WO2005107347A1 - 非接触型データキャリア用導電部材とその製造方法及び装置 - Google Patents
非接触型データキャリア用導電部材とその製造方法及び装置 Download PDFInfo
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- WO2005107347A1 WO2005107347A1 PCT/JP2005/007527 JP2005007527W WO2005107347A1 WO 2005107347 A1 WO2005107347 A1 WO 2005107347A1 JP 2005007527 W JP2005007527 W JP 2005007527W WO 2005107347 A1 WO2005107347 A1 WO 2005107347A1
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- WIPO (PCT)
- Prior art keywords
- conductive layer
- data carrier
- conductive member
- base material
- conductive
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0522—Using an adhesive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1054—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing and simultaneously bonding [e.g., cut-seaming]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49163—Manufacturing circuit on or in base with sintering of base
Definitions
- Non-contact type data carrier conductive member and method and apparatus for manufacturing the same
- the present invention relates to a conductive member for a non-contact type data carrier such as an antenna, an interposer, and a bridge, and a method and an apparatus for manufacturing the same.
- a wireless tag used for a product is manufactured using a conductive member for a non-contact data carrier such as an antenna.
- a resist pattern is mainly formed on a metal layer such as aluminum or copper laminated on a base material. It is manufactured by etching.
- Patent Document 1 JP-A-9-44762
- the punching blade of the metal foil and the press of the mold are formed so that the patterns are exactly coincident with each other. Cannot be formed.
- the number of materials used for the laminate increases.
- an object of the present invention is to provide means for solving the above problems.
- the invention according to claim 1 is directed to an adhesive layer (5, 32) formed on a substrate (4) in a predetermined pattern, and the adhesive layer (5, 32)
- a non-contact type data carrier conductive member having a conductive layer (6) having a metal foil or alloy foil strength substantially the same as that of the above-mentioned pattern adhered thereto is adopted.
- the invention according to claim 2 provides the conductive member for a non-contact type data carrier according to claim 1, wherein the notch for cutting the conductive layer (6) along the contour of the conductive layer (6). 7) adopts a non-contact type data carrier conductive member formed on the base material (4).
- the invention according to claim 3 provides the conductive member for a non-contact data carrier according to claim 1 or 2, wherein the surface of the conductive layer (6) is a protective layer (28). Use a non-contact type conductive material for data carriers covered with.
- thermoplastic adhesive layer is formed on the surface while running the substrate (4).
- the conductive layer (6) is overlaid from the thermoplastic adhesive layer (5) side, and the bonding process of heating and bonding in a predetermined pattern; And a punching step of punching the layer (6) with the pattern described above.
- the non-contact type wherein the punching step is performed after the bonding step is performed.
- a method for manufacturing a conductive member for a mold data carrier is employed.
- the non-contact type in which the punching step is performed and then the bonding step is performed is performed.
- a method for manufacturing a conductive member for a mold data carrier is employed.
- the bonding step and the punching step are performed by a cylinder (16).
- a method for manufacturing a conductive member for a mold data carrier is employed.
- the invention according to claim 8 is a method for manufacturing a conductive member for a non-contact type data carrier according to claim 4, wherein the bonding step and the punching step are performed by a flat plate (21).
- a method of manufacturing a conductive member for a contact data carrier is employed.
- thermoplastic adhesive layer is formed on the surface while running the substrate (4).
- the conductive layer (6) on which the (5) is formed is overlapped from the thermoplastic adhesive layer (5) side, and an adhesive means (19) for heating and bonding in a predetermined pattern, and a conductive layer on the substrate (4)
- the bonding means (19) and the punching means (18) have the same cylinder (16).
- a manufacturing apparatus for a conductive member for a non-contact type data carrier provided in the flat board (21) is employed.
- the invention according to claim 11 provides a non-contact data carrier in which an interposer (3) is electrically connected to the antenna (2), which is the non-contact data carrier conductive member according to claim 1. adopt.
- the bridge (24) and the IC chip (8) are electrically connected to the antenna (2), which is the conductive member for a non-contact data carrier according to claim 1.
- Adopt a contactless data carrier.
- the invention according to claim 13 is the method for manufacturing a conductive member for a non-contact type data carrier according to claim 4, wherein the conductive layer (6) and the base material (4) are formed in the bonding step or the punching step.
- the invention according to claim 14 is the apparatus for manufacturing a conductive member for a non-contact type data carrier according to claim 9, wherein the bonding means (19) or the punching means (18) is provided with the conductive layer (6).
- An apparatus for manufacturing a conductive member for a non-contact data carrier having a cushioning pressing body (29) for pressing a superimposed body with the base (4) is employed.
- the invention according to claim 16 is the method for manufacturing a conductive member for a non-contact type data carrier according to claim 15, wherein the superposed body of the conductive layer (6) and the base material (4) after the separation step.
- the invention according to claim 17 provides an apparatus for manufacturing a conductive member for a non-contact type data carrier according to claim 9, wherein an unnecessary portion of the conductive layer (6) from the base material (4) is provided.
- An apparatus for manufacturing a conductive member for a non-contact type data carrier which further includes a separating means (20a) for separating 6b).
- the unnecessary portion (6b) of the conductive layer (6) is removed in the apparatus for manufacturing a conductive member for a non-contact data carrier according to claim 17.
- An apparatus for manufacturing a conductive member for a non-contact type data carrier which is provided with a heat press means (30, 31) for heating and pressurizing a superimposed body of the conductive layer (6) and the base material (4) later, is adopted.
- the invention according to claim 19 is the method for manufacturing a conductive member for a non-contact type data carrier according to claim 15, wherein the unnecessary portion (6b) of the conductive layer (6) is sucked while the unnecessary portion (6b) is sucked.
- a method of manufacturing a conductive member for a non-contact type data carrier is employed, in which an unnecessary portion (6b) is separated from the substrate (4) by blowing gas between the portion (6b) and the substrate (4). .
- the invention according to claim 20 provides the apparatus for manufacturing a conductive member for a non-contact data carrier according to claim 17, wherein the unnecessary portion of the conductive layer (6) from the base material (4) is formed.
- the separating means for separating 6b) is provided between the suction means (39) for sucking the unnecessary portion (6b) of the conductive layer (6) and the unnecessary portion (6b) of the conductive layer (6) and the base material (4).
- -Contact type data with nozzle (40) for blowing gas to An apparatus for manufacturing a conductive member for a carrier is employed.
- the adhesive layer (5, 32) is formed in a predetermined pattern on the base material (4), and the pattern is formed on the adhesive layer (5, 32). Since it is a non-contact type data carrier conductive member to which a conductive layer (6) made of a metal foil or an alloy foil having substantially the same pattern as that of the adhesive layer (5, 32) under the conductive layer (6) is attached. Extrusion is prevented.
- the pattern can be formed, for example, by coating.
- the notch for cutting the conductive layer (6) along the contour of the conductive layer (6) ( Since 7) is a conductive member for a non-contact type data carrier formed on the base material (4), the pattern of the conductive layer (6) is adjusted by the cuts (7), and the electrical conductivity of the conductive layer (6) is adjusted. Performance is improved.
- the surface of the conductive layer (6) has a protective layer (28). Since it is a non-contact type conductive member for a data carrier, it is prevented from being oxidized or damaged.
- the thermoplastic adhesive layer (5) is formed on the surface while the base material (4) is running.
- the method includes a bonding step of superposing from the side of the agent layer (5) and bonding by heating in a predetermined pattern, and a punching step of punching the conductive layer (6) on the substrate (4) with the above-mentioned pattern. Since it is a method of manufacturing a conductive member for a contact type data carrier, the use of a conductive layer on which a thermoplastic adhesive layer has been formed in advance enables the use of a pattern forming device such as a printing machine or a coating device to make a non-contact type data carrier.
- Power for manufacturing conductive members for non-contact data carriers can be cut off, which simplifies and reduces the cost of manufacturing facilities for conductive members for non-contact data carriers.
- a thermoplastic adhesive layer can be formed on the entire surface on the conductive layer side, there is no need to align the conductive layer and the heating mold in the heat bonding step, and a facility for manufacturing a conductive member for a non-contact type data carrier. Is simplified.
- a non-contact method in which the punching step is performed after the bonding step is performed.
- the conductive layer (6) is fixed on the substrate (4) because it is a method for manufacturing conductive members for die-shaped data carriers. After that, punching can be performed. Therefore, the displacement of the conductive layer (6) on the base material (4) due to the punching can be prevented.
- a non-contact method in which the punching step is performed and then the bonding step is performed. Since it is a method of manufacturing a conductive member for a mold data carrier, "deformation of the base material” and “shearing of the conductive layer” generated in the punching step are completely removed by hot pressing in the subsequent heat bonding step. Improves adhesion and adhesion to steel, increases durability, and stabilizes electrical performance
- the non-contact type wherein the bonding step and the punching step are performed by a cylinder (16). Since the method is a method for manufacturing a conductive member for a mold data carrier, the speed of manufacturing the conductive member for a non-contact data carrier can be increased.
