenly adsorbed over the entire surface where the adsorbed parts are not concentrated in one place. Thinned electronic parts are easily deformed by suction force when the suction points are concentrated in one place, but even electronic parts that are easily deformed by evenly sucking on the entire surface will be deformed. It is possible to hold it without sucking it.
- FIG. 1 is a cross-sectional view showing a main configuration of a mounting apparatus according to an embodiment.
- FIGS. 2A to 2E are schematic views showing the mounting process of the IC chip on the substrate by the above apparatus in order.
- FIG. 3 is a flowchart showing a procedure for controlling the mounting operation by the apparatus.
- FIG. 4 is a timing chart showing the operation timing of each part in the control procedure.
- FIG. 5 is a flowchart showing a modification of the control procedure.
- FIG. 6 is a flowchart showing a further modification of the control procedure.
- FIG. 7 is a plan view showing a configuration example of the suction nozzle according to the embodiment.
- FIG. 8 is a cross-sectional view showing the main configuration of a component mounting apparatus according to the prior art.
- FIG. 9A to FIG. 9E are schematic diagrams for explaining the mounting procedure according to the prior art step by step.
- a solder bump formed as a protruding electrode on an electrode of an IC chip which is an example of an electronic component, is melt-bonded to a pad formed as a substrate electrode on a substrate electrode, thereby bonding the IC chip to the substrate.
- a component mounting method and a component mounting apparatus to be mounted are shown.
- a mounting control method that makes it possible to accurately mount even an IC chip that is thin and easily loses its flatness, or an IC chip in which a large number of electrodes are arranged in a narrow pitch. The device is provided.
- the object on which the IC chip is mounted is used as the substrate, in the case of a chip-on-chip in which the IC chip is mounted on the IC chip that is not just the circuit board, the IC chip to be mounted is used as the substrate.
- FIG. 1 shows a configuration of a main part of the mounting apparatus according to the embodiment.
- the IC chip 1 is sucked and held by the suction nozzle 11 and mounted on the substrate 4 held on the mounting stage 25.
- 3 shows the component parts.
- the mounting head 3 is configured such that a component supply position force can be freely moved to a component mounting position by an XY robot (not shown), and can be moved up and down by a lift drive unit 21.
- a mounting tool 3a is attached to the tip of the mounting head 3.
- the mounting tool 3a includes a suction nozzle 11 formed in a shape and size corresponding to the IC chip 1 to be sucked and held, and the suction nozzle 11
- the ceramic heater 12 that heats the IC chip 1 adsorbed and held on the substrate, the heat insulating part 13 that blocks the heat so that the heat of the ceramic heater 12 does not transfer to the mounting head body 3b, and the heated IC chip 1 is cooled.
- a blow nozzle 19 that blows wind and a support shaft 17 that supports these components are provided.
- the mounting head body 3b includes a frame 16 that supports the mounting tool 3a in a suspended state, and a load cell 14 that detects a contact load on the substrate 4 of the IC chip 1 sucked and held by the suction nozzle 11.
- the intermediate frame 16c that connects the upper frame 16a provided on the frame 16 and the lower frame 16b that guides the vertical movement of the support shaft 17 has an upper and lower And a ball screw shaft 21a that is screwed into the nut portion 21b is inserted into the ascending / descending drive portion 21.
- the ball screw shaft 21a is rotationally driven by the lift drive motor 21c.
- the load cell 14 is a kind of a load measuring instrument using a resistance strain meter, and the IC chip 1 that is sucked and held by the suction nozzle 11 attached to the tip of the mounting head 3 when the mounting head 3 is lowered.
- the solder bump la contacts the substrate electrode 4a of the substrate 4, the upper end of the support shaft 17 constituting the mounting tool 3a pushes up the load detection surface of the load cell 14, so the load is a distortion of the elastic body constituting the load cell 14.
- a load as an electrical signal is output by detecting and electrically converting it as a strain amount of the resistance wire strain gauge.
- the mounting head 3 configured as described above can be freely moved in the horizontal direction by an XY robot (not shown), so that the IC chip 1 supplied to the component supply position by moving up and down to the component supply position is sucked into the suction nozzle 11.
- the mounting stage 25 is provided with a substrate holding nozzle 25a for sucking and holding the substrate 4 and a heater 25b for preheating the substrate 4.
- a mounting control method for mounting the IC chip 1 on the substrate 4 using the mounting head 3 configured as described above will be described with reference to FIG. 2A to FIG.
- the following control operations are executed by the control unit 6 provided in the component mounting apparatus.
