WO2005035654A1 - 保護膜用樹脂組成物 - Google Patents
保護膜用樹脂組成物 Download PDFInfo
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- WO2005035654A1 WO2005035654A1 PCT/JP2004/014756 JP2004014756W WO2005035654A1 WO 2005035654 A1 WO2005035654 A1 WO 2005035654A1 JP 2004014756 W JP2004014756 W JP 2004014756W WO 2005035654 A1 WO2005035654 A1 WO 2005035654A1
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- protective film
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Definitions
- the present invention relates to a resin composition suitable for forming a protective film, and in particular, has excellent heat resistance as a protective film provided on a colored film (eg, a colored resin film) formed on the surface of a glass substrate or the like.
- the present invention relates to a resin composition which gives a film and has good storage stability.
- a liquid crystal display element is immersed in a solvent, an acid, an alkaline solution, or the like during a manufacturing process, and the element surface is locally exposed to a high temperature by sputtering when an ITO (Indium Tin Oxide) layer is formed. .
- ITO Indium Tin Oxide
- a protective film having resistance thereto is generally formed.
- such a protective film has a low degree of liquid crystal contamination, has smoothness, and has an adhesion to a substrate on which the protective film is formed and a layer formed on the protective film.
- melamine resin As a material for the protective film, melamine resin, polyimide resin, acrylic resin, epoxy resin and the like have been proposed. As a result, the demand for heat resistance is becoming stronger, and if all the required characteristics are satisfied, it is still difficult to find a material that is well-balanced.
- melamine resin has a problem in that it has good heat resistance but has extremely poor adhesion to a glass substrate, and tends to cause squeezing on a substrate or a filter.
- Polyimide resin has high heat resistance, but has problems such as poor transparency, lack of storage stability of resin, and poor solubility and the possibility of using an organic solvent that can damage the color filter. is there.
- Acrylic resin is excellent in visible light transmittance but insufficient in heat resistance, and has a problem that wrinkles and cracks occur on the film surface at high temperatures.
- Patent Document 1 Also, an acrylic resin having an epoxy group, or a protective film using an epoxy resin and o-cresol novolac-based curing agent (see Patent Documents 2 and 3) have been studied. There is a problem that the adhesion is insufficient or the light transmittance is reduced due to yellowing, wrinkling, and cracking of the film due to heat during vapor deposition of ITO. Attempts have been made to use acid anhydrides as hardeners to overcome yellowing, but their reactivity and hygroscopicity have problems with storage stability, and they can be used in terms of solubility. Problems remain, such as the limited amount of organic solvents and the safety of the solvents.
- Patent Document 4 discloses a method of forming a protective film on a color filter using a composition containing a decomposition product, a polyfunctional acrylate polymer, and a photopolymerization initiator. In this method, it is described that acidic colloidal silica is preferred, and that it is preferable to form a double protective film.
- this protective film is considered to be excellent in ITO resistance, water resistance, moisture permeability, etc., it takes time and effort to form a double protective film, and the storage stability of the resin composition is mentioned. However, further improvement is desired in that there may be a problem in that respect.
- Patent Document 1 Japanese Patent Application Laid-Open No. 11-315249
- Patent Document 2 JP-A-5-140274
- Patent Document 3 JP-A-5-140267
- Patent Document 4 JP-A-11 231120
- An object of the present invention is to provide a protective film for a color filter colored resin film having excellent heat resistance, water resistance and visible light transmittance, which can be used as a double protective film.
- colloidal silica which may be blended as a filler for forming a protective film or the like is used as an epoxy resin.
- colloidal silica which may be blended as a filler for forming a protective film or the like is used as an epoxy resin.
- a resin composition for a protective film when blended with a multifunctional monomer such as epoxy resin having a functional group or polyfunctional acrylic resin, especially epoxy resin having two or more epoxy groups.
- the present inventors have found that the alkali metal content and PH in the colloidal silica, which is not much considered, greatly affect the properties and storage stability of the protective film, and completed the present invention.
- the present invention blends a colloidal slurry in which silica fine particles having specific physical properties (low alkali content and pH 6-8) are dispersed with a polyfunctional monomer, particularly an epoxy resin having two or more epoxy groups.
- a polyfunctional monomer particularly an epoxy resin having two or more epoxy groups.
- silica fine particles (solid content) in the colloidal slurry are 10 to 150 parts by mass with respect to 100 parts by mass of the total amount of the epoxy resin having two or more epoxy groups, the curing agent and the curing accelerator.
- Cyclic terpene skeleton-containing polyhydric phenolic force A compound in which two molecules of phenols are added to one molecule of cyclic terpene conjugate and Z or aldehydes and Z or ketones in the presence of an acidic catalyst.
- the resin composition according to the above item (3) which is a conjugate obtained by a condensation reaction,
- a resin composition for a protective film comprising a colloidal slurry of silica fine particles having a diameter of 50 nm or less, a PH of 6 to 8 and a metal content of 5 ppm or less,
- the resin composition for a protective film of the present invention has excellent storage stability, good workability, excellent transparency, and particularly high ITO resistance, high surface smoothness, and high water resistance. Since a cured film having excellent properties can be formed, it is suitable for forming a protective film such as a colored resin film. Therefore, when the resin composition is used for forming a protective film such as a color filter in a color liquid crystal display device, the reliability of the device can be improved.
