WO2005014686A1 - 光硬化型樹脂組成物及びそれを用いたフラットパネルディスプレイ用シール剤 - Google Patents

光硬化型樹脂組成物及びそれを用いたフラットパネルディスプレイ用シール剤 Download PDF

Info

Publication number
WO2005014686A1
WO2005014686A1 PCT/JP2004/011465 JP2004011465W WO2005014686A1 WO 2005014686 A1 WO2005014686 A1 WO 2005014686A1 JP 2004011465 W JP2004011465 W JP 2004011465W WO 2005014686 A1 WO2005014686 A1 WO 2005014686A1
Authority
WO
WIPO (PCT)
Prior art keywords
mass
group
resin composition
compound
fluorine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2004/011465
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Yugo Yamamoto
Yasushi Mizuta
Yuichi Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Priority to EP04771452A priority Critical patent/EP1661930A4/en
Priority to US10/567,864 priority patent/US7495035B2/en
Priority to KR1020067002781A priority patent/KR101121671B1/ko
Priority to JP2005512993A priority patent/JP4804922B2/ja
Publication of WO2005014686A1 publication Critical patent/WO2005014686A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10706—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer being photo-polymerized
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/03—Viewing layer characterised by chemical composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
    • C09K2323/055—Epoxy
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer

Definitions

  • R represents a hydrogen atom, a fluorine atom, a methyl group, an ethyl group, a propyl group, a butyl group,
  • Carbon atoms such as pentyl group, hexyl group and other alkyl groups with 1 to 6 carbon atoms, trifluoromethyl group, perfluoromethyl group, perfluoroethyl group, perfluoropropyl group, etc. It is an aryl group having 6 to 18 carbon atoms, such as a fluoroalkyl group, a phenyl group, a naphthyl group or the like, a furyl group or a phenyl group.
  • R is the same or different
  • R represents a hydrogen atom, a fluorine atom, a methinole group, an ethyl group, a propyl group, a butyl group,
  • a compound in which part or all of the hydrogen atoms of the carbon-hydrogen bond of these compounds of [Formula 2] to [Formula 5] are substituted with fluorine More specifically, a compound in which a total of six methyl groups in bisphenol A glycidyl ether are substituted with fluorine (bisphenol AF diglycidyl ether), and a total of six methyl groups in bisphenol A are substituted with fluorine. And a reaction product of the compound and the epoxy compound.
  • the cyclic polyoxyethylene conjugate (C) in the present invention includes a compound represented by the following formula [Chemical formula 6].
  • compounds having similar structures include dibenzo-18-crown-6-ether, cyclohexano-18-crown-16-ether, dicyclohexyl-18-crown-6-ether, and 2-hydroxymethyl-1 18-crown-6-ether, 2-aminomethyl-18-crown-16-ether, cyclohexano-15-crown-5-ether, 2-hydroxymethinole-15-crown-1 5-ether, 2- Aminomethyl-1-15-crown-1-ether, 2,3-bis-1- (2-chloro-phenyl) -1,4,7,10,13-pentaoxacyclopentadecane, cyclohexano-12
  • examples thereof include those containing a cyclic polyoxyethylene compound in a part of the structure, such as crown-14-ether, 2-hydroxymethyl-12-crown-14-ether, and talibutand. It is also possible to use compounds obtained by substituting some or all of the hydrogen atoms of carbon-hydrogen bonds in these compounds with fluor
  • the resin composition of the present invention contains other organic compounds (D), other resin components, coupling agents, curability improvers, fillers, modifiers, and the like, as long as the effects of the present invention are not impaired.
  • a stabilizer and the like can be contained.
  • resin components include, for example, polyamide, polyamideimide, polyurethane, polybutadiene, polychloroprene, polyether, polyester, styrene-butadiene-styrene block copolymer, petroleum resin, xylene resin, ketone resin, cellulose resin And fluorine-based oligomers, silicon-based oligomers, and polysulfide-based oligomers. These may be used alone or in combination of two or more.
  • R is linear or branched such as methylene, ethylene, propylene, butylene, etc.
  • alkylene group such as a propyl group and a glycidyl ether group. They are primary amine, thiol group, butyl group and isocyanate group. It is also possible to use a material in which part or all of the hydrogen atoms of the carbon-hydrogen bond of these coupling agents are substituted with fluorine. Good Preferably, use a material in which hydrogen of methylene group and / or methyl group is replaced with fluorine.
  • a photosensitizer / photoradical type initiator may be added.
  • benzophenone, 2,2-diethoxyacetophenone, benzyl, benzoinoleisopropinoleatenole, benzinoresimetinoleketanole, 1-hydroxycyclohexinolephenylketone, thioxanthone and the like can be mentioned. It can.
  • the amount of these used is 0.15% by mass in the photocurable resin composition.
  • the content is 0.1% by mass or more, curability by light irradiation is given, and when the content is 5% by mass or less, the hygroscopicity of the cured material can be suppressed.
  • a compound having radical polymerizability represented by an acrylic monomer may be added.
  • filler examples include styrene-based polymer particles, methacrylate-based polymer particles, ethylene-based polymer particles, and propylene-based polymer particles. These may be used alone or in combination of two or more.
  • examples of the stabilizer include an ultraviolet absorber, a preservative, and an antibacterial agent.