- the cylinder (16) can be used as a rotary die.
- the bonding step and the punching step are performed by a flat plate (21). Since the method is a method for manufacturing a conductive member for a contact-type data carrier, the punching pattern of the conductive layer (6) in the punching step can be easily changed.
- a flat plate (21) As the flat plate (21), a flat blade of a flat press device can be used.
- the conductive layer (6) having the thermoplastic adhesive layer (5) formed on the surface thereof is moved while the base material (4) is running. It includes an adhesive means (19) for superimposing and bonding in a predetermined pattern from the side of (5), and a punching means (18) for punching the conductive layer (6) on the substrate (4) with the above-mentioned pattern. Since it is a manufacturing device for non-contact type conductive members for data carriers, the use of a conductive layer on which a thermoplastic adhesive layer has been formed in advance allows non-contact forming devices such as printing machines and coating devices to be in non-contact.
- thermoplastic adhesive layer can be formed on the entire surface of the conductive layer, it is not necessary to align the conductive layer and the heating mold in the heating bonding step. Equipment is simplified.
- the bonding means (19) and the punching means (18) are formed by the same cylinder (16).
- bonding and punching can be performed in the same place, so that the device is compact and the installation space is reduced. be able to.
- a non-contact data carrier in which the interposer (3) is electrically connected to the antenna (2), which is the non-contact data carrier conductive member according to claim 1, is provided. Therefore, a wireless tag or the like can have excellent electrical performance.
- the bridge (24) and the IC chip (8) are electrically connected to the antenna (2), which is the non-contact type data carrier conductive member according to claim 1. Since it is a non-contact type data carrier, a wireless tag or the like can have excellent electrical performance.
- the conductive layer (6) and the base material (4) are formed in the bonding step or the punching step.
- This method is for manufacturing a conductive member for a non-contact type data carrier, in which the superposed body is pressed through a cushion material, so that the superposed body of the conductive layer (6) and the base material (4) can be made uniform during bonding or punching. Therefore, the conductive layer (6) having an appropriate pattern can be formed on the substrate (4).
- the bonding means (19) or the punching means (18) includes the conductive layer (6). Since this is a noncontact data carrier conductive member manufacturing apparatus provided with a cushioning pressing body (29) for pressing a superimposed body with the base material (4), the cushioning pressing body (29) is used when bonding or punching. ) Makes it possible to press the superimposed body of the conductive layer (6) and the base material (4) with a uniform pressing force, and thus to form the conductive layer (6) in an appropriate pattern on the base material (4). Can be.
- unnecessary portions of the conductive layer (6) from the base material (4) ( 6b) is a method for producing a conductive member for a non-contact data carrier, which further comprises a separation step of separating The unnecessary portion (6b) of the conductive layer (6) can be separated immediately after punching the conductive layer (6) in a predetermined pattern on the base material (4).
- the conductive member for a carrier can be easily and quickly produced.
- the conductive layer (6) and the base material (4) are overlapped after the separation step. Since this is a method of manufacturing a conductive member for a non-contact type data carrier, which further includes a hot pressing step of pressing while heating the body, air bubbles and the like are mixed between the conductive layer (6) and the base material (4). Even if the edge of the pattern of the conductive layer (6) rises from the substrate (4) after the pattern is punched, or if the surface of the conductive layer (6) is wavy, 4) Adhesion can be made smoothly over the entire pattern. Therefore, characteristics as an antenna or the like can be improved. It is also possible to bury the pattern of the conductive layer (6) in the base material (4) by adjusting the pressing force or the like, but in that case, the pattern of the conductive layer (6) is properly protected.
- the unnecessary part (6 b) of the conductive layer (6) is removed in the apparatus for manufacturing a conductive member for a noncontact data carrier according to claim 17.
- a device for manufacturing a conductive member for a non-contact type data carrier which is provided with hot press means (30, 31) for heating and pressing the superimposed body of the conductive layer (6) and the base material (4) after heating.
- the pattern edge of the conductive layer (6) is lifted from the substrate (4) after the pattern is punched, or the conductive layer ( Even if the surface of (6) is wavy, the conductive layer (6) can be smoothly adhered to the substrate (4) over the entire pattern by the hot pressing means (30, 31). Therefore, characteristics as an antenna or the like can be improved. It is also possible to bury the pattern of the conductive layer (6) in the base material (4) by adjusting the pressing force of the hot pressing means (30, 31) or the like. The pattern is properly protected.
- the unnecessary portion (6b) of the conductive layer (6) is sucked while sucking the unnecessary portion (6b).
- the unnecessary portion (6b) of the conductive layer (6) is separated by separating the unnecessary portion (6b) from the base material (4) by blowing gas between the unnecessary portion (6b) and the substrate (4). Can be removed smoothly.
- Separation means for separating (6b) comprises suction means (39) for sucking unnecessary portions (6b) of conductive layer (6), unnecessary portions (6b) of conductive layer (6) and base material (4) And a nozzle (40) for blowing gas between them, not only can the unnecessary portion (6b) of the conductive layer (6) be removed smoothly, but also the device structure for separation can be improved. It can be simplified.
- FIG. 1 is a perspective view schematically showing a wireless tag manufactured using an antenna and an interposer according to the present invention.
- FIG. 2 is a perspective view schematically showing an antenna according to the present invention.
- FIG. 3 (A) is a sectional view taken along line III-III in FIG. 2, and FIG. 3 (B) is a similar sectional view showing a case where a protective layer is added.
- FIG. 4 is a perspective view schematically showing an interposer according to the present invention.
- FIG. 5 is a sectional view taken along line VV in FIG.
- FIG. 6 is a schematic side view showing an apparatus for manufacturing an antenna according to the present invention.
- FIG. 7 is a schematic side view showing an antenna manufacturing apparatus according to Embodiment 2 of the present invention.
- FIG. 8 is a schematic side view showing an antenna manufacturing apparatus according to Embodiment 3 of the present invention.
- FIG. 9 is a perspective view schematically showing a wireless tag made using an antenna and a bridge according to Embodiment 4 of the present invention.
- FIG. 10 is a perspective view schematically showing an interposer with an antenna according to a fifth embodiment of the present invention.
- FIG. 11 is a schematic side view of an antenna manufacturing apparatus according to Embodiment 6 of the present invention.
- FIG. 12 is a schematic side view of an antenna manufacturing apparatus according to Embodiment 7 of the present invention.
- FIG. 13 is a schematic side view of an antenna manufacturing apparatus according to Embodiment 8 of the present invention.
- FIG. 14 is a schematic side view of an antenna manufacturing apparatus according to Embodiment 9 of the present invention.
- FIG. 15 is a schematic side view of an antenna manufacturing apparatus according to Embodiment 10 of the present invention.
- FIG. 16 is a schematic side view of an antenna manufacturing apparatus according to Embodiment 11 of the present invention.
- FIG. 17 is a schematic side view of an antenna manufacturing apparatus according to Embodiment 12 of the present invention.
- FIG. 18 is a schematic side view of an antenna manufacturing apparatus according to Embodiment 13 of the present invention.
- FIG. 19 is a schematic side view of an antenna manufacturing apparatus according to Embodiment 14 of the present invention.
- FIG. 20 is a schematic side view of an antenna manufacturing apparatus according to Embodiment 15 of the present invention.
- FIG. 21 FIG.
- FIG. 21 is a schematic side view of an antenna manufacturing apparatus according to Embodiment 16 of the present invention.
- FIG. 22 is a schematic side view of an antenna manufacturing apparatus according to Embodiment 17 of the present invention.
- FIG. 23 is a schematic side view of an antenna manufacturing apparatus according to Embodiment 18 of the present invention.
- FIG. 24 is a sectional view of an antenna manufactured by the antenna manufacturing apparatus according to Embodiment 7 of the present invention before heat pressing.
- FIG. 25 is a cross-sectional view of an antenna manufactured by the antenna manufacturing apparatus according to Embodiment 7 of the present invention after heat pressing.
- FIG. 26 is a perspective view showing a separation step in the antenna manufacturing apparatus according to Embodiment 19 of the present invention.
- FIG. 27 is a perspective view showing a separation step in the antenna manufacturing apparatus according to Embodiment 20 of the present invention.
- FIG. 28 is a schematic side view of an antenna manufacturing apparatus according to Embodiment 21 of the present invention.
- FIG. 29 is a schematic side view of the antenna manufacturing apparatus according to Embodiment 22 of the present invention.
- FIG. 30 is a schematic side view of an antenna manufacturing apparatus according to Embodiment 23 of the present invention.
- FIG. 31 is a schematic side view of an antenna manufacturing apparatus according to Embodiment 24 of the present invention.
- FIG. 32 is a schematic side view of an antenna manufacturing apparatus according to Embodiment 25 of the present invention.
- FIG. 33 is a schematic side view of an antenna manufacturing apparatus according to Embodiment 26 of the present invention.
