WO2005020256A1 - 積層型電子部品 - Google Patents
積層型電子部品 Download PDFInfo
- Publication number
- WO2005020256A1 WO2005020256A1 PCT/JP2004/010711 JP2004010711W WO2005020256A1 WO 2005020256 A1 WO2005020256 A1 WO 2005020256A1 JP 2004010711 W JP2004010711 W JP 2004010711W WO 2005020256 A1 WO2005020256 A1 WO 2005020256A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrode
- signal
- ground
- electrodes
- internal electrode
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/35—Feed-through capacitors or anti-noise capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Definitions
- the present invention relates to a multilayer electronic component, and more particularly, to a multilayer electronic component intended for use in a DC power line for noise suppression.
- FIG. 10 is a plan view showing the multilayer ceramic capacitor 1, showing elements provided inside the multilayer ceramic capacitor 1 in a see-through state.
- the multilayer ceramic capacitor 1 includes a multilayer body 3 including a plurality of stacked dielectric layers 2 as insulating layers.
- a floating electrode 4 indicated by a broken line is formed inside the multilayer body 3 along a specific interface between the dielectric layers 2. The floating electrode 4 is not drawn out to any of the outer surfaces of the laminate 3.
- first and second internal electrodes 5 and 6 which respectively form capacitances with the floating electrode 4 by facing the floating electrode 4, are provided with dielectric layers. It is formed along a specific interface between the two.
- the first internal electrode 5 is drawn out to the first side surface 7 of the multilayer body 3, and is electrically connected to the first external electrode 8 here.
- the second internal electrode 6 is drawn out to the second side surface 9 facing the first side surface 7, where it is electrically connected to the second external electrode 10.
- the first internal electrode 5 and the external electrode 9 are used as signal-side electrodes, Electrode 6 and external electrode 10 are connected to the ground side.
- the multilayer ceramic capacitor 1 shown in FIG. 10 is used as a noise suppression component, a problem is encountered in that high equivalent frequency inductance (ESL) is large and high frequency characteristics are poor. This is because the internal electrodes 5 and 6 are not formed as through conductors, so that relatively large inductance components are generated in the internal electrodes 5 and 6 themselves. Further, as shown in FIG. 10, when the internal electrodes 5 and 6 are formed along the same interface between the dielectric layers 2, the capacitance between the internal electrodes 5 and 6 And an inductance component proportional to the length between the internal electrodes 5 and 6 is generated. This also increases the ESL.
- ESL equivalent frequency inductance
- Patent document 1 JP-A-2000-106322
- an object of the present invention is to provide a multilayer electronic component that can solve the above-described problems.
- the present invention is directed to a laminated electronic component including a laminated body including a plurality of laminated insulating layers.
- the present invention has the following configuration. It is characterized by having.
- At least three types of through electrodes which are floating electrodes and at least three types of penetrating internal electrodes facing the floating electrodes to form capacitance between the floating electrodes, respectively, are provided at specific interfaces between the insulating layers. Along each of them.
- Each type of penetrating internal electrode extends so as to penetrate the laminate, and each of the opposing side surfaces of the laminate has at least three types of external electrodes electrically connected to each type of penetrating internal electrode. Is formed.
- the floating electrode is formed without being electrically connected to any of the external electrodes.
- At least two types of through internal electrodes are used as signal side through internal electrodes, and at least one type is used as ground side through internal electrodes.
- the penetrating internal electrodes include the first and second signal-side penetrating internal electrodes and the ground-side penetrating internal electrode, the first signal-side penetrating internal electrode and the second signal-side penetrating internal electrode. Between the signal-side penetrating internal electrode, between the first signal-side penetrating internal electrode and the ground-side penetrating internal electrode, and between the second signal-side penetrating internal electrode and the ground-side penetrating internal electrode, respectively. A capacitor element connected in series through the floating electrode is formed.
- At least one of the penetrating internal electrodes has a signal. It is used as a through-electrode on the ground side, and at least two types are used as through-electrodes on the ground side.
