WO2017120889A1 - 天线芯片嵌合体、制做天线芯片嵌合体的装置及其工艺 - Google Patents

天线芯片嵌合体、制做天线芯片嵌合体的装置及其工艺 Download PDF

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Publication number
WO2017120889A1
WO2017120889A1 PCT/CN2016/071020 CN2016071020W WO2017120889A1 WO 2017120889 A1 WO2017120889 A1 WO 2017120889A1 CN 2016071020 W CN2016071020 W CN 2016071020W WO 2017120889 A1 WO2017120889 A1 WO 2017120889A1
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WO
WIPO (PCT)
Prior art keywords
antenna
chip
aluminum foil
connecting piece
workstation
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PCT/CN2016/071020
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English (en)
French (fr)
Inventor
焦林
谢娟平
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焦林
谢娟平
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Publication date
Application filed by 焦林, 谢娟平 filed Critical 焦林
Priority to PCT/CN2016/071020 priority Critical patent/WO2017120889A1/zh
Publication of WO2017120889A1 publication Critical patent/WO2017120889A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier

Definitions

  • the present invention relates to a radio frequency technology, and in particular to an antenna chip mating body, an apparatus for manufacturing an antenna chip mating body, and a process thereof.
  • the traditional process of making an antenna chip mosaic is complicated. It is completed by two different production lines for manufacturing an RF antenna layer and mounting a chip on an RF antenna. Therefore, the production efficiency leads to high application cost and affects the popularization and use of RF technology.
  • the existing RF antenna manufacturing process includes the following:
  • the chemical etching method is a mainstream manufacturing process of the antenna, and the defect is that the manufacturing process is complicated, the cost is high, and a large amount of waste liquid is generated, which affects the environment, and is a non-environmental production process.
  • the manufacturing cost is higher than that of the chemical etching process, and the resistance of the conductive ink to the RF antenna is poor, which affects the environment and service life of the RF antenna.
  • the PET aluminum foil is composited on the PET base film, and the antenna pattern is cut out by the die cutter die, and then the waste is exhausted. Because the shape of the RF antenna is complicated, the minimum line width is 0.7 mm, the line spacing is 0.7 mm, and it is very difficult to make the die cut. However, it is only possible to make a radio frequency antenna with a simple graphic.
  • the conventional chemical etching process or die-cutting process requires the use of PET aluminum foil composite film for the RF antenna. This composite film will produce large protrusions, which will affect the appearance and affect the printing quality.
  • the aluminum foil is repeatedly punched and combined to make the RF antenna, although it is environmentally friendly, there is no PET base film, but the thickness of the aluminum foil is only 0.01-0.015 mm, and the precision of the punching die is high.
  • the HF band coil antenna requires three sets of molds three times. The die-cut combination is extremely difficult to manufacture, resulting in increased costs.
  • the laser-made RF antenna technology is suitable for making complex-pattern RF antennas, and the high-energy aluminum foil outside the RF antenna is vaporized and discharged, which reduces the production efficiency.
  • the defect is that high-power lasers are needed, resulting in high equipment investment, high manufacturing cost, and difficulty in popularization. .
  • connection mode of the chip connection assembly (STRAP) and the antenna is a pinning process or a conductive glue bonding process, and the long-term stability is poor because the surface of the aluminum foil is easily oxidized to affect the conduction efficiency.
  • the present invention provides an antenna chip fitting body, an apparatus for manufacturing an antenna chip fitting body, and a process thereof.
  • An antenna chip fitting body comprising an antenna supporting paper (21), an aluminum foil antenna (44") disposed on the antenna supporting paper (21), and a chip connecting piece assembly (73) ,
  • the aluminum foil antenna (44") after the waste is removed is formed around a plurality of turns, and the aluminum foil antenna (44") after the waste removal is respectively provided with a chip right antenna connection point (44"-1) and a chip left a side antenna connection point (44"-2), and a lower side of the scraped aluminum foil antenna (44") is connected to the antenna support paper (21) via an antenna pattern glue (31).
  • the chip connector assembly (73) includes a chip (73-4), and the chip (73-4) is fixed on the chip connection film PET film (73-1) through a conductive adhesive (73-6).
  • the antenna supporting paper (21) is a PVC film or a PET film or paper.
  • a laser engraving groove (51) is disposed between the two strips of the scrap-excluded aluminum foil antenna (44").
  • the chip (73-4) is provided with a chip standing leg (73-5), and the chip standing leg (73-5) is connected with the conductive adhesive (73-6).
  • chip right side connecting piece aluminum foil (73-2) is soldered to the chip right side antenna connecting point (44"-1), the chip left side connecting piece aluminum foil (73-3) and the said The left antenna connection point (44"-2) of the chip is soldered.
  • the chip connecting piece positioning glue (72) is disposed between the chip connecting piece PET base film (73-1) and the aluminum foil antenna (44") after forming the circuit.
  • a surface of the antenna chip assembly is bonded with a composite protective layer (91).
  • the composite protective layer (91) is any one of a peelable protective film, a self-adhesive protective film, a paper protective layer or a PVC protective film.
  • the composite protective layer (91) is a release paper or an antistatic film.
  • the chip connector assembly (73) has an outer dimension of 10-20 mm and a width of 3 mm.
  • An apparatus for manufacturing an antenna chip fitting body comprising: an antenna supporting paper unwinding device (10), wherein the antenna supporting paper unwinding device (10) unwinds an antenna supporting paper (21) Along the direction in which the antenna supporting paper (21) is unwound, an antenna supporting paper positioning mark line and an antenna graphic frame printing seat (20), an antenna graphic glue printing seat (30), and an aluminum foil die cutting are sequentially disposed.
  • the antenna pattern glue printing seat (30) is configured to print an antenna pattern glue (31) on the antenna supporting paper (21),
  • the aluminum foil die cutting station (40) comprises an aluminum foil unwinding device (42), a die device (43) and an aluminum foil waste winding device (46), and the die device (43) is opposite to the aluminum foil unwinding device (42)
  • the unwound aluminum foil is die-cut, and the die-cut antenna pattern aluminum foil (44) is pasted onto the antenna pattern glue (31).
  • the fragmented aluminum foil discharge workstation (60) comprises a PET film unwinding material (62), a hot pressing plate (63), and an antenna scrap chip aluminum foil winding device (64), and the PET film unwinding material (62) is placed
  • the rolled PET film (61) with hot melt precoat is adhered to the antenna pattern aluminum foil (44) through the hot plate (63), and the antenna scrap aluminum foil (44') is adhered. Is separated from the aluminum foil antenna (44") after the waste is removed,
  • the chip connecting piece assembly mounting workstation (70) comprises a chip connecting piece positioning glue printing seat (71), a chip connecting piece coil unwinding device (74), a chip connecting piece die device (75), and a die cutting chip connection. a post-chip waste winding device (76) and a spot welding machine (77), the chip connecting piece web unwinding device (74) sequentially connecting the chip connecting piece die device (75) and the die-cutting chip connection a post-chip waste winding device (76), the chip connecting piece positioning glue printing seat (71) is disposed at a front end of the chip connecting piece assembly mounting workstation (70), and the spot welding machine (77) is disposed at the The chip connector assembly is mounted on the back end of the workstation (70).
  • an antenna and chip radio frequency performance testing device (80) is further provided, and the antenna and chip radio frequency performance testing device (80) is disposed between the chip connecting piece assembly mounting workstation (70) and the winding device. .
  • a composite seat (90) is further disposed behind the antenna and chip RF performance testing device (80).
  • the winding device includes a packaged product winding device (100) and a singulated product collection device (110).
