CN104377159A - 一种适用于管壳内有凸出键合指的细间距共晶焊吸嘴 - Google Patents

一种适用于管壳内有凸出键合指的细间距共晶焊吸嘴 Download PDF

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CN104377159A
CN104377159A CN201410642813.0A CN201410642813A CN104377159A CN 104377159 A CN104377159 A CN 104377159A CN 201410642813 A CN201410642813 A CN 201410642813A CN 104377159 A CN104377159 A CN 104377159A
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suction nozzle
crystallizing
bonding
shell
bonding finger
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任春岭
陈强
多新中
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JIANGSU BOPU ELECTRONIC TECHNOLOGY Co Ltd
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JIANGSU BOPU ELECTRONIC TECHNOLOGY Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

本发明公开了一种适用于管壳内有凸出键合指的细间距共晶焊吸嘴，包括吸嘴，所述吸嘴用于与管壳共晶焊接，其特征是，所述吸嘴底部的侧边上设置有缺口；所述管壳内部设置有凸起的键合指；所述缺口的宽度大于键合指的宽度。本发明所达到的有益效果：吸嘴侧面有缺口，缺口可以在两边或一边，根据需要设计，具有选择性，灵活多样。吸嘴在夹取零件时，比较容易控制键合指凸起边缘到零件边缘的距离。本吸嘴结构设计简单，在贴片机上使用方便，可以很好的解决贴片中管壳键合指凸起边缘与零件边缘的细间距共晶焊工艺。

Description

一种适用于管壳内有凸出键合指的细间距共晶焊吸嘴
技术领域
本发明涉及一种适用于管壳内有凸出键合指的细间距共晶焊吸嘴，属于通信雷达器件封装技术领域。
背景技术
微波功率器件广泛地用于通信系统和雷达系统中。微波器件的设计中有关引线的电感和电容直接影响到电路的性能，而控制电感的途径之一就是引线的长短和高低，控制引线的的长短需要控制电路中零件的位置，当零件需要靠近管壳中的键合指时，普通的吸嘴就很难控制那么小的间隙。
发明内容
为解决现有技术的不足，本发明的目的在于提供一种可以达到0.05mm甚至更小的间隙的适用于管壳内有凸出键合指的细间距共晶焊吸嘴。
为了实现上述目标，本发明采用如下的技术方案：
一种适用于管壳内有凸出键合指的细间距共晶焊吸嘴，包括吸嘴，所述吸嘴用于与管壳共晶焊接，其特征是，所述吸嘴底部的侧边上设置有缺口；所述管壳内部设置有凸起的键合指；所述缺口的宽度大于键合指的宽度。
前述的一种适用于管壳内有凸出键合指的细间距共晶焊吸嘴，其特征是，所述管壳内设置有微波待焊零件；所述键合指的高度大于微波待焊零件的厚度；所述缺口的深度等于从吸嘴底部的侧边到微波待焊零件边缘的距离。
前述的一种适用于管壳内有凸出键合指的细间距共晶焊吸嘴，其特征是，所述缺口设置在一侧或者是两侧。
本发明所达到的有益效果：吸嘴侧面有缺口，缺口可以在两边或一边，根据需要设计，具有选择性，灵活多样。吸嘴在夹取零件时，比较容易控制键合指凸起边缘到零件边缘的距离。本吸嘴结构设计简单，在贴片机上使用方便，可以很好的解决贴片中管壳键合指凸起边缘与零件边缘的细间距共晶焊工艺。
附图说明
图1是吸嘴的结构示意图；
图2是吸嘴的截面结构示意图；
图3是吸嘴的底面结构示意图；
图4是管壳的俯视图；
图5是管壳的截面结构示意图。
图中附图标记的含义：
1-微波管壳，2-微波待焊零件，3-键合指，4-吸嘴，5-吸嘴内孔，6-缺口。
具体实施方式
下面结合附图对本发明作进一步描述。以下实施例仅用于更加清楚地说明本发明的技术方案，而不能以此来限制本发明的保护范围。
本发明设计的一种适用于管壳内有凸出键合指3的细间距共晶焊吸嘴4。如图1，吸嘴4底部的侧边上设置有缺口6，缺口6设置在其中一侧或者是两侧，可以根据需要设计。
管壳内设置有微波待焊零件2和凸起的键合指3。
吸嘴4在夹取零件时，为了比较容易控制键合指3凸起边缘到零件边缘的距离，缺口6的宽度要大于键合指3的宽度，键合指3的高度大于微波待焊零件2的厚度，缺口6的深度D等于从吸嘴4底部的侧边到微波待焊零件2边缘的距离(如图3)，那么在焊接过程中微波待焊零件2边缘可以更加的靠近键合指3边缘，贴片共晶焊能够控制更小的间隙。满足微波器件设计需要的细间距要求。
现有技术中，微波器件的设计中有关引线的电感和电容直接影响到电路的性能，而控制电感的途径之一就是引线的长短和高低，控制引线的的长短需要控制电路中零件的位置，当零件需要靠近管壳中的键合指3时，普通的吸嘴4就很难控制那么小的间隙。在常用的吸嘴4上，采用本方案进行设计吸嘴4，可以达到0.05mm甚至更小的间隙，这样为微波电路的设计带来了很大的方便。其中缺口6的设计是为了能够给管壳的键合指3留出足够的空隙，包括高度上和深度上的距离，这样能更好实现键合指3凸起边缘到零件边缘的细间距共晶焊。在常用的吸嘴4上，采用新方案进行设计吸嘴4，可以达到0.05mm甚至更小的间隙，这样为微波电路的设计带来了很大的方便。其中缺口6的设计是为了能够给管壳的键合指3留出足够的空隙，包括高度上和深度上的距离，这样能更好实现键合指3凸起边缘到零件边缘的细间距共晶焊。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明技术原理的前提下，还可以做出若干改进和变形，这些改进和变形也应视为本发明的保护范围。