- the colloidal slurry of silica fine particles used in the resin composition for a protective film of the present invention has a specific surface area conversion method in consideration of maintaining high transparency as a protective film and clogging during a filtration step.
- the average particle diameter of the silica fine particles measured by the method described above is 50 nm or less, preferably 45 nm or less, more preferably 35 nm or less.
- concentration of the alkali metal component (such as Na) in the colloidal slurry of silica fine particles used in the resin composition of the present invention is 5 ppm or less, and is preferably It is at most 3 ppm, more preferably at most lppm.
- the pH of the colloidal slurry of silica fine particles used in the resin composition of the present invention affects the reactivity of the resin component and the storage stability of the resin composition.
- PH is the neutral region of 6-8, preferably 6.5-7.5, more preferably 7.0-7.5
- the colloidal slurry of silica fine particles used in the resin composition of the present invention is generally obtained by hydrolyzing a silicate ester according to the method described in JP-A-2004-91220 or a method similar thereto. Power that can also be marketed, for example, as Quartron PL series (trade name, manufactured by Fuso Chemical Industry Co., Ltd.)!
- the blending amount of the colloidal slurry of silica fine particles differs depending on the resin component to be combined. However, the total amount of the epoxy resin having two or more epoxy groups, the curing agent, and the curing accelerator as the silica fine particle solid content ( In the following, these three components are combined and simply referred to as the “fat component”, and it is generally preferable to mix 10 ⁇ 150 ⁇ ⁇ preferably 20 ⁇ 100 ⁇ ⁇ [preferably 25 ⁇ 80 ⁇ ].
- the resin used in the resin composition of the present invention is an epoxy resin having two or more epoxy groups, and an epoxy resin having two or more epoxy groups.
- the former is more preferable, since the former is preferred.
- Examples of the epoxy resin having two or more epoxy groups include, for example, a polyfunctional epoxy resin which is a glycidyl ether compound of a polyphenol compound, and a polyfunctional epoxy compound which is a glycidyl ether compound of various novolac resins.
- Fat alicyclic polyfunctional epoxy resin, aliphatic polyfunctional epoxy resin, heterocyclic polyfunctional epoxy resin, glycidyl ester-based multifunctional epoxy resin, glycidylamine-based polyfunctional epoxy resin, halogen Examples include polyfunctional epoxy resins obtained by glycidyl-forming phenols.
- Polyfunctional epoxy resins which are glycidyl etherified compounds of polyphenol compounds, include 2- (4-hydroxyphenol) -2- [4- [1,1-bis ( 4-Hydroxyphenyl) ethyl] phenyl] propane, bisphenol A, bisphenol A, bisphenol S, 4,4'-biphenol, tetramethylbisphenol A, dimethylbisphenol 8, tetramethylbisphenol F, dimethylbisphenol ?
- Tetramethylbisphenol S dimethylbisphenol Enol 3, tetramethyl-4,4'-biphenol, dimethyl-4,4'-biphenol, 1- (4-hydroxyphenyl) -2- (4- (1,1-bis- (4-hydroxyphenyl) ethyl) phenyl Le] propane, 2,2'-methylene bis (4-methyl-6-tert-butylphenol), 4,4'butylidene-bis (3-methyl-6-tert-butylphenol), trishydroxyphenylmethane, resorcinol, hydroquinone, pyrogallol, A polyfunctional epoxy that is a glycidyl etherified product of a phenolic compound having a fluorene skeleton such as phlorogrisinol and a diisopropylidene skeleton, a phenol having a fluorene skeleton such as 1,1-diphenyl-4-hydroxyfluorene, and a phenolated polybut
- Polyfunctional epoxy resins which are glycidyl ethers of various novolak resins, include phenols, talesols, ethyl phenols, butyl phenols, octyl phenols, bisphenol A, bisphenol F and bisphenol.
- Novolak resin using various phenols such as bisphenols such as S and naphthols, phenol novolak resin containing a xylylene skeleton, phenol novolak resin containing a dicyclopentagen skeleton, and phenol novolak containing a biphenol skeleton.
- glycidyl ether tertiary products of various novolak resins such as phenol novolak resins having a fluorene skeleton.
- an alicyclic polyfunctional epoxy resin having an aliphatic ring skeleton such as cyclohexane and the like and as an aliphatic polyfunctional epoxy resin, 1, 4-butanediol, Glycidyl ethers of polyhydric alcohols such as 1,6-hexanediol, polyethylene glycol, and pentaerythritol, and heterocyclic polyfunctional epoxy resins include heterocyclic rings having a heterocyclic ring such as an isocyanuric ring or a hydantoin ring.
- Polyfunctional epoxy resins and glycidyl ester epoxy resins include epoxy resins composed of carboxylic acid esters such as hexahydrophthalic acid diglycidyl ester and glycidylamine polyfunctional epoxy resins.
- halogenated phenols such as brominated bisphenol A, brominated bisphenol F, brominated bisphenol S, brominated phenol novolak, brominated cresol novolac, chlorinated bisphenol S, and chlorinated bisphenol A, etc.
- Glycidyl-diluted epoxy resin may be used.
- 2- (4-hydroxyphenyl) It has an aliphatic ring skeleton such as-(l-)-2- [4 [1,1bis (4-hydroxyphenyl) ethyl] phenyl] propane, bisphenol 8, phenol novolak resin containing a fluorene skeleton, and cyclohexane.