  • the hydrophobicity of the component that can transmit moisture after curing is improved. And the moisture resistance can be improved. Further, by using the component of the fluorine-containing organic compound in the components (B) and Z or (D), the adhesive strength can be improved.
  • the total sum (F) is preferably 0-40% by mass as a fluorine atom in the mass of the components (B), (C) and (D) in view of adhesive strength.
  • the characteristics of the resin composition of the present invention are excellent in moisture resistance and high adhesive strength.
  • the content of the component (C) and the content of the component (F) must not be simultaneously 0.0% by mass.
  • the fluorine-containing organic compound is contained in the components (A), (B), (C) and (D)
  • the total fluorine content (F) of the component (A), (B) A content of 0.1 to 40% by mass as a fluorine atom in the mass of (C) and (D) is preferable.
  • the resin composition of the present invention preferably contains a fine particle inorganic filler.
  • Fine particle inorganic filler is an inorganic filler having an average primary particle diameter of 0.005 10 x m. Specific examples include silica, talc, alumina, pummo, calcium carbonate and the like.
  • the fine particle inorganic filler can be used both as a surface-untreated one and a surface-treated one. Examples of the surface-treated fine particle inorganic filler include a methoxy group, a trimethylsilyl group, an octyl silyl group, and a fine particle inorganic filer surface-treated with silicone oil. These components can be used alone or in combination of two or more.
  • the amount of the fine particle inorganic filler used is 0 to 250 parts by mass with respect to 100 parts by mass of the total of the components (A), (B), (C), and (D) described above. It is effective in imparting wettability, adhesive strength and thixotropic properties.
  • the method of applying the sealant to the display substrate is not limited as long as the sealant can be applied uniformly.
  • it may be performed by a known method such as a screen printing method or a method of applying using a dispenser.
  • the display base material is attached and irradiated with light to cure the sealant.
  • the light source that can be used here is Any material can be used as long as it can be cured within the working time.
  • a light source that can emit light in the range of ultraviolet light and visible light is used. More specifically, a low-pressure mercury lamp, a high-pressure mercury lamp, a xenon lamp, a metal halide lamp and the like can be mentioned.
  • the irradiation light amount is usually 500 9000 mjZcm 2 , which can be appropriately selected within a range where the uncured portion of the resin composition does not remain or a range where no adhesion failure occurs.
  • the amount of irradiation is no particular upper limit to the amount of irradiation, but an excessive amount is not preferable because unnecessary energy is wasted and productivity is reduced.
  • the viscosity of the resin composition was measured at 25 ° C with an E-type viscometer (RC-500 manufactured by Toki Sangyo)
  • the moisture permeability of the resin composition film (thickness: 100 ⁇ m) photocured according to JIS Z0208 was measured at 40 ° C. and 90% RH.
  • the adhesive strength after boiling was determined by combining a glass plate with a glass plate, sandwiching it with a resin composition (thickness 20 / m), irradiating the light-adhered sample to the glass, immersing it in boiling water for 1 hour, and removing it. Let dry. The adhesive strength when the two substrates were peeled off was measured at a pulling speed of 2 mm / min.
  • the curability was evaluated by applying a resin composition to a glass plate at a film thickness of 100 ⁇ , and irradiating light with a metal halide lamp at 3000 mJ to evaluate the curing conditions of the coating film by finger touch.
  • Fluorine-containing cationic polymerizable compound Bisphenol AF diglycidyl ether Light power thione initiator; Tricumyl rhododium tetra (pentafluorophenyl) borate (trade name: RHODORSIL PHOTOINITIATOR2074, manufactured by RHODIA) Silane capping agent; Xypropyl trimethyoxysilane (trade name: SH6040, manufactured by Toray Dow Co., Ltd. Silicone Co., Ltd.) Fine particle inorganic filler; Fine particle talc: Untreated, fine particle talc having an average primary particle diameter of 1 ⁇ m.
  • a resin composition was prepared according to the formulation shown in Table 1 in the same manner as in Example 1 except that the components having the composition shown in Table 1 were used in the amounts shown in Table 1. Various evaluations were made on the resin compositions shown in Table 1. The results are shown in Table 1.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Sealing Material Composition (AREA)
  • Polyethers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electroluminescent Light Sources (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
PCT/JP2004/011465 2003-08-12 2004-08-10 光硬化型樹脂組成物及びそれを用いたフラットパネルディスプレイ用シール剤 Ceased WO2005014686A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP04771452A EP1661930A4 (en) 2003-08-12 2004-08-10 PHOTOHÄRTBARE COMPOSITION AND SEALANT FOR FLAT SCREEN THEREWITH
US10/567,864 US7495035B2 (en) 2003-08-12 2004-08-10 Photo-curable resin composition and sealing agent for flat panel display using the same
KR1020067002781A KR101121671B1 (ko) 2003-08-12 2004-08-10 광경화형 수지 조성물 및 그것을 이용한 플랫 패널디스플레이용 실링제
JP2005512993A JP4804922B2 (ja) 2003-08-12 2004-08-10 光硬化型樹脂組成物及びそれを用いたフラットパネルディスプレイ用シール剤