  • a process for fabricating an antenna chip chimera comprising the steps of:
  • S2 an antenna supporting paper positioning mark line and an antenna graphic frame printing base (20) printing an antenna graphic frame line (22) and a positioning marking line (23) on the antenna supporting paper (21);
  • an antenna pattern glue printing seat (30) prints an antenna pattern glue (31) on the antenna carrier paper (21);
  • the fragmented aluminum foil waste disposal workstation (60) removes the antenna scrap debris aluminum foil (44') other than the antenna pattern frame line (22) to form an aluminum foil antenna (44") after removing the waste material;
  • the chip connecting piece assembly mounting workstation (70) fabricates the chip (73-4) to form a chip connecting piece assembly (73) for easy connection, and connects the chip connecting piece assembly (73) to the exclusion Both ends of the aluminum foil antenna (44") after the scrap;
  • step S4 specifically includes:
  • S42 The die device (43) die-cuts the aluminum foil (41) and punches the antenna pattern aluminum foil (44) pasting onto the antenna pattern glue (31);
  • the aluminum foil scrap winding device (46) recovers the aluminum foil scrap (45) after punching the antenna pattern.
  • the aluminum foil (41) has a thickness of 0.01 to 0.015 mm.
  • the material area of the antenna pattern aluminum foil (44) accounts for 1/5-1/3 of the area of the aluminum foil (41).
  • step S6 specifically includes:
  • the PET film unwinding material (62) unwinds the PET film (61) with a hot melt adhesive precoat, and the PET film (61) with a hot melt adhesive precoating from the hot pressing
  • the plate (63) passes, and the hot melt adhesive layer (61-1) on the PET film (61) with the hot melt adhesive precoat faces downward, and the hot press is provided on the hot press plate (63)
  • the plate bump (63-1) presses the PET film (61) with the hot melt adhesive precoat layer as the hot platen (63) is lowered, so that the hot melt adhesive layer (61-1) ) bonded to the antenna pattern aluminum foil (44),
  • the hot platen (63) rises, drives the PET film (61) with a hot melt adhesive precoat, and is separated from the PET film (61) with a hot melt adhesive precoat.
  • the PET film (61) with a hot melt adhesive precoat adheres the antenna scrap chip aluminum foil (44') to be separated from the waste-removed aluminum foil antenna (44"),
  • step S7 specifically includes:
  • S71 a chip connecting piece positioning glue printing seat (71) coating the chip connecting piece positioning glue (72) on the aluminum foil antenna (44") after removing the waste;
  • the chip connecting piece coil unwinding device (74) puts the chip connecting piece assembly (73) Rolling, chip connecting piece die device (75) die cutting the chip connecting piece assembly (73) and falling on the chip connecting piece positioning glue (72);
  • step S7 completes the installation of the chip connecting piece assembly (73)
  • the integrated RF performance is performed by the antenna and the chip RF performance testing device (80), and the inkjet dot is not up to the radio frequency performance. Mark or punch mark.
  • the composite seat (90) is bonded to the surface of the aluminum foil antenna (44") after the waste removal and the chip connection piece assembly (73). .
  • the step S8 includes winding the packaged antenna chip assembly and winding a single antenna chip assembly, wherein the packaged product winding device (100) is mounted on the packaged antenna chip assembly.
  • the winding is performed, and the single-piece finished product collecting device (110) cuts the antenna chip fitting body having a thickness of more than 0.3 mm into a single sheet and collects it.
  • the advantageous effect is that
  • the invention has the advantages of punching and cutting RF antenna: pure aluminum foil, no PET base film, and large-area recovery of scrap aluminum foil after punching, environmental protection and low cost.
  • the invention has the advantages of fine laser engraving, and is suitable for engraving complex graphic RF antennas and coil type RF antennas.
  • the invention solves the problem of removing the fragmented aluminum foil scrap produced by the complex graphic RF antenna manufacturing process.
  • the invention has the function of installing a chip connecting piece assembly, and completes the antenna manufacturing and installation once online.
  • the entire process of the chip greatly improves the production efficiency of the RF antenna and the chip mosaic (INLAY), greatly reduces the manufacturing cost, and promotes the promotion and application of the RF technology.
  • the invention has the HF band coil antenna jumper installation function using the chip connection piece assembly of the extended chip connection piece, and the coil antenna manufacturing and chip mounting efficiency are completed at the same time of mounting the chip, and the HF band antenna and the chip mosaic body are greatly reduced. (INLAY) cost.
  • the chip connecting piece aluminum foil of the invention is connected with the radio frequency antenna aluminum foil by spot welding process, and the two layers of aluminum foil are melted and welded into one body under high temperature pressure, which is not affected by the conductive property of the surface oxide layer of the aluminum foil, and is better than the traditional conductive glue process and the needle-punching process. Compared to the connection, the stability is good.
  • FIG. 1 is a front view of a conventional HF-band RF antenna manufactured by a chemical etching method
  • Figure 2 is a side view of Figure 1;
  • Figure 3 is a rear elevational view of Figure 1;
  • FIG. 4 is a front view of a conventional HF-band RF antenna manufactured by a chemical etching method
  • Figure 5 is a side view of Figure 4.
  • Figure 6 is a schematic structural view of the present invention.
  • Figure 7 is a side view of Figure 6;
  • Figure 8 is an enlarged view of a chip connecting portion of the present invention.
  • FIG. 9 is a schematic diagram of a printed antenna frame diagram and a positioning mark according to the present invention.
  • Figure 10 is a schematic view of the printed antenna pattern glue of the present invention.
  • Figure 11 is a schematic view of a die-cut antenna pattern aluminum foil according to the present invention.
  • Figure 12 is a side view of the antenna pattern aluminum foil of Figure 11;
  • Figure 13 is a schematic view showing the groove between the lines of the laser-engraved antenna of the present invention.
  • Figure 14 is an enlarged view of a portion A of Figure 13;
  • Figure 15 is a schematic view showing a hot press plate hot-press antenna pattern aluminum foil and a PET film with a hot-melt adhesive pre-coating according to the present invention
  • Figure 16 is a schematic view of a PET film with a hot melt adhesive precoat taken away from an antenna scrap aluminum foil;
  • Figure 17 is a schematic structural view of a chip connecting piece assembly of the present invention.
  • Figure 18 is a side view of Figure 17;
  • Figure 19 is a schematic view showing the positioning of the printing chip connecting piece of the present invention.
  • Figure 20 is an enlarged view of a portion B of Figure 19;
  • Figure 21 is a schematic view showing the mounting of the chip connecting piece assembly of the present invention.
  • Figure 22 is an enlarged view of a portion C of Figure 21;
  • Figure 23 is a schematic view of an apparatus for fabricating an antenna chip assembly according to the present invention.
  • antenna supporting paper unwinding device 11, PET film; 12, antenna aluminum foil; 12-1, antenna aluminum foil left connection point; 12-2, antenna aluminum foil right connection point; 13, antenna jumper; 13-1, antenna jumper left connection point; 13-2, antenna jumper right connection point; 14, needle pin; 15, chip; 16, antenna surface layer composite paper; 17, bump; 20, antenna support paper positioning Marking line and antenna graphic frame printing base; 21, antenna supporting paper; 22, antenna graphic frame line; 23, positioning marking line; 30, antenna graphic glue printing seat; 31, antenna graphic glue; 40, aluminum foil punching workstation 41, aluminum foil; 42, aluminum foil unwinding device; 43, die device; 44, antenna pattern aluminum foil; 44', antenna scrap aluminum foil; 44", aluminum foil antenna after waste removal; 44"-1, chip right antenna Connection point; 44"-2, antenna connection point on the left side of the chip; 45, aluminum foil scrap after punching the antenna pattern; 46, aluminum foil scrap winding device; 50, laser engraving workstation; Light engraving groove; 60, fragmented aluminum foil waste disposal workstation; 61, PET film with hot melt adhesive pre
  • the existing RF antenna manufacturing process includes chemical etching method, conductive ink type RF antenna production process, die cutting method for RF antenna process, chemical etching process or die cutting process, pure aluminum foil multiple punching combination, laser manufacturing RF antennas, etc. And it has a variety of flaws. E.g:
  • the traditional chemical etching method is used to make the HF band RF antenna.