- Glycidyl ethers of polyhydric alcohols such as alicyclic polyfunctional epoxy resins and pentaerythritol are preferred.
- Most preferred! / ⁇ is 2- (4-hydroxyphenyl) -2- [4 [1,1bis (4-hydroxyphenyl) ethyl] phenyl] propane.
- Examples of the curing agent used in the resin composition of the present invention include a phenol-based curing agent, an acid anhydride-based curing agent, a carboxylic acid-based curing agent, an amine-based curing agent, and a hydrazide-based curing agent.
- a phenolic curing agent particularly a polyvalent phenolic conjugate containing a cyclic terpene skeleton, is preferred.
- the compound is used as a curing agent, the cured product of the above-mentioned high-density yarn hardly undergoes yellowing at high temperatures.
- the cyclic terpene skeleton-containing polyvalent phenol conjugate is not particularly limited as long as it is a compound having a cyclic terpene skeleton and two or more phenolic hydroxyl groups in the molecule.
- a cyclic terpene conjugate is reacted with a phenol to form a molecule of the cyclic terpenic conjugate in a ratio of about 2 molecules of the phenol to one molecule.
- the hydroxyl equivalent of the polyhydric phenolic compound having a cyclic terpene skeleton is not particularly limited.
- a compound having a hydroxyl equivalent of usually 140 to 190 g / eq, preferably 150 to 180 g / eq, more preferably 155 to 175 gZeq is used. Is done.
- One of the preferable polyvalent phenolic conjugates containing a cyclic terpene skeleton is a polyvalent phenolic conjugate with a cyclic terpene skeleton having a high molecular weight, such as a novolac-type polyvalent phenolic conjugate with a cyclic terpene skeleton. Is mentioned.
- Examples of the cyclic terpene compound used as a raw material for the cyclic terpene skeleton-containing polyphenol compound include limonene (formula (1) below), dipentene which is an optical isomer of limonene, and ⁇ -type pinene (described below).
- phenols to be added to the cyclic terpene conjugate include unsubstituted or C 13 -alkyl groups and aryl groups such as phenol, o-cresol, 2,6-xylenol and o-arylphenol. And a phenol substituted with a hydroxy group or the like. Of these, phenol or o-talesole is preferred, and phenol is particularly preferred.
- aldehydes or ketones used in the production of a polyhydric phenol compound having a cyclic terpene skeleton having a high molecular weight include formaldehyde, paraformaldehyde, acetoaldehyde, benzaldehyde, hydroxybenzaldehyde, acetone, and cyclohexane.
- aldehydes or ketones used in the production of a polyhydric phenol compound having a cyclic terpene skeleton having a high molecular weight
- formaldehyde paraformaldehyde, acetoaldehyde, benzaldehyde, hydroxybenzaldehyde, acetone, and cyclohexane.
- examples thereof include aliphatic aldehydes or ketones having 1 to 16 carbon atoms such as nonone and benzaldehyde which may have a substituent such as a hydroxy group.
- a solvent such as an aromatic hydrocarbon, an alcohol, or an ether is usually used, and a group power including the aldehyde and the ketone is also selected.
- a group power including the aldehyde and the ketone is also selected.
- an acidic catalyst hydrochloric acid, sulfuric acid, phosphoric acid, Polyphosphoric acid, boron trifluoride and the like are used.
- the cyclic terpene skeleton-containing polyvalent phenol conjugate thus obtained is, for example, a conjugate obtained by reacting limonene and phenol, the compound of the following formulas (I) and ( ⁇ ) Presumed to be a mixture.
- the polyvalent phenol compound having a cyclic terpene skeleton acts as a curing agent in the present invention, and is usually used alone, but may be used in combination with another curing agent in some cases. When used in combination, it is preferable to use the cured product within a range that does not decrease the physical properties such as heat resistance and yellowing resistance and visible light transmittance. Usually, the range is preferably about 0 to 20% based on the total amount of the curing agent.
- Examples of the curing agent that can be used in combination include acid anhydride-based curing agents, carboxylic acid-based curing agents, amine-based curing agents, phenol-based curing agents other than the cyclic terpene skeleton-containing polyvalent phenol compound, and hydrazide-based curing agents. it can.
- Examples of the acid anhydride type hardener include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, and ethylene glycol trimellitic anhydride.
- Alicyclic carboxylic anhydrides such as phthalic anhydride, hexahydrophthalic anhydride, nadic anhydride, hetic anhydride, and hymic anhydride are mentioned.
- Examples of the carboxylic acid type hardener include aliphatic polycarboxylic acids having 2 to 22 carbon atoms such as succinic acid, adipic acid, azelaic acid and sebacic acid, phthalic acid, isophthalic acid, terephthalic acid, and the like.
- Aromatic carboxylic acids such as 1,2,4 benzenetricarboxylic acid, 1,2,4,5 benzenetetracarboxylic acid, naphthalenedi (or tetra) carboxylic acid, tetrahydrophthalic acid, hexahydrophthalic acid, methylhexahydrophthalic acid
- Examples include alicyclic polycarboxylic acids such as acids.
- amine-based curing agent examples include diaminodiphenylmethane, diaminodiphenylsulfone, diaminodiphenylether, p-phenylenediamine, m-phenylenediamine, o-phenylenediamine, 1,5-diaminonaphthalene, m Aromatic amines such as xylylenediamine, aliphatic diamines such as ethylenediamine, diethylenediamine, isophoronediamine, bis (4-amino-3-methyldicyclohexyl) methane, polyetherdiamine, and dicyandiamide And guanidines such as 1- (o-tolyl) biguanide.