- FIG. 34 FIG.
- FIG. 34 is a schematic side view of an antenna manufacturing apparatus according to a twenty-seventh embodiment of the present invention.
- FIG. 35 is a schematic side view of an antenna manufacturing apparatus according to Embodiment 28 of the present invention.
- FIG. 36 is a schematic side view of the antenna manufacturing apparatus according to Embodiment 29 of the present invention.
- FIG. 37 is a schematic side view of an antenna manufacturing apparatus according to Embodiment 30 of the present invention.
- thermoplastic adhesive layer 5 .
- the wireless tag 1 shown in FIG. 1 uses an antenna 2 which is a conductive member for a non-contact type data carrier shown in FIG. 2, and an interposer 3 which is a conductive member for a non-contact type data carrier shown in FIG. Made As shown in FIG. 1, the ends 2a and 2b of the antenna 2 are electrically connected by an interposer 3, and the entire surface of the wireless tag 1 is covered with a protective layer (not shown) such as a resin film.
- Antenna 2 has a layer configuration as shown in FIG. 3 (A). That is, a thermoplastic adhesive layer 5 is printed on a sheet-like base material 4 made of paper, resin, or the like with the same pattern as the spiral pattern of the antenna 2, and the antenna is placed on the thermoplastic adhesive layer 5.
- the conductive layer 6, which is also a metal foil or alloy foil, such as aluminum, copper, copper alloy, phosphor bronze, or SUS, is heated and bonded in the spiral pattern of 2.
- the antenna has various patterns such as a bar-shaped pattern, a pad-shaped pattern, and a cross-shaped pattern depending on the communication frequency band in addition to the spiral pattern.
- thermoplastic adhesive layer 5 is applied to the pattern of the antenna 2 by a printing method such as inkjet printing, gravure printing, flexographic printing, screen printing, or the like. As described above, the thermoplastic adhesive layer 5 is formed on the base material 4 by the printing method, so that the conductive layer 6 is formed on the base material 4 without being greatly raised, and the conductive layer 6 is formed from below the conductive layer 6. The exudation of the thermoplastic adhesive is prevented.
- a cut 7 is formed in the base material 4 so as to cut the conductive layer 6 along the pattern of the antenna 2, that is, the contour of the conductive layer 6.
- the cuts 7 make the contour of the pattern of the conductive layer 6 neat, and the electrical performance of the conductive layer 6 is enhanced.
- the surface of the conductive layer 6 is covered with a protective layer 28 as necessary, whereby the conductive layer 6 is protected from oxidation, damage, and the like. Resin or the like is used for the protective layer 28.
- the interposer 3 is configured by electrically connecting strip-shaped conductive sheets 9 and 9 to electrodes (not shown) on both sides of the IC chip 8, respectively, as shown in FIG. Then, the conductive sheets 9 and 9 on both sides are bonded to the ends 2a and 2b of the antenna 2 with a conductive adhesive or the like. As shown in FIG. 5, the conductive sheets 9 and 9 have the same layer configuration as the antenna 2 described above.
- a conductive layer 12 which is also relatively thinner than the base material 4 of the antenna 2 and has a metal foil or alloy foil force of aluminum, copper, copper alloy, phosphor bronze, SUS or the like via an adhesive layer 11 on a base material 10 is bonded or bonded. It is formed by lamination.
- the conductive layer 12 may be bonded via a thermoplastic adhesive layer as in the case of the antenna 2 in some cases.
- the interposer 3 it is also possible to use an interposer other than the above-mentioned production method, for example, one produced with conductive ink.
- a continuum 4a of the base material 4 and a continuum 6a of the conductive layer 6 as a metal foil are prepared, and both the continuities 4a, 6a are continuously run in the direction of the arrow at the same speed.
- thermoplastic adhesive layer 5 is printed on the surface of the continuum 4a of the base material 4 at regular intervals in the same pattern as the pattern of the antenna 2.
- the dryer 14 is disposed downstream of the inkjet nozzle 13.
- the thermoplastic adhesive layer 5 printed on the surface of the continuum 4a of the substrate 4 is dried by removing the solvent and the like contained therein by the dryer 14.
- the dryer 14 is omitted depending on the type of the thermoplastic adhesive 5a used.
- the processing cylinder 16 and the receiving roller 17 are arranged so as to sandwich the continuous body 4a of the base material 4 and the continuous body 6a of the conductive layer 6 which is a metal foil. Is done.
- the processing cylinder 16 is a metal roller having a built-in electric heater (not shown), and a punching blade 18 corresponding to the pattern of the antenna 2 is formed on a peripheral surface thereof.
- a punching blade 18 corresponding to the pattern of the antenna 2 is formed on a peripheral surface thereof.
- four sets of punching blades 18 for punching one antenna 2 pattern are arranged around the processing cylinder 16.
- the number of sets arranged differs depending on the antenna size, processing cylinder diameter, and the like.
- a heat transfer body 19 is inserted between the blades of the pattern portion of the punching blade 18.
- the heat transfer body 19 is desirably made of a cushioning material made of rubber, heat-resistant resin or the like. Also heat transfer The portion corresponding to the body 19 can be formed of the same material as the punching blade 18.
- the receiving roller 17 is formed of a metal roller. By changing the position of the metal roller, the gap (gap) with the processing cylinder 16 can be adjusted according to the thickness of the base material 4.
- the continuum 4a of the base material 4 and the continuum 6a of the conductive layer 6 that is a metal foil are drawn between the processing cylinder 16 and the receiving roller 17 in an overlapping state, and are punched on the metal foil by the punching blade 18. Na 2 pattern is punched.
- the punched conductive layer 6 of the pattern of the antenna 2 is pressed by the heat conductor 19 against the thermoplastic adhesive layer 5 of the same pattern as the antenna 2 on the continuum 4 a of the base material 4.
- the thermoplastic adhesive layer 5 is melted by the heat transfer from the heat transfer body 19, and the conductive layer 6 is adhered onto the continuous body 4a of the base material by the melted thermoplastic adhesive layer 5.
- the antenna 2 can be manufactured easily and accurately. Further, the manufacturing apparatus is compact and the installation space is reduced.
- the continuum 4a of the base material 4 is cut along the contour of the antenna 2 along the contour of the antenna 2 by the tip of a punching blade 18 formed by punching the continuum 6a of the conductive layer 6 which is a metal foil. Is formed. Thereby, the conductive layer 6 is accurately punched according to the pattern of the antenna 2, and the contour of the pattern of the antenna 2 is neatly adjusted.
- air holes 27 are desirably formed in portions corresponding to unnecessary portions other than the heat transfer body 19 in the processing cylinder 16.
- the air holes 27 function as suction means for suctioning unnecessary portions to the punching blade side, and also function as discharging means for discharging unnecessary portions from the punching blade side after punching. That is, when the punching blade 18 punches the conductive layer 6 which is a metal foil, the unnecessary portion is sucked toward the punching blade side by sucking air from the air hole 27 in the punching blade side, that is, in the direction of arrow a. Thereby, the conductive layer 6 is punched out with a more accurate pattern.
- the air holes 27 may be switchably connected to an intake mechanism and an exhaust mechanism (not shown). Alternatively, the air holes connected to the intake mechanism and the air holes connected to the exhaust mechanism may be independently provided.
- Separation rollers 20a and 20b are provided downstream of the processing cylinder 16, and the continuum 4a of the base material 4 and the continuum 6a of the conductive layer 6 which is a metal foil pass through the separation rollers 20a and 20b. Pulled in the opposite direction, the antenna 2 travels in the direction of the arrow while being carried on the continuum 4a of the substrate 4, and the unnecessary portion 6b of the metal foil travels in the direction of the arrow while being separated from the continuum 4a of the substrate 4. I do.
- the continuum 4a of the base material 4 is divided for each antenna 2 and provided for the manufacture of the above-described wireless tag, for example.
- the strip-shaped conductive sheet 9 of the interposer 3 can be manufactured by the same method and apparatus as those used for manufacturing the antenna 2.
- the processing cylinder 16 in the first embodiment is separated into two cylinders 16a and 16b, and the continuum 4a of the base material 4 and the conductive layer 6 as a metal foil are formed. Are arranged along the flow direction of the continuum 6a.
- the cylinder 16a on the upstream side is a heating cylinder, and a heat transfer body 19 that forms a heating pattern corresponding to the pattern of the antenna 2 is formed on the peripheral surface thereof in a convex shape.
- the heat transfer body 19 is formed of rubber, heat-resistant resin, or the like having cushioning and heat transfer properties.
- the cylinder 16a can also be made by patterning with a metal roll.
- the cylinder 16b on the downstream side is a punching cylinder, and a punching blade 18 corresponding to the pattern of the antenna 2 is formed on the peripheral surface thereof.
- Receiving rollers 17a and 17b similar to the receiving roller 17 of the first embodiment are disposed to face the heating cylinder 16a and the punching cylinder 16b, respectively.