- the penetrating internal electrode when the penetrating internal electrode includes the signal-side penetrating internal electrode and the first and second ground-side penetrating internal electrodes, the signal-side penetrating internal electrode and the first ground-side penetrating internal electrode.
- Capacitor elements connected in series through floating electrodes are formed between the electrodes and between the signal-side through internal electrodes and the second ground-side internal through electrodes.
- the signal-side penetrating internal electrode and the ground-side penetrating internal electrode may be formed along the same interface between the insulating layers, but preferably, at least one of the signal-side penetrating internal electrodes is used. And at least one of the ground-side penetrating internal electrodes are arranged on opposite sides of the floating electrode. More preferably, with respect to all the signal-side through internal electrodes and all the ground-side through internal electrodes, the signal-side through internal electrodes and the ground-side through internal electrodes are arranged on opposite sides of the floating electrode. .
- a plurality of sets of the floating electrode and the penetrating internal electrode are provided in the laminate. Combinations may be arranged in the stacking direction.
- the multilayer electronic component of the present invention since the penetrating internal electrodes are formed, when any of the penetrating internal electrodes is used as the signal-side penetrating internal electrode, in the signal-side penetrating internal electrode, The generated inductance component can be substantially eliminated. Therefore, it is possible to provide a multilayer electronic component that can reduce the ESL and is suitably used as a noise suppression component having excellent high-frequency characteristics.
- the inductance component proportional to the length between them can be almost eliminated, and the ESL is reduced accordingly.
- the size can be reduced, and the high-frequency characteristics can be further improved.
- the signal-side penetrating internal electrodes and the ground-side penetrating internal electrodes are on opposite sides of the floating electrode.
- the inductance component proportional to the length between all signal-side through electrodes and all ground-side through-electrodes can be almost eliminated.
- the size can be effectively reduced, and the best high frequency characteristics can be provided.
- any one of the plurality of types of through internal electrodes can be used as the ground-side through internal electrode, and therefore, is electrically connected to the through internal electrode.
- Any of the external electrodes can be used as the ground-side external electrode. Therefore, according to the present invention, the arrangement of the ground-side external electrodes can be arbitrarily selected as desired, such as the end or the center of the side surface of the laminate.
- FIG. 1 is a perspective view showing an appearance of a multilayer electronic component 11 according to a first embodiment of the present invention.
- FIG. 2 is a front view showing a cross section of the multilayer electronic component 11 shown in FIG. 1.
- FIG. 3 is a plan view showing the internal structure of the multilayer electronic component 11 shown in FIG. 1, (a) shows a cross section through which signal-side through internal electrodes 15-17 pass, and (b) Indicates a cross section through which the floating electrode 14 passes.
- FIG. 4 is an equivalent circuit diagram provided by the multilayer electronic component 11 shown in FIG. 1.
- FIG. 5 is a front view showing a cross section of a multilayer electronic component 31 according to a second embodiment of the present invention.
- FIG. 6 is a plan view showing the internal structure of the multilayer electronic component 31 shown in FIG. 5, and (a) shows the first signal-side penetrating internal electrode 15 and the ground-side penetrating internal electrode 17 3B shows a cross section through which the floating electrode 14 passes, and FIG. 3C shows a cross section through which the second signal-side penetrating internal electrode 16 passes.
- FIG. 7 is a perspective view showing an appearance of a multilayer electronic component 41 according to a third embodiment of the present invention.
- FIG. 8 is a plan view showing the internal structure of the multilayer electronic component 41 shown in FIG. 7, and (a) is a cross-section through which the first and second ground-side penetrating internal electrodes 43 and 44 pass. (B) shows a cross section through which the floating electrode 14 passes, and (c) shows a cross section through which the signal side penetrating internal electrode 42 passes.
- FIG. 9 is an equivalent circuit diagram provided by the multilayer electronic component 41 shown in FIG. 7.
- FIG. 10 is a plan view showing a conventional multilayer ceramic capacitor 1 which is of interest to the present invention, and shows elements provided inside thereof in a see-through manner.
- FIG. 1 to FIG. 4 are for explaining the first embodiment of the present invention.