- phenolic curing agent other than the cyclic terpene skeleton-containing polyvalent phenol conjugate examples include, for example, bisphenol A, bisphenol F, bisphenol S, 4,4′-biphenylphenol, and tetramethylbisphenol.
- bisphenol A bisphenol F
- bisphenol S bisphenol S
- 4,4′-biphenylphenol 4,4′-biphenylphenol
- tetramethylbisphenol dimethylbisphenol eight
- tetramethylbisphenol F dimethylbisphenol?
- Tetramethylbisphenol S dimethylbisphenol 3, tetramethyl-4,4'-biphenol, dimethyl-4,4'-biphenylphenol, 1- (4-hydroxyphenol) 2— [4— (1,1, bis (4— Hydroxyphenyl) ethyl) phenyl] propane, 2,2'-methylenebis (4-methyl-6-tertbutylbutylphenol), 4,4'butylidene-bis (3-methyl-6-tertbutylbutylphenol), Trishydroxyphenol, resorcinol, hydroquinone, pyrogallol, phenols having a diisopropylidene skeleton, phenols having a fluorene skeleton such as 1,1-di-4-hydroxyphenylfluorene, phenolated polybutadiene, phenol, tarezols, ethyl phenol , Butylphenols, octylphenols, bisphenols A, bisphenol enol?
- Various novolak resins such as phenol novolak resin having phenol, biphenol-containing phenol novolak resin, fluorene skeleton-containing phenol novolak resin, and furan skeleton-containing phenol novolak resin.
- hydrazide hardener examples include, for example, carposihydrazide, oxalic acid dihydrazide, malonic acid dihydrazide, succinic acid dihydrazide, glutaric acid dihydrazide, adipic acid dihydrazide, pimelic dihydrazide, suberic acid dihydrazide, and azelaic acid dihydrazide dihydrazide.
- Dihydrazides such as 1,4-cyclohexandihydrazide, tartaric acid dihydrazide, malic acid dihydrazide, iminodiacetic acid dihydrazide, N, N'-hexamethylenebissemicarbazide and itaconic acid dihydrazide Hydrazide-based curing agent, pyromellitic acid trihydrazide, Echirenjiamin tetraacetate tetrahydrazide, 1, 2, polyfunctional hydrazide type curing agent such as 4-benzenetricarboxylic hydrazide.
- the curing agent is usually 0.2 to 1.8, preferably 0.4 to 1.4.4, more preferably 0.2 to 1.8 in the equivalent ratio of the functional group of the curing agent to the epoxy group of the epoxy resin. Use within the range of 0.6.
- an imidazole-based curing accelerator is used as a curing accelerator.
- Other compounds known as catalysts for promoting the curing of epoxy resin, for example, Grade amines and phosphines can be used in combination as long as the physical properties are not impaired.
- Examples of the imidazole-based curing accelerator include 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-pendecylimidazole, 2-heptadecylimidazole, and 2-phenylimidazole.
- the amount of the curing accelerator used in the epoxy resin composition is about 0.1 to 10 parts with respect to 100 parts of the epoxy resin.
- these imidazole-based curing accelerators are used. Is used in an amount of usually at least 0.1 part, preferably at least 0.3 part, more preferably at least 0.5 part, and at most 7 parts, preferably at most 5 parts, per 100 parts of the epoxy resin. Parts or less, more preferably 4 parts or less, even more preferably 3.5 parts or less.
- acrylic resin examples include 2-hydroxyethyl (meth) atalylate, 2-hydroxypropyl (meth) atalylate, and 1,4-butanediol mono ( (Meta) acrylate, carbitol (meth) acrylate, atariloyl morpholine, hydroxyl-containing (meth) acrylate (eg, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-butanediol mono (meth) acrylate, etc.) and polyvalent acid anhydrides of rubonic acid compounds (eg, succinic anhydride, maleic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, etc.) Half-ester, polyethylene glycol di (meth) acrylate, tripropylene glycol di (meth) Acrylate, tri
- the colloidal slurry of the silica fine particles was measured by a BET specific surface area method in order to maintain transparency as a protective film.
- the blending amount of the colloidal slurry of silica fine particles varies depending on the resin component to be combined. However, as a solid content of silica fine particles, usually 100 parts of an acrylic resin component (acrylic resin, photopolymerization initiator) is used. 100 parts, preferably 20-80 parts, and more preferably 25-70 parts are blended. If the amount is more than 100 parts, the dispersion state of the silica fine particles is deteriorated, aggregation is likely to occur, storage stability is deteriorated, and the thixotropic property of the resin component is increased, and a smooth coating film is formed. If the amount is less than 10 parts, it may be difficult to impart ITO resistance.
- an acrylic resin component acrylic resin, photopolymerization initiator
- an epoxy resin and an acrylic resin can be used in combination.
- photocuring is performed using a photopolymerization initiator, and then the epoxy resin, the curing agent, and the curing accelerator are heat-cured, or the epoxy resin is used.
- the colloidal slurry of the silica fine particles is used as a protective film so that the silica is measured by a specific surface area conversion method in order to maintain transparency. Fine particles with a primary particle size of 50 nm or less are used.
- the blending amount of the colloidal slurry of silica fine particles depends on the resin component to be combined.