- FIG. 3 is a flowchart showing a control procedure by the control unit 6, and the control operation will be described based on this control procedure. Note that the numbers Sl and S2 shown in the figure are step numbers indicating the control procedure and coincide with the numbers added in the text.
- the IC chip is moved by the suction nozzle 11 after being moved to the component supply position by the XY robot.
- the mounting head 3 with suction 1 held is moved to the component mounting position by the XY robot and positioned so that the IC chip 1 is positioned above the mounting position with respect to the substrate 4 held on the mounting stage 25.
- the IC chip 1 is thinned as described above, if the IC chip 1 is sucked by the suction nozzle 11, as shown in FIG.
- the central part facing 11a is attracted by vacuum negative pressure, and the peripheral part is prone to warp, and the thinned IC chip 1 is prone to distortion during its processing and wavy.
- the control unit 6 moves down the mounting head 3 until a predetermined contact load value is detected, and presses the IC chip 1 onto the substrate 4 (S 3).
- the heating temperature of the ceramic heater 12 is raised while maintaining the elevation position of the mounting head 3 so that the state where the IC chip 1 is pressed onto the substrate 4 is maintained (S6).
- the ceramic heater 12 is energized after a predetermined time after the IC chip 1 is sucked and held by the suction nozzle 11, and preheated to a predetermined temperature without melting the solder bump la formed on the IC chip 1.
- the substrate 4 held on the mounting stage 25 is also preheated by the substrate heater 25b, and preheated to a predetermined temperature at which the solder supplied in advance to the surface of the substrate electrode 4a does not melt. .
- FIG. 4 shows the height position control of the suction nozzle 11 by the mounting head 3 and the heating control of the suction nozzle 11 by the ceramic heater 12 as changes at each control timing shown in (1) to (12). It is.
- the thermal effect causes thermal expansion in the suction nozzle 11 and the like.
- the mounting head 3 is raised so that it can be known in advance and the amount of thermal expansion is corrected (S7). As shown in FIG.
- the rising of the mounting head 3 is continued until a predetermined time has elapsed since the temperature does not drop rapidly even when heating by the ceramic heater 12 is stopped and cooling blow is started.
- Thermal expansion occurs only on the mounting tool 3a side
- Heat transfer to the mounting stage 25 via the IC chip 1 and the substrate 4 causes thermal expansion in the mounting stage 25, which is delayed from the expansion on the mounting tool 3a side.
- the rise of the mounting head 3 is calculated with the calculated amount of thermal expansion of the mounting stage 25 at a timing delayed from the start of heating by the ceramic heater 12, as shown in Fig. 4. To be controlled.
- the mounting head 3 side and the mounting stage 25 side which have been thermally expanded due to this cooling, are contracted, and the IC chip 1 and the substrate 4 are separated by a predetermined distance.
- the mounting head 3 that has moved up at a timing after a predetermined time after stopping heating and starting cooling blow is switched to a lowering movement (Sl l), and as shown in FIG. A control operation in which 1 and the substrate 4 are lowered to a height position where they face each other at a predetermined interval is executed.
- the bonded body 10 in which the solder bump la and the solder of the substrate electrode 4a are fused is held for a predetermined time at a temperature below the freezing point at which the solidified body 10 is solidified (S12).
- S13 time elapses
- the solder 10 is solidified, and the force in the peeling direction acts to create an interface at the joint and an open state does not occur. It is formed in a simple shape, preventing an increase in electrical resistance and poor conduction.
- the suction of the IC chip 1 by the suction nozzle 11 By releasing the suction (S14) and raising the mounting head 3 (S15), the IC chip 1 is mounted on the substrate 4 as shown in FIG. 2E.
- FIG. 5 is a modification of the control procedure after step S 12 in the flowchart shown in FIG. 3.
- the control procedure up to step S 12 is the same as the control method described above. Omitted.
- the load direction is determined based on the load detection value by the load cell 14.
- S16 At the position where the mounting head 3 is lowered in accordance with the direction in which the load direction peels off the joint surface, that is, the mounting head 3 side and the mounting stage 25 side, which were thermally expanded, contract with cooling.
- the descent stop position of the mounting head 3 does not match the contraction amount, and the joint surface is peeled off, causing an interface or open.
- the mounting head 3 Since it can be determined that it is easy to do, the mounting head 3 is lowered (S18).
- the load direction is the direction in which the joint surface is compressed, that is, the load is increased in the state where the mounting head 3 is stopped at the position where the mounting head 3 is lowered according to the contraction when the molten solder solidifies.
- the descent stop position of the mounting head 3 exceeds the contraction amount, and there is a risk of short-circuiting between adjacent solder bumps la due to the solder being compressed and extending laterally. Therefore, control for raising the mounting head 3 is performed (S19).