- the continuum 4a of the base material 4 and the continuum 6a of the conductive layer 6 as a metal foil are drawn between the heating cylinder 16a and the receiving roller 17a in an overlapping state, and the heat transfer material 19 on the heating cylinder 16a is drawn.
- the thermoplastic adhesive layer 5 printed in the same shape as the pattern of the antenna 2 on the continuum 4a of the base material 4 is melted by the above pattern, and the conductive layer of metal foil is formed on the melted thermoplastic adhesive layer 5. 6 is pressed.
- the continuum 4a of the substrate 4 and the continuum 6a of the conductive layer 6 which is a metal foil are drawn between the punching cylinder 16b and the receiving roller 17b while overlapping, and The foil is punched in the pattern of antenna 2 with a punching blade 18.
- the continuum 4a of the base material 4 and the continuum 6a of the conductive layer 6 as a metal foil are separated in the same manner as in the first embodiment.
- the metal foil can be punched after the metal foil is fixed on the base material 4.
- the displacement of the conductive layer 6 on the substrate 4 due to the removal is prevented.
- the conductive sheet 9 of the interposer 3 can be manufactured in the same manner as the manufacturing of the antenna 2 described above.
- the processing cylinder 16 and the receiving roller 17 are replaced by a flat plate 21 and a receiving table 22 which are flat blades of a flat press device. .
- the continuum 4 of the base material 4 and the continuum 6a of the conductive layer 6 which is a metal foil are intermittently fed between the processing flat plate 21 and the receiving table 22 at a constant pitch. It reciprocates up and down with respect to the cradle 22. Then, the continuum 6a of the conductive layer 6 which is a metal foil is punched into a pattern of the antenna 2 for each reciprocating motion, and is pressed against the molten thermoplastic adhesive layer 5 on the continuum 4 of the base material. Thereafter, the continuum 4a of the base material 4 and the continuum 6a of the conductive layer 6 as a metal foil are separated in the same manner as in the first embodiment.
- the processing flat plate 21 and the cradle 22 are separated into a heating flat plate and a punching flat plate, as in the case of Embodiment 2, and the cradle 22 is assigned to each of them. You can.
- air holes 27 are formed in the processing flat plate 21 at locations corresponding to unnecessary portions other than the heat transfer bodies 19.
- the punching blade 18 punches the conductive layer 6 made of a metal foil, the unnecessary portion is sucked toward the punching blade side by sucking air from the air hole 27 in the punching blade side, that is, in the direction of arrow a.
- the conductive layer 6 is punched with a more accurate pattern.
- air is blown out from the air holes 27 in the direction of arrow b to push out unnecessary portions to the outside of the punching blade 18. This makes it possible to easily collect unnecessary portions.
- unnecessary parts other than the heat transfer body 19 in the processing cylinder 16 It is possible to prevent the portion corresponding to the main part from being clogged.
- the air holes 27 may be switchably connected to an intake mechanism and an exhaust mechanism (not shown). Alternatively, the air holes connected to the intake mechanism and the air holes connected to the exhaust mechanism may be independently provided. May be installed.
- the IC chip 8 is mounted in the middle of the antenna 2 which is the conductive member for the non-contact type data carrier.
- the ends 2a and 2b of the antenna 2 are electrically connected by a bridge 24 instead of the interposer 3.
- the bridge 24 is formed of a laminate formed by laminating a conductive layer made of metal foil on a base material made of a resin film or the like by laminating or the like.
- the bridge 24 can be manufactured in the same manner as the manufacture of the antenna 2 described in the first embodiment.
- the interposer 25 of the fifth embodiment is configured as an interposer with an antenna.
- the antennas 26, 26 are formed of a laminate in which a conductive layer made of metal foil is laminated on a base made of a resin film or the like via a thermoplastic adhesive layer.
- the antennas 26, 26 are examples of the bar-shaped pattern antenna described above.
- the antenna 26 can be manufactured in the same manner as the antenna described in the first embodiment.
- thermoplastic adhesive layer 5 is printed in a predetermined pattern by an inkjet nozzle 13 on a surface thereof while a continuum 6a of a conductive layer 6 as a metal foil is running. Then, the thermoplastic adhesive layer 5 is dried by the dryer 14, and at the same time, the continuum 6a of the conductive layer 6 is overlapped from the side of the thermoplastic adhesive layer 5 while the continuum 4a of the base material 4 is running, and heated and bonded. I have to do it! /
- thermoplastic adhesive layer 5 is printed on the upper surface thereof, and after the thermoplastic adhesive layer 5 is dried, Turn the thermoplastic adhesive layer 5 upside down with the turn bar so that the thermoplastic adhesive layer 5 faces the continuum 4a side of the base material 4, and then the continuum 6a of the conductive layer 6 is connected to the base material 4 from the thermoplastic adhesive layer 5 side. Superimposed on body 4a And then heat and bond them.
- the manufacturing apparatus of the conductive member for a non-contact type data carrier according to the seventh embodiment differs from the first embodiment shown in FIG.
- the superimposed body is pressed through a cushion material.
- a cushioning pressing body 29 such as a rubber sheet is wound around the peripheral surface of the receiving roller 17 facing the processing cylinder 16.
- the superimposed body is pressurized with a uniform pressing force when passing between the power cylinder 16 and the receiving roller 17, so that the conductive layer 6 is accurately punched out on the base material 4 and at the same time. Will be properly bonded.
- the unnecessary portion 6b of the conductive layer 6 is removed from the continuous body 4a of the base material 4, and the continuous body 4a is pressed while being heated further downstream. Specifically, hot pressing is performed between the heating roller 30 and the pressure roller 31. As a result, air bubbles or the like are mixed between the conductive layer 6 and the substrate 4 even after the pattern is punched, the edge of the pattern of the conductive layer 6 is lifted from the substrate 4, the surface of the conductive layer 6 Even if it is wavy, the pattern of the conductive layer 6 is smoothly adhered onto the base material 4 over the entirety.
- the heating press by adjusting the pressing force of the base material 4 by the heating roller 30 and the pressure roller 31, the calorie heat temperature, and the like, as shown in FIG. Force that can be adhered in a protruding state as shown in FIG. 25.
- the pattern of the conductive layer 6 can be buried in the softened base material 4. In the latter case, the entire surface of the base material 4 is smooth, and the pattern of the conductive layer 6 is properly protected from abrasion and the like. In this case, the notch 7 almost disappears.
- a continuum 6a of conductive layer 6 whose surface is covered with protective layer 28 made of resin is used.
- the presence of the protective layer 28 prevents the conductive layer 6 from being oxidized and damaged during the manufacture of the non-contact type data carrier conductive member.
- This protective layer 28 is provided as needed, and can be omitted.
- the processing cylinder 16 in the seventh embodiment is separated into two cylinders 16a and 16b, and a continuous body 4a of the base material 4 and a conductive layer that is a metal foil are provided. 6 are arranged along the flow direction of the continuum 6a.
- a cushioning pressing body 29 such as a rubber sheet is wound around the peripheral surfaces of the receiving rollers 17a and 17b facing the cylinders 16a and 16b.
- the superimposed body of the continuum 6a of the conductive layer 6 and the continuum 4a of the base material 4 is pressurized with a uniform pressing force when passing between the cylinders 16a, 16b and the receiving rollers 17a, 17b.
- the thermoplastic adhesive layer 5 is uniformly melted, and the conductive layer 6 is accurately punched out on the base material 4 to be properly bonded to the base material 4.
- the working cylinder 16 and the receiving roller 17 in the seventh embodiment are replaced by a flat plate 21 and a receiving stand 22 which are flat blades of a flat press device.
- the superimposed body is pressurized via a cushion material.
- a cushioning pressing body 29 such as a rubber sheet is attached to the upper surface of the receiving table 22.
- FIG. 14 the same parts as those in FIGS. 12 and 8 are denoted by the same reference numerals, and redundant description will be omitted.
- thermoplastic adhesive layer 5 is printed in a predetermined pattern by an inkjet nozzle 13 on a surface thereof while a continuum 6a of a conductive layer 6 is running. Then, the thermoplastic adhesive layer 5 is dried by the dryer 14, and at the same time, the continuum 6a of the conductive layer 6 is moved to the side of the thermoplastic adhesive layer 5 while running the continuum 4a of the base material 4. The power comes to be superimposed and bonded together!
- the antenna manufactured by the manufacturing method and apparatus according to the eleventh embodiment has the same layer configuration as the layer configuration shown in FIG. 3A, but the adhesive layer 5 is formed of an adhesive having different properties. .
- a UV (ultraviolet) or EB (electron beam) curable adhesive layer is printed in the same pattern as that of the antenna 2 on a sheet-like substrate 4 made of paper, resin, or the like.
- a conductive layer 6 made of metal foil or alloy foil of aluminum, copper, copper alloy, phosphor bronze, SUS, or the like is adhered on the EB curable adhesive layer in the pattern of the antenna 2.