Claims (3)

1.一种适用于管壳内有凸出键合指的细间距共晶焊吸嘴，包括吸嘴，所述吸嘴用于与管壳共晶焊接，其特征是，所述吸嘴底部的侧边上设置有缺口；所述管壳内部设置有凸起的键合指；所述缺口的宽度大于键合指的宽度。
2.根据权利要求1所述的一种适用于管壳内有凸出键合指的细间距共晶焊吸嘴，其特征是，所述管壳内设置有微波待焊零件；所述键合指的高度大于微波待焊零件的厚度；所述缺口的深度等于从吸嘴底部的侧边到微波待焊零件边缘的距离。
3.根据权利要求1所述的一种适用于管壳内有凸出键合指的细间距共晶焊吸嘴，其特征是，所述缺口设置在一侧或者是两侧。
CN201410642813.0A 2014-11-14 2014-11-14 一种适用于管壳内有凸出键合指的细间距共晶焊吸嘴 Pending CN104377159A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018218849A1 (zh) * 2017-06-02 2018-12-06 广东瑞谷光网通信股份有限公司 芯片旋转共晶焊接台

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CN1965401A (zh) * 2004-06-08 2007-05-16 松下电器产业株式会社 元器件安装方法及元器件安装装置
CN103258768A (zh) * 2012-02-15 2013-08-21 富士电机株式会社 校正用目标治具以及半导体制造装置
CN203406275U (zh) * 2013-07-11 2014-01-22 江苏博普电子科技有限责任公司 一种精度定位贴片装置
JP2014034103A (ja) * 2012-08-10 2014-02-24 Yamaha Motor Co Ltd 部品搬送用ヘッド、部品吸着用ノズル及び部品実装装置
CN203579673U (zh) * 2013-11-28 2014-05-07 无锡中微高科电子有限公司 共晶焊机拾取芯片用万向调平吸嘴
CN204230220U (zh) * 2014-11-14 2015-03-25 江苏博普电子科技有限责任公司 一种适用于管壳内有凸出键合指的细间距共晶焊吸嘴

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1374831A (zh) * 2001-02-27 2002-10-16 芝浦机械电子装置股份有限公司 部件固定头、使用该固定头的部件安装装置及安装方法
CN1965401A (zh) * 2004-06-08 2007-05-16 松下电器产业株式会社 元器件安装方法及元器件安装装置
CN103258768A (zh) * 2012-02-15 2013-08-21 富士电机株式会社 校正用目标治具以及半导体制造装置
JP2014034103A (ja) * 2012-08-10 2014-02-24 Yamaha Motor Co Ltd 部品搬送用ヘッド、部品吸着用ノズル及び部品実装装置
CN203406275U (zh) * 2013-07-11 2014-01-22 江苏博普电子科技有限责任公司 一种精度定位贴片装置
CN203579673U (zh) * 2013-11-28 2014-05-07 无锡中微高科电子有限公司 共晶焊机拾取芯片用万向调平吸嘴
CN204230220U (zh) * 2014-11-14 2015-03-25 江苏博普电子科技有限责任公司 一种适用于管壳内有凸出键合指的细间距共晶焊吸嘴

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018218849A1 (zh) * 2017-06-02 2018-12-06 广东瑞谷光网通信股份有限公司 芯片旋转共晶焊接台

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