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003-207236 2003-08-12
JP2003207236 2003-08-12
JP2003-346516 2003-10-06
JP2003346516 2003-10-06

Publications (1)

Publication Number Publication Date
WO2005014686A1 true WO2005014686A1 (ja) 2005-02-17

Family

ID=34137893

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/011465 Ceased WO2005014686A1 (ja) 2003-08-12 2004-08-10 光硬化型樹脂組成物及びそれを用いたフラットパネルディスプレイ用シール剤

Country Status (6)

Country Link
US (1) US7495035B2 (https=)
EP (1) EP1661930A4 (https=)
JP (1) JP4804922B2 (https=)
KR (1) KR101121671B1 (https=)
TW (1) TW200513517A (https=)
WO (1) WO2005014686A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008305580A (ja) * 2007-06-05 2008-12-18 Sekisui Chem Co Ltd 光後硬化性組成物、有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス表示装置の製造方法、及び、有機エレクトロルミネッセンス表示装置
CN1979337B (zh) * 2005-08-08 2012-01-11 索尼株式会社 制备喷液型记录头的方法
JP2015044917A (ja) * 2013-08-27 2015-03-12 積水化学工業株式会社 光後硬化性樹脂組成物
JP2016120683A (ja) * 2014-12-25 2016-07-07 三井化学株式会社 積層構造物、光硬化性組成物および積層構造物の製造方法
JP2021190428A (ja) * 2020-06-03 2021-12-13 三星エスディアイ株式会社Samsung SDI Co., Ltd. 有機発光素子封止用組成物およびこれにより製造された有機層を含む有機発光表示装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007040209A1 (ja) * 2005-10-03 2007-04-12 Mitsui Chemicals, Inc. フラットパネルディスプレイ用シール材
US20080161471A1 (en) * 2006-02-10 2008-07-03 Mitsui Chemicals, Inc. Resin Composition for Sealing Material, Sealing Material, Sealing Method, and Electroluminescent Display
GB2444053A (en) * 2006-11-23 2008-05-28 Eques Coatings Hybrid UV-curable resins
CN101816026A (zh) * 2007-10-22 2010-08-25 夏普株式会社 显示装置及其制造方法
KR101215743B1 (ko) * 2010-08-10 2012-12-26 세키스이가가쿠 고교가부시키가이샤 액정 적하 공법용 시일제
WO2014042328A1 (ko) * 2012-09-13 2014-03-20 제일모직 주식회사 광경화 조성물, 이를 포함하는 장벽층 및 이를 포함하는 봉지화된 장치
WO2014199626A1 (ja) * 2013-06-10 2014-12-18 三井化学株式会社 熱硬化性組成物、有機ｅｌ素子用面封止剤およびその硬化物
TWI519560B (zh) 2014-11-24 2016-02-01 財團法人工業技術研究院 含氧雜環丁烷基與環氧基之樹脂與樹脂組成物
TWI691588B (zh) * 2014-12-09 2020-04-21 日商三井化學股份有限公司 有機el元件用面密封材及其硬化物
KR102126389B1 (ko) 2018-09-14 2020-06-25 셀라이온바이오메드 주식회사 벤즈히드릴티오 아세트아미드 화합물을 유효성분으로 포함하는 간 질환의 예방 또는 치료용 조성물
EP4050060A1 (en) * 2021-02-26 2022-08-31 Henkel AG & Co. KGaA A photocurable adhesive or sealant composition