  • the HF band RF antenna is a coil antenna.
  • the composite film of the PET film double-sided composite aluminum foil is used, the antenna aluminum foil 12 is chemically etched on the front side, and the antenna jumper 13 is etched on the back side. Both ends of the antenna jumper 13 antenna jumper left connection point 13-1, antenna jumper right connection point 13-2 respectively at the two ends of the antenna aluminum foil 12 antenna aluminum foil left connection point 12-1, antenna aluminum foil right connection point 12-
  • the position of 2 corresponds to that because the PET film 11 is in the middle, the insulation between the antenna jumper 13 and the antenna aluminum foil 12 is not conducted.
  • the wiring right connection points 13-2 are electrically connected together, and are serially connected via the chip 15 to form a complete coil. Obviously, the process is complicated, and the electrical stability of the connection of the pin 14 is poor.
  • the traditional chemical etching process or die-cutting process is to use a PET aluminum foil composite film for the RF antenna. Therefore, the traditional INLAY has a PET film 11.
  • the area of the PET film 11 of the cut sheet of INLAY is larger than the area of the antenna foil 12, and the INLAY is fitted between the two layers of paper (film), and the thickness of the PET film 11 is between 0.038 and 0.05 mm, which is much larger than the thickness of the aluminum foil of 0.01 mm. Therefore, the surface of the antenna surface layer composite paper 16 produces the projections 17 of the PET film 11 of INLAY, which affects the appearance and affects the printing quality.
  • the antenna surface layer composite paper 16 may also be an antenna surface layer composite film.
  • the present invention provides an antenna chip fitting body, an apparatus for fabricating an antenna chip fitting body, and a specific process thereof.
  • the antenna chip fitting body includes an antenna supporting paper 21, an aluminum foil antenna 44" disposed on the antenna supporting paper 21, and a chip connecting piece assembly 73, and an antenna supporting paper 21
  • PVC film or PET film the cost is low.
  • PVC film or PET film is used as the supporting base film of the antenna aluminum foil, and the composite finished PVC film or PET film or paper is made on the finished surface of INLAY, and then cut into single sheets.
  • HF band card core material used to make plastic RF cards.
  • the aluminum foil antenna 44" after the waste is removed is formed around several circles, and the appearance pattern is simple, circular, square or rectangular, and the aluminum foil antenna 44" after the waste is removed is provided with the chip right antenna connection point 44"-1 and the chip respectively.
  • the left antenna connection point 44"-2, the lower side of the aluminum foil antenna 44" after the waste is removed is connected to the antenna support paper 21 via the antenna pattern glue 31, and the adjacent two strips of the aluminum foil antenna 44" after the waste is removed are provided.
  • the laser engraving groove 51 has a width of less than 0.1 mm.
  • the chip connector assembly 73 has an outer dimension of 10-20 mm and a width of 3 mm for easy connection to the RF antenna.
  • the chip connection piece assembly 73 includes a chip 73-4, and the chip 73-4 is fixed on the chip by a conductive adhesive 73-6.
  • the connecting piece PET bottom film 73-1 is provided on both sides of the chip 73-4 with the chip right side connecting piece aluminum foil 73-2 and the chip left side connecting piece aluminum foil 73-3, the chip right side connecting piece aluminum foil 73-2 and the chip
  • the right antenna connection point 44"-1 is connected, and the left side connecting piece aluminum foil 73-3 and the chip left side antenna connection point 44"-2 are connected.
  • the chip 73-4 is provided with a chip standing leg 73-5, the chip standing leg 73-5 is connected with the conductive adhesive 73-6, and the chip right side connecting piece aluminum foil 73-2 is soldered to the chip right side antenna connecting point 44"-1.
  • the left side connecting piece aluminum foil 73-3 of the chip and the left side antenna connecting point 44"-2 of the chip are soldered.
  • a chip connecting piece positioning glue 72 is provided between the chip connecting piece PET base film 73-1 and the aluminum foil antenna 44" which forms the circuit after the waste is removed.
  • the surface of the antenna chip mating body is bonded with a composite protective layer 91, and the composite protective layer 91 can be:
  • Uncoverable protective layer such as release paper, anti-static film, etc.
  • an apparatus for manufacturing an antenna chip fitting body includes an antenna supporting paper unwinding device 10, and an antenna supporting paper unwinding device 10 unwinds the antenna supporting paper 21, and supports it along the antenna.
  • the antenna pattern glue print holder 30 is used to print the antenna pattern glue 31 on the antenna carrier paper 21.
  • the aluminum foil punching workstation 40 includes an aluminum foil unwinding device 42, a die device 43 and an aluminum foil scrap winding device 46.
  • the die device 43 punches the aluminum foil after the aluminum foil unwinding device 42 is unwound, and punches the cut antenna pattern aluminum foil. 44 is pasted onto the antenna pattern glue 31, using a punching process, and the die-cutting die is simple This is low.
  • the fragmented aluminum foil discharge workstation 60 includes a PET film unwinding material 62, a hot pressing plate 63, and an antenna scrap chip aluminum foil winding device 64.
  • the PET film unwinding material 62 is unwound and has a hot melt adhesive precoated PET film. After being passed through the hot press plate 63, it is adhered to the antenna pattern aluminum foil 44, and the antenna scrap aluminum foil 44' is adhered away to be separated from the aluminum foil antenna 44" after the waste is removed.
  • the chip connecting piece assembly mounting workstation 70 includes a chip connecting piece positioning glue printing seat 71, a chip connecting piece coil unwinding device 74, a chip connecting piece die device 75, a chip connecting piece after punching the chip connecting piece, and a spot winding device 76 and spot welding
  • the machine 77, the chip connecting piece coil unwinding device 74 sequentially connects the chip connecting piece die device 75 and the blank chip connecting piece after the scrap winding device 76, and the chip connecting piece positioning glue printing seat 71 is disposed on the chip connecting piece assembly.
  • a spot welder 77 is disposed at the rear end of the chip connector assembly mounting workstation 70.
  • an antenna and chip RF performance testing device 80 is also included. Also included is an antenna and chip RF performance testing device 80, and an antenna and chip RF performance testing device 80 is disposed between the chip connector assembly mounting station 70 and the winding device.
  • a composite base 90 is further disposed behind the antenna and chip RF performance testing device 80.
  • the winding device comprises a packaged product winding device 100 and a singulated product collection device 110.
  • a process for fabricating an antenna chip chimera includes the following steps:
  • Antenna support paper positioning mark line and antenna pattern frame line printing seat 20 print antenna pattern frame line 22 and positioning mark line 23 on the antenna support paper 21, and the positioning mark line 23 is an alignment mark of each station, ensuring Each station can be accurate, and the work of each station is synchronized accurately.
  • the antenna pattern line 22 is used to observe the printing accuracy of the antenna pattern glue.
  • the antenna pattern glue printing seat 30 prints the antenna pattern glue 31 on the antenna supporting paper 21;
  • the aluminum foil punching workstation 40 unwinds the aluminum foil 41 and punches it, and pastes the punched antenna pattern aluminum foil 44 onto the antenna pattern glue 31.
