CN101872727A - 一种芯片焊接方法及结构 - Google Patents

一种芯片焊接方法及结构 Download PDF

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CN101872727A
CN101872727A CN200910107150A CN200910107150A CN101872727A CN 101872727 A CN101872727 A CN 101872727A CN 200910107150 A CN200910107150 A CN 200910107150A CN 200910107150 A CN200910107150 A CN 200910107150A CN 101872727 A CN101872727 A CN 101872727A
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substrate
groove
weld pad
welding method
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傅敬尧
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AMBIT ELECTRONICS (ZHONGSHAN) Co Ltd
Hon Hai Precision Industry Co Ltd
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AMBIT ELECTRONICS (ZHONGSHAN) Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to US12/686,514 priority patent/US20100273297A1/en
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Abstract

一种芯片焊接方法，包括：于基板表面开设多个凹槽；于所述凹槽底部设置焊垫，所述焊垫的厚度小于所述凹槽的深度；将芯片通过多个锡球与所述基板相连接，所述锡球分别落入所述凹槽内，与所述焊垫相接触；及将所述芯片与所述基板共同过回焊炉，从而使二者紧密结合。本发明还提供一种芯片焊接结构。由于基板上的焊垫大小、位置固定，而且因为凹槽的存在使得锡球相对于焊垫的位置不易偏移，可以保证芯片之锡球与基板之间结合更可靠，避免开路现象。

Description

一种芯片焊接方法及结构
技术领域
本发明涉及一种芯片焊接方法及结构，尤指一种覆晶焊接方法及结构。
背景技术
习知的陶瓷基板表面为平面，其上印制导电胶，以形成芯片焊接电路。导电胶为金属/非金属氧化物粉末与有机溶剂的混合体，将导电胶印刷于基板上需要借助网版，将导电胶放置于网版上，通过刮刀印刷于基板上，再通过静置、烘烤、烧结的制程形成电路或电路元器件。
图1所示为于习知的芯片焊接的示意图。于陶瓷基扳10上印制导电胶，形成芯片焊接电路，即焊垫12，芯片20的通过锡球30与基板10连接，锡球30与相接触，通过回焊炉将芯片20焊接于陶瓷基板10之焊垫12上。由于陶瓷基板10表面为平面，当于陶瓷基板10上印制导电胶时，由于网版印刷固有缺陷及导电胶特性差异导致焊垫12存在大小及位置的偏差，其中，网版印刷固有缺陷是指网版设计时产生的尺寸误差，从而导致焊垫12的位置存在偏差；导电胶特性差异是指导电胶的组成成分存在一定的误差，所述误差会造成导电胶的颗粒大小不同，从而导致焊垫12的存在尺寸大小的偏差。
因此，将所述印刷有焊垫12的基板10与芯片20一起过回焊炉的过程中，由于焊垫12存在大小及位置的偏差会导致熔锡时各焊垫12间的拉力不同，从而导致焊垫12与锡球30之间焊接不良而存在开路现象。
发明内容
有鉴于此，本发明提供一种于陶瓷基板上焊接芯片的方法及结构，可避免基板与芯片间焊接不良。
本发明实施方式中的芯片焊接方法包括如下步骤：于基板表面开设多个凹槽；于所述凹槽底部铺设导电胶，并对所述导电胶处进行烘烤、烧结，以使所述导电胶形成焊垫；及将芯片通过多个锡球连接于所述基板，并使所述锡球分别落入所述凹槽内，以与所述焊垫相接触，并将所述芯片与所述基板共同过回焊炉，从而使二者紧密结合。
本发明实施方式中的芯片焊接结构包括基板和芯片。所述基板表面设有多个凹槽，所述凹槽底部设有焊垫，所述焊垫的厚度小于所述凹槽的深度；所述芯片通过多个锡球与所述基板上的凹槽内的焊垫相连接，所述锡球分别落入所述凹槽内，与所述焊垫相接触，并将所述芯片与所述基板共同过回焊炉，从而使二者紧密结合。
优选地，通过激光技术于所述基板表面开设所述凹槽。
优选地，通过冲压技术于所述基板表面开设所述凹槽。
优选地，所述焊垫由导电胶经烘烤、烧结所形成。
通过所述方法制成的芯片焊接结构，由于基板上的焊垫大小、位置固定，而且因为凹槽的存在使得锡球相对于焊垫的位置不易偏移，可以保证芯片之锡球与基板之间结合更可靠，避免开路现象。
附图说明
图1是习知的芯片焊接方法示意图。
图2是本发明一实施方式中芯片焊接方法示意图。
具体实施方式
图2所示为本发明一实施方式中于陶瓷基板上焊接芯片的方法示意图。
图2(a)所示为未被加工之基板40。本发明之于陶瓷基板上焊接芯片的方法首先于未被加工之基板40表面开设多个凹槽42，为方便说明，本实施方式中包括3个凹槽42，如图2(b)所示。所述凹槽42可以通过激光技术或者冲压技术于基板40上加工形成，当然也可以通过其它加工方法形成所述凹槽42。本实施方式中，所述基板40的厚度为10喱(mil)，所述凹槽42的深度为1喱(mil)，所述凹槽42为正方形，其截面积为6×6喱(mil)。其它实施方式中，所述凹槽42亦可为圆形、椭圆形等其它形状。
加工形成所述凹槽42后，于所述凹槽42底部铺设导电胶，并对所述导电胶进行烘烤、烧结，从而使所述导电胶形成焊垫44。所述焊垫44之厚度小于所述凹槽42之深度，这样使得锡球50容纳于其中后不易偏移。
最后将芯片60通过多个锡球50与所述基板40相连接，并使所述锡球50分别落入所述凹槽42内，以与所述焊垫44相接触，并将所述芯片60与所述基板40共同过回焊炉，从而使二者紧密结合。
通过本发明之芯片焊接方法，可先准确定位凹槽42的位置，再于凹槽42内设置焊垫44，这样可以保证焊垫44于基板40上的准确定位，也可以确定焊垫44的大小。当过回焊炉时，芯片60通过锡球50焊接于基板40上，所述锡球50与焊垫44于凹槽42内熔化并焊接为一体，凹槽42限制了回焊过程中焊垫44与锡球50熔化时形成的焊锡由于其内聚力产生的位置偏移，从而有效地防止了焊垫44与锡球50之间开路的现象。
图2(c)中所示之芯片焊接结构，芯片与基板之间通过锡球50结合紧密可靠，具有良好的电性连接。