- the UV or EB curable adhesive layer is applied to the pattern of the antenna 2 by a printing method such as inkjet printing, gravure printing, flexographic printing, screen printing, or the like.
- the conductive layer 6 is formed on the base material 4 without being greatly raised, and the conductive layer 6 The exudation of the glue is prevented.
- the surface of the conductive layer 6 is covered with a protective layer 28, if necessary, to protect the surface of the conductive layer 6 from being oxidized or damaged. Resin or the like is used for the protective layer 28.
- the adhesive layer 11 of the interposer 3 shown in FIG. 5 can also be a UV or EB curable adhesive layer.
- a continuum 4a of the base material 4 and a continuum 6a of the conductive layer 6 as a metal foil are prepared, and both the continuities 4a, 6a are continuously run at the same speed in the direction of the arrow.
- An inkjet nozzle 13 is disposed above the traveling path of the continuum 4a of the base material 4, and the inkjet nozzle 13 uses a liquid UV or EB curable adhesive 32a to form a continuum of the base material 4. 4 Discharge toward the surface of a. Thereby, the UV or EB curable adhesive layer 32 is printed at regular intervals on the surface of the continuum 4a of the base material 4 in the same pattern as the pattern of the antenna 2.
- the UV or EB irradiating device 33 installed on the downstream side of the guide roller 15 also irradiates the UV or EB to the UV or EB curable adhesive layer 32 on the base material 4 side. Thereby, the UV or EB curable adhesive layer 32 exhibits adhesiveness.
- the substrate 4 needs to transmit UV, so the substrate 4 is formed of a transparent or translucent resin, glass, or the like.
- the substrate 4 is not limited to transparent and translucent as long as it is a material that allows EB to pass through, and may be opaque resin, glass, paper, or the like.
- the processing cylinder 16 and the receiving roller 17 form a continuum 4a of the base material 4 and a continuum 6a of the conductive layer 6 which is a metal foil. It is arranged so as to sandwich it.
- the processing cylinder 16 includes a punching blade 18 corresponding to the pattern of the antenna 2 on the peripheral surface of the roller.
- a punching blade 18 corresponding to the pattern of the antenna 2 on the peripheral surface of the roller.
- four sets of punching blades 18 for punching the pattern of one antenna 2 are arranged around the processing cylinder 16.
- the number of sets arranged differs depending on the antenna dimensions, the processing cylinder diameter, and the like.
- a pressing body 34 is inserted between the blades of the pattern portion of the punching blade 18 as needed.
- the pressing body 34 is desirably made of a cushioning material made of rubber, heat-resistant resin, or the like. Further, a portion corresponding to the pressing body 34 may be formed of the same material as the punching blade 18.
- the receiving roller 17 may be a single metal roller, but it is preferable that a cushioning pressing body 29 made of a cushion material such as a rubber sheet is attached to the peripheral surface.
- the continuum 4a of the base material 4 and the continuum 6a of the conductive layer 6 that is a metal foil are drawn between the processing cylinder 16 and the receiving roller 17 in an overlapping state, and are punched on the metal foil by the punching blade 18. Na 2 pattern is punched.
- the punched conductive layer 6 having the pattern of the antenna 2 is pressed against the UV or EB curable adhesive layer 32 having the same pattern as the antenna 2 on the continuum 4a of the base material 4 by the pressing member 34.
- the conductive layer 6 has the UV or EB. Or, it adheres to the continuum 4a of the substrate 4 by the EB-curable adhesive layer 32.
- the superimposed body of the base material 4 and the conductive layer 6 forms a cushion-like pressing body 29. Is applied with a uniform pressing force.
- a notch 7 as shown in FIG. 3 is formed along the contour of the antenna 2 by the tip of the punching blade 18.
- the conductive layer 6 is accurately punched out according to the pattern of the antenna 2, and the contour of the pattern of the antenna 2 is neatly adjusted.
- Separation rollers 20a and 20b are provided downstream of the processing cylinder 16, and the continuum 4a of the base material 4 and the continuum 6a of the conductive layer 6 as a metal foil are separated from the separation rollers 20a and 20b. After passing through the antenna, the antenna 2 travels in the direction of the arrow while being carried on the continuum 4a of the substrate 4, and the unnecessary portion 6b of the metal foil is separated from the continuum 4a of the substrate 4. While traveling in the direction of the arrow.
- the unnecessary portion 6b of the metal foil can be collected by winding it around a winding roller (not shown) or by suctioning it with a suction device.
- a heat press means for heating and pressing the superimposed body of the metal foil and the base material 4 after the unnecessary portions 6b of the conductive layer 6 have been removed.
- the hot pressing means specifically includes a heating roller 30 and a pressure roller 31. By hot-pressing the superimposed body with the two rollers 30, 31, even after punching the pattern, air bubbles or the like may be mixed between the conductive layer 6 of the metal foil and the base material 4, or the pattern of the conductive layer 6 may not be formed. Even if the edge of the base material 4 is raised or the surface of the metal foil of the conductive layer 6 is wavy, the pattern of the conductive layer 6 is smoothly adhered to the base material 4 over the entirety.
- the pressure of the base material 4 by the heating roller 30 and the pressure roller 31 and the heating temperature of the base material 4 are adjusted so that the pattern of the conductive layer 6 is based on the pattern shown in FIG.
- it is possible to adhere to the material 4 in a protruding state it is also possible to bury the pattern of the conductive layer 6 in the softened substrate 4 as in the case shown in FIG. In the latter case, the entire surface of the base material 4 becomes smooth, and the pattern of the conductive layer 6 is properly protected from abrasion and the like.
- the continuum 4a of the base material 4 is divided for each antenna 2 and provided for, for example, the production of a wireless tag as described above.
- the strip-shaped conductive sheet 9 of the interposer 3 is also used for manufacturing the antenna 2. It can be manufactured by the same method and apparatus as the method and apparatus used.
- the UV or EB curable adhesive layer 32 on the base material 4 is directly provided on the upstream side of the guide roller 15.
- a UV or EB irradiation device 33 for irradiating UV or EB is provided.
- the UV or EB curable adhesive layer 32 exhibits adhesiveness before the conductive layer 6 is superimposed on the substrate 4 from above the UV or EB curable adhesive layer 32. Therefore, unlike the eleventh embodiment, even if the material of the substrate 4 does not transmit UV or EB, the UV or EB curable adhesive layer 32 can be provided with adhesiveness.
- FIG. 17 the same parts as those in FIG. 16 are denoted by the same reference numerals, and redundant description will be omitted.
- a machining cylinder according to the twelfth embodiment is used.
- the flat plate 21 and the receiving table 22 which are flat blades of the flat press device are substituted for the receiving roller 16 and the receiving roller 17.
- a pressing body 34 is inserted between the blades of the pattern portion of the punching blade 18 as needed. It is desirable that the pressing body 34 be made of a cushioning material made of rubber, heat-resistant resin, or the like. Further, a portion corresponding to the pressing body 34 may be formed of the same material as the punching blade 18.
- a UV or EB curable adhesive layer 32 is provided on the surface of the conductive layer 6 by the inkjet nozzle 13 while running the continuum 6a.
- UV or EB is irradiated to the UV or EB curable adhesive layer 32 by the UV or EB irradiation device 33, and the continuum 6a of the conductive layer 6 is applied to the base material 4 using the guide roller 15 as a superimposing means.
- the continuum 6a of the conductive layer 6 is applied to the base material 4 using the guide roller 15 as a superimposing means.
- the UV or EB curable adhesive layer 32 is directly irradiated with UV or EB, the UV or EB curable adhesive is provided regardless of the material of the continuous body on which the UV or EB curable adhesive layer 32 is provided. Layer 32 can be provided with adhesion.
- a continuum 6a of a conductive layer 6 made of a metal foil whose surface is covered with a protective layer 28 is used.
- the protective layer 28 is formed of, for example, a resin. The provision of the protective layer 28 prevents the conductive layer 6 from being oxidized and damaged during manufacture of the conductive member for the non-contact type data carrier.
- the antenna 2 which is a conductive member for a non-contact type data carrier manufactured by this manufacturing method and apparatus has a layer structure shown in FIG. 24 or FIG.
- a continuum 6a of a conductive layer 6 whose surface is covered with a protective layer 28 is used.
- the protective layer 28 is formed of, for example, resin. The provision of the protective layer 28 prevents the conductive layer from being oxidized and damaged during the manufacture of the antenna 2 which is a non-contact type data carrier conductive member.
- a continuum 6a of conductive layer 6 whose surface is covered with protective layer 28 is used.
- the protective layer 28 is formed of, for example, resin. The provision of the protective layer 28 prevents the conductive layer from being oxidized and damaged during the manufacture of the antenna 2 which is a non-contact type data carrier conductive member.
- a continuum 6a of a conductive layer 6 whose surface is covered with a protective layer 28 is used.
- the protective layer 28 is formed of, for example, resin. The provision of the protective layer 28 prevents the conductive layer from being oxidized and damaged during the manufacture of the antenna 2 which is a non-contact type data carrier conductive member.