- the silica resin solid content includes a resin component (an epoxy resin having two or more epoxy groups, a curing agent, a curing accelerator, and Z or , Acrylic resin, photopolymerization initiator), and usually 10 to 150 parts, preferably 20 to 100 parts, and more preferably 25 to 80 parts. If the amount is more than 100 parts, the dispersion state of the silica fine particles deteriorates, aggregation tends to occur and storage stability deteriorates, and the thixotropic property of the resin component increases, and a smooth coating film is formed. It becomes ⁇ If the amount is less than 10 parts, it may be difficult to impart ITO resistance.
- Examples of the organic solvent used in the resin composition of the present invention include alcohols such as methanol, ethanol, propanol, and butanol, preferably lower alcohol having 14 to 14 carbon atoms, and ethylene glycolone monomethinoleate.
- Glycol ethers such as ethylene glycolone monoethylenoate, ethylene glycolone monobutynoate ether, propylene glycolone monomethinoleatel, 3-methoxybutanol and 3-methyl-3-methoxybutanol, preferably Is a lower ether having 1 to 4 carbon atoms of an alkylene glycol having 1 to 4 carbon atoms, a lower ether having 1 to 4 carbon atoms, ethylene glycol monoethyl ether acetate, ethylene glycol monoethyl butenoate ethereal acetate, propylene glycol monomethyl ether acetate, propylene glycol Lemonethinooleatenorea acetate, 3
- Alkylene glycol ether acetates such as 3-methoxybutyl acetate and ethyl ethoxypropiolate, and preferably aromatic hydrocarbons such as lower alkyl ether acetate having 1 to 4 carbon atoms and lower alkyl ether having 14 to 14 carbon atoms and toluene and xylene , Methyl ethyl ketone, cyclohexanone, cyclopentanone, ketones such as 4-hydroxy-14-methyl-2-pentanone, methyl acetate, ethyl acetate, propyl acetate, butyl acetate, methyl 2-hydroxy-2-methylpropionate , 2-hydroxy-2-methylethyl propionate, methyl hydroxyacetate, hydroxyethyl acetate, butyl hydroxyacetate, methyl lactate, ethyl lactate, butyl lactate, methyl 3-hydroxypropionate, methyl 3-hydroxypropionate, 3-hydroxypropionat
- Lower ether acetates having 1-4 carbon atoms of alkylene glycols having 2-3 carbon atoms such as norethenorea acetate, propylene glycol monomonoethenooleate acetate, ethylene glycol monobutyl ether acetate, etc.
- lower ether acetates of propylene glycol, propylene glycol monomethyl ether, 3-Methoxybutanol, 3-methyl-3-methoxybutanol and esters are preferred, but it is necessary to select one that does not destroy the monodispersion of silica fine particles in the colloidal slurry.
- the amount of the organic solvent used is not particularly limited, and may be adjusted according to the desired film thickness, surface smoothness, film forming method, and the like to impart coating suitability.
- the resin composition of the present invention may contain, if necessary, a coupling agent, a surfactant, an oxidation stabilizer, a light stabilizer, a moisture resistance improver, a thixotropy-imparting agent, an antifoaming agent, and other various additives.
- Additives such as fats, tackifiers, antistatic agents, lubricants, and ultraviolet absorbers can also be added.
- Examples of usable coupling agents include 3-glycidoxypropyltrimethoxysilane, 3-silane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and N- (2-aminoethyl) ) 3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) 3-aminopropylmethyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, butyltrimethoxysilane, N — (2- (Bubenzylbenzylamino) ethyl) 3-aminopropyltrimethoxysilane hydrochloride, 3-methacryloxypropyltrimethoxysilane, 3-methylpropylmethoxydimethoxysilane, 3-chloropropyltrimethoxysilane Silane coupling agents, such
- a silane coupling agent having an epoxy group which is preferred by a silane coupling agent, is more preferable.
- the adhesion to the substrate is improved, and a protective film having excellent moisture resistance reliability can be obtained.
- the amount is about 0.1 to 5 parts, preferably about 0.5 to 4 parts with respect to 100 parts of the resin, preferably 100 parts of the epoxy resin.
- a surfactant can be used to improve the coating suitability of the resin composition for a protective film.
- a silicon-based surfactant and a fluorine-based surfactant are used.
- the amount of the surfactant is usually 0.001 to 15 parts, preferably 0 to 100 parts of resin, preferably epoxy resin. 01-4 parts, more preferably 0.1-3 parts, and even more than 0.5 part up to 3 parts or less.
- the resin composition of the present invention comprises a colloidal slurry of silica fine particles, an epoxy resin having two or more epoxy groups and a Z or acrylic compound, a curing agent such as an imidazole curing accelerator, and Accordingly, various additives can be uniformly dissolved in an organic solvent to obtain a varnish.
- the solid content concentration is usually about 10% or more, preferably about 15% or more, more preferably about 20% or more, and about 50% or less, preferably about 40% or less, and more preferably about 35% or less. It may be prepared. These concentrations may be adjusted appropriately according to the resin composition, and the viscosity at 25 ° C. is adjusted to 2 to 30 mPa ⁇ s, preferably 4-1 to 15 mPa ⁇ s in consideration of the efficiency of coating and the like. Nogayo! / ⁇ .