- step S13 When the elapse of the predetermined time in step S13 ends, the suction of the IC chip 1 by the suction nozzle 11 is released (S14), and the mounting head 3 is raised, as in the procedure of the control method described above. From Sugiko (S15), IC chip 1 is mounted on board 4.
- the separation distance between the IC chip 1 and the substrate 4 is appropriately adjusted by the change in the distance between the IC chip 1 and the substrate 4 due to the thermal expansion of the mounting tool 3a and the mounting stage 25. Therefore, when the force in the peeling direction acts on the solder, the interface or Opening can be prevented, and a short circuit can be prevented from occurring between adjacent solders swelled laterally due to a compressive force acting on the solder.
- FIG. 6 is a modification of the control procedure after step S12 in the flowchart shown in FIG. 3.
- the control procedure up to step S12 is the same as the control method described above, and the description and illustration thereof are omitted. .
- step S12 solidification of the solder is determined from the load detection value by the load cell 14 (S20).
- the load detection value by the load cell 14 S20.
- the temperature on the mounting tool 3a side decreases, but the temperature drop on the mounting stage 25 side is delayed, so the heat of the mounting stage 25 is transferred to the mounting tool 3a side, and the mounting tool 3a
- the load detected by the load cell 14 increases if the solder is solidified.
- the solidification state of the solder can be determined from the detected value, when the solidification determination load is detected, it is determined that the joining is completed, and the suction of the IC chip 1 by the suction nozzle 11 is released (S14), and the mounting head 3 (S15), the IC chip 1 is mounted on the substrate 4.
- the thermal expansion of the mounting tool 3a is small.
- the ceramic heater 12 It is preferable to apply a heat insulating part 13 having a small thermal expansion coefficient between the heat insulating part 13 and the support shaft 17.
- Conventionally used! / Ru thermal expansion coefficient of the components of the heat insulation portion 13 is about 8 X 10- 6, the thermal expansion coefficient of 1 in the components of the heat insulating unit 13 according to this embodiment X 10- 6 As a result, the amount of thermal expansion of the entire mounting tool 3a is reduced.
- the air intake groove 11c is formed only in a lattice pattern as shown in the figure.
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP20050745698 EP1777738A1 (en) | 2004-06-08 | 2005-06-03 | Component mounting method and component mounting apparatus |
US11/570,183 US20070181644A1 (en) | 2004-06-08 | 2005-06-03 | Component mounting method and component mounting apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004-170288 | 2004-06-08 | ||
JP2004170288A JP4736355B2 (ja) | 2004-06-08 | 2004-06-08 | 部品実装方法 |
Publications (1)
Publication Number | Publication Date |
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WO2005122237A1 true WO2005122237A1 (ja) | 2005-12-22 |
Family
ID=35503368
Family Applications (1)
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---|---|---|---|
PCT/JP2005/010218 WO2005122237A1 (ja) | 2004-06-08 | 2005-06-03 | 部品実装方法及び部品実装装置 |
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Country | Link |
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US (1) | US20070181644A1 (ja) |
EP (1) | EP1777738A1 (ja) |
JP (1) | JP4736355B2 (ja) |
CN (1) | CN100461358C (ja) |
TW (1) | TW200605246A (ja) |
WO (1) | WO2005122237A1 (ja) |
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JP2007214241A (ja) * | 2006-02-08 | 2007-08-23 | Sony Corp | 半導体チップの実装方法及び半導体チップの実装装置 |
WO2007108290A1 (ja) * | 2006-03-16 | 2007-09-27 | Matsushita Electric Industrial Co., Ltd. | バンプ形成方法およびバンプ形成装置 |
KR101344258B1 (ko) | 2006-12-29 | 2014-01-22 | 엘지디스플레이 주식회사 | 탭 검사방법 |
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- 2005-06-03 US US11/570,183 patent/US20070181644A1/en not_active Abandoned
- 2005-06-03 WO PCT/JP2005/010218 patent/WO2005122237A1/ja active Application Filing
- 2005-06-03 EP EP20050745698 patent/EP1777738A1/en not_active Withdrawn
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Also Published As
Publication number | Publication date |
---|---|
US20070181644A1 (en) | 2007-08-09 |
JP2005353696A (ja) | 2005-12-22 |
TW200605246A (en) | 2006-02-01 |
EP1777738A1 (en) | 2007-04-25 |
CN100461358C (zh) | 2009-02-11 |
CN1965401A (zh) | 2007-05-16 |
TWI292598B (ja) | 2008-01-11 |
JP4736355B2 (ja) | 2011-07-27 |
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