Claims (8)

1.一种芯片焊接方法，其特征在于，包括：
于基板表面开设多个凹槽；
于所述凹槽底部设置焊垫，所述焊垫的厚度小于所述凹槽的深度；
将芯片通过多个锡球与所述基板相连接，所述锡球分别落入所述凹槽内，与所述焊垫相接触；及
将所述芯片与所述基板共同过回焊炉，从而使二者紧密结合。
2.如权利要求1所述的芯片焊接方法，其特征在于，所述凹槽通过激光技术于所述基板表面开设。
3.如权利要求1所述的芯片焊接方法，其特征在于，所述凹槽通过冲压技术于所述基板表面开设。
4.如权利要求1所述的芯片焊接方法，其特征在于，所述焊垫由导电胶经烘烤、烧结所形成。
5.一种芯片焊接结构，其特征在于，包括：
基板，所述表面设有多个凹槽，所述凹槽底部设有焊垫，所述焊垫的厚度小于所述凹槽的深度；及
芯片，所述芯片通过多个锡球与所述基板上的凹槽内的焊垫相连接，所述锡球分别落入所述凹槽内，与所述焊垫相接触，并将所述芯片与所述基板共同过回焊炉，从而使二者紧密结合。
6.如权利要求5所述的芯片焊接结构，其特征在于，所述焊垫由导电胶经烘烤、烧结所形成。
7.如权利要求5所述的芯片焊接结构，其特征在于，所述凹槽是通过激光技术于所述基板表面形成。
8.如权利要求5所述的芯片焊接结构，其特征在于，所述凹槽是通过冲压技术于所述基板表面形成。
CN200910107150A 2009-04-24 2009-04-24 一种芯片焊接方法及结构 Pending CN101872727A (zh)

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CN200910107150A CN101872727A (zh) 2009-04-24 2009-04-24 一种芯片焊接方法及结构
US12/686,514 US20100273297A1 (en) 2009-04-24 2010-01-13 Chip packaging method

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CN104465598A (zh) * 2014-12-19 2015-03-25 江苏长电科技股份有限公司 金属引线框高导热倒装片封装结构及其工艺方法
CN105576110A (zh) * 2014-10-31 2016-05-11 首尔伟傲世有限公司 高效率发光装置
CN105935844A (zh) * 2015-03-03 2016-09-14 发那科株式会社 基板、具备该基板的电动机以及焊接方法
CN109719381A (zh) * 2019-02-21 2019-05-07 巴中市特兴智能科技有限公司 一种自动焊接键合金线的工艺方法

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CN103247586A (zh) * 2012-02-04 2013-08-14 隆达电子股份有限公司 芯片接合结构及芯片接合的方法
CN105576110A (zh) * 2014-10-31 2016-05-11 首尔伟傲世有限公司 高效率发光装置
CN105576110B (zh) * 2014-10-31 2018-04-13 首尔伟傲世有限公司 高效率发光装置
CN104465598A (zh) * 2014-12-19 2015-03-25 江苏长电科技股份有限公司 金属引线框高导热倒装片封装结构及其工艺方法
CN105935844A (zh) * 2015-03-03 2016-09-14 发那科株式会社 基板、具备该基板的电动机以及焊接方法
CN105935844B (zh) * 2015-03-03 2020-02-21 发那科株式会社 基板、具备该基板的电动机以及焊接方法
CN109719381A (zh) * 2019-02-21 2019-05-07 巴中市特兴智能科技有限公司 一种自动焊接键合金线的工艺方法

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