- FIG. 1 is a perspective view showing an appearance of the multilayer electronic component 11 according to the first embodiment
- FIG. 2 is a front view showing a cross section of the multilayer electronic component 11 shown in FIG.
- FIG. 3 is a plan view showing a specific cross section to show the internal structure of the multilayer electronic component 11.
- FIG. 6 is an equivalent circuit diagram provided by the multilayer electronic component 11.
- the multilayer electronic component 11 includes a multilayer body 13 including a plurality of laminated insulating layers 12.
- Insulating layer 12 is made of, for example, a dielectric ceramic.
- it has a rectangular parallelepiped shape.
- FIG. 3 (b) shows a cross section through which the floating electrode 14 passes.
- FIG. 2 and FIG. 3 (a) at least three layers which form a capacitance between the multilayer body 13 and the floating electrode 14 by facing the floating electrode 14 are respectively provided.
- Types of through internal electrodes 15-17 are formed along a specific interface between the insulating layers 12.
- three types of through internal electrodes 1517 are formed, and these three types of through internal electrodes 1517 are formed along the same interface between the insulating layers 12.
- FIG. 3 (a) shows a cross section through which the through internal electrodes 15-17 pass.
- each of the penetrating internal electrodes 15-17 has a rectangular shape and extends to penetrate the laminate 13 in a longitudinal direction parallel to each other. Then, on each of the opposing side surfaces 18 and 19 of the laminate 13, external electrodes 20 and 21 electrically connected to the penetrating internal electrode 15, external electrodes 22 and 21 electrically connected to the penetrating internal electrode 16 are provided. 23, and external electrodes 24 and 25 electrically connected to the penetrating internal electrodes 17, respectively.
- the floating electrode 14 has a rectangular shape having a wide area capable of facing all of the penetrating internal electrodes 15-17, and No connection is made to any of the 25, and it is formed in a state.
- the through internal electrodes 15 17, for example, the through internal electrodes 15 and 16 are the first and second through electrodes, respectively.
- the through-hole internal electrode 17 is used as a second signal-side through-hole internal electrode, and the through-hole internal electrode 17 is used as a ground-side through-hole internal electrode. Therefore, of the external electrodes 20 25, the external electrodes 20 and 21 are used as first signal side external electrodes, the external electrodes 22 and 23 are used as second signal side external electrodes, and the external electrodes 24 and 25 are grounded. Used as a side external electrode.
- the multilayer electronic component 11 realizes an equivalent circuit as shown in FIG. In FIG. 4, the same applies to elements corresponding to the elements shown in FIGS. 1 to 3.
- the correspondence between the elements provided in the multilayer electronic component 11 shown in FIGS. 1 to 3 and the elements provided in the equivalent circuit is clarified by adding the reference numerals.
- first signal-side penetrating internal electrode 15 electrically connected to first signal-side external electrodes 20 and 21 and second signal-side external electrodes 22 and 23 are electrically connected to each other.
- Capacitor elements C1 and C2 connected in series through the floating electrode 14 are formed between the second through-electrode 16 and the second signal-side penetrating internal electrode 16 connected to the capacitor.
- the first signal-side penetrating internal electrode 15 electrically connected to the first signal-side external electrodes 20 and 21 and the ground-side penetrating internal electrode 17 electrically connected to the ground-side external electrodes 24 and 25 are provided.
- capacitor elements C3 and C4 connected in series through the floating electrode 14 are formed.
- a second signal-side penetrating internal electrode 16 electrically connected to the second signal-side external electrodes 22 and 23 and a ground-side penetrating internal electrode 17 electrically connected to the ground-side external electrodes 24 and 25 are provided.
- capacitor elements C5 and C6 connected in series through the floating electrode 14 are formed.
- the multilayer electronic component 11 since the multilayer electronic component 11 has the penetrating signal-side internal electrodes 15 and 16 penetrating, the inductance component generated in the signal-side penetrating internal electrodes 15 and 16 is substantially reduced. Therefore, the ESL can be reduced, and a noise suppression component having excellent high frequency characteristics can be obtained.