- the coating film formed by the protective resin composition (varnish) of the present invention thus obtained has excellent adhesion to various materials such as glass, wood, metal, and plastic. It has excellent lubricity, heat and yellowing resistance, transparency, and toughness. Thus, it is particularly useful as a coating film (high visible light transmittance coating film) in places requiring high visible light transmittance, such as organic EL elements and plasma display panels.
- a material that satisfies high visible light transmittance may be a film having a film thickness of 1 ⁇ m, more preferably 1.5 / ⁇ , and still more preferably 2 m.
- the transmittance power of the light is 95% or more in light having a wavelength of 400 nm.
- the coating film formed by the resin composition of the present invention is excellent in high temperature resistance at the time of ITO film formation, it is necessary to form a protective film on a colored resin film such as a color filter for liquid crystal display. Alternatively, it is particularly useful for forming a smooth layer of a color filter for liquid crystal display.
- the transparent thin film obtained by hardening the resin composition of the present invention has a function of effectively preventing ionic impurities eluted as much as possible from the color filter from contaminating the liquid crystal.
- the resin composition (varnish) of the present invention is used as a protective film such as a color filter protective film
- the resin composition is usually applied onto a color filter by a spin coating method.
- the film thickness is usually 0.1 to 10 m after curing, preferably 0.5 to 8 m, more preferably 0.8 to 5 / ⁇ , and still more preferably 0.8 to 3 m. Is applied.
- the viscosity of the composition of the present invention at 25 ° C is 2 mPa's or more, preferably 4 mPa's or more, more preferably 5 mPa's or more, and 30 mPa's or more.
- the amount of the organic solvent is usually adjusted so as to be not more than 15 s, preferably not more than 15 mPa's, and more preferably not more than 13 mPa's.
- the viscosity is preferably 10 mPa's or less, and more preferably 8 mPa's or less.
- the curing temperature may not be constant, for example, the curing may be performed while increasing the temperature.
- Pre-beta solvent removal and post-beta curing can be performed using an oven, a hot plate or the like.
- photo-curing usually, after removing the solvent by a pre-beta, irradiation and curing are performed by a known exposure machine, and then post-beta is performed.
- the protective film obtained by curing the resin composition of the present invention is substantially transparent.
- the color filter on which the substantially transparent protective film of the present invention is formed as described above is a liquid filter.
- Crystal display device and the like A typical liquid crystal display device is composed of a color filter section (an ITO film and an ITO patterning are applied as necessary), a liquid crystal section, a knock light section and a polarizing film section.
- the liquid crystal display device of the present invention can be obtained by using a color filter provided with the protective film of the present invention in the portion.
- a composition having a composition ratio shown in the column of Example 1 in Table 1 (the numerical value is “part”) was dissolved in propylene glycol monoethyl ether acetate, and the solid content concentration was 25% and the viscosity was 5.2 mPa-s (R type).
- a viscometer (measured at lOrpm) was prepared.
- the composition was applied using a spin coater so that the thickness after curing became 1.5 / zm.
- the composition was cured at 220 ° C. for 20 minutes to form a transparent protective film of the present invention.
- Table 2 shows the evaluation results of the obtained protective film (the evaluation method will be described later).
- a protective film was prepared in the same manner as in Example 1 except that the compositions having the composition ratios shown in each column of Example 2 and Comparative Examples 12 and 12 of Table 1 were used. Table 2 shows the results of these evaluations.
- Example 2 In the same manner as in Example 1 except that the glass substrate in Examples 1 and 2 was replaced with a finely patterned color filter (a colored resin film formed on the surface of the glass substrate), a color filter was used. A protective film was formed on the filter. The evaluation result of the protective film was 2 ⁇
- Example Example 2 Comparative Example 1 Comparative Example 2 Epoxy resin A 100 100 100 100 100 Curing agent A 74 74 74 74 Accelerator A 2 2 2 2 Additive A 1 1 1 1 Additive A 1 1 1 1 Silica fine particle slurry A 76
- Epoxy resin A 2- (4-hydroxyphenyl) -1-2- [4- [1,1-bis (4-hydroxyphenyl) ethyl] phenyl] propane glycidyl ether compound (trade name: VG3101 , Epoxy equivalent: about 211 gZeq, manufactured by Mitsui-Danigaku Kogyo Co., Ltd.)
- the compound is 2- [4 (2,3-epoxypropoxy) phenyl) —2— [4— [1,1bis [4 — (2,3 Epoxypropoxy)
- ethyl] propane
- Curing agent A Novolak type terpene skeleton-containing phenol resin (hydroxyl equivalent: 174 g Zeq, trade name: Epicure MP402FPY, manufactured by Japan Epoxy Resin Co., Ltd.) Accelerator A: 2,3-dihydro-1H-pyromouth— [1, 2—a] Benzimidazole (trade name “Cyazole TBZ”, manufactured by Shikoku Chemicals Co., Ltd.)
- Additive A Fluorosurfactant Megafac F470 (manufactured by Dainippon Ink Co., Ltd.)
- Additive B Epoxysilane-based coupling agent SILAACE S-510 (manufactured by Chisso Corporation)
- Silica fine particle slurry A Colloidal silica slurry (Na concentration lppm or less, average particle diameter of silica fine particles 19 nm, PH 7.3) Product name PL-2L-PGME (manufactured by Fuso-Danigaku Kogyo) Silica fine particle slurry B: Colloidal silica Slurry (Na concentration lppm or less, average particle diameter of silica fine particles 33nm, PH 7.2) Product name PL-3L-PGME (made by Fuso-Danigaku Kogyo) Silica fine particle slurry C: Colloidal silica slurry (Na concentration 0.6 wt% or less, average particle diameter of silica fine particles 14 nm, PH 4.7) Product name PGM—ST (manufactured by Nissan Chemical Industries)
- the numerical values in the table of the silica fine particle slurry indicate the amount of the silica fine particle solid content.