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09241603A (ja) * 1996-03-06 1997-09-16 Sumitomo Bakelite Co Ltd 液晶表示素子用シール材組成物及びそれを用いた液晶表示素子
JP2001089743A (ja) * 1999-09-24 2001-04-03 Mitsui Chemicals Inc シール材用光硬化型樹脂組成物、シール方法
JP2001207120A (ja) * 2000-01-26 2001-07-31 Nippon Paint Co Ltd 高透光性膜の製造方法およびコーティング組成物
JP2001207150A (ja) * 2000-01-26 2001-07-31 Sony Chem Corp 接着剤組成物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU497960B2 (en) * 1974-04-11 1979-01-25 Minnesota Mining And Manufacturing Company Photopolymerizable compositions
US4876322A (en) * 1984-08-10 1989-10-24 Siemens Aktiengesselschaft Irradiation cross-linkable thermostable polymer system, for microelectronic applications
KR100418453B1 (ko) * 1995-10-02 2005-02-07 간사이 페인트 가부시키가이샤 캔용자외선-경화코팅조성물
JP3765896B2 (ja) * 1996-12-13 2006-04-12 Ｊｓｒ株式会社 光学的立体造形用光硬化性樹脂組成物
JPH11152441A (ja) * 1997-11-21 1999-06-08 Kansai Paint Co Ltd 紫外線硬化型缶用塗料組成物
JP2886853B1 (ja) * 1998-06-08 1999-04-26 関西ペイント株式会社 カチオン重合性塗料組成物
JP3737285B2 (ja) 1998-08-28 2006-01-18 積水化学工業株式会社 光硬化性組成物、光硬化性接着シート、及び接合方法
WO2001012745A1 (fr) * 1999-08-12 2001-02-22 Mitsui Chemicals, Inc. Composition de resine photodurcissable pour materiau d'etancheite et procede correspondant
JP4193343B2 (ja) 1999-08-12 2008-12-10 三井化学株式会社 シール剤用光硬化型樹脂組成物およびシール方法
JP4382978B2 (ja) * 2000-12-04 2009-12-16 学校法人神奈川大学 光硬化性・熱硬化性樹脂組成物
KR20030007186A (ko) * 2001-07-17 2003-01-23 미쯔이카가쿠 가부시기가이샤 광 양이온성 경화가능 수지 조성물 및 그 용도