- FIG. 5 and FIG. 6 are for describing a second embodiment of the present invention.
- FIG. 5 is a diagram corresponding to FIG. 2
- FIG. 6 is a diagram corresponding to FIG.
- elements corresponding to the elements shown in FIGS. 2 and 3 are denoted by the same reference numerals, and duplicate description will be omitted.
- the multilayer electronic component 31 shown in FIG. 5 and FIG. 6 has substantially the same appearance as the multilayer electronic component 11 shown in FIG.
- An external electrode 2025 is formed on each of the opposing side surfaces 18 and 19 of FIG.
- a floating electrode 14 is formed inside the multilayer body 13, and furthermore, the floating electrode 14 is opposed to the floating electrode 14.
- 3 types of penetrating internal electrodes 15 17 are formed, each forming a capacitance between
- the first signal-side through internal electrode 15 and the ground-side through internal electrode 17 are arranged as shown in FIGS. 5 and 6 (a). , Formed along the same interface between the insulating layers 12.
- FIGS. 5 and 6 (a) Formed along the same interface between the insulating layers 12.
- the second signal-side penetrating internal electrode 16 is formed between the insulating layer 12 on which the first signal-side penetrating internal electrode 15 and the ground-side penetrating internal electrode 17 are formed. Is formed along the interface between the insulating layers 12 which is different from the interface between the first signal side through electrode 15 and the ground side through electrode 17 with the floating electrode 14 interposed therebetween. Is done.
- a combination of a plurality of sets of floating electrodes 14 and through internal electrodes 15-17 is arranged in the stacking direction. Is done.
- the equivalent circuit shown in FIG. 4 is also realized by the multilayer electronic component 31 according to the second embodiment.
- the second signal-side penetrating internal electrode 16 and the ground-side penetrating internal electrode 17 are arranged on the opposite sides of the floating electrode 14, so that an inductance component proportional to the length between the second signal-side penetrating internal electrode 16 and the ground-side penetrating internal electrode 17 is almost eliminated. Since the ESL can be reduced and the ESL can be reduced accordingly, high-frequency characteristics can be improved as compared with the case of the first embodiment.
- the degree of freedom of the shape of the penetrating internal electrodes 15 17 is large, for example, the first signal-side penetrating internal electrodes 15 and the ground-side penetrating internal electrodes 17 face each other.
- a shape that is convex in the direction is also possible.
- the shape of the second signal-side penetrating internal electrode 16 is not limited to the rectangular shape as shown in FIG. 6C, and the facing portion may be wide.
- FIG. 7 to FIG. 9 are for explaining the third embodiment of the present invention.
- FIG. 7 is a perspective view showing the appearance of the multilayer electronic component 41 according to this embodiment.
- FIG. 8 is a plan view showing the internal structure of the multilayer electronic component 41 with a specific cross section.
- FIG. 9 is an equivalent circuit diagram provided by the multilayer electronic component 41.
- the structure of the multilayer electronic component 41 will be described with reference to FIG. 7 and FIG. In FIGS. 7 and 8, the same elements as those shown in FIGS. , And duplicate description will be omitted.
- a floating electrode 14 is formed inside the multilayer body 13, and further, by opposing the floating electrode 14, a capacitance is formed between the floating electrode 14 and the floating electrode 14.
- Three types of penetrating internal electrodes 42-44 to be formed are formed. Of the penetrating internal electrodes 42 and 44, the penetrating internal electrode 42 and the penetrating internal electrodes 43 and 44 are arranged on opposite sides of the floating electrode 14, and the penetrating internal electrodes 43 and 44 are Formed along the same interface between them.
- the penetrating internal electrode 42 is used as a signal-side penetrating internal electrode, and the penetrating internal electrodes 43 and 44 each have a fourth force. Used as the first and second ground-side through internal electrodes.
- external electrodes 45 and 46 electrically connected to signal-side penetrating internal electrode 42 are used as signal-side external electrodes, and external electrodes 45 and 46 electrically connected to first ground-side internal penetrating electrode 43. 47 and 48 are used as first ground side external electrodes, and external electrodes 49 and 50 electrically connected to the second ground side penetrating internal electrode 44 are used as second ground side external electrodes.