  • the laser engraving workstation 50 engraves the antenna pattern aluminum foil 44 by computer-controlled laser to form a laser engraving groove 51.
  • the laser engraving has the advantage of fine processing, and the laser beam engraves the groove between the antenna lines on the graphic aluminum foil of the antenna area.
  • the laser engraving groove 51 has a width of 0.1 mm to modulate various RF antennas.
  • the fragmented aluminum foil discharge station 60 removes the antenna scrap piece aluminum foil 44' other than the antenna pattern frame line 22, and forms an aluminum foil antenna 44" after the waste is removed.
  • the chip connection piece assembly mounting station 70 fabricates the chip 73-4 to form a chip connection piece assembly 73 for easy connection, and connects the chip connection piece assembly 73 to both ends of the aluminum foil antenna 44" after the waste is removed.
  • step S7 completes the installation of the chip connector assembly 73
  • the integrated RF performance is performed by the antenna and chip RF performance testing device 80, and the inkjet dot mark or punch mark is not up to the radio frequency performance.
  • the composite seat 90 is bonded to the surface of the aluminum foil antenna 44" and the chip connecting piece assembly 73 after the waste is removed.
  • the composite protective layer 91 is laminated on the surface of the INLAY product. It becomes a radio frequency functional paper (film) and an online composite facial paper. It is used to make RF tags and RF ticket cards. The manufacturing process is simple and the cost is low.
  • Step S8 includes winding the packaged antenna chip assembly and winding a single antenna chip assembly, wherein the packaged product winding device 100 winds up the packaged antenna chip assembly and cuts the sheet
  • the finished product collecting device 110 cuts a single piece of the antenna chip fitting having a thickness of more than 0.3 mm and collects it.
  • step S4 specifically includes:
  • the aluminum foil unwinding device 42 unwinds the aluminum foil 41, the thickness of the aluminum foil 41 is 0.01-0.015 mm;
  • the aluminum foil scrap winding device 46 recovers the aluminum foil scrap 45 after punching the antenna pattern, and recovers the scrap aluminum foil for making the antenna, thereby reducing the manufacturing cost of the antenna.
  • Step S6 specifically includes:
  • the PET film unwinding material 62 unwinds the PET film 61 with the hot-melt adhesive pre-coating, and the PET film 61 with the hot-melt adhesive pre-coating passes through the hot pressing plate 63, and has a hot melt adhesive.
  • the hot-melt adhesive layer 61-1 on the pre-coated PET film 61 faces downward, and the hot-pressing plate bump 63-1 provided on the hot-pressing plate 63 is pressed with the lowering of the hot pressing plate 63 with the hot-melt adhesive pre-pre
  • the coated PET film 61 is such that the hot melt adhesive layer 61-1 is bonded to the antenna pattern aluminum foil 44.
  • the hot pressing plate 63 rises, drives the PET film 61 with the hot-melt adhesive pre-coating layer, and is separated from the PET film 61 with the hot-melt adhesive pre-coating, and the PET film 61 with the hot-melt adhesive pre-coating.
  • the antenna scrap scrap aluminum foil 44' is bonded to the aluminum foil antenna 44" after the waste is removed, and the antenna scrap chip aluminum foil 44' is disposed of waste, thereby solving the problem that the coil antenna and the 3D chip antenna are manufactured to eliminate the fragmented aluminum foil scrap. .