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09241603A (ja) * 1996-03-06 1997-09-16 Sumitomo Bakelite Co Ltd 液晶表示素子用シール材組成物及びそれを用いた液晶表示素子
JP2001089743A (ja) * 1999-09-24 2001-04-03 Mitsui Chemicals Inc シール材用光硬化型樹脂組成物、シール方法
JP2001207120A (ja) * 2000-01-26 2001-07-31 Nippon Paint Co Ltd 高透光性膜の製造方法およびコーティング組成物
JP2001207150A (ja) * 2000-01-26 2001-07-31 Sony Chem Corp 接着剤組成物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1661930A4 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1979337B (zh) * 2005-08-08 2012-01-11 索尼株式会社 制备喷液型记录头的方法
JP2008305580A (ja) * 2007-06-05 2008-12-18 Sekisui Chem Co Ltd 光後硬化性組成物、有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス表示装置の製造方法、及び、有機エレクトロルミネッセンス表示装置
JP2015044917A (ja) * 2013-08-27 2015-03-12 積水化学工業株式会社 光後硬化性樹脂組成物
JP2016120683A (ja) * 2014-12-25 2016-07-07 三井化学株式会社 積層構造物、光硬化性組成物および積層構造物の製造方法
JP2021190428A (ja) * 2020-06-03 2021-12-13 三星エスディアイ株式会社Samsung SDI Co., Ltd. 有機発光素子封止用組成物およびこれにより製造された有機層を含む有機発光表示装置
JP7762514B2 (ja) 2020-06-03 2025-10-30 三星エスディアイ株式会社 有機発光素子封止用組成物およびこれにより製造された有機層を含む有機発光表示装置

Also Published As

Publication number Publication date
US20060241208A1 (en) 2006-10-26
KR20060061821A (ko) 2006-06-08
US7495035B2 (en) 2009-02-24
JP4804922B2 (ja) 2011-11-02
TWI305801B (https=) 2009-02-01
JPWO2005014686A1 (ja) 2007-10-04
EP1661930A4 (en) 2010-09-29
TW200513517A (en) 2005-04-16
KR101121671B1 (ko) 2012-03-14
EP1661930A1 (en) 2006-05-31

Similar Documents

Publication Publication Date Title
JP4193343B2 (ja) シール剤用光硬化型樹脂組成物およびシール方法
WO2001012745A1 (fr) Composition de resine photodurcissable pour materiau d'etancheite et procede correspondant
WO2005014686A1 (ja) 光硬化型樹脂組成物及びそれを用いたフラットパネルディスプレイ用シール剤
JP2010018797A (ja) 光学部品用硬化性組成物、光学部品用接着剤及び有機エレクトロルミネッセンス素子用封止剤
JP7197609B2 (ja) 封止剤、硬化体、有機エレクトロルミネッセンス表示装置、及び装置の製造方法
JP2003327951A (ja) シール材用光硬化型樹脂組成物
US20030062125A1 (en) Photocationic-curable resin composition and uses thereof
WO2007040209A1 (ja) フラットパネルディスプレイ用シール材
JP4563448B2 (ja) シール材樹脂組成物、シール材、シール方法およびエレクトロルミネッセンスディスプレイ
EP4644457A1 (en) Curable resin composition, adhesive, sealing material, cured product, semiconductor apparatus, and electronic device
JP2003096184A (ja) 光硬化型樹脂組成物
JP2001089743A (ja) シール材用光硬化型樹脂組成物、シール方法
US7714037B1 (en) Photoinitiated cationic epoxy compositions and articles exhibiting low color
CN100404578C (zh) 光固化型树脂组合物和用其的平板显示器用密封剂
JP2003096185A (ja) 光硬化型樹脂組成物
JP2005187636A (ja) 光硬化性樹脂組成物、表示素子用接着剤、接着方法および表示素子
JP4050573B2 (ja) 光硬化型樹脂組成物
EP4298176B1 (en) Photocurable adhesive composition
JP4805216B2 (ja) 光硬化型樹脂組成物
JP2011225886A (ja) 光硬化型樹脂組成物
US20080161471A1 (en) Resin Composition for Sealing Material, Sealing Material, Sealing Method, and Electroluminescent Display
JP3896119B2 (ja) 表示素子用光硬化性樹脂組成物及び表示素子
CN120813624A (zh) 固化性组合物、密封剂、框密封剂、显示面板及其制造方法
CN120858127A (zh) 固化性组合物、密封剂、框密封剂、显示面板及其制造方法
JP2011118105A (ja) カチオン光硬化型液晶パネルシール剤及びそれを用いた液晶パネルの製造方法

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200480022945.8

Country of ref document: CN

AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2005512993

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1020067002781

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2006241208

Country of ref document: US

Ref document number: 10567864

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 2004771452

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2004771452

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1020067002781

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 10567864

Country of ref document: US