- the signal-side penetrating internal electrode 42 electrically connected to the signal-side external electrodes 45 and 46 and the first ground-side external electrodes 47 and 48
- Capacitor elements C7 and C8 connected in series through the floating electrode 14 are formed between the first ground side penetrating internal electrode 43 which is electrically connected.
- the signal-side penetrating internal electrode 42 electrically connected to the signal-side external electrodes 45 and 46 and the second ground-side penetrating internal electrode electrically connected to the second ground-side external electrodes 49 and 50 are provided.
- Capacitor elements C9 and C10 connected in series through the floating electrode 14 are formed between the capacitor elements C9 and C10.
- the signal-side penetrating internal electrode 42, the ground-side penetrating internal electrodes 43 and 44, and the force floating electrode 14 are arranged on opposite sides, the signal-side penetrating internal electrode 42 For both the internal electrode 42 and the ground-side through internal electrodes 43 and 44, Since the inductance component proportional to the length between them can be almost eliminated, the ESL can be further reduced as compared with the case of the second embodiment, and as a result, more excellent high frequency characteristics can be obtained. Can be given.
- a plurality of sets of floating electrodes 14 and penetrating internal electrodes 42 are provided in the multilayer body 13. 44 combinations are arranged in the stacking direction.
- Electrodes may be provided.
- the ground-side external electrodes 24 and 25 are arranged at one end of each of the side surfaces 18 and 19 of the multilayer body 13.
- Ground-side external electrodes 47 and 50 are arranged at both ends of each of the side surfaces 18 and 19.
- the placement of such ground-side external electrodes may be, for example, at the center of sides 18 and 19. From this fact, it is understood that according to the present invention, the arrangement of the ground-side external electrodes can be arbitrarily selected as desired.
- the multilayer electronic component according to the present invention can reduce the equivalent series resistance, so that it can be suitably used as a noise suppression component for a DC power supply line having excellent high-frequency characteristics.
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005513253A JP4089726B2 (ja) | 2003-08-22 | 2004-07-28 | 積層型電子部品 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-298373 | 2003-08-22 | ||
JP2003298373 | 2003-08-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005020256A1 true WO2005020256A1 (ja) | 2005-03-03 |
Family
ID=34213716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/010711 WO2005020256A1 (ja) | 2003-08-22 | 2004-07-28 | 積層型電子部品 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4089726B2 (ja) |
WO (1) | WO2005020256A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010045298A (ja) * | 2008-08-18 | 2010-02-25 | Tdk Corp | 積層コンデンサ |
US7843679B2 (en) * | 2007-07-09 | 2010-11-30 | Tdk Corporation | Multilayer capacitor having low impedance over a wide frequency band |
JP2015041735A (ja) * | 2013-08-23 | 2015-03-02 | 株式会社村田製作所 | コンデンサ素子 |