  • the antenna scrap chip aluminum foil winding device 64 winds up the antenna scrap chip aluminum foil 44'.
  • Step S7 specifically includes:
  • the chip connecting piece positioning glue printing seat 71 coats the chip connecting piece positioning glue 72 on the aluminum foil antenna 44" after the waste is removed, because the chip connecting piece positioning glue 72 is insulated, ensuring the chip connecting piece assembly 73 and removing the waste material. Insulation between aluminum foil antennas 44";
  • the spot welder 77 melts and fuses the chip connecting piece aluminum foil on the chip connecting piece assembly 73 and the aluminum foil antenna 44" after removing the waste material by the welding head 77-1 thereon to electrically connect and eliminate the waste.
  • the surface oxidation of the aluminum foil antenna 44" also does not affect the electrical connection between the chip connector assembly 73 and the aluminum foil antenna 44" after the waste is removed, ensuring stable operation of the RF chip.

Abstract

一种天线芯片嵌合体，包括天线承托纸(21)、设于所述天线承托纸(21)上的排除废料后的铝箔天线(44")以及芯片连接片总成(73)，所述排除废料后的铝箔天线(44")围绕形成若干圈，并且所述排除废料后的铝箔天线(44")两端分别设有芯片右侧天线连接点(44"-1)和芯片左侧天线连接点(44"-2)，所述排除废料后的铝箔天线(44")下侧通过天线图形胶水(31)与所述天线承托纸(21)连接。降低了制做成本。

Description

天线芯片嵌合体、制做天线芯片嵌合体的装置及其工艺 技术领域
本发明涉及一种射频技术，具体的说，是涉及一种天线芯片嵌合体、制做天线芯片嵌合体的装置及其工艺。
背景技术
传统制做天线芯片嵌合体(INLAY)的工艺复杂，由制做射频天线层及在射频天线上安装芯片两个不同的生产线完成，因而生产效率导致应用成本高，影响了射频技术的推广使用。而现有的射频天线的制作工艺包括以下几种：
1、化学刻蚀法
化学刻蚀法为天线主流制做工艺，其缺陷是制做工序复杂，成本高，而且产生大量废液，影响环境，属非环保生产工艺。
2、导电油墨式射频天线生产工艺
因导电油墨成本高，导致制做成本高于化学刻蚀工艺，导电油墨制做射频天线的耐折度差，影响射频天线的使用环境及使用寿命。
3、模切法制做射频天线工艺
将PET铝箔复合在PET底膜上，用模切刀模切出天线图形，然后排废，因为射频天线形状复杂，最小线条宽0.7mm，线间距0.7mm，制做模切到具十分困难，而而只能制做图形简单的射频天线。
4、化学刻蚀工艺或模切工艺
传统的化学刻蚀工艺或模切工艺制做射频天线都要采用PET铝箔复合膜，此种复合膜会产生较大的凸起，既影响美观又影响印刷质量。
5、纯铝箔多次冲切组合
纯铝箔多次冲切并组合制做射频天线的虽然环保，没有PET底膜，但因铝箔的厚度只有0.01-0.015毫米，冲切模具精度要求高，如HF频段线圈式天线要三组模具三次冲切组合，制做难度极高，导致成本增加。
6、激光制做射频天线
激光制做射频天线工艺适用于制做复图形射频天线，将射频天线以外铝箔高能汽化排废，降低了生产效率，缺陷是需采用大功率激光器，导致设备投资高，制做成本高，难以推广。
另外，在现有技术中，芯片连接总成(STRAP)与天线的连接方式为扎针工艺或导电胶粘结工艺，因铝箔表面易氧化影响导电效率，所以长期稳定性差。
发明内容
为了克服现有的技术的不足,本发明提供一种天线芯片嵌合体、制做天线芯片嵌合体的装置及其工艺。
本发明技术方案如下所述：
天线芯片嵌合体，其特征在于，包括天线承托纸(21)、设于所述天线承托纸(21)上的排除废料后的铝箔天线(44”)以及芯片连接片总成(73)，
所述排除废料后的铝箔天线(44”)围绕形成若干圈，并且所述排除废料后的铝箔天线(44”)两端分别设有芯片右侧天线连接点(44”-1)和芯片左侧天线连接点(44”-2)，所述排除废料后的铝箔天线(44”)下侧通过天线图形胶水(31)与所述天线承托纸(21)连接，
所述芯片连接片总成(73)包括芯片(73-4)，所述芯片(73-4)通过导电胶(73-6)固定在芯片连接片PET底膜(73-1)上，所述芯片(73-4)的两侧设有芯片右侧连接片铝箔(73-2)和芯片左侧连接片铝箔(73-3)，所述芯片右侧 连接片铝箔(73-2)与所述芯片右侧天线连接点(44”-1)连接，所述芯片左侧连接片铝箔(73-3)和所述芯片左侧天线连接点(44”-2)连接。
进一步的，所述天线承托纸(21)为PVC膜或PET膜或纸。
进一步的，相邻两圈的所述排除废料后的铝箔天线(44”)之间设有激光雕刻沟槽(51)。
进一步的，所述芯片(73-4)上设有芯片驻脚(73-5)，所述芯片驻脚(73-5)与所述导电胶(73-6)连接。
更进一步的，所述芯片右侧连接片铝箔(73-2)与所述芯片右侧天线连接点(44”-1)焊接，所述芯片左侧连接片铝箔(73-3)和所述芯片左侧天线连接点(44”-2)焊接。
进一步的，所述芯片连接片PET底膜(73-1)与形成回路的所述排除废料后的铝箔天线(44”)之间设有芯片连接片定位胶水(72)。
进一步的，所述天线芯片嵌合体表面贴合有复合保护层(91)。
更进一步的，所述复合保护层(91)为可揭开的保护膜、不干胶贴合保护膜、纸质保护层或者PVC保护膜中的任意一种。
更进一步的，所述复合保护层(91)为离型纸或防静电膜。
进一步的，所述芯片连接片总成(73)的外形尺寸长为10-20mm，宽为3mm。
一种制做天线芯片嵌合体的装置，其特征在于，包括天线承托纸放卷装置(10)，所述天线承托纸放卷装置(10)对天线承托纸(21)进行放卷，沿着所述天线承托纸(21)放卷的方向，依次设有天线承托纸定位标志线与天线图形框线印刷座(20)、天线图形胶水印刷座(30)、铝箔冲切工作站(40)、激光雕刻工作站(50)、碎片化铝箔排废工作站(60)、芯片连接片总成安装工作站(70) 以及收卷装置，
所述天线图形胶水印刷座(30)用于在所述天线承托纸(21)上印刷天线图形胶水(31)，
所述铝箔冲切工作站(40)包括铝箔放卷装置(42)、冲模装置(43)以及铝箔废料收卷装置(46)，所述冲模装置(43)对所述铝箔放卷装置(42)放卷后的铝箔进行冲切，并将冲切后的天线图形铝箔(44)粘贴到所述天线图形胶水(31)上，
所述碎片化铝箔排废工作站(60)包括PET膜放卷料(62)、热压板(63)以及天线废料碎片铝箔收卷装置(64)，所述PET膜放卷料(62)放卷后的带有热熔胶预涂层的PET膜(61)经所述热压板(63)后与所述天线图形铝箔(44)粘连，并将天线废料碎片铝箔(44')粘走，使其与排除废料后的铝箔天线(44”)分离，