- the peeling step is performed by the turn bar 35.
- the base material 4 is separated into the base material 4 and the unnecessary portion 6b of the conductive layer by the member 35, and at the same time, the base material 4 is reversed and travels to the second guide roller 37.
- the substrate 4 flows so that the corner 2c of the pattern of the antenna 2 composed of the conductive layer 6 flows ahead, so that the pattern of the antenna 2 easily separates from the continuum 6a of the conductive layer 6 on the turn bar 35 .
- the pattern of the antenna 2 is punched in a superimposed body of the base material 4 and the conductive layer 6 so as to be inclined with respect to the traveling direction.
- the corner 2c of the pattern of the antenna 2 precedes the others.
- the pattern is easily separated from the conductive layer 6.
- thermoplastic adhesive layer 5 is printed on the surface in advance in the same pattern as that of the antenna 2 at regular intervals.
- the continuum 4a of the base material 4 is used.
- the continuum 4a is supplied in one direction as shown in FIG. 28, in a single sheet or with a winding roll force being fed out.
- the ink jet nozzle 13 as a printing machine for forming a pattern according to the first embodiment, a coating device, and the like are connected to a noncontact data carrier conductive member manufacturing facility. Has been.
- a guide roller 15 is disposed downstream of the continuum 4a of the base material 4 in the supply direction, and the continuum 6a of the conductive layer 6 as a metal foil is guided by the guide roller 15 while the continuum of the base material 4 is formed. 4a overlaps the thermoplastic adhesive layer 5 from above.
- a processing cylinder 16 and a receiving roller 17 are disposed so as to sandwich the continuum 4a of the base material 4 and the continuum 6a of the conductive layer 6 as a metal foil.
- the continuum 4a of the base material 4 and the continuum 6a of the conductive layer 6 which is a metal foil are drawn between the power cylinder 16 and the receiving roller 17 in an overlapping state, The pattern of the antenna 2 is punched by the punching blade 18 on the metal foil.
- the punched conductive layer 6 of the pattern of the antenna 2 is pressed by the heat conductor 19 against the thermoplastic adhesive layer 5 of the same pattern as the antenna 2 on the continuum 4 a of the base material 4. At that time, the thermoplastic adhesive layer 5 is melted by the heat transfer from the heat transfer body 19, and the conductive layer 6 is adhered to the substrate continuous body 4a by the melted thermoplastic adhesive layer 5.
- Separation rollers 20a and 20b are provided on the downstream side of the processing cylinder 16, and the continuum 4a of the base material 4 and the continuum 6a of the conductive layer 6 as a metal foil pass through the separation rollers 20a and 20b. Pulled in the opposite direction, the antenna 2 travels in the direction of the arrow while being carried on the continuum 4a of the substrate 4, and the unnecessary portion 6b of the metal foil travels in the direction of the arrow while being separated from the continuum 4a of the substrate 4. I do.
- thermoplastic adhesive layer 5 is printed on the preliminary surface in the same pattern as that of the antenna 2 at regular intervals.
- a continuum 4a of the substrate 4 is used.
- the continuous body 4a is supplied in one direction as shown in FIG. 28 in the state of a single sheet or a take-up roll.
- a guide roller 15 is disposed downstream of the continuum 4a of the base material 4 in the supply direction, and the continuum 6a of the conductive layer 6 that is a metal foil is guided by the guide roller 15 while the continuum of the base material 4 is being guided. 4a overlaps the thermoplastic adhesive layer 5 from above.
- cylinders 16a, 16b and the like are arranged on the downstream side of the guide roller 15, and the continuum 4a of the base material 4 and the continuum 6a of the conductive layer 6 as a metal foil overlap each other.
- thermoplastic adhesive layer 5 is printed at a predetermined interval on the preliminary surface in the same pattern as the antenna 2 pattern.
- a continuum 4a of the substrate 4 is used.
- the continuous body 4a is supplied in one direction as shown in FIG. 28 in the state of a single sheet or a take-up roll.
- a guide roller 15 is disposed downstream of the continuum 4a of the base material 4 in the supply direction, and the continuum 6a of the conductive layer 6 as a metal foil is guided by the guide roller 15 while the continuum of the base material 4 is formed. 4a overlaps the thermoplastic adhesive layer 5 from above.
- the continuum 4a of the base material 4 and the continuum 6a of the conductive layer 6 which is a metal foil are intermittently fed between the flat plate 21 and the pedestal 22 at a constant pitch. Reciprocate up and down with respect to 22. Then, the continuum 6 a of the conductive layer 6, which is a metal foil, is punched into a pattern of the antenna 2 for each reciprocating motion, and pressed against the molten thermoplastic adhesive layer 5 on the continuum 4 a of the base material 4. Thereafter, the continuum 4a of the base material 4 and the continuum 6a of the conductive layer 6 as a metal foil are separated in the same manner as in the third embodiment.
- a conductive adhesive layer 5 is printed on the surface in advance in the same pattern as that of the antenna 2 at regular intervals.
- a continuum 6a of layer 6 is used. This continuum 6a is supplied in one direction as shown in FIG. 31 in the state of a single sheet or a take-up roll.
- the continuum 6a of the conductive layer 6 is run and the continuum 6a of the conductive layer 6 is superimposed on the thermoplastic adhesive layer 5 side while the continuum 4a of the base material 4 is running at the same time. It is supposed to.
- thermoplastic adhesive layer 5 is previously formed on the entire surface by solid printing or coating using a metal foil.
- a continuum 6a of a certain conductive layer 6 is used.
- the continuum 6a is supplied in one direction as shown in FIG. 31 in the state of a single sheet or a take-up roll.
- the continuum 6a of the conductive layer 6 is run from the thermoplastic adhesive layer 5 side while running the continuum 6a of the conductive layer 6 while simultaneously running the continuum 4a of the base material 4. Only the parts corresponding to the pattern are heated and glued! / Puru.
- the separation roller 20a for removing the unnecessary portion 6b of the conductive layer 6 may be a normal roller having a smooth peripheral surface, but may be a suction roller having a large number of suction holes on the peripheral surface.
- the unnecessary portion 6b can be more reliably removed from the continuum 4a of the material 4.
- thermoplastic adhesive layer can be formed on the entire surface of the conductive layer. This simplifies equipment for manufacturing conductive members for non-contact data carriers, which does not require alignment.
- the continuum 4a of the base material 4 and the continuum 6a of the conductive layer 6 which is a metal foil are drawn between the punching cylinder 16b and the receiving roller 17b in an overlapping state. Punched in the pattern of antenna 2. Subsequently, it was drawn between the heating cylinder 16a and the receiving roller 17a, and was printed in the same shape as the pattern of the antenna 2 on the continuous body 4a of the base material 4 by the pattern of the heat transfer body 19 on the heating cylinder 16a.
- the thermoplastic adhesive layer 5 is melted, and the conductive layer 6 of the metal foil punched on the melted thermoplastic adhesive layer 5 is pressed.
- the working cylinder 16 is replaced by the force cylinder 16 used in the first embodiment.
- the air holes 27 are formed in the processing cylinder 16 at locations corresponding to unnecessary portions other than the heat transfer body 19.
- the air holes 27 function as suction means for sucking unnecessary portions to the punching blade side, and also function as discharging means for discharging unnecessary portions from the punching blade side after punching.
- FIG. 35 instead of the processing cylinder 16 of Embodiment 11 shown in FIG. 16, two cylinders 16a and 16b similar to those in Embodiment 2 shown in FIG.
- the body 4a and the conductive layer 6 as a metal foil are arranged along the flow direction of the continuous body 6a.
- the cylinder 16a on the upstream side is a pressurizing cylinder, and a pressurizing body 19a for forming a heating pattern corresponding to the pattern of the antenna 2 is formed on the peripheral surface thereof in a convex shape.
- the cylinder 16b on the downstream side is a punching cylinder, and a punching blade 18 corresponding to the pattern of the antenna 2 is formed on a peripheral surface thereof.
- the continuum 4a of the base material 4 and the continuum 6a of the conductive layer 6 that is a metal foil are drawn between the heating cylinder 16a and the receiving roller 17a in an overlapping state, and are pressed on the pressing cylinder 16a.
- the pattern 19a the continuum 6a of the conductive layer 6 is pressed against the UV or EB curable adhesive layer 32 printed in the same shape as the pattern of the antenna 2 on the continuum 4a of the substrate 4.
- the UV or EB curable adhesive layer 32 having a shape corresponding to the antenna pattern exhibits adhesiveness by UV or EB irradiation from the UV or EB irradiation device 33.
- the UV or EB curable adhesive layer 32 adheres to the continuum 4a of the substrate 4.
- the continuum 4a of the base material 4 and the continuum 6a of the conductive layer 6 which is a metal foil are drawn in between the punching cylinder 16b and the receiving roller 17b while overlapping, and the metal foil is removed by the punching blade 18 to form the antenna 2 Punched in the pattern of
- the separation rollers 20a and 20b of the first embodiment shown in FIG. 6 are omitted, and the continuum 4a of the base material 4 and the conductive layer 6 which is a metal foil are connected.