- Example 1 Example 2 Example 3 Example 4 Comparative Example 1 Comparative Example 2 ITO test ⁇ ⁇ ⁇ ⁇ X ⁇ Storage stability ⁇ ⁇ ⁇ ⁇ ⁇ Gelation Transparency ⁇ ⁇ _ ⁇ ⁇ ⁇ Heat resistance ⁇ ⁇ X ⁇
- composition was deposited on a glass substrate to a thickness of 1.5 m, and ITO was sputtered at 200 ° C to a thickness of 1500 A and a sheet resistance of 20 ⁇ / port. The state of the film was observed, and the sample having no change in appearance was marked with ⁇ , the one with partial wrinkles and cracks was rated ⁇ , and the one with wrinkles and cracks generated entirely and cloudy was rated as X.
- the obtained transparent thin film was measured with a spectrophotometer, and the transmittance of 4 OOnm in terms of film thickness per Lm was 95% or more: ⁇ , the one of 90-95% was ⁇ , X is less than 90%. 4.Heat resistance test
- Each of the obtained protective films was left in an oven at 250 ° C. for 60 minutes, and the yellowing of the protective film was visually determined.
- the criterion was that, as compared with the coating film before being left at a high temperature, ⁇ was almost unchanged, ⁇ was slightly yellowed, and X was yellowed and unusable.
- the resin composition of the present invention has excellent storage stability, and therefore has good workability, and also has excellent transparency and heat resistance, particularly high heat resistance. Has ITO resistance.
- the resin composition for a protective film of the present invention has excellent storage stability, good workability, excellent transparency, and particularly high ITO resistance, high surface smoothness, and high water resistance. Since a cured film having excellent properties can be formed, it can be used as a resin composition for forming an excellent protective film. In addition, since there is little contamination of liquid crystal and the like, it is suitable for forming a protective film such as a colored resin film. Therefore, when the resin composition is used for forming a protective film such as a color filter in a color liquid crystal display device, the reliability of the device can be improved.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Optical Filters (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
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Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093130084A TW200517436A (en) | 2003-10-09 | 2004-10-05 | Resin composition for protective film |
US10/574,755 US20070134498A1 (en) | 2003-10-09 | 2004-10-06 | Resin composition for protective film |
JP2005514584A JP4681454B2 (ja) | 2003-10-09 | 2004-10-06 | 保護膜用樹脂組成物 |
EP04792112A EP1672026A4 (en) | 2003-10-09 | 2004-10-06 | RESIN COMPOSITION FOR PROTECTIVE FILM |
CA 2541496 CA2541496A1 (en) | 2003-10-09 | 2004-10-06 | Resin composition for protective film |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003350936 | 2003-10-09 | ||
JP2003-350936 | 2003-10-09 |
Publications (1)
Publication Number | Publication Date |
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WO2005035654A1 true WO2005035654A1 (ja) | 2005-04-21 |
Family
ID=34431059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/014756 WO2005035654A1 (ja) | 2003-10-09 | 2004-10-06 | 保護膜用樹脂組成物 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20070134498A1 (ja) |
EP (1) | EP1672026A4 (ja) |
JP (1) | JP4681454B2 (ja) |
KR (1) | KR20060131734A (ja) |
CN (1) | CN100387652C (ja) |
CA (1) | CA2541496A1 (ja) |
TW (1) | TW200517436A (ja) |
WO (1) | WO2005035654A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012511079A (ja) * | 2008-12-05 | 2012-05-17 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 自己組織化シリカ縮合物 |
WO2013146355A1 (ja) * | 2012-03-29 | 2013-10-03 | 富士フイルム株式会社 | 熱線遮蔽材および貼合せ構造体 |
WO2015076160A1 (ja) * | 2013-11-22 | 2015-05-28 | 富士フイルム株式会社 | 硬化性組成物、硬化膜の製造方法、硬化膜および表示装置 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200415197A (en) * | 2002-10-03 | 2004-08-16 | Nippon Kayaku Kk | Epoxy resin composition for optical semiconductor package |