所述芯片连接片总成安装工作站(70)包括芯片连接片定位胶水印刷座(71)、芯片连接片卷材放卷装置(74)、芯片连接片冲模装置(75)、冲切下芯片连接片后废料收卷装置(76)以及点焊机(77)，所述芯片连接片卷材放卷装置(74)依次连接所述芯片连接片冲模装置(75)和所述冲切下芯片连接片后废料收卷装置(76)，所述芯片连接片定位胶水印刷座(71)设于所述芯片连接片总成安装工作站(70)前端，所述点焊机(77)设于所述芯片连接片总成安装工作站(70)后端。
进一步的，还包括天线与芯片射频性能测试装置(80)，所述天线与芯片射频性能测试装置(80)设于所述芯片连接片总成安装工作站(70)和所述收卷装置之间。
更进一步的，所述天线与芯片射频性能测试装置(80)后方还设有复合座(90)。
进一步的，所述收卷装置包括卷装成品收卷装置(100)和切单张成品收集装置(110)。
一种制做天线芯片嵌合体的工艺，其特征在于，包括以下步骤：
S1：天线承托纸放卷装置(10)放卷天线承托纸(21)；
S2：天线承托纸定位标志线与天线图形框线印刷座(20)在所述天线承托纸(21)上印刷天线图形框线(22)和定位标志线(23)；
S3：天线图形胶水印刷座(30)在所述天线承托纸(21)上印刷天线图形胶水(31)；
S4：铝箔冲切工作站(40)对铝箔(41)放卷并对其进行冲切，并将冲切后的天线图形铝箔(44)粘贴到所述天线图形胶水(31)上；
S5：激光雕刻工作站(50)通过电脑控制激光对所述天线图形铝箔(44)进行雕刻形成激光雕刻沟槽(51)；
S6：碎片化铝箔排废工作站(60)清除所述天线图形框线(22)以外的天线废料碎片铝箔(44')，形成排除废料后的铝箔天线(44”)；
S7：芯片连接片总成安装工作站(70)将芯片(73-4)制作形成便于连接的芯片连接片总成(73)，并将所述芯片连接片总成(73)连接在所述排除废料后的铝箔天线(44”)的两端；
S8：将连接好的天线芯片嵌合体进行收卷。
进一步的，所述步骤S4具体包括：
S41：铝箔放卷装置(42)对铝箔(41)放卷；
S42：冲模装置(43)冲切所述铝箔(41)并将冲切后的所述天线图形铝箔 (44)粘贴到所述天线图形胶水(31)上；
S43：铝箔废料收卷装置(46)回收冲切天线图形后的铝箔废料(45)。
更进一步的，所述步骤S41中，所述铝箔(41)的厚度为0.01-0.015mm。
更进一步的，所述步骤S42中，所述天线图形铝箔(44)的用料面积占投料铝箔(41)面积的1/5-1/3。
进一步的，所述步骤S6：具体包括：
S61：所述PET膜放卷料(62)对带有热熔胶预涂层的PET膜(61)进行放卷，带有热熔胶预涂层的PET膜(61)从所述热压板(63)通过，并且所述带有热熔胶预涂层的PET膜(61)上的热熔胶层(61-1)面向下方，所述热压板(63)上设置的热压板凸点(63-1)随着所述热压板(63)的下降压紧所述带有热熔胶预涂层的PET膜(61)，使得所述热熔胶层(61-1)与所述天线图形铝箔(44)粘结在一起，
S62：所述热压板(63)上升、带动所述带有热熔胶预涂层的PET膜(61)，并与所述带有热熔胶预涂层的PET膜(61)分离，所述带有热熔胶预涂层的PET膜(61)粘结所述天线废料碎片铝箔(44')使其与所述排除废料后的铝箔天线(44”)分离，
S63：所述天线废料碎片铝箔收卷装置(64)对所述天线废料碎片铝箔(44')进行收卷。
进一步的，所述步骤S7具体包括：
S71：芯片连接片定位胶水印刷座(71)在所述排除废料后的铝箔天线(44”)上涂布芯片连接片定位胶水(72)；
S72：芯片连接片卷材放卷装置(74)对所述芯片连接片总成(73)进行放 卷，芯片连接片冲模装置(75)冲切下所述芯片连接片总成(73)并将其落在所述芯片连接片定位胶水(72)上；
S73：点焊机(77)通过其上的焊头(77-1)将所述芯片连接片总成(73)上的芯片连接片铝箔与所述排除废料后的铝箔天线(44”)熔化后焊接在一起，实现电气连接。
进一步的，所述步骤S7完成对所述芯片连接片总成(73)的安装后，通过天线与芯片射频性能测试装置(80)对其进行综合射频性能，对于射频性能不达标的喷墨打点标记或冲孔标记。
更进一步的，综合射频性能测试完成后，复合座(90)在所述排除废料后的铝箔天线(44”)和所述芯片连接片总成(73)的表面贴合复合保护层(91)。
进一步的，所述步骤S8包括对卷装的天线芯片嵌合体进行收卷和单张的天线芯片嵌合体进行收卷，其中，卷装成品收卷装置(100)对卷装的天线芯片嵌合体进行收卷，切单张成品收集装置(110)对厚度大于0.3mm的天线芯片嵌合体切成单张，并对其进行收集。
根据上述方案的本发明，其有益效果在于，
1、本发明具有冲切式制做射频天线的优点：使用纯铝箔，没有PET底膜，而且可以大面积回收冲切之后的废料铝箔，环保，低成本。
2、本发明具有激光雕刻精细的优点，适于刻制复杂图形的射频天线，线圈式射频天线。
3、本发明解决了复杂图形射频天线制造过程产生的碎片化铝箔废料排除难题。
4、本发明具有安装芯片连接片总成的功能，在线一次完成天线制做及安装 芯片全部工序，大大提高射频天线与芯片嵌合体(INLAY)的生产效率，大幅度降低制做成本，促进射频技术推广应用。
5、本发明具有HF频段线圈式天线跨接线安装功能使用加长芯片连接片的芯片连接片总成，在安装芯片同时完成线圈式天线制造与芯片安装效率，大幅度降低HF频段天线与芯片嵌合体(INLAY)成本。
6、本发明制做过程中没有传统工艺中的天线PET底膜，使得射频功能纸(膜)没有PET底膜凸起，表面平整，提高美观与印刷质量。
7、本发明芯片连接片铝箔与射频天线铝箔实施点焊工艺连接，高温压力下两层铝箔熔化焊接成为一体，不受铝箔表面氧化层对导电性能的影响，比传统的导电胶工艺，扎针工艺连接相比，稳定性好。
附图说明
图1为传统的化学刻蚀法制做的HF频段射频天线的主视图；
图2为图1的侧视图；
图3为图1的后视图；
图4为传统的化学刻蚀法制做的HF频段射频天线的主视图；
图5为图4的侧视图；
图6为本发明的结构示意图；
图7为图6的侧视图；
图8为本发明芯片连接部位的放大图；
图9为本发明印刷天线框线图与定位标志的示意图；
图10为本发明印制天线图形胶水的示意图；
图11为本发明冲切天线图形铝箔的示意图；
图12为图11中天线图形铝箔的侧视图；
图13为本发明激光雕刻天线线条之间沟槽的示意图；
图14为图13中A部的放大图；
图15为本发明热压板热压天线图形铝箔和带有热熔胶预涂层的PET膜的示意图；
图16为本发明带有热熔胶预涂层的PET膜带走天线废料碎片铝箔的示意图；
图17为本发明中芯片连接片总成的结构示意图；
图18为图17的侧视图；
图19为本发明印刷芯片连接片定位胶水的示意图；
图20为图19中B部的放大图；
图21为本发明安装芯片连接片总成的示意图；
图22为图21中C部放大图；
图23为本发明制作天线芯片嵌合体装置的示意图。
在图中，10、天线承托纸放卷装置；11、PET膜；12、天线铝箔；12-1、天线铝箔左连接点；12-2、天线铝箔右连接点；13、天线跨接线；13-1、天线跨接线左连接点；13-2、天线跨接线右连接点；14、扎针；15、芯片；16、天线面层复合纸；17、凸起；20、天线承托纸定位标志线与天线图形框线印刷座；21、天线承托纸；22、天线图形框线；23、定位标志线；30、天线图形胶水印刷座；31、天线图形胶水；40、铝箔冲切工作站；41、铝箔；42、铝箔放卷装置；43、冲模装置；44、天线图形铝箔；44’、天线废料碎片铝箔；44”、排除废料后的铝箔天线；44”-1、芯片右侧天线连接点；44”-2、芯片左侧天线连接点；45、冲切天线图形后的铝箔废料；46、铝箔废料收卷装置；50、激光雕刻工作站；51、激 光雕刻沟槽；60、碎片化铝箔排废工作站；61、带有热熔胶预涂层的PET膜；61-1、热熔胶层；61-2、加温后粘结废料铝箔的热熔胶；62、PET膜放卷料；63、热压板；63-1、热压板凸点；64、天线废料碎片铝箔收卷装置；70、芯片连接片总成安装工作站；71、芯片连接片定位胶水印刷座；72、芯片连接片定位胶水；73、芯片连接片总成；73-1、芯片连接片PET底膜；73-2、芯片右侧连接片铝箔；73-3、芯片左侧连接片铝箔；73-4、芯片；73-5、芯片驻脚；73-6、导电胶；74、芯片连接片卷材放卷装置；75、芯片连接片冲模装置；76、冲切下芯片连接片后废料收卷装置；77、点焊机；77-1、焊头；80、天线与芯片射频性能测试装置；90、复合座；91、复合保护层；100、卷装成品收卷装置；110、切单张成品收集装置。