- the bodies 6a overlap and are wound up as a winding roll 38 with the pattern cut in the conductive layer 6.
- the sheets are cut into pieces of a certain length and stacked.
- the take-up roll 38 or the sheet is processed by separation rollers 20a, 20b and the like provided at other places, and unnecessary portions 6b of the conductive layer 6 are removed.
- the separation rollers 2 Oa and 20 b can be omitted as in the case of the twenty-ninth embodiment.
- a suction pipe 39 is provided as a means for separating the unnecessary portion 6b of the conductive layer 6 from the continuous body 6a of the conductive layer 6.
- the separation roller 20b is used as a means for separating the unnecessary portion 6b of the conductive layer 6 from the continuous body 6a of the conductive layer 6.
- the base material 4 After the continuum 6a of the conductive layer 6, which is a metal foil, is heated and adhered to the continuum 4a of the base material 4 only at a location corresponding to the pattern of the antenna by the processing cylinder 16 and the receiving roller 17, the base material 4 When the continuum 4a arrives at the location where the suction pipe 39 and the separation roller 20b are installed, the unnecessary portion 6b of the conductive layer 6 is sucked by the suction pipe 39, while the continuum 4a of the base material 4 is guided by the separation roller 20a. In addition, the vehicle runs in reverse at an acute angle.
- the unnecessary portion 6b of the conductive layer 6 is appropriately peeled off from the continuum 4a of the base material 4, and is collected in a collection box (not shown) to which the suction pipe 39 is connected.
- the unnecessary portion 6b of the conductive layer 6 also generates a spiral force.
- the suction tube 39 sucks the spiral portion, the spiral unnecessary portion 6b can be collected smoothly.
- a nozzle 40 for jetting a gas such as air is provided as necessary.
- the gas ejected from this nozzle is sprayed toward the boundary between the continuum 4a of the base material 4 and the unnecessary portion 6b of the conductive layer 6, thereby facilitating peeling and removal of the unnecessary portion 6b of the conductive layer 6. Is done.
- the present invention can employ the following various aspects.
- An adhesive layer (5, 32) is printed in a predetermined pattern on the base material (4), and a conductive metal foil having substantially the same pattern as the above pattern is formed on the adhesive layer (5, 32).
- a conductive member for a non-contact type data carrier to which the layer (6) is adhered When the conductive layer (6) rises greatly on the substrate (4) The adhesive layer (5, 32) is prevented from protruding from under the conductive layer (6).
- a conductive step for a non-contact type data carrier comprising a bonding step of laminating and heating the layer (6) and a punching step of punching the conductive layer (6) on the substrate (4) in the pattern described above. How to manufacture components. There is no need to prepare a conventional multilayer sheet. Therefore, material can be saved.
- the formation of the predetermined pattern can be performed by printing, coating, or the like.
- thermoplastic adhesive layer (5) is formed in a predetermined pattern on the surface, is run, and the conductive layer (5) is placed on the thermoplastic adhesive layer (5).
- a method for producing a conductive member for a non-contact type data carrier comprising a bonding step in which 6) are overlapped and heated and bonded, and a punching step in which a conductive layer (6) is punched out on the base material (4) in the pattern described above. .
- a conductive layer in which the thermoplastic adhesive layer is formed in a pattern in advance a printing machine and a coating device, etc., which are pattern forming devices for the thermoplastic adhesive layer, can be used to manufacture conductive members for non-contact data carriers.
- the manufacturing facility for the non-contact data carrier conductive member is simplified and inexpensive.
- thermoplastic adhesive layer (5) in a predetermined pattern on the surface thereof while running the conductive layer (6), and a conductive layer (6) running the base material (4).
- Continuum (6a) from the side of the thermoplastic adhesive layer (5) and bonding by heating, and a punching step of punching the conductive layer (6) on the base material (4) in the pattern described above.
- a method for producing a non-contact type conductive member for a data carrier There is no need to prepare a conventional multilayer sheet. Therefore, material saving can be achieved.
- the formation of the predetermined pattern can be performed by printing, coating, or the like.
- thermoplastic adhesive layer (6) having the thermoplastic adhesive layer (5) formed on the surface in a predetermined pattern is formed by the thermoplastic adhesive layer.
- a non-contact type conductive member for a data carrier comprising a bonding step of superimposing and heating and bonding, and a punching step of punching a conductive layer (6) on the base material (4) in the pattern described above. Since this is a manufacturing method, the use of a conductive layer in which the thermoplastic adhesive layer is Manufacturing equipment for conductive members for non-contact type data carriers can be separated from printing machines and coating equipment, which are pattern forming devices, simplifying the equipment for manufacturing conductive members for non-contact type data carriers and reducing costs. Become. In addition, since the thermoplastic adhesive layer is patterned on the conductive layer side, it is not necessary to perform the heat bonding process in a pattern.For example, hot pressing the entire surface eliminates the need for positioning and simplifies equipment. .
- the method for producing a conductive member for a non-contact type data carrier according to the above 2) further includes a drying step of drying the thermoplastic adhesive layer (5) formed in the pattern forming step.
- a method for manufacturing a conductive member for a non-contact data carrier After removing the solvent and the like from the thermoplastic adhesive layer (5), the conductive layer (6) can be adhered to the base material (4). Therefore, the conductive layer (6) can be formed smoothly and uniformly on the substrate (4), and can be formed quickly.
- An adhesive means (19) for superposing and heating and bonding the conductive layer (6) from above, and a punching means (18) for punching the conductive layer (6) on the substrate (4) with the above pattern are included.
- conductive members for non-contact data carriers A conductive member for a non-contact data carrier can be manufactured without using a conventional multilayer laminated sheet. Therefore, material saving can be achieved.
- thermoplastic adhesive layer (5) is formed on the surface in a predetermined pattern! And bonding the conductive layer (6) from above on the thermoplastic adhesive layer (5) and bonding by heating, and the conductive layer (6) on the substrate (4) with the above-mentioned pattern.
- An apparatus for manufacturing a conductive member for a non-contact type data carrier comprising: a punching step (18) for punching out by a punch.
- An apparatus for producing a conductive member for a non-contact type data carrier comprising: A conductive member for a non-contact type data carrier can be manufactured without using a conventional multilayer laminated sheet. Therefore, the material can be saved.
- Non-contact type including an adhesive means (19) for superimposing and bonding by heating from the side of (5) and a punching means (18) for punching the conductive layer (6) on the base material (4) in the pattern described above.
- Equipment for manufacturing conductive members for data carriers By using a conductive layer in which the thermoplastic adhesive layer is formed in a pattern in advance, the power of manufacturing equipment for non-contact data carrier conductive members is separated from the printing machine, coating equipment, etc., which are pattern forming devices. This simplifies the equipment for manufacturing conductive members for non-contact data carriers and reduces the cost.
- thermoplastic adhesive layer is patterned on the conductive layer side, it is not necessary to perform heat bonding in a pattern.
- a conductive layer having a predetermined pattern can be obtained by performing hot pressing on the entire surface without positioning. Can be.
- An apparatus for producing a conductive member for a non-contact type data carrier comprising: The conductive layer (6) can be adhered to the substrate (4) after removing the solvent and the like from the thermoplastic adhesive layer (5).
- the conductive layer (6) can be formed smoothly and uniformly on the substrate (4), and can be formed quickly.
- the punching means may include an unnecessary portion (6b) on the punching blade (18) side when punching the conductive layer (6).
- An apparatus for producing a conductive member for a non-contact type data carrier comprising: a suction means (27) for sucking the air; and a discharging means (27) for discharging the unnecessary portion (6b) to the side of the punching blade (18) after punching.
- the conductive layer (6) can be punched with an accurate pattern, and unnecessary portions can be easily collected.
- a method of manufacturing a conductive member for a non-contact type data carrier comprising: Not only is it possible to save material without the need to prepare a conventional multi-layer laminated sheet, but also because the UV or EB curable adhesive layer (32) cures relatively quickly, the base material (4) And the running speed of the conductive layer (6) can be increased to increase the production efficiency. Further, compared to the case where a thermoplastic adhesive is used as the adhesive, it is possible to prevent the atmosphere in the process from being heated at a high temperature.
- a pattern forming step of forming a UV or EB curable adhesive layer (32) on the surface of the substrate (4) with a predetermined pattern while running the same, and the UV or EB curable adhesive A UV or EB irradiation step of irradiating the layer (32) with UV or EB, and a superposition step of superposing the conductive layer (6) from above the UV or EB curable adhesive layer (32) irradiated with UV or EB;
- Non-contact data comprising a bonding step of pressing the conductive layer (6) on the base material (4) under pressure and a punching step of punching the conductive layer (6) on the base material (4) in the pattern described above.