JP2015216201A (ja) * | 2014-05-09 | 2015-12-03 | 株式会社村田製作所 | 積層コンデンサ及びその使用方法 |
US20210327646A1 (en) * | 2020-04-20 | 2021-10-21 | Kemet Electronics Corporation | Multi-Terminal MLCC for Improved Heat Dissipation |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0625109U (ja) * | 1992-08-28 | 1994-04-05 | 日本紙業株式会社 | 組立紙器 |
JP6000983B2 (ja) | 2012-11-20 | 2016-10-05 | Jfeミネラル株式会社 | ニッケル粉末、導電ペースト、および、積層セラミック電子部品 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57175427U (ja) * | 1981-04-30 | 1982-11-05 | ||
JPS5895032U (ja) * | 1981-12-18 | 1983-06-28 | 日本電気株式会社 | セラミツクコンデンサ |
JPS61129322U (ja) * | 1985-01-31 | 1986-08-13 | ||
JPS6466916A (en) * | 1987-09-07 | 1989-03-13 | Matsushita Electric Ind Co Ltd | Manufacture of laminated ceramic capacitor |
JPH06275463A (ja) * | 1993-03-19 | 1994-09-30 | Murata Mfg Co Ltd | 積層型貫通コンデンサアレイ |
JPH11214256A (ja) * | 1998-01-28 | 1999-08-06 | Murata Mfg Co Ltd | 積層3端子コンデンサアレイ |
-
2004
- 2004-07-28 WO PCT/JP2004/010711 patent/WO2005020256A1/ja active Application Filing
- 2004-07-28 JP JP2005513253A patent/JP4089726B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57175427U (ja) * | 1981-04-30 | 1982-11-05 | ||
JPS5895032U (ja) * | 1981-12-18 | 1983-06-28 | 日本電気株式会社 | セラミツクコンデンサ |
JPS61129322U (ja) * | 1985-01-31 | 1986-08-13 | ||
JPS6466916A (en) * | 1987-09-07 | 1989-03-13 | Matsushita Electric Ind Co Ltd | Manufacture of laminated ceramic capacitor |
JPH06275463A (ja) * | 1993-03-19 | 1994-09-30 | Murata Mfg Co Ltd | 積層型貫通コンデンサアレイ |
JPH11214256A (ja) * | 1998-01-28 | 1999-08-06 | Murata Mfg Co Ltd | 積層3端子コンデンサアレイ |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7843679B2 (en) * | 2007-07-09 | 2010-11-30 | Tdk Corporation | Multilayer capacitor having low impedance over a wide frequency band |
JP2010045298A (ja) * | 2008-08-18 | 2010-02-25 | Tdk Corp | 積層コンデンサ |
JP2015041735A (ja) * | 2013-08-23 | 2015-03-02 | 株式会社村田製作所 | コンデンサ素子 |
JP2015216201A (ja) * | 2014-05-09 | 2015-12-03 | 株式会社村田製作所 | 積層コンデンサ及びその使用方法 |
US20210327646A1 (en) * | 2020-04-20 | 2021-10-21 | Kemet Electronics Corporation | Multi-Terminal MLCC for Improved Heat Dissipation |
Also Published As
Publication number | Publication date |
---|---|
JPWO2005020256A1 (ja) | 2006-10-19 |
JP4089726B2 (ja) | 2008-05-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100761624B1 (ko) | 적층 콘덴서 | |
JP4299258B2 (ja) | 積層コンデンサ | |
JP4864271B2 (ja) | 積層コンデンサ | |
JP2004014961A (ja) | 積層貫通型コンデンサ | |
JP2000114096A (ja) | 積層コンデンサ | |
JP2976960B2 (ja) | 積層3端子コンデンサアレイ | |
TWI345796B (en) | Feedthrough multilayer capacitor array | |
JPH10335143A (ja) | 積層型インダクタ | |
JP4462194B2 (ja) | 積層型貫通コンデンサアレイ | |
JP4911036B2 (ja) | 積層コンデンサおよびその実装構造 | |
JP3470566B2 (ja) | 積層型電子部品 | |
JP5870674B2 (ja) | 積層コンデンサアレイ | |
KR101051620B1 (ko) | 적층 콘덴서 | |
JP4293561B2 (ja) | 積層型貫通コンデンサアレイの実装構造 | |
WO2005020256A1 (ja) | 積層型電子部品 | |
WO2015107810A1 (ja) | ノイズフィルタ | |
JP6232836B2 (ja) | コンデンサ素子 | |
JP2000182891A (ja) | 積層コンデンサ | |
JP4412386B2 (ja) | 貫通型積層コンデンサ | |
JP2982558B2 (ja) | 積層型貫通コンデンサ | |
JP3166702B2 (ja) | 積層型コモンモードチョークコイル | |
JPH0430615A (ja) | ノイズ・フイルタ | |
JP2006128523A (ja) | 複合コンデンサ | |
JPH1188008A (ja) | 積層型フィルタ及び積層型共用器 | |
JP2004015572A (ja) | 複合部品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2005513253 Country of ref document: JP |
|
122 | Ep: pct application non-entry in european phase |