JP5056575B2 (ja) * | 2008-05-12 | 2012-10-24 | ソニー株式会社 | 樹脂組成物、電子機器、電子機器の製造方法 |
KR20110084992A (ko) * | 2008-11-18 | 2011-07-26 | 닛산 가가쿠 고교 가부시키 가이샤 | 실리카 입자를 함유하는 중합성 유기 화합물 조성물의 제조 방법 |
JP5214477B2 (ja) * | 2009-01-20 | 2013-06-19 | 株式会社東芝 | 粒子配列構造体の製造方法、およびそれを利用する有機エレクトロルミネッセンス素子の製造方法ならびにパターン形成方法 |
CN101891998B (zh) * | 2009-05-18 | 2012-11-21 | 攀钢集团钢铁钒钛股份有限公司 | 一种涂料组合物和镀锌钝化材料 |
JP5772325B2 (ja) * | 2011-07-15 | 2015-09-02 | 大日本印刷株式会社 | 熱硬化性樹脂組成物 |
WO2014050608A1 (ja) * | 2012-09-28 | 2014-04-03 | 富士フイルム株式会社 | 光学フィルム及びその製造方法、偏光板並びに液晶表示装置 |
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JPS63285112A (ja) * | 1987-05-15 | 1988-11-22 | Nissan Chem Ind Ltd | 高純度大粒子径シリカゾルの製造法 |
JP2002050594A (ja) * | 2000-08-04 | 2002-02-15 | Fuso Chemical Co Ltd | コロイド状シリカスラリー |
JP2002179993A (ja) * | 2000-12-14 | 2002-06-26 | Nippon Steel Chem Co Ltd | カラーフィルター保護膜用組成物及びカラーフィルターの製造方法 |
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US4973462A (en) * | 1987-05-25 | 1990-11-27 | Kawatetsu Mining Company, Ltd. | Process for producing high purity silica |
CA2025865C (en) * | 1989-09-27 | 1998-08-04 | Kazuyoshi Tsuneta | Corrosion resistant coating composition |
JPH04266976A (ja) * | 1990-10-31 | 1992-09-22 | Dow Corning Corp | 耐摩耗性熱硬化性エポキシコーティング組成物 |
JP2982678B2 (ja) * | 1996-02-19 | 1999-11-29 | 東洋インキ製造株式会社 | 撥水コーティング用樹脂組成物 |
US7034404B1 (en) * | 1999-02-25 | 2006-04-25 | Nitto Denko Corporation | Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor device |
JP2001019653A (ja) * | 1999-07-05 | 2001-01-23 | Nippon Kayaku Co Ltd | アリルフェノール系化合物、エポキシ樹脂硬化剤及び硬化性エポキシ樹脂組成物 |
JP4435391B2 (ja) * | 2000-08-04 | 2010-03-17 | 扶桑化学工業株式会社 | コロイド状シリカスラリー |
US20040077800A1 (en) * | 2001-02-23 | 2004-04-22 | Chie Umeyama | Composition for protective film, method of using the same, and use thereof |
JP3948980B2 (ja) * | 2001-02-23 | 2007-07-25 | 日本化薬株式会社 | 保護膜用組成物、その使用方法及びその用途 |
TW200415197A (en) * | 2002-10-03 | 2004-08-16 | Nippon Kayaku Kk | Epoxy resin composition for optical semiconductor package |
-
2004
- 2004-10-05 TW TW093130084A patent/TW200517436A/zh unknown
- 2004-10-06 CN CNB2004800296537A patent/CN100387652C/zh not_active Expired - Fee Related
- 2004-10-06 US US10/574,755 patent/US20070134498A1/en not_active Abandoned
- 2004-10-06 WO PCT/JP2004/014756 patent/WO2005035654A1/ja active Application Filing
- 2004-10-06 CA CA 2541496 patent/CA2541496A1/en not_active Abandoned
- 2004-10-06 EP EP04792112A patent/EP1672026A4/en not_active Withdrawn
- 2004-10-06 JP JP2005514584A patent/JP4681454B2/ja not_active Expired - Fee Related
- 2004-10-06 KR KR1020067006234A patent/KR20060131734A/ko not_active Application Discontinuation
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JPS63285112A (ja) * | 1987-05-15 | 1988-11-22 | Nissan Chem Ind Ltd | 高純度大粒子径シリカゾルの製造法 |
JP2002050594A (ja) * | 2000-08-04 | 2002-02-15 | Fuso Chemical Co Ltd | コロイド状シリカスラリー |
JP2002179993A (ja) * | 2000-12-14 | 2002-06-26 | Nippon Steel Chem Co Ltd | カラーフィルター保護膜用組成物及びカラーフィルターの製造方法 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012511079A (ja) * | 2008-12-05 | 2012-05-17 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 自己組織化シリカ縮合物 |
WO2013146355A1 (ja) * | 2012-03-29 | 2013-10-03 | 富士フイルム株式会社 | 熱線遮蔽材および貼合せ構造体 |
JP2013228694A (ja) * | 2012-03-29 | 2013-11-07 | Fujifilm Corp | 熱線遮蔽材および貼合せ構造体 |
WO2015076160A1 (ja) * | 2013-11-22 | 2015-05-28 | 富士フイルム株式会社 | 硬化性組成物、硬化膜の製造方法、硬化膜および表示装置 |
JP6093876B2 (ja) * | 2013-11-22 | 2017-03-08 | 富士フイルム株式会社 | 硬化性組成物、硬化膜の製造方法、硬化膜および表示装置 |
JPWO2015076160A1 (ja) * | 2013-11-22 | 2017-03-16 | 富士フイルム株式会社 | 硬化性組成物、硬化膜の製造方法、硬化膜および表示装置 |
Also Published As
Publication number | Publication date |
---|---|
EP1672026A4 (en) | 2007-01-17 |
CN1867629A (zh) | 2006-11-22 |
CA2541496A1 (en) | 2005-04-21 |
EP1672026A1 (en) | 2006-06-21 |
JP4681454B2 (ja) | 2011-05-11 |
CN100387652C (zh) | 2008-05-14 |
TW200517436A (en) | 2005-06-01 |
JPWO2005035654A1 (ja) | 2006-12-21 |
US20070134498A1 (en) | 2007-06-14 |
KR20060131734A (ko) | 2006-12-20 |
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