具体实施方式
下面结合附图以及实施方式对本发明进行进一步的描述：
现有的射频天线的制作工艺包括化学刻蚀法、导电油墨式射频天线生产工艺、模切法制做射频天线工艺、化学刻蚀工艺或模切工艺、纯铝箔多次冲切组合、激光制做射频天线等。而其存在各种各样的缺陷。例如：
如图1-3所示，传统的化学刻蚀法制做HF频段射频天线中，HF频段射频天线为线圈式天线。采用PET膜双面复合铝箔的复合膜，正面化学刻蚀出天线铝箔12，背面刻蚀出天线跨接线13。天线跨接线13的两端天线跨接线左连接点13-1、天线跨接线右连接点13-2分别于天线铝箔12的两端天线铝箔左连接点12-1、天线铝箔右连接点12-2的位置相对应，因为中间是PET膜11，所以天线跨接线13与天线铝箔12之间绝缘不导通。在天线铝箔左连接点12-1、天线铝箔右连接点12-2位置区施扎针14穿透PET膜11，PET膜11两面的铝箔变形，天线铝箔左连接点12-1与天线跨接线左连接点13-1、天线铝箔右连接点12-2与天线跨 接线右连接点13-2分别电气连接在一起，经芯片15串接成为完整的线圈。显而易见，工序复杂，而且扎针14连接的电气稳定性可靠性差。
如图4-5所示，传统的化学刻蚀工艺或模切工艺制做射频天线都要采用PET铝箔复合膜，所以传统的INLAY都有PET膜11，在制做射频标签或射频纸时，裁剪下的单张INLAY的PET膜11面积大于天线铝箔12的面积，INLAY嵌合在两层纸(膜)的中间，PET膜11的厚度0.038-0.05毫米之间，其远大于铝箔厚度0.01毫米，所以天线面层复合纸16的表面产生INLAY的PET膜11的凸起17，既影响美观又影响印刷质量。天线面层复合纸16也可以为天线面层复合膜。
针对上述缺陷，本发明提供了一种天线芯片嵌合体、制作天线芯片嵌合体的装置以及其具体工艺。
如图3-22所示，天线芯片嵌合体，包括天线承托纸21、设于天线承托纸21上的排除废料后的铝箔天线44”以及芯片连接片总成73，天线承托纸21为PVC膜或PET膜，制做成本低，采用PVC膜或PET膜做为天线铝箔的承托底膜，制成INLAY成品后表面复合PVC膜或PET膜或纸，然后裁切为单张成为HF频段卡芯料，用来制做塑料射频卡。
排除废料后的铝箔天线44”围绕形成若干圈，外观图形简单，圆形、方形或长方形，并且排除废料后的铝箔天线44”两端分别设有芯片右侧天线连接点44”-1和芯片左侧天线连接点44”-2，排除废料后的铝箔天线44”下侧通过天线图形胶水31与天线承托纸21连接，相邻两圈的排除废料后的铝箔天线44”之间设有激光雕刻沟槽51，激光雕刻沟槽51宽度小于0.1毫米。
芯片连接片总成73的外形尺寸长为10-20mm，宽为3mm，便于与射频天线连接。芯片连接片总成73包括芯片73-4，芯片73-4通过导电胶73-6固定在芯片 连接片PET底膜73-1上，芯片73-4的两侧设有芯片右侧连接片铝箔73-2和芯片左侧连接片铝箔73-3，芯片右侧连接片铝箔73-2与芯片右侧天线连接点44”-1连接，芯片左侧连接片铝箔73-3和芯片左侧天线连接点44”-2连接。
芯片73-4上设有芯片驻脚73-5，芯片驻脚73-5与导电胶73-6连接，芯片右侧连接片铝箔73-2与芯片右侧天线连接点44”-1焊接，芯片左侧连接片铝箔73-3和芯片左侧天线连接点44”-2焊接。
芯片连接片PET底膜73-1与形成回路的排除废料后的铝箔天线44”之间设有芯片连接片定位胶水72。
天线芯片嵌合体表面贴合有复合保护层91，复合保护层91可以为：
①可揭开的保护层，如离型纸，防静电膜等。
②复合不干胶粘合保护层，复合之后成为不干胶。
③复合纸质保护层，复合之后制做射频票卡。
④复合PVC膜保护层，复合之后成为射频卡芯料，用来制做塑料射频票卡。
如图23所示，一种制做天线芯片嵌合体的装置，包括天线承托纸放卷装置10，天线承托纸放卷装置10对天线承托纸21进行放卷，沿着天线承托纸21放卷的方向，依次设有天线承托纸定位标志线与天线图形框线印刷座20、天线图形胶水印刷座30、铝箔冲切工作站40、激光雕刻工作站50、碎片化铝箔排废工作站60、芯片连接片总成安装工作站70以及收卷装置。
天线图形胶水印刷座30用于在天线承托纸21上印刷天线图形胶水31。
铝箔冲切工作站40包括铝箔放卷装置42、冲模装置43以及铝箔废料收卷装置46，冲模装置43对铝箔放卷装置42放卷后的铝箔进行冲切，并将冲切后的天线图形铝箔44粘贴到天线图形胶水31上，采用冲切工艺，冲切模具简单成 本低。
碎片化铝箔排废工作站60包括PET膜放卷料62、热压板63以及天线废料碎片铝箔收卷装置64，PET膜放卷料62放卷后的带有热熔胶预涂层的PET膜61经热压板63后与天线图形铝箔44粘连，并将天线废料碎片铝箔44'粘走，使其与排除废料后的铝箔天线44”分离。
芯片连接片总成安装工作站70包括芯片连接片定位胶水印刷座71、芯片连接片卷材放卷装置74、芯片连接片冲模装置75、冲切下芯片连接片后废料收卷装置76以及点焊机77，芯片连接片卷材放卷装置74依次连接芯片连接片冲模装置75和冲切下芯片连接片后废料收卷装置76，芯片连接片定位胶水印刷座71设于芯片连接片总成安装工作站70前端，点焊机77设于芯片连接片总成安装工作站70后端。
还包括天线与芯片射频性能测试装置80，天线与芯片射频性能测试装置80设于芯片连接片总成安装工作站70和收卷装置之间。
优选的，天线与芯片射频性能测试装置80后方还设有复合座90。
优选的，收卷装置包括卷装成品收卷装置100和切单张成品收集装置110。
综合上述装置，一种制做天线芯片嵌合体的工艺，包括以下步骤：
S1：天线承托纸放卷装置10放卷天线承托纸21。
S2：天线承托纸定位标志线与天线图形框线印刷座20在天线承托纸21上印刷天线图形框线22和定位标志线23，定位标志线23是各个工位的对位标志，确保每个工位都能准确，完成各工位同步工作准确，天线图形框线22用来观察天线图形胶水的印刷准确度。
S3：天线图形胶水印刷座30在天线承托纸21上印刷天线图形胶水31；
S4：铝箔冲切工作站40对铝箔41放卷并对其进行冲切，并将冲切后的天线图形铝箔44粘贴到天线图形胶水31上。
S5：激光雕刻工作站50通过电脑控制激光对天线图形铝箔44进行雕刻形成激光雕刻沟槽51，激光雕刻具有精细加工的优点，激光束在天线区域图形铝箔上雕刻出天线线条之间的沟槽，激光雕刻沟槽51宽度0.1毫米可以调刻出各种射频天线。
S6：碎片化铝箔排废工作站60清除天线图形框线22以外的天线废料碎片铝箔44'，形成排除废料后的铝箔天线44”。
S7：芯片连接片总成安装工作站70将芯片73-4制作形成便于连接的芯片连接片总成73，并将芯片连接片总成73连接在排除废料后的铝箔天线44”的两端。
步骤S7完成对芯片连接片总成73的安装后，通过天线与芯片射频性能测试装置80对其进行综合射频性能，对于射频性能不达标的喷墨打点标记或冲孔标记。综合射频性能测试完成后，复合座90在排除废料后的铝箔天线44”和芯片连接片总成73的表面贴合复合保护层91。在INLAY成品收卷之前，表面复合面纸(膜)即成为射频功能纸(膜)，在线复合面纸，用来制做射频标签，射频票卡，制做工艺简单，成本低。
S8：将连接好的天线芯片嵌合体进行收卷。
步骤S8包括对卷装的天线芯片嵌合体进行收卷和单张的天线芯片嵌合体进行收卷，其中，卷装成品收卷装置100对卷装的天线芯片嵌合体进行收卷，切单张成品收集装置110对厚度大于0.3mm的天线芯片嵌合体切成单张，并对其进行收集。
具体的，步骤S4具体包括：
S41：铝箔放卷装置42对铝箔41放卷，铝箔41的厚度为0.01-0.015mm；
S42：冲模装置43冲切铝箔41并将冲切后的天线图形铝箔44粘贴到天线图形胶水31上，天线图形铝箔44的用料面积占投料铝箔41面积的1/5-1/3；