- Manufacturing method of conductive member for carrier Manufacturing method of conductive member for carrier.
- the UV or EB curable adhesive layer (32) cures relatively quickly, so that the base material (4 ) And the traveling speed of the conductive layer (6) can be increased to increase the production efficiency. Further, it is possible to prevent the atmosphere in the process from becoming high in temperature as compared with the case where a thermoplastic adhesive is used as the adhesive. In addition, since UV or EB is directly irradiated to the UV or EB curable adhesive layer (32), adhesion to the UV or EB curable adhesive layer (32) is independent of the material of the substrate (4). Can be given.
- a method for producing a conductive member for a non-contact type data carrier comprising: As well as saving on materials that do not require the preparation of conventional multi-layer laminated sheets, the base material (4) because the UV or EB curable adhesive layer (32) cures relatively quickly In addition, the running speed of the conductive layer (6) can be increased to increase the production efficiency. Further, compared to the case where a thermoplastic adhesive is used as the adhesive, it is possible to prevent the atmosphere in the process from being heated at a high temperature. In addition, since the UV or EB curable adhesive layer (32) is directly irradiated with UV or EB, the UV or EB curable adhesive layer (32) is irrespective of the material of the substrate on which the UV or EB curable adhesive layer (32) is provided. Adhesiveness can be imparted to the curable adhesive layer (32).
- the base material ( 4) and the traveling speed of the conductive layer (6) can be increased to increase production efficiency. Further, compared to the case where a thermoplastic adhesive is used as the adhesive, it is possible to prevent the high-temperature dangling of the atmosphere in the process. it can.
- An apparatus for producing a conductive member for a non-contact type data carrier comprising: a punching means (18) for punching out by means of a punch.
- the UV or EB curable adhesive layer (32) cures relatively quickly, so that the base material ( 4) and the traveling speed of the conductive layer (6) can be increased to increase production efficiency. Further, compared to the case where a thermoplastic adhesive is used as the adhesive, it is possible to prevent the atmosphere in the process from being heated at a high temperature. Also, since the UV or EB curable adhesive layer (32) is directly irradiated with UV or EB, the UV or EB curable adhesive layer (32) is provided with adhesiveness regardless of the material of the base material. be able to.
- An apparatus for producing a conductive member for a non-contact type data carrier comprising: a punching means (18) for punching out the conductive layer (6) in the pattern described above.
- the UV or EB curable adhesive layer (32) cures relatively quickly, the base material ( 4) and the traveling speed of the conductive layer (6) can be increased to increase production efficiency. Further, it is possible to prevent the process atmosphere from being heated at a high temperature as compared with a case where a thermoplastic adhesive is used as the adhesive.
- the UV or EB curable adhesive layer (32) is directly irradiated with UV or EB, the UV or EB curable adhesive layer (32) is provided with UV or EB curing regardless of the material of the continuous body.
- the adhesive can be imparted to the adhesive layer (32).
- the bonding means (19) and the punching means (18) are the same cylinder (16) or flat plate.
- a punching means is not required on the punching blade (18) side when punching the conductive layer (6).
- a conductive member for a non-contact type data carrier comprising a suction means (27) for sucking the part (6b) and a discharging means (27) for discharging the unnecessary part (6b) after punching to the side of the blade (18).
- the punching means (18) may be formed by overlapping the conductive layer (6) with the base material (4).
- An apparatus for manufacturing a conductive member for a non-contact type data carrier comprising a cushioning pressing body (29) for pressing a body.
- the superimposed body of the conductive layer (6) and the base material (4) can be pressed with a uniform pressing force by the cushioning pressing body (29), so that it can be properly applied on the base material (4).
- the conductive layer (6) having a simple pattern can be formed.
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Abstract
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Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05734388A EP1744607A4 (en) | 2004-04-28 | 2005-04-20 | CONDUCTIVE MEMBER FOR NON-CONTACT DATA CARRIER AND METHOD AND DEVICE FOR MANUFACTURING THE SAME |
US11/578,311 US7930822B2 (en) | 2004-04-28 | 2005-04-20 | Method and device for manufacturing a conductive member for non-contact type data carrier |
CN2005800186423A CN1985552B (zh) | 2004-04-28 | 2005-04-20 | 用于非接触型数据载体的导电元件及其制造方法和装置 |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
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JP2004-134659 | 2004-04-28 | ||
JP2004134659 | 2004-04-28 | ||
JP2005-058239 | 2005-03-02 | ||
JP2005058239 | 2005-03-02 | ||
JP2005106822A JP4752307B2 (ja) | 2004-04-28 | 2005-04-01 | 非接触型データキャリア用導電部材とその製造方法及び装置 |
JP2005-106822 | 2005-04-01 |
Publications (1)
Publication Number | Publication Date |
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WO2005107347A1 true WO2005107347A1 (ja) | 2005-11-10 |
Family
ID=35242084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/007527 WO2005107347A1 (ja) | 2004-04-28 | 2005-04-20 | 非接触型データキャリア用導電部材とその製造方法及び装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7930822B2 (ja) |
EP (1) | EP1744607A4 (ja) |
JP (1) | JP4752307B2 (ja) |
CN (1) | CN1985552B (ja) |
TW (1) | TW200540026A (ja) |
WO (1) | WO2005107347A1 (ja) |
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JP2008015969A (ja) * | 2006-07-10 | 2008-01-24 | Dainippon Printing Co Ltd | 非接触型データキャリア用導電部材の製造方法及び装置 |
JP2015220719A (ja) * | 2014-05-21 | 2015-12-07 | Tdk株式会社 | アンテナ装置及びその製造方法 |
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JP4779556B2 (ja) * | 2005-10-07 | 2011-09-28 | 大日本印刷株式会社 | 非接触型データキャリア用導電部材の製造方法及び装置 |
WO2008053702A1 (en) * | 2006-11-01 | 2008-05-08 | Dai Nippon Printing Co., Ltd. | Non-contact ic tag label and method of producing the same |
JP5083091B2 (ja) * | 2008-07-24 | 2012-11-28 | 大日本印刷株式会社 | 非接触型データキャリア用導電部材の形成方法及び装置 |
CN102217136B (zh) * | 2008-11-14 | 2014-05-07 | 凸版印刷株式会社 | 非接触ic标签及物品 |
CN103262668B (zh) * | 2010-11-19 | 2016-04-06 | 凸版印刷株式会社 | 金属箔图案层叠体、金属箔起模方法、电路基板的制造方法 |
EP3300125B1 (en) * | 2011-06-06 | 2020-01-15 | DSM IP Assets B.V. | Metal foil, patterned-laminate and a solar cell module |
US9216564B2 (en) | 2011-08-03 | 2015-12-22 | Graphic Packaging International, Inc. | Systems and methods for forming laminates with patterned microwave energy interactive material |
DE102012209328A1 (de) * | 2012-06-01 | 2013-12-05 | 3D-Micromac Ag | Verfahren und Anlage zum Herstellen eines Mehrschichtelements sowie Mehrschichtelement |
US9380709B2 (en) * | 2013-03-15 | 2016-06-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of cutting conductive patterns |
EP3049248B1 (en) | 2013-09-26 | 2018-11-07 | Graphic Packaging International, LLC | Laminates, and systems and methods for laminating |
JP2017535946A (ja) * | 2014-11-05 | 2017-11-30 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | 製品基板をコーティングするための方法と装置 |
CA2965743C (en) | 2014-12-22 | 2020-01-14 | Graphic Packaging International, Inc. | Systems and methods for forming laminates |
WO2017159222A1 (ja) * | 2016-03-18 | 2017-09-21 | サトーホールディングス株式会社 | アンテナパターンの製造方法、rfidインレットの製造方法、rfidラベルの製造方法及びrfid媒体の製造方法 |
CN107482302A (zh) * | 2017-07-01 | 2017-12-15 | 华中科技大学 | 一种rfid天线制作方法 |
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WO2020141331A1 (en) * | 2019-01-04 | 2020-07-09 | Sherkin Technologies Uk Ltd | Improvements in or relating to flexible electronics |
US10709022B1 (en) * | 2019-04-19 | 2020-07-07 | Gentherm Incorporated | Milling of flex foil with two conductive layers from both sides |
CN112589913A (zh) * | 2021-03-05 | 2021-04-02 | 赛柯赛斯新能源科技(苏州)有限公司 | 柔性电路板圆刀裁切工艺及其加工装置 |
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Also Published As
Publication number | Publication date |
---|---|
EP1744607A1 (en) | 2007-01-17 |
TWI351354B (ja) | 2011-11-01 |
JP2006277700A (ja) | 2006-10-12 |
JP4752307B2 (ja) | 2011-08-17 |
CN1985552B (zh) | 2012-09-05 |
US7930822B2 (en) | 2011-04-26 |
EP1744607A4 (en) | 2010-10-27 |
US20070214637A1 (en) | 2007-09-20 |
TW200540026A (en) | 2005-12-16 |
CN1985552A (zh) | 2007-06-20 |
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