S43：铝箔废料收卷装置46回收冲切天线图形后的铝箔废料45，将制做天线的废料铝箔回收，降低了天线的制做成本。
步骤S6：具体包括：
S61：PET膜放卷料62对带有热熔胶预涂层的PET膜61进行放卷，带有热熔胶预涂层的PET膜61从热压板63通过，并且带有热熔胶预涂层的PET膜61上的热熔胶层61-1面向下方，热压板63上设置的热压板凸点63-1随着热压板63的下降压紧带有热熔胶预涂层的PET膜61，使得热熔胶层61-1与天线图形铝箔44粘结在一起。
S62：热压板63上升、带动带有热熔胶预涂层的PET膜61，并与带有热熔胶预涂层的PET膜61分离，带有热熔胶预涂层的PET膜61粘结天线废料碎片铝箔44'使其与排除废料后的铝箔天线44”分离，实施天线废料碎片铝箔44'排废，解决了线圈式天线，3D芯片天线制做中排除碎片化铝箔废料的难题。
S63：天线废料碎片铝箔收卷装置64对天线废料碎片铝箔44'进行收卷。
步骤S7具体包括：
S71：芯片连接片定位胶水印刷座71在排除废料后的铝箔天线44”上涂布芯片连接片定位胶水72，因为芯片连接片定位胶水72绝缘，确保芯片连接片总成73与排除废料后的铝箔天线44”之间绝缘；
S72：芯片连接片卷材放卷装置74对芯片连接片总成73进行放卷，芯片连接片冲模装置75冲切下芯片连接片总成73并将其落在芯片连接片定位胶水72 上；
S73：点焊机77通过其上的焊头77-1将芯片连接片总成73上的芯片连接片铝箔与排除废料后的铝箔天线44”熔化后焊接在一起，实现电气连接，排除废料后的铝箔天线44”表面氧化也不会影响到芯片连接片总成73与排除废料后的铝箔天线44”的电气连接，确保射频芯片工作性能稳定。
应当理解的是，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，而所有这些改进和变换都应属于本发明所附权利要求的保护范围。
上面结合附图对本发明专利进行了示例性的描述，显然本发明专利的实现并不受上述方式的限制，只要采用了本发明专利的方法构思和技术方案进行的各种改进，或未经改进将本发明专利的构思和技术方案直接应用于其它场合的，均在本发明的保护范围内。

Claims (10)

  1. 天线芯片嵌合体，其特征在于，包括天线承托纸(21)、设于所述天线承托纸(21)上的排除废料后的铝箔天线(44”)以及芯片连接片总成(73)，
    所述排除废料后的铝箔天线(44”)围绕形成若干圈，并且所述排除废料后的铝箔天线(44”)两端分别设有芯片右侧天线连接点(44”-1)和芯片左侧天线连接点(44”-2)，所述排除废料后的铝箔天线(44”)下侧通过天线图形胶水(31)与所述天线承托纸(21)连接，
    所述芯片连接片总成(73)包括芯片(73-4)，所述芯片(73-4)通过导电胶(73-6)固定在芯片连接片PET底膜(73-1)上，所述芯片(73-4)的两侧设有芯片右侧连接片铝箔(73-2)和芯片左侧连接片铝箔(73-3)，所述芯片右侧连接片铝箔(73-2)与所述芯片右侧天线连接点(44”-1)连接，所述芯片左侧连接片铝箔(73-3)和所述芯片左侧天线连接点(44”-2)连接。
  2. 根据权利要求1所述的天线芯片嵌合体，其特征在于，所述天线承托纸(21)为PVC膜或PET膜或纸。
  3. 根据权利要求1所述的天线芯片嵌合体，其特征在于，相邻两圈的所述排除废料后的铝箔天线(44”)之间设有激光雕刻沟槽(51)。
  4. 根据权利要求1所述的天线芯片嵌合体，其特征在于，所述天线芯片嵌合体表面贴合有复合保护层(91)。
  5. 根据权利要求4所述的天线芯片嵌合体，其特征在于，所述复合保护层(91)为可揭开的保护膜、不干胶贴合保护膜、纸质保护层或者PVC保护膜中的任意一种。
  6. 制做天线芯片嵌合体的装置，其特征在于，包括天线承托纸放卷装置(10)， 所述天线承托纸放卷装置(10)对天线承托纸(21)进行放卷，沿着所述天线承托纸(21)放卷的方向，依次设有天线承托纸定位标志线与天线图形框线印刷座(20)、天线图形胶水印刷座(30)、铝箔冲切工作站(40)、激光雕刻工作站(50)、碎片化铝箔排废工作站(60)、芯片连接片总成安装工作站(70)以及收卷装置，
    所述天线图形胶水印刷座(30)用于在所述天线承托纸(21)上印刷天线图形胶水(31)，
    所述铝箔冲切工作站(40)包括铝箔放卷装置(42)、冲模装置(43)以及铝箔废料收卷装置(46)，所述冲模装置(43)对所述铝箔放卷装置(42)放卷后的铝箔进行冲切，并将冲切后的天线图形铝箔(44)粘贴到所述天线图形胶水(31)上，
    所述碎片化铝箔排废工作站(60)包括PET膜放卷料(62)、热压板(63)以及天线废料碎片铝箔收卷装置(64)，所述PET膜放卷料(62)放卷后的带有热熔胶预涂层的PET膜(61)经所述热压板(63)后与所述天线图形铝箔(44)粘连，并将天线废料碎片铝箔(44')粘走，使其与排除废料后的铝箔天线(44”)分离，
    所述芯片连接片总成安装工作站(70)包括芯片连接片定位胶水印刷座(71)、芯片连接片卷材放卷装置(74)、芯片连接片冲模装置(75)、冲切下芯片连接片后废料收卷装置(76)以及点焊机(77)，所述芯片连接片卷材放卷装置(74)依次连接所述芯片连接片冲模装置(75)和所述冲切下芯片连接片后废料收卷装置(76)，所述芯片连接片定位胶水印刷座(71)设于所述芯片连接片总成安装工作站(70)前端，所述点焊机(77)设于所述芯片连接片总成安装工作站(70)后端。
  7. 制做天线芯片嵌合体的工艺，其特征在于，包括以下步骤：
    S1：天线承托纸放卷装置(10)放卷天线承托纸(21)；
    S2：天线承托纸定位标志线与天线图形框线印刷座(20)在所述天线承托纸(21)上印刷天线图形框线(22)和定位标志线(23)；
    S3：天线图形胶水印刷座(30)在所述天线承托纸(21)上印刷天线图形胶水(31)；
    S4：铝箔冲切工作站(40)对铝箔(41)放卷并对其进行冲切，并将冲切后的天线图形铝箔(44)粘贴到所述天线图形胶水(31)上；
    S5：激光雕刻工作站(50)通过电脑控制激光对所述天线图形铝箔(44)进行雕刻形成激光雕刻沟槽(51)；
    S6：碎片化铝箔排废工作站(60)清除所述天线图形框线(22)以外的天线废料碎片铝箔(44')，形成排除废料后的铝箔天线(44”)；
    S7：芯片连接片总成安装工作站(70)将芯片(73-4)制作形成便于连接的芯片连接片总成(73)，并将所述芯片连接片总成(73)连接在所述排除废料后的铝箔天线(44”)的两端；
    S8：将连接好的天线芯片嵌合体进行收卷。
  8. 根据权利要求7所述的制做天线芯片嵌合体的工艺，其特征在于，所述步骤S7完成对所述芯片连接片总成(73)的安装后，通过天线与芯片射频性能测试装置(80)对其进行综合射频性能，对于射频性能不达标的喷墨打点标记或冲孔标记。
  9. 根据权利要求8所述的制做天线芯片嵌合体的工艺，其特征在于，综合射频性能测试完成后，复合座(90)在所述排除废料后的铝箔天线(44”)和所 述芯片连接片总成(73)的表面贴合复合保护层(91)。
  10. 根据权利要求7所述的制做天线芯片嵌合体的工艺，其特征在于，所述步骤S8包括对卷装的天线芯片嵌合体进行收卷和单张的天线芯片嵌合体进行收卷，其中，卷装成品收卷装置(100)对卷装的天线芯片嵌合体进行收卷，切单张成品收集装置(110)对厚度大于0.3mm的天线芯片嵌合体切成单张，并对其进行收集。
PCT/CN2016/071020 2016-01-15 2016-01-15 天线芯片嵌合体、制做天线芯片嵌合体的装置及其工艺 WO2017120889A1 (zh)

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CN113478569A (zh) * 2021-06-28 2021-10-08 深圳市领滔科技有限公司 模切产品生产工艺及模切